JPH0319626U - - Google Patents
Info
- Publication number
- JPH0319626U JPH0319626U JP7706889U JP7706889U JPH0319626U JP H0319626 U JPH0319626 U JP H0319626U JP 7706889 U JP7706889 U JP 7706889U JP 7706889 U JP7706889 U JP 7706889U JP H0319626 U JPH0319626 U JP H0319626U
- Authority
- JP
- Japan
- Prior art keywords
- wire saw
- abrasive grains
- uneven portion
- view
- saw according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 claims description 8
- 239000006061 abrasive grain Substances 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
Description
第１図は本考案に係るワイヤーソーの一部を示
す斜視図、第２図は同ワイヤーソーに使用される
ビーズの第１実施例を示す斜視図、第３図は同ビ
ーズの要部を拡大して示した一例の断面図、第４
図は同じく他の例の断面図、第５図は第２実施例
のビーズの斜視図、第６図は第３実施例のビーズ
の斜視図、第７図は同ビーズの要部を拡大して示
した一例の断面図、第８図は同じく他の例の断面
図である。
１……ワイヤーソー、２……ワイヤー、３……
ビーズ（砥石チツプ）、３ａ……ビーズ基台、４
……溝部、４ａ……凹部、５……ダイヤモンド砥
粒、６……取り付け用孔。
Fig. 1 is a perspective view showing a part of the wire saw according to the present invention, Fig. 2 is a perspective view showing a first embodiment of beads used in the wire saw, and Fig. 3 shows the main parts of the beads. Cross-sectional view of an example enlarged, No. 4
The figure is a cross-sectional view of another example, FIG. 5 is a perspective view of a bead of the second embodiment, FIG. 6 is a perspective view of a bead of the third embodiment, and FIG. 7 is an enlarged view of the main part of the same bead. FIG. 8 is a sectional view of another example. 1... wire saw, 2... wire, 3...
Beads (grindstone chip), 3a...Bead base, 4
...Groove portion, 4a...Recessed portion, 5...Diamond abrasive grain, 6...Mounting hole.
Claims (1)
凸部全面に亘つて砥粒を固定したことを特徴とす
るワイヤーソー。 (2) 砥粒を電着手段により固定した請求項(1)記
載のワイヤーソー。 (3) 凹凸面の形成が、リング状又は螺旋状の溝
部もしくは凹部である請求項(1)又は(2)記載のワ
イヤーソー。[Claims for Utility Model Registration] (1) A wire saw characterized in that an uneven portion is formed on the surface of a bead base, and abrasive grains are fixed over the entire surface of the uneven portion. (2) The wire saw according to claim (1), wherein the abrasive grains are fixed by electrodeposition means. (3) The wire saw according to claim (1) or (2), wherein the uneven surface is formed as a ring-shaped or spiral groove or recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7706889U JPH0319626U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7706889U JPH0319626U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0319626U true JPH0319626U (en) | 1991-02-26 |
Family
ID=31619107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7706889U Pending JPH0319626U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0319626U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002233963A (en) * | 2001-02-02 | 2002-08-20 | Tadao Ishikawa | Wire saw and its manufacturing method |
| JP2006043814A (en) * | 2004-08-04 | 2006-02-16 | Asahi Diamond Industrial Co Ltd | Wire saw and beads for wire saw |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135414A (en) * | 1987-11-20 | 1989-05-29 | Sanwa Daiyamondo Kogyo Kk | Cutting tool |
-
1989
- 1989-06-30 JP JP7706889U patent/JPH0319626U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135414A (en) * | 1987-11-20 | 1989-05-29 | Sanwa Daiyamondo Kogyo Kk | Cutting tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002233963A (en) * | 2001-02-02 | 2002-08-20 | Tadao Ishikawa | Wire saw and its manufacturing method |
| JP2006043814A (en) * | 2004-08-04 | 2006-02-16 | Asahi Diamond Industrial Co Ltd | Wire saw and beads for wire saw |
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