JP2010058032A - Dust collector for sheet work - Google Patents

Dust collector for sheet work Download PDF

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JP2010058032A
JP2010058032A JP2008225516A JP2008225516A JP2010058032A JP 2010058032 A JP2010058032 A JP 2010058032A JP 2008225516 A JP2008225516 A JP 2008225516A JP 2008225516 A JP2008225516 A JP 2008225516A JP 2010058032 A JP2010058032 A JP 2010058032A
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wafer workpiece
dust
suction port
sheet work
wafer
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JP4834047B2 (en
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Hiroshi Uzawa
啓 宇澤
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TAKUSHOO KK
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TAKUSHOO KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a dust collector for a sheet work which can feed the sheet work smoothly by preventing the sheet work from being adsorbed by an air spraying opening. <P>SOLUTION: A lower dust-removing head 1 corresponding to the lower surface M<SB>1</SB>of the sheet work M is disposed to remove dust R attached to the sheet work M. The lower dust-removing head 1 has an upstream suction inlet 3 and a downstream suction inlet 4 for sucking air and the dust R, and a lower spraying nozzle 6 arranged between the upstream suction inlet 3 and the downstream suction inlet 4 and having a discharge slit 5 for spraying air. In the front and back vicinities of the discharge slit 5, sheet work contact preventing rotors 7 are attached which prevents the sheet work M from contacting the upper surface 9a of the body 9 of the lower dust-removing head 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、枚葉ワークの除塵装置に関する。   The present invention relates to a dust removing device for a single-wafer workpiece.

従来、枚葉ワークの除塵装置として、枚葉ワークにエアーを噴出・吸入して塵を除去するものがある（例えば、特許文献１参照）。   2. Description of the Related Art Conventionally, there is a single-wafer workpiece dust removing device that removes dust by blowing and sucking air into and out of a single-wafer workpiece (for example, see Patent Document 1).

しかし、従来の枚葉ワークは厚さ寸法が 0.5mm〜 2.8mmだったところ、近年の枚葉ワークは0.2mm 〜0.3mm と薄肉化しており、枚葉ワークがたわみやすいという欠点があった。さらに、図５（Ａ）に示すように、エアーの噴出口Ｅから流速が大きいエアーが噴出されると、上述の薄肉の枚葉ワークＸがベルヌーイの原理にもとづいて図５（Ｂ）から（Ａ）のように下方のエアーの噴出口Ｅの近傍に吸着して送りが止まるという欠点があった。図５（Ｂ）は、枚葉ワークＸが吸着する直前のエアーの流れを示し、このとき、ベルヌーイの原理によって、枚葉ワークＸに吸着力Ｆがはたらく。
特許第３９７５２０５号公報 However, the conventional single-wafer workpiece has a thickness of 0.5 mm to 2.8 mm. However, in recent years, the single-wafer workpiece has been thinned to 0.2 mm to 0.3 mm, and the single-wafer workpiece has a drawback of being easily bent. Further, as shown in FIG. 5 (A), when air with a high flow velocity is ejected from the air ejection port E, the thin single-wafer workpiece X is based on Bernoulli's principle from FIG. 5 (B) ( As in A), there is a drawback that the feeding stops by adsorbing in the vicinity of the lower air outlet E. FIG. 5B shows the flow of air immediately before the single-wafer workpiece X is adsorbed. At this time, the adsorption force F acts on the single-wafer workpiece X according to the Bernoulli principle.
Japanese Patent No. 3975205

解決しようとする課題は、枚葉ワークがたわむ点である。また、枚葉ワークがエアーの噴出口の近傍に吸着して送りが止まる点である。   The problem to be solved is that the single wafer work bends. In addition, the sheet work is attracted to the vicinity of the air outlet and feeding stops.

そこで、本発明に係る枚葉ワークの除塵装置は、枚葉ワークに付着した塵を取り除くために該枚葉ワークの下面に対応して下除塵ヘッドを設け、該下除塵ヘッドが、エアー・塵を吸入する上流側吸入口と下流側吸入口と、該上流側吸入口と下流側吸入口との間に設けられると共にエアーを噴出する吐出スリットを有する下噴出ノズルと、を備え、上記吐出スリットの前後各近傍に、上記枚葉ワークが下除塵ヘッド本体の上面に接触するのを防ぐための枚葉ワーク接触防止回転体を空転自在に付設したものである。
また、上記枚葉ワーク接触防止回転体の直径寸法Ｄを 2.0mm≦Ｄ≦ 4.0mmに設定するとともに、上記吐出スリットと上記枚葉ワーク接触防止回転体の軸心との距離寸法Ｗを 2.1mm≦Ｗ≦ 3.0mmに設定したものである。 Therefore, the dust removal apparatus for a single-wafer workpiece according to the present invention is provided with a lower dust removal head corresponding to the lower surface of the single-wafer workpiece in order to remove dust adhering to the single-wafer workpiece, An upstream suction port and a downstream suction port for sucking air, and a lower ejection nozzle provided between the upstream suction port and the downstream suction port and having a ejection slit for ejecting air. In the vicinity of the front and rear, a single-wafer workpiece contact prevention rotating body for preventing the single-wafer workpiece from coming into contact with the upper surface of the lower dust removing head main body is attached to be freely rotatable.
In addition, the diameter dimension D of the single-piece workpiece contact prevention rotator is set to 2.0 mm ≦ D ≦ 4.0 mm, and the distance dimension W between the discharge slit and the axis of the single-piece workpiece contact prevention rotator is 2.1 mm. ≦ W ≦ 3.0 mm is set.

本発明の枚葉ワークの除塵装置によれば、特に薄肉の枚葉ワーク（例えば、 0.2〜 0.3mm程度のガラス）がたわむことを防止することができ、枚葉ワークがエアーの噴出口の近傍に吸着することを防止して、スムーズに枚葉ワークに送りを与えることができる。   According to the dust removal apparatus for a single-wafer workpiece of the present invention, it is possible to prevent a thin-walled single-wafer workpiece (for example, glass having a thickness of about 0.2 to 0.3 mm) from being bent, and the single-wafer workpiece is in the vicinity of an air outlet. Therefore, the sheet can be fed smoothly.

図１〜図４は、本発明の実施の一形態を示し、この枚葉ワークの除塵装置は、（例えばガラスから成る）枚葉ワークＭの両面に（下除塵ヘッド１及び上除塵ヘッド２から）エアーを吹き付けたのち吸入して、枚葉ワークＭに付着した塵Ｒを両面同時に除去するように構成されている。すなわち、枚葉ワークＭに付着した塵Ｒを取り除くために枚葉ワークＭの下面Ｍ1 に対応して下除塵ヘッド１が設けられるとともに、枚葉ワークＭの上面Ｍ2 に対応して上除塵ヘッド２が設けられる。 1 to 4 show an embodiment of the present invention. A dust removing device for a single-wafer workpiece is provided on both surfaces (for example, made of glass) of a single-wafer workpiece M (from a lower dust removing head 1 and an upper dust removing head 2). ) Air is blown and then sucked to remove dust R adhering to the single-wafer workpiece M on both sides simultaneously. That is, in order to remove the dust R adhering to the single-wafer workpiece M, the lower dust removing head 1 is provided corresponding to the lower surface M 1 of the single-wafer workpiece M, and the upper dust removal corresponding to the upper surface M 2 of the single-wafer workpiece M. A head 2 is provided.

下除塵ヘッド１が、エアー・塵Ｒを吸入する上流側吸入口３と下流側吸入口４と、上流側吸入口３と下流側吸入口４との間に設けられると共にエアーを噴出する吐出スリット５を有する下噴出ノズル６と、を備える。   The lower dust removing head 1 is provided between the upstream suction port 3 and the downstream suction port 4 for sucking air / dust R, and between the upstream suction port 3 and the downstream suction port 4 and discharges the air. And a lower jet nozzle 6 having 5.

吐出スリット５の前後各近傍に、枚葉ワークＭが下除塵ヘッド本体９の上面９ａに接触するのを防ぐための枚葉ワーク接触防止回転体７が空転自在に付設されている。枚葉ワーク接触防止回転体７は、図４（Ａ）に示すようなミニチュアベアリングに樹脂コーティングしたもの、ミニチュアベアリングにセラミックコーティングしたもの、又は、セラミック等から成る。あるいは、図４（Ｂ）のように各枚葉ワーク接触防止回転体７が、孔付の複数の短筒体７ａとこれを串挿状に挿通した枢支軸７ｂから構成する。   Near each of the front and rear sides of the discharge slit 5, a single-wafer workpiece contact prevention rotating body 7 for preventing the single-wafer workpiece M from coming into contact with the upper surface 9a of the lower dust removing head main body 9 is attached to be freely rotatable. The single-piece workpiece contact prevention rotating body 7 is made of a miniature bearing as shown in FIG. 4A, which is resin-coated, a miniature bearing which is ceramic-coated, or ceramic. Alternatively, as shown in FIG. 4 (B), each single-wafer workpiece contact preventing rotating body 7 is composed of a plurality of short cylindrical bodies 7a with holes and pivot shafts 7b that are inserted in a skewered manner.

枚葉ワーク接触防止回転体７の直径寸法Ｄが 2.0mm≦Ｄ≦ 4.0mmに設定されている。直径寸法ＤがＤ＜ 2.0mmの場合、突出高さＨが小さくなり、枚葉ワークＭが吐出スリット５に吸着される虞れがある。直径寸法Ｄが 4.0mm＜Ｄの場合、吐出スリット５と枚葉ワーク接触防止回転体７の軸心８との距離寸法Ｗが大きくなり、枚葉ワークＭが吐出スリット５に吸着される虞れがある。   The diameter D of the single-piece workpiece contact preventing rotating body 7 is set to 2.0 mm ≦ D ≦ 4.0 mm. When the diameter dimension D is D <2.0 mm, the protrusion height H becomes small, and there is a possibility that the single-wafer workpiece M is attracted to the discharge slit 5. When the diameter dimension D is 4.0 mm <D, the distance dimension W between the discharge slit 5 and the axis 8 of the single-piece workpiece contact prevention rotating body 7 is increased, and the single-piece workpiece M may be attracted to the discharge slit 5. There is.

吐出スリット５と枚葉ワーク接触防止回転体７の軸心８との距離寸法Ｗが 2.1mm≦Ｗ≦ 3.0mmに設定されている。距離寸法ＷがＷ＜ 2.1mmの場合、下噴出ノズル６の形成部６ａが強度不足になる虞れがある。距離寸法Ｗが 3.0mm＜Ｗの場合、枚葉ワークＭが吐出スリット５に吸着される虞れがある。   The distance dimension W between the discharge slit 5 and the shaft center 8 of the single-wafer workpiece contact prevention rotating body 7 is set to 2.1 mm ≦ W ≦ 3.0 mm. When the distance dimension W is W <2.1 mm, the formation portion 6a of the lower ejection nozzle 6 may be insufficient in strength. When the distance dimension W is 3.0 mm <W, the single-wafer workpiece M may be attracted to the discharge slit 5.

枚葉ワーク接触防止回転体７の下除塵ヘッド本体９からの突出高さＨが 1.0mm≦Ｈ≦ 2.1mmに設定されている。突出高さＨが 1.0mm＜Ｈの場合、枚葉ワークＭが吐出スリット５に吸着される虞れがある。突出高さＨが 2.1mm＜Ｈの場合、枚葉ワーク接触防止回転体７を下除塵ヘッド本体９に付設するのが困難になる。   The protrusion height H from the lower dust removing head main body 9 of the single-wafer workpiece contact preventing rotating body 7 is set to 1.0 mm ≦ H ≦ 2.1 mm. When the protrusion height H is 1.0 mm <H, there is a possibility that the single-wafer workpiece M is attracted to the discharge slit 5. When the protrusion height H is 2.1 mm <H, it is difficult to attach the single-wafer workpiece contact preventing rotating body 7 to the lower dust removing head body 9.

ところで、図１〜図３に於て、他の構成を説明すると、10は超音波発生用溝部を示す。枚葉ワークＭは、図１・図２の矢印Ｙ方向に流れる。そして、受けローラ13、受けローラ11、受けローラ12、受けローラ14に支持される。上流側吸入口３は、内側吸入口31及び外側吸入口32から成る。下流側吸入口４は、内側吸入口41及び外側吸入口42から成る。   By the way, in FIG. 1 to FIG. 3, another configuration will be described. Reference numeral 10 denotes an ultrasonic wave generating groove. The single-wafer workpiece M flows in the direction of the arrow Y in FIGS. Then, it is supported by the receiving roller 13, the receiving roller 11, the receiving roller 12, and the receiving roller 14. The upstream suction port 3 includes an inner suction port 31 and an outer suction port 32. The downstream suction port 4 includes an inner suction port 41 and an outer suction port 42.

なお、本発明は、設計変更可能であって、例えば、上除塵ヘッド２を省略するも良い。   The design of the present invention can be changed, and for example, the upper dust removing head 2 may be omitted.

以上のように、本発明は、枚葉ワークＭに付着した塵Ｒを取り除くために枚葉ワークＭの下面Ｍ1 に対応して下除塵ヘッド１を設け、下除塵ヘッド１が、エアー・塵Ｒを吸入する上流側吸入口３と下流側吸入口４と、上流側吸入口３と下流側吸入口４との間に設けられると共にエアーを噴出する吐出スリット５を有する下噴出ノズル６と、を備え、吐出スリット５の前後各近傍に、枚葉ワークＭが下除塵ヘッド本体９の上面９ａに接触するのを防ぐための枚葉ワーク接触防止回転体７を空転自在に付設したので、枚葉ワークＭがたわむことを防止することができる。また、枚葉ワークＭがエアーの噴出口（下噴出ノズル６）の近傍に吸着することを防止して、スムーズに枚葉ワークＭに送りを与えることができる。
また、枚葉ワーク接触防止回転体７の直径寸法Ｄを 2.0mm≦Ｄ≦ 4.0mmに設定するとともに、吐出スリット５と枚葉ワーク接触防止回転体７の軸心８との距離寸法Ｗを 2.1mm≦Ｗ≦ 3.0mmに設定したので、枚葉ワークＭがエアーの噴出口（下噴出ノズル６）に吸着することを確実に防止して、スムーズに枚葉ワークＭに送りを与えることができる。 As described above, the present invention provides the lower dust removing head 1 corresponding to the lower surface M 1 of the single-wafer workpiece M in order to remove the dust R adhering to the single-wafer workpiece M. An upstream suction port 3 and a downstream suction port 4 for sucking R; a lower ejection nozzle 6 provided between the upstream suction port 3 and the downstream suction port 4 and having a discharge slit 5 for ejecting air; And a single-wafer workpiece contact prevention rotating body 7 for preventing the single-wafer workpiece M from coming into contact with the upper surface 9a of the lower dust removing head body 9 is attached to the front and rear of the discharge slit 5 so as to be freely rotatable. It is possible to prevent the leaf work M from being bent. Further, it is possible to prevent the single-wafer workpiece M from being adsorbed in the vicinity of the air ejection port (lower ejection nozzle 6), and to smoothly feed the single-wafer workpiece M.
Further, the diameter dimension D of the single-piece workpiece contact prevention rotating body 7 is set to 2.0 mm ≦ D ≦ 4.0 mm, and the distance dimension W between the discharge slit 5 and the axis 8 of the single-piece workpiece contact prevention rotation body 7 is 2.1. Since mm ≦ W ≦ 3.0 mm is set, it is possible to reliably prevent the single-wafer workpiece M from adsorbing to the air outlet (lower ejection nozzle 6) and to smoothly feed the single-wafer workpiece M. .

本発明の実施の一形態の使用状態を示す平面図である。It is a top view which shows the use condition of one Embodiment of this invention. 要部拡大正面図である。It is a principal part enlarged front view. さらなる要部拡大正面図である。It is a further principal part expansion front view. 枚葉ワーク接触防止回転体の実施例を示す斜視図である。It is a perspective view which shows the Example of the single-piece | work workpiece contact prevention rotary body. 従来例を示す要部断面正面図である。It is a principal part cross-sectional front view which shows a prior art example.

符号の説明Explanation of symbols

１ 下除塵ヘッド
３ 上流側吸入口
４ 下流側吸入口
５ 吐出スリット
６ 下噴出ノズル
７ 枚葉ワーク接触防止回転体
８ 軸心
９ 下除塵ヘッド本体
９ａ 上面
Ｄ 直径寸法
Ｍ 枚葉ワーク
Ｍ1 下面
Ｒ 塵
Ｗ 距離寸法 1 lower dust removing head 3 upstream suction port 4 downstream suction port 5 discharge slit 6 bottom spray nozzle 7 leaves the workpiece contact prevents the rotary body 8 axis 9 under dust removing head body 9a top D diameter M leaves the workpiece M 1 lower surface R Dust W Distance dimension

Claims (2)

枚葉ワーク（Ｍ）に付着した塵（Ｒ）を取り除くために該枚葉ワーク（Ｍ）の下面（Ｍ1 ）に対応して下除塵ヘッド（１）を設け、該下除塵ヘッド（１）が、エアー・塵（Ｒ）を吸入する上流側吸入口（３）と下流側吸入口（４）と、該上流側吸入口（３）と下流側吸入口（４）との間に設けられると共にエアーを噴出する吐出スリット（５）を有する下噴出ノズル（６）と、を備え、上記吐出スリット（５）の前後各近傍に、上記枚葉ワーク（Ｍ）が下除塵ヘッド本体（９）の上面（９ａ）に接触するのを防ぐための枚葉ワーク接触防止回転体（７）を空転自在に付設したことを特徴とする枚葉ワークの除塵装置。 In order to remove dust (R) adhering to the single-wafer workpiece (M), a lower dust removal head (1) is provided corresponding to the lower surface (M 1 ) of the single-wafer workpiece (M), and the lower dust removal head (1) Are provided between the upstream suction port (3) and the downstream suction port (4) for sucking air and dust (R), and between the upstream suction port (3) and the downstream suction port (4). And a lower ejection nozzle (6) having a ejection slit (5) for ejecting air, and the single-wafer workpiece (M) is disposed in the vicinity of the front and rear of the ejection slit (5). A single-wafer workpiece dust removing device, wherein a single-wafer workpiece contact prevention rotating body (7) for preventing contact with the upper surface (9a) of the steel sheet is attached freely. 上記枚葉ワーク接触防止回転体（７）の直径寸法（Ｄ）を 2.0mm≦Ｄ≦ 4.0mmに設定するとともに、上記吐出スリット（５）と上記枚葉ワーク接触防止回転体（７）の軸心（８）との距離寸法（Ｗ）を 2.1mm≦Ｗ≦ 3.0mmに設定した請求項１記載の枚葉ワークの除塵装置。   The diameter dimension (D) of the single-wafer workpiece contact preventing rotator (7) is set to 2.0 mm ≦ D ≦ 4.0 mm, and the discharge slit (5) and the shaft of the single-wafer workpiece contact preventing rotator (7). The dust removal apparatus for a single-wafer workpiece according to claim 1, wherein the distance (W) to the core (8) is set to 2.1 mm ≤ W ≤ 3.0 mm.
JP2008225516A 2008-09-03 2008-09-03 Single-wafer workpiece dust remover Active JP4834047B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015223532A (en) * 2014-05-26 2015-12-14 有限会社タクショー Dust collector for sheet work-piece
CN114130757A (en) * 2020-09-03 2022-03-04 拓秀有限会社 Cleaner head

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108677A (en) * 1986-10-24 1988-05-13 Toshiba Battery Co Ltd Packed battery system
JPS6433773A (en) * 1987-07-30 1989-02-03 Hitachi Ltd Data falsification checking system
JP2003332401A (en) * 2002-05-09 2003-11-21 Hugle Electronics Inc Substrate conveying and dust cleaning device
JP2004167494A (en) * 2004-03-11 2004-06-17 Takushoo:Kk Foreign matter removing apparatus for sheet work
JP2006278713A (en) * 2005-03-29 2006-10-12 Dainippon Screen Mfg Co Ltd Apparatus for cleaning substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108677A (en) * 1986-10-24 1988-05-13 Toshiba Battery Co Ltd Packed battery system
JPS6433773A (en) * 1987-07-30 1989-02-03 Hitachi Ltd Data falsification checking system
JP2003332401A (en) * 2002-05-09 2003-11-21 Hugle Electronics Inc Substrate conveying and dust cleaning device
JP2004167494A (en) * 2004-03-11 2004-06-17 Takushoo:Kk Foreign matter removing apparatus for sheet work
JP2006278713A (en) * 2005-03-29 2006-10-12 Dainippon Screen Mfg Co Ltd Apparatus for cleaning substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015223532A (en) * 2014-05-26 2015-12-14 有限会社タクショー Dust collector for sheet work-piece
CN114130757A (en) * 2020-09-03 2022-03-04 拓秀有限会社 Cleaner head

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