JP2004167494A - Foreign matter removing apparatus for sheet work - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a foreign matter removing apparatus for a sheet work capable of reliably removing dust from the sheet work at a low cost without damaging a product. <P>SOLUTION: The foreign matter removing apparatus is equipped with a dust removal head for removing the dust R sticking to a sheet work 1. The removal head is equipped with: an upstream side dust suction port 3 and downstream side dust suction port 4 for sucking the air/dust R; and a jet nozzle 5 disposed between the port 3 and the port 4 and for ejecting air. The apparatus is also equipped with: a transport roller 46 which is located on the upstream side of the dust removal head, supports the sheet work 1 and feeds the work to the dust removal head; and a transport roller 46 which is located on the downstream side of the dust removal head, supports the sheet work 1 and feeds the work from the dust removal head to the downstream side. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an apparatus for removing foreign matter from a single-wafer work.

Conventionally, as shown in FIG. 7, when sucking and removing (cleaning) dust r by sucking air from the single-wafer work 51, the single-wafer work 51 is fixed so that the single-wafer work 51 is not necessarily attracted to the dust removing device 52. For this purpose, a clamp mechanism such as a suction table 54 to which a vacuum pump 57 is connected is required (for example, see Patent Document 1). In addition, ancillary equipment such as a loader 55 and an unloader 56 for transferring and receiving the single-wafer workpiece 51 to and from these devices are also provided in the middle of the transport rollers 53.
Japanese Utility Model Publication No. 5-80573

However, in the configuration of the conventional dust removing apparatus as described above, the structure and operation of the equipment are complicated, the installation of the dust removal apparatus requires cost, and the installation of the additional equipment requires a large space. However, there is a problem that the existing line needs to be significantly remodeled.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a single-wafer work foreign matter removing apparatus capable of removing dust from both surfaces of a single-wafer work reliably and without damaging the product at low cost.

The foreign matter removing device for a single-wafer work according to the present invention is a foreign matter removing device provided with a dust removing head for removing dust attached to the single-wafer work, wherein the dust removing head includes an upstream dust sucking air and dust. A suction port, a downstream dust suction port, and an ejection nozzle that is provided between the upstream dust suction port and the downstream dust suction port and that ejects air. A transport roller for placing the leaf work and sending it to the dust removal head, and a transport roller for loading the single-wafer work and sending it downstream from the dust removal head, downstream of the dust removal head. is there.
Further, in the foreign matter removing device provided with a dust removing head for removing dust attached to the single-wafer work, the dust removing head includes an upstream dust suction port for sucking air and dust, and a downstream dust suction port. An ejection nozzle that is provided between an upstream dust intake port and a downstream dust intake port and that ejects air, wherein the upstream dust intake port and the downstream dust intake port of the dust removing head and an upstream / downstream direction At the same position, there is provided an upstream supporting rotary body and a downstream supporting rotary body that support the single-wafer work so as not to contact the upstream dust suction port and the downstream dust suction port.
Further, in a foreign matter removing device provided with a dust removing head for removing dust attached to a single-wafer work, the dust removing head includes an upstream dust inlet for sucking air and dust, a downstream dust inlet, An ejection nozzle that is provided between the upstream dust intake port and the downstream dust intake port and ejects air, and is rotatably attached to an upstream end and a downstream end of the casing of the dust removing head. The apparatus is provided with an upstream sub-support rotary body and a downstream sub-support rotary body on which the single-wafer work is placed.

Further, in a foreign matter removing device for removing dust attached to a single-wafer work, a lower dust-removing head and an upper dust-removal head disposed on both lower and upper surfaces of the single-wafer work are mounted. An upstream transport roller that sends the sheet work between the two heads, and a downstream transport roller that sends the sheet work downstream from between the heads, wherein the lower dust removing head and the upper dust removing head, An upstream dust intake port and a downstream dust intake port for sucking air and dust, respectively, and an ejection nozzle provided between the upstream dust intake port and the downstream dust intake port for ejecting air are provided. It is a thing.
In a foreign matter removing device for removing dust adhered to a single-wafer work, a lower dust-removal head and an upper dust-removal head are provided on the lower and upper surfaces of the single-wafer work, respectively. An upstream dust suction port for sucking air and dust, a downstream dust suction port, and a jet nozzle that is provided between the upstream dust suction port and the downstream dust suction port and that jets air, The single-wafer work is supported at the same position in the upstream and downstream direction of the upstream dust suction port and the downstream dust suction port of the lower dust removal head so as not to contact the upstream dust suction port and the downstream dust suction port. It is provided with an upstream supporting rotator and a downstream supporting rotator.
In a foreign matter removing device for removing dust adhered to a single-wafer work, a lower dust-removal head and an upper dust-removal head are provided on the lower and upper surfaces of the single-wafer work, respectively. An upstream dust intake port and a downstream dust intake port for inhaling air and dust, and an ejection nozzle that is provided between the upstream dust intake port and the downstream dust intake port and that ejects air, An upstream sub-support rotator and a downstream sub-support rotator that are rotatably attached at the upstream end and the downstream end of the casing of the lower dust removal head and on which the single-wafer work is mounted. .

  ADVANTAGE OF THE INVENTION According to the foreign material removal device of the single-wafer work of this invention, a predetermined clearance is provided between a single-wafer work and a dust suction port, without making a single-wafer work contact a dust removal head, and the clearance is always kept constant The dust removal operation can be performed while keeping the dust, and the dust can be reliably removed from the single-wafer work. In addition, it is possible to prevent the single wafer work from being damaged.

  Hereinafter, the present invention will be described in detail based on the illustrated embodiments.

  FIG. 1 is a cross-sectional side view of an embodiment of a dust remover according to the present invention, and FIG. 2 is an enlarged cross-sectional side view of a main part of the dust remover. This apparatus removes (cleans) dust R adhered to a flat thin film rectangular plate-like single work 1 (base material) such as a running glass substrate. It is installed so as to intersect with the traveling path of the transport means 45 that is placed and sent.

  The single-wafer work 1 is a glass substrate used particularly in the LCD (liquid crystal display) and PDP (plasma display) industries, and the thickness of the glass substrate is 0.5 mm to 3.0 mm. Other examples include a printed substrate of an insulating plate, a substrate serving as a board inside a computer, and a sheet of a thin plate such as paper, film, or aluminum foil.

  As shown in FIGS. 1 and 2, the dust removing apparatus includes a lower dust removing head 2 and an upper dust removing head 2 'on the lower and upper surfaces of the single-wafer work 1, and a blower unit (not shown). The lower dust removing head 2 is provided between the upstream dust suction port 3 and the downstream dust suction port 4 and between the upstream dust suction port 3 and the downstream dust suction port 4 and ejects an ultrasonic air E. The upper dust removing head 2 'has an upstream dust suction port 3', a downstream dust suction port 4 ', and a space between the upstream dust suction port 3' and the downstream dust suction port 4 '. And an ejection nozzle 5 ′ for ejecting the ultrasonic air E. Further, the lower and upper dust removing heads 2 and 2 'are provided on the lower and upper surfaces of the single-wafer work 1, and the dust suction ports 3, 3' and 4, 4 'and the jet nozzles 5 and 5' are described later in detail. Are arranged so as to be substantially symmetric.

  Specifically, the lower (upper) dust removing head 2 (2 ′) includes a casing 6 (6 ′) disposed in a direction perpendicular to the traveling direction of the single-wafer work 1 and a casing 6 (6 ′). ). The casing 6 (6 ') has two negative pressure chambers 8, 8 (8', 8 ', 8) which are defined by partition walls 7, 7 (7', 7 ') in the cross-sectional shape. 8 ') and an extruded rectangular section 10 (10') having a positive pressure chamber 9 (9 ') located between the two negative pressure chambers 8, 8 (8', 8 '); And both end caps, not shown, which cover and fix both ends. The ultrasonic generators are disposed in the positive pressure chamber 9 (9 ') of the rectangular cylindrical portion 10 (10') so as to extend over the entire length of the dust removing head 2 (2 ').

  Further, an air suction path (not shown) for sucking air (air) from the negative pressure chamber 8 is connected to the negative pressure chamber 8 of the lower dust removing head 2, and the positive pressure chamber 9 is provided inside the positive pressure chamber 9. An air supply passage (not shown) for supplying positive-pressure air to the air passage is connected to the air supply passage. Then, air is supplied from the blower unit to the positive pressure chamber 9 via the air supply path, and the ultrasonic air E is ejected from the ejection nozzle 5, and the air / dust R is sucked from the upstream / downstream dust suction ports 3, 4. The air / dust R in the negative pressure chamber 8 is configured to return to the blower unit via an air suction path, a dust filter, and the like. Further, the upper dust removing head 2 'has the same configuration and achieves the same operation.

  FIG. 3 shows a plan view of the lower dust removing head 2. As shown in FIGS. 1, 2 and 3, the upstream and downstream dust suction ports 3 and 4 of the lower dust removing head 2 are separated in the upstream and downstream directions (with a branch portion B), respectively, and are arranged in parallel. It is formed from a book inlet. Then, as shown in FIG. 2, the innermost suction ports 31 and 41 on the upstream and downstream sides are respectively disposed so as to be symmetrical with the upper and lower dust suction ports 3 ′ and 4 ′ on the upper dust removing head 2 ′. ing. That is, both outer suction ports 32 and 42 of the upper and lower dust suction ports 3 and 4 of the lower dust removing head 2 are upstream inlets of the upper and lower dust removing ports 2 ′ and 4 ′, respectively. Side and downstream exit side.

Thereby, when the single-wafer work 1 approaches the upstream dust inlets 3 and 3 'of the lower upper dust removal heads 2 and 2', and when the single-work 1 separates from the downstream dust inlets 4 and 4 '. Since the single-wafer work approaches and separates from the lower dust-removal head 2 while being pressed against the lower dust-removal head 2, the thin single-wafer work 1 is always reliably moved to the lower dust-removal head side without vibrating vertically due to the vertical suction force. the it can be placed with a gap G _2, enables stable dust removal operation is not scratch the product.

  As shown in FIGS. 1, 2 and 3, the sheet work 1 is placed at the same position in the upstream and downstream dust suction ports 3 and 4 in the upper and downstream direction (feed direction of the sheet work 1). An upstream supporting rotary body 11 and a downstream supporting rotary body 12 that support the lower dust removing head 2 so as not to contact the upstream and downstream dust suction ports 3 and 4 are provided. That is, the upstream dust suction port 3 and the upstream support rotating body 11 are arranged on substantially the same line in the width direction of the single-wafer workpiece 1 and side by side with the upstream dust suction port 3. The downstream-side dust suction port 4 and the downstream-side support rotating body 12 are arranged on substantially the same line in the width direction of the single-wafer workpiece 1 and side by side with the downstream-side dust suction port 4. Further, it is preferable that the suction ports 3 and 4 are arranged near the center of the supporting rotating bodies 11 and 12.

That is, the upstream supporting rotary member 11 and the downstream supporting rotary member 12 have a protruding height H from the upper surfaces of the suction ports 3 and 4 of the lower dust removing head 2, and the lower dust removing head 2 has the arm members 16, 16. 16 is rotatably pivoted via, the respective protrusion by 17 sheet workpiece 1 and the lower dust removing head 2 may have a gap G _2.

Thus, sheet workpiece 1 without contact with the lower dust removing head 2, with a predetermined gap G ₂ to the sheet workpiece 1 and the dust suction port 3 and 4 and, always constant the gap G ₂ The dust removal operation can be performed while keeping the dust, and the dust R can be reliably removed from both surfaces of the single-wafer work 1. Moreover, it is possible to prevent the single-wafer work 1 from being damaged.

The suction ports 3 ′ and 4 ′ of the upper dust removing head 2 ′ are arranged at positions above the single-wafer work 1 and have a gap G ₁ with the single-wafer work 1. In addition, the opening position (height) of the suction port and the opening position (height) of the ejection port are arranged on substantially the same horizontal plane in both the upper dust removing head 2 'and the lower dust removing head 2.

  In addition, an upstream sub-supporting rotator 13 and a downstream sub-supporting rotator 14 are provided on the upstream and downstream sides (both sides in the side view) of the lower dust removing head 2. These may be provided with a rotating shaft in the casing 6 of the lower dust removing head 2 as shown in FIG. 2 and may be rotatable, and as shown in FIG. It may be pivoted. The sub-rotating members 13 and 14 can be placed in the height direction in contact with the single-wafer work 1, and the contact points (lines) of the sub-rotating members 11 and 12 are in contact with the single-wafer work 1. It is arranged to be at the same height as the point (line). That is, the single-wafer work 1 is set so as to be (horizontally) flush with the support rotating bodies 11 and 12 and the sub-supporting rotating bodies 13 and 14. The installation positions in the width direction of the sub support rotators 13 and 14 are set to correspond to the arrangement of the upstream support rotator 11 to the downstream support rotator 12, as shown in FIG.

  As shown in the plan view of FIG. 3, the upstream dust suction port 3 and the downstream dust suction port 4 of the lower dust removal head 2 are constituted by a plurality of slits in the width direction perpendicular to the traveling direction of the single-wafer work 1. ing. The upstream dust suction port 3 and the downstream dust suction port 4 are arranged in a staggered manner in the width direction, and when the single-wafer work 1 is passed through the dust removing device, it extends over the entire width of the single-wafer work 1. Thus, it is arranged to pass through at least one of the upstream dust inlet 3 and the downstream dust inlet 4. That is, the single-wafer work 1 always passes through the upstream dust inlet 3 and / or the downstream dust inlet 4 over the entire width. Further, the slit-shaped ejection nozzles 5, 5 'are opened on the single-wafer work 1 side of the positive pressure chambers 9, 9' over the entire length in the longitudinal direction of the rectangular tubular portions 10, 10 '.

  Accordingly, even if the upstream and downstream support rotating bodies 11 and 12 are arranged at the same position in the upstream and downstream directions as the upstream and downstream dust suction ports 3 and 4, the dust R can be removed over the entire width of the single-wafer work 1. The dust R can be reliably removed over the entire surface of the single-wafer work 1.

  The ultrasonic air E, E is ejected from the ejection nozzles 5, 5 'of each of the dust removing heads 2, 2', and the air is introduced into the negative pressure chamber 8 from the dust suction ports 3, 3 ', 4, 4'. Inhalation. Generally, when air flows at a high speed on the surface of an object, a boundary layer is generated. According to this apparatus, the ultrasonic air E, E strikes the front and back surfaces of the single-wafer work 1, so that the boundary layer is destroyed by ultrasonic waves. The high-speed air directly hits the front and back surfaces of the single-wafer work 1, and the dust R is separated from the surface of the work 1 by the effect of a so-called air knife. The separated dust R is sucked into the negative pressure chambers 8 from the dust suction ports 3, 3 ', 4, 4' on the air flow, and further passes through an air suction passage (not shown) to collect a filter or the like. Collected in the dust. Thereby, the dust R can be reliably removed from both the front and back surfaces of the single-wafer work 1.

  Next, the state of the single-wafer work 1 in which the dust R is removed by the removing device will be described. As shown in FIG. 4A, the single-wafer work 1 sent from the upstream side in the direction of arrow A by the transport roller 46 (shown in FIG. 1) ) The dust removing head 2 (2 ') is placed and guided so as not to be in contact with the corner of the dust removing head 2 (2'), and is inserted between the lower and upper dust removing heads 2 and 2 '.

Thereafter, as shown in FIG. 4B, when the leading end 1a of the single-wafer work 1 is sent to a position above the outer suction port 32 of the upstream dust suction port 3, the single-wafer work 1 is moved to the outer suction port. It is held so as to be pressed against the upstream sub-rotating body 13 by the suction force of the suction pressure of 32. That is, the sheet workpiece 1 and the upper dust removing head 2 'and the lower dust removing head 2 is placed and conveyed while maintaining the respective gaps G ₁ and G _2. In this state, the upward suction force from the upstream dust suction port 3 ′ on the upper dust removal head 2 ′ side does not act on the single-wafer work 1.

  At this time, since the single-wafer work 1 is very thin, the distal end portion 1a is bent downward by the downward suction force. However, as shown in FIG. 2, the upstream and downstream protruding width W of the upstream support rotating body 11 is configured to be larger than the upstream and downstream installation width U of the upstream dust suction port 3 of the lower dust removing head 2. Therefore, the front end portion 1a curved downward is guided by the projecting portion 17 of the upstream support rotary member 11 before coming into contact with the upstream dust suction port 3, so that the front end portion 1a is The single-piece work 1 is smoothly conveyed to the downstream side by rotating the support rotating body 11 without contacting the suction port 32).

That is, when the single-wafer work 1 approaches the upstream dust suction ports 3, 3 'of the lower upper dust removing heads 2, 2', and when the single-wafer work 1 separates from the downstream dust suction ports 4, 4 ', single leaf work 1 without contact with the lower dust removing head 2, and makes it easier to convey to the downstream smoothly with a gap G ₂ side and a predetermined sheet workpiece 1 and the dust suction port 3 and 4, dust The work can be performed, and the dust R can be reliably removed from the single-wafer work 1 without damaging the product.

  Here, the upstream-downstream projecting width W of the upstream-side support rotating body 11 is the visible portion of the support rotating body 11 disposed so as to protrude upward from the upper surface of the suction port 3 in a side view (of the dust removing head 2). , That is, the dimension of the projecting portion 17 in the upstream and downstream directions. The upstream and downstream installation width U of the upstream dust inlet 3 is defined as the distance from the most upstream end to the most downstream end of the two openings of the upstream dust inlet 3, that is, from the upstream end of the outer inlet 32. It is the width provided in the upstream / downstream direction up to the downstream end of the innermost suction port 31.

Then, as shown in FIG. 4 (c), when the front end portion 1a of the single-wafer work 1 passes between the facing downstream and upstream dust suction ports 3, 3 ', the dust R is peeled off from the single-wafer work 1. It is drawn into the negative pressure chambers 8, 8 '. At this time, the single-wafer work 1 receives an upward suction force due to the suction pressure of the upstream dust suction port 3 ′ of the upper dust removal head 2 ′, but the upstream side dust suction port 3 (the negative pressure chamber 8) of the lower dust removal head 2. ) side absolute value of the intake negative pressure P ₁ of sets upper dust removing head 2 'of the upstream side dust suction inlet 3' (negative pressure chamber 8 ') side of the larger than the absolute value as the intake negative pressure P ₂ and for that, sheet workpiece 1 is always in the lower dust removing head 2 side at a predetermined gap G ₂ and the upper dust removing head 2 'side with a predetermined gap G _1, is conveyed to be pressed on the upstream side supporting rotator 11 As a result, the single-wafer work 1 does not flutter up and down (vertical vibration), and the ejection and suction of air is performed stably.

As a result, the sheet work 1 is kept pressed by the upstream and downstream support rotating bodies 11 and 12 without separately providing an adsorption device or the like for holding the sheet work 1, so that the sheet work is always placed on the lower dust removing head side. leaf work 1 is can be placed with a gap G _2, it is possible to dust work stable duplex with a simple configuration.

Next, the transport state of the single-wafer work 1 moving away from the removing device will be described. As shown in FIG. 5 (a), the single-wafer workpiece 1 being fed in the direction of arrow A from the upstream side is placed and guided by the downstream supporting rotator 12 and the downstream auxiliary supporting rotator 14, and the ejection nozzle Pass between 5,5 '. At this time, the single-wafer workpiece 1 receives a suction force upward due to the suction pressure of the downstream dust suction port 4 ′ of the upper dust removal head 2 ′, but receives the downstream dust suction port 4 (negative pressure chamber) of the lower dust removal head 2. absolute value of the intake negative pressure P ₁ of 8) side, set to be larger than the absolute value of the 'downstream dust suction port 4' (negative pressure chamber 8 ') the suction side negative pressure P ₂ the upper dust removing head 2 to order that, sheet workpiece 1 is always in the lower dust removing head 2 side at a predetermined gap G ₂ and the upper dust removing head 2 'side with a predetermined gap G _1, conveying to be pressed on the downstream side supporting rotator 12 Since the single-wafer work 1 does not flutter up and down (vertical vibration), the ejection and suction of air are performed stably.

  Thereafter, as shown in FIG. 5 (b), when the rear end 1b of the single-wafer work 1 is sent to a position above the outer suction port 42 of the downstream-side dust suction port 4, the single-wafer work 1 is removed from the upper dust. Since the upward suction force from the downstream dust suction port 4 ′ on the head 2 ′ side does not act on the single-wafer work 1, the suction force of the outer suction port 42 of the lower dust removal head 2 causes the downstream sub-supporting rotary body to rotate. It is held so that it is pressed against the 14 side.

  At this time, since the single-wafer work 1 is very thin, the rear end portion 1b bends downward due to the downward suction force. However, as shown in FIG. 2, the upstream and downstream projecting width W of the downstream support rotary body 12 is configured to be larger than the upstream and downstream installation width U of the downstream dust suction port 4 of the lower dust removing head 2. Therefore, the rear end portion 1b that is curved downward is guided by the protruding portion 18 of the downstream support rotary member 12 before coming into contact with the downstream dust intake port 4, so that the rear end portion 1b is The sheet-feeding work 1 is smoothly conveyed to the downstream side by rotating the downstream-side support rotating body 12 without contacting the (outside suction port 42).

  Then, as shown in FIG. 5C, the rear end 1b of the single-wafer work 1 from which the dust R has been removed on both surfaces is disposed on the downstream sub-supporting rotary member 14, and the single-wafer work 1 is subjected to lower (upper) dust removal. The head 2 (2 ') is placed and guided so as not to be in contact with the corners of the head 2 (2'), and is separated from the space between the lower and upper dust removing heads 2 and 2 '. Then, it is sent to the downstream side by the transport roller 46.

  As shown in FIG. 6, an appropriate number of the conveying rollers 46 forming the existing conveying means 45 are removed from the production line, and the lower dust removing head 2 is installed in the space, so as to correspond to this. The upper dust removing head 2 'may be arranged above the transport roller 46.

  This eliminates the need for additional equipment for transferring the single-wafer work 1 other than the lower and upper dust removal heads 2 and 2 ', and can be installed on the existing production line, and can be easily installed even in a narrow space. As a result, it is possible to make the equipment compact and reduce the capital investment cost.

FIG. 1 is a side sectional view showing one embodiment of a foreign matter removing device of the present invention. It is an expanded side sectional view of a foreign material removal device. It is a top view of a lower dust removal head. It is a side sectional view explaining work which removes dust. It is a side sectional view explaining work which removes dust. FIG. 6 is a side sectional view showing another embodiment of the foreign matter removing device of the present invention. It is a side sectional view showing an example of the conventional foreign substance removal device.

Explanation of reference numerals

Reference Signs List 1 single-sheet work 2 lower dust removing head 2 'upper dust removing head 3 upstream dust inlet 3' upstream dust inlet 4 downstream dust inlet 4 'downstream dust inlet 5 ejection nozzle 5' ejection nozzle 6 casing
11 Upstream support rotating body
12 Downstream support rotating body
13 Upstream sub-support rotator
14 Downstream sub support rotator
46 Transport roller R dust

Claims (6)

  In a foreign matter removing device provided with a dust removing head for removing dust (R) adhered to a single-wafer work (1), the dust removing head includes an upstream dust inlet (3) for sucking air and dust (R). ), A downstream dust suction port (4), and a jet nozzle (5) provided between the upstream dust suction port (3) and the downstream dust suction port (4) and for jetting air. A transport roller (46) for placing the single-wafer work (1) on the upstream side of the dust-removal head and sending the work to the dust-removal head; and loading the single-wafer work (1) on the downstream side of the dust-removal head. And a conveying roller (46) to be disposed and sent from the dust removal head to the downstream side.   In a foreign matter removing device provided with a dust removing head for removing dust (R) adhered to a single-wafer work (1), the dust removing head includes an upstream dust inlet (3) for sucking air and dust (R). ), A downstream dust suction port (4), and a jet nozzle (5) provided between the upstream dust suction port (3) and the downstream dust suction port (4) and for jetting air. At the same position in the upstream and downstream direction as the upstream dust suction port (3) and the downstream dust suction port (4) of the dust removing head, the sheet-like work (1) is connected to the upstream dust suction port (3). An apparatus for removing foreign matter from a single-wafer work, comprising: an upstream supporting rotary body (11) and a downstream supporting rotary body (12) for supporting the downstream dust suction port (4) so as not to contact the downstream dust suction port (4).   In a foreign matter removing device provided with a dust removing head for removing dust (R) adhered to a single-wafer work (1), the dust removing head includes an upstream dust inlet (3) for sucking air and dust (R). ), A downstream dust suction port (4), and a jet nozzle (5) provided between the upstream dust suction port (3) and the downstream dust suction port (4) and for jetting air. An upstream sub-support rotator (13) and a downstream sub-support that are rotatably mounted on the upstream end and the downstream end of the casing (6) of the dust removing head and on which the single-wafer work (1) is placed. A foreign matter removing device for a single-wafer work, comprising: a rotating body (14).   In a foreign matter removing device for removing dust (R) attached to a single-wafer work (1), a lower-dust removing head (2) and an upper-dust removing head (2) disposed on both lower and upper surfaces of the single-wafer work (1). 2 ′), an upstream-side transport roller (46) for placing the single-wafer work (1) and sending the single-wafer work (1) between the two heads (2) and (2 ′), and the head ( 2) a downstream conveying roller (46) for sending the sheet-like work (1) downstream from between (2 ') and the lower dust removing head (2) and the upper dust removing head (2'). The upstream dust inlets (3) and (3 ') for sucking air and dust (R), the downstream dust inlets (4) and (4'), and the upstream dust inlets (3) and (3 '), respectively. ) And downstream nozzles (4), (4 '), and ejection nozzles (5, 5') for ejecting air, wherein the single-wafer work is provided. Foreign matter removal device.   In a foreign matter removing device for removing dust (R) attached to a single-wafer work (1), a lower-dust removing head (2) and an upper-dust removing head (2 ') are provided on both lower and upper surfaces of the single-work (1). The lower dust removing head (2) and the upper dust removing head (2 ') include an upstream dust inlet (3) (3') and a downstream dust inlet (3) for sucking air and dust (R), respectively. 4) (4 ') and an ejection nozzle (5) which is provided between the upstream dust suction ports (3) (3') and the downstream dust suction ports (4) (4 ') and which jets air. (5 ′), and the single-wafer work (1) is located at the same position in the upstream and downstream direction as the upstream dust suction port (3) and the downstream dust suction port (4) of the lower dust removal head (2). ) Supporting the upstream dust suction port (3) and the downstream dust suction port (4) so as not to contact the downstream dust suction port (3) and the downstream dust suction port (4). (12) and the foreign matter removing apparatus of a single wafer workpiece, characterized in that it comprises a.   In a foreign matter removing device for removing dust (R) attached to a single-wafer work (1), a lower-dust removing head (2) and an upper-dust removing head (2 ') are provided on both lower and upper surfaces of the single-work (1). The lower dust removing head (2) and the upper dust removing head (2 ') include an upstream dust inlet (3) (3') and a downstream dust inlet (3) for sucking air and dust (R), respectively. 4) (4 ') and an ejection nozzle (5) which is provided between the upstream dust suction ports (3) (3') and the downstream dust suction ports (4) (4 ') and which jets air. (5 '), an upstream side of the casing (6) of the lower dust removing head (2), which is rotatably mounted at an upstream end and a downstream end of the lower dust removing head (2) and on which the single-wafer work (1) is placed. An apparatus for removing foreign matter from a single-wafer work, comprising: a sub-support rotary body (13); and a downstream sub-support rotary body (14).

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