JPS59120557U

JPS59120557U - porous whetstone

Info

Publication number: JPS59120557U
Application number: JP1373883U
Authority: JP
Inventors: 仁郎井上
Original assignee: 株式会社デ−・テイ・ア−ル
Priority date: 1983-02-03
Filing date: 1983-02-03
Publication date: 1984-08-14

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は正面図、第２図は第１図のＡＡ断面図、第３図
は側面図、第４図、第５図、第６図は部分断面図、第７
図は平面図、第８図は正面図、第９図はＢＢ断面図、第
１０図は部分断面図、第１１図、第１２図、第１３図は
砥粒層の各種の断面形状を示す部分断面図、第１４図は
帯鋸の部分正面図、第１５図は第１４図の断面図である
。１・・・台金、２．２’、２’、２厘ト・砥粒層、３・
・・小孔、４・・・台金外周、５・・・台金右側面、６
・・・台　　　　゛全左側面、６′・・・台金右側面、
７・・・台金上面、８・・・台金右側面。Figure 1 is a front view, Figure 2 is a sectional view taken along the line AA in Figure 1, Figure 3 is a side view, Figures 4, 5, and 6 are partial sectional views, and Figure 7 is a partial sectional view.
The figure is a plan view, FIG. 8 is a front view, FIG. 9 is a BB sectional view, FIG. 10 is a partial sectional view, and FIGS. 11, 12, and 13 show various cross-sectional shapes of the abrasive grain layer. 14 is a partial front view of the band saw, and FIG. 15 is a sectional view of FIG. 14. 1... Base metal, 2.2', 2', 2', abrasive grain layer, 3.
...Small hole, 4...Base metal outer periphery, 5...Base metal right side, 6
...Base ゛All left side, 6'...Base metal right side,
7...Top surface of base metal, 8...Right side of base metal.

Claims

[Claims for Utility Model Registration] (1) A large number of cylindrical holes are formed inwardly from the ground surface of the hard abrasive grain-containing layer 2 formed and fixed on the surface of the base metal 1. A porous whetstone with 3 small holes. (2) The porous whetstone according to claim 1, wherein the porous whetstone has a disk shape, a dish shape, a bowl shape, or a band shape. (3) The porous grindstone according to claim 1, wherein the small holes are linear small holes. (4) The porous grindstone according to claim 1, wherein the small hole is a small hole drilled by a laser machining method or an electric discharge machining method. (5) The porous grindstone according to claim 1, wherein the hard abrasive grains are diamond abrasive grains or cubic boron nitride abrasive grains. (6) The hard abrasive grain-containing layer is formed by sintering a mixture of hard abrasive grains and metal bond, or by firing a mixture of a synthetic resin material. The porous grindstone according to item 1.