JP2010054927A - Placing plate and exposure and drawing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a placing plate capable of appropriately sucking and holding a substrate even when the outer circumference of the substrate curves upward, or capable of holding a substrate while keeping flatness accuracy of the whole substrate surface even when the edge of the substrate is wavy. <P>SOLUTION: The placing plate (153) is detachably placed on a base table (52) by each of substrates (SW) in different sizes to be exposed. The placing plate (153) has a plurality of suction holes (66) formed on the surface, the holes to be connected to a gas passage (62) formed in the base table (52) so as to place a substrate (SW) to be exposed, and has a sealing member (65) formed outside the surface having the plurality of suction holes formed, the sealing member having a lip portion protruding from the surface where the placing plate places a substrate to be exposed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting plate and an exposure drawing apparatus that are mounted when an electric circuit pattern, characters and symbols (hereinafter referred to as “pattern”) are exposed. In particular, the present invention relates to a mounting plate and an exposure drawing apparatus that can appropriately cope with a wavy substrate or a thin and difficult-to-fix substrate.

  The substrate on which the pattern is formed is mounted on an electronic device such as a mobile phone, various mobile devices, and a personal computer. With the miniaturization of these electronic devices, there is a demand for increasing the degree of integration of circuits formed on the substrate, and the thickness of the substrate has also been reduced for patterns such as wiring, connection lands, and vias. However, as the substrate becomes thinner, the influence of heat treatment and the photosensitive material or circuit material applied on the surface is strong, and this tends to cause the substrate to be warped and hinder transportation and fixing. In particular, in the exposure drawing process, unless the entire substrate is fixed to a flat surface, the resolution of the pattern to be formed is lost and an accurate pattern cannot be formed. In addition, accurate position information cannot be obtained even when measuring the position of the substrate.

As a method for fixing a deformed substrate or a thin substrate on a uniform plane, Patent Document 1 forms suction holes on a fixed substrate and forms small-diameter suction holes on the periphery according to the size of the substrate. In this way, the substrate was fixed by suction. Moreover, in patent document 2, the board | substrate was adsorb | sucked using the vacuum leak prevention lip which used the circular adsorption | suction apparatus and formed the circular outer periphery with the silicone rubber.
JP 2006-276084 A JP 2002-317810 A

  However, when a thin substrate is formed due to the demand for an increasingly thin substrate, the substrate is likely to be deformed, and particularly, the edge is greatly deformed. On the other hand, in the technique disclosed in Patent Document 1, since the small-diameter suction holes are not provided in the entire edge portion of the substrate, the vacuum exhaust leaks when the edge portion of the substrate is deformed in a wave shape. There is a problem that the displacement required for fixing cannot be obtained. Further, in the technique disclosed in Patent Document 2, the deformed substrate portion does not necessarily contact the annular lip portion. Further, even if the substrate plate is sucked, the mounting plate causes unevenness due to the difference in the planar state between the substrate portion sucked by the annular lip portion and the other substrate portion.

  The present invention provides a mounting plate that can be adequately attracted and held even when the outer periphery of the substrate is warped, and that can be held with flat accuracy over the entire surface of the substrate even when the edge of the substrate is wavy. To do. In addition, it can handle multiple size substrates, and even if the mounting surface of the substrate is worn by use, it has a simple configuration and has a mounting plate that excels in maintenance workability such as replacement, improving the quality of the substrate An object of the present invention is to provide an exposure drawing apparatus.

The mounting plate according to the first aspect is a detachable mounting plate that is mounted on the base table for each substrate to be exposed having a different size. In this mounting plate, a plurality of suction holes communicating with gas passages formed in the base table for mounting the substrate to be exposed are formed on the surface, and the mounting plate is placed outside the surface on which the plurality of suction holes are formed. A seal member having a lip portion protruding above the surface on which the mounting plate places the substrate to be exposed is formed.
With this configuration, mounting plates of different sizes that can be attached to and detached from the base table are used, so that it is possible to flexibly cope with substrates to be exposed of various sizes. In the base table, gas passages are formed in the X and Y axis directions according to the placement area of the maximum size placement plate, and the suction holes of the placement plate change direction in the Z axis direction along this gas passage, The structure is in contact with the outside air. Further, the outer periphery of the mounting plate is used as a seal member when suction is applied by forming a lip portion at a position protruding from the surface of the mounting plate. If the lip portion has the same height as the surface of the mounting plate, the periphery of the substrate to be exposed cannot contact the lip portion and an airtight space cannot be formed, but the lip portion is formed at the protruding position. Thus, the suction of the substrate to be exposed can be ensured.

In the mounting plate of the second aspect, the lip portion on the outer periphery of the mounting plate is formed of a soft material, and the thickness is gradually reduced from the base portion of the lip portion toward the tip.
For this reason, it has the structure where the adhesiveness of a to-be-exposed board | substrate and a lip | rip part is excellent.

In the mounting plate according to the third aspect, the substrate to be exposed has a rectangular shape, and the seal member is formed by connecting a plurality of seal members. The seal member forms a lip portion for the corner portion in a region corresponding to the corner portion of the rectangular shape, and there is no joint in the lip portion for the corner portion.
For this reason, adhesiveness is improved by eliminating a joint in the corner lip. Further, if there is no joint at the corner lip, the durability of the seal member is improved.

In the fourth aspect, when the substrate to be exposed is placed, the tip of the lip portion is formed so as to be at the same position or inside the outer peripheral end of the substrate to be exposed.
With this configuration, when the tip of the lip portion is disposed at the same position or inside the outer peripheral edge of the substrate to be exposed, an airtight space can be created by the substrate to be exposed and the lip portion, and suction of the substrate to be exposed can be ensured. Can be.

The mounting plate according to the fifth aspect is adjusted to the size of the substrate to be exposed by changing the length of the linear sealing member among the plurality of sealing members.
With this configuration, a rectangular shape with a desired size can be formed by adjusting the number of seal members at four corners and the number of linear seal members in accordance with the size of the substrate to be exposed.

In the mounting plate according to the sixth aspect, the outer frame and the groove are formed on the outer periphery of the mounting plate, and the seal member is disposed in the groove.
For this reason, handling of a soft sealing member becomes easy. In addition, by changing the width of the outer frame, alignment with a plurality of mounting plates can be facilitated even if the size of the base plate is the same.

The mounting plate according to the seventh aspect has an alignment light source for aligning the substrate to be exposed on the inner side of the seal member and on the surface thereof.
An alignment light source for aligning the substrate to be exposed is provided on the surface of the mounting plate inside the seal member, and an alignment mark that passes through the mounting plate can be observed.

  In the mounting plate of the eighth aspect, in the seventh aspect, the alignment light source is a planar light source. For example, an organic EL or the like can be used as a planar light source.

An exposure drawing apparatus according to a ninth aspect exposes a pattern on a substrate to be exposed. The exposure drawing apparatus includes a base table in which a gas passage is formed, and a mounting plate in which a plurality of suction holes that are detachably supported by the base table and communicate with the gas passage are provided to place a substrate to be exposed. And a sealing member having a lip portion protruding from a surface on which the substrate to be exposed is placed on the outer periphery of the placement plate.
With this configuration, even if the peripheral part of the substrate to be exposed is warped, the exposure drawing apparatus can adsorb air tightly with the substrate to be exposed because the peripheral part of the substrate to be exposed contacts with the lip portion of the soft material. Flat surfaces can be formed. Since the exposure drawing apparatus can accurately measure the substrate to be exposed, it becomes an apparatus capable of precise exposure.

In the exposure drawing apparatus according to the tenth aspect, guide pins are formed on the base table, and guide holes are formed on the mounting plate to match the guide pins.
Since the guide pin and the guide hole can be aligned and positioned, the gas passage and the plurality of adsorption holes can be reliably communicated with each other.

  The mounting plate of the present invention is uniform by forming a lip portion of a soft material on the outer peripheral portion of the mounting plate and evacuating it even if a thin rectangular substrate to be exposed is deformed at the edge. The substrate to be exposed can be fixed by suction on a flat surface. For this reason, the exposure drawing apparatus can perform accurate position measurement, and accordingly, an accurate pattern can be exposed.

<Configuration of exposure drawing apparatus 100>
Hereinafter, an embodiment of the mounting plate of the exposure drawing apparatus 100 of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing the overall configuration of the exposure drawing apparatus 100.

  The exposure drawing apparatus 100 includes a housing 11, a gate-like structure 12, and a light source unit 20. On the housing 11, a gate-like structure 12 is installed and fixed. On the gate-like structure 12, light source units 20 are installed at two locations.

  The two light source units 20 have the same internal configuration, for example, and emit ultraviolet light in which various wavelengths from 365 nm to 440 nm are mixed from the light source unit 20. The ultraviolet light emitted from the light source unit 20 reflects a desired pattern by an exposure drawing unit (not shown) including a plurality of minute mirrors arranged inside the gate-like structure 12. The reflected light is applied to the substrate SW (see FIG. 2). For ultraviolet light, a shutter (not shown) is provided in the middle of the passage path to control the amount of ultraviolet light.

  An alignment camera AC is installed at two locations on the front part of the gate-like structure 12, and the position information of the substrate SW placed on the placement plate 53 is accurately read, and a control unit (not configured) of the exposure drawing apparatus 100 is detected. (Shown). The alignment camera AC may have a structure movable in the width direction (Y-axis direction) of the substrate SW, and the alignment camera AC can be moved to a desired position by linear driving or motor driving. In this embodiment, the alignment cameras AC are installed at two locations. However, if the exposure image drawing pattern of the substrate SW is fine, the alignment camera AM is increased to three or more locations, and the interval between the alignment marks AM is reduced. I do not care.

  An XY stage 51 is installed on the upper surface of the housing 11, a base table 52 is installed on the upper surface of the XY stage 51, and a mounting plate 53 is mounted on the upper surface thereof. The XY stage 51 is provided with a drive device (not shown) that can move in the horizontal direction of the XY plane, and moves in the space below the gate-like structure 12 together with the base table 52 and the mounting plate 53.

  The XY stage 51 can move to the exposure position below the gate-like structure 12, and can form a pattern by aligning the substrate SW placed on the placement plate 53 with the focus of the exposure drawing unit. The driving device of the XY stage 51 is, for example, a linear motor, and the linear motor can move the XY stage 51 to a precise position in the X axis direction and the Y axis direction of the housing. Note that the drive device may use not only a linear motor but also means comprising a ball screw and a screw driving motor. Any means can be used as long as the mechanism can accurately control the movement and the current position.

  The substrate SW placed on the placement plate 53 is a thin substrate and is formed with a pattern such as circuit wiring. The size of the substrate SW is, for example, about 600 mm in the X-axis direction and about 500 mm in the Y-axis direction, and has various sizes such as 500 mm × 410 mm square. A resist layer is formed on these substrates SW so that exposure drawing can be performed with ultraviolet light. In this embodiment, a photosensitive dry film is used for laminating a resist layer on the substrate SW. The photosensitive dry film uses a type in which a resist layer is formed on one side, and the resist layer is not formed on the other side. In the photosensitive dry film, the resist layer side is adhered to the surface of the substrate SW so that the film side comes into contact with the atmosphere. The photosensitive dry film is fixed to the substrate SW by post-heat treatment after bonding. Note that the resist layer may be fixed to the substrate SW by applying the liquid resist to the substrate SW and performing a heat treatment.

  In the following, various embodiments according to the difference of the mounting plate 53 mounted on the base table 52 of the exposure drawing apparatus 100 will be described.

≪First embodiment≫
As described above, the substrate SW to which the resist surface of the photosensitive dry film is bonded is subjected to heat treatment, so that it is deformed and conveyed to the mounting plate 53 of the exposure drawing apparatus 100. The thinly deformed substrate SW is fixed by suction by the mounting plate 53 of this embodiment, so that a uniform plane can be formed.

  FIG. 2 is a cross-sectional view showing configurations of the XY stage 51, the base table 52, the mounting plate 53, and the substrate SW. In FIG. 2, a base table 52 is formed on the upper part of the XY stage 51, a detachable mounting plate 53 is mounted on the base table 52, and a substrate SW adsorbed on the upper part is shown. Note that FIG. 2 shows the mounting plate 53 and the substrate SW separately for easy explanation. FIG. 3 is a top view of the base table 52. FIG. 4 is a top view of the mounting plate 53.

  The XY stage 51 can move in the XY directions, and the base table 52, the mounting plate 53, and the substrate SW can be moved together as a single unit.

  The base table 52 includes a gas pipe 61, a gas groove 62 and a guide pin 63. 2 and 3, the gas pipe 61 is formed by extending the base table 52 in the Z-axis direction, the upper part of the gas pipe 61 is connected to the gas groove 62, and the lower part of the gas pipe 61 is sideways. It passes through an extending pipe and is connected to a vacuum suction device (not shown). The gas groove 62 is a groove for allowing gas to pass therethrough, and a gas groove 62X in the X-axis direction and a gas groove 62Y in the Y-axis direction are formed on the surface of the base table 52. As the gas grooves 62 are formed in a mesh shape in this way, the same adsorption force is generated on the entire surface of the base table 52. The guide pin 63 has a cylindrical shape and protrudes vertically from the base table 52, and is formed on the edge of the base table 52. Since the guide pins 63 are formed to fix the mounting plate 53, the guide pins 63 may be formed at two or more locations, and also match the mounting plate 53 such as corners of the edges at the positions to be formed. Arbitrary position may be sufficient.

  A plurality of gas pipes 61 or a single gas pipe 61 are evacuated to a vacuum adsorption device. The gas groove 62 is formed by cutting the surface of the base table 52 in the XY direction, and a part of the intersection of the X axis and the Y axis is connected to the gas pipe 61 in the Z axis direction. When the mounting plate 53 is mounted on the upper part of the gas groove 62, the upper part of the gas groove 62 is closed and hermetically sealed to form a gas pipe.

  As shown in FIG. 4, the mounting plate 53 includes a guide hole 64, a seal member 65, a suction hole 66, and an outer frame 67. The mounting plate 53 has suction holes 66 formed on the entire surface on which the substrate SW is mounted, and the outer periphery thereof is surrounded by a seal member 65, and the outer periphery thereof is further surrounded by an outer frame 67. A guide hole 64 is formed at the edge of the outer frame 67 at a position that matches the guide pin 63 of the base table 52.

  The suction hole 66 forms a circular hole of about 1.5 mmφ, is formed so as to penetrate the mounting plate 53 in the Z-axis direction, and along the lower gas groove 62 (the position is indicated by a broken line in FIG. 4), Dozens to hundreds are formed.

  As an example, the mounting plate 53 is made of a lightweight material such as aluminum having a thickness of about 2 mm, is hard on the mounting surface facing the substrate SW, and contains a hard fluororesin that has excellent detachability from the substrate SW. Consists of a coating.

  By mounting the mounting plate 53, the gas groove 62 becomes a gas passage pipe, and suction is performed by a vacuum suction device connected to the gas pipe 61, so that the substrate SW is disposed by the suction hole 66 disposed at a position facing the substrate SW. Is adsorbed with a uniform suction force.

  In the outer frame 67, for example, guide holes 64 are formed in two places, one on each long side, and one guide hole 64 is a long hole. The long guide hole 64 is formed so that the guide pin 63 can be easily fitted. The guide hole 64 is formed outside the seal member 65 and is formed so as to penetrate the mounting plate 53 in the Z-axis direction. The guide hole 64 is formed in a size that matches the guide pin 63, the position in the XY direction is fixed by the one guide hole 64 and the guide pin 63, and the other guide hole 64 and the guide pin 63 rotate. Prevents misalignment.

  The seal member 65 includes an arc-shaped seal member 65C having a shape that fits the corner portions that are the four corners of the mounting plate 53, and a linear seal member 65S. The arc-shaped sealing member 65C is installed at four locations in the corner portion, and the other four sides can surround the outer periphery of the mounting plate 53 by using the linear sealing member 65S. The seal member 65C and the seal member 65S are joined using an epoxy adhesive or the like.

  FIG. 5 is an enlarged view of the AA cross section of FIG. 4, and the details of the seal member 65 and its periphery will be described. 5A shows a state in which the base table 52 is installed on the XY stage 51 and the substrate is not attracted to the placement plate 53, and FIG. 5B shows that the substrate is attracted to the placement plate 53. It shows the state.

  A rectangular groove 68 for receiving the seal member 65 formed in the outer frame 67 is formed in the lower portion of the seal member 65. That is, the rectangular groove 68 is also formed along the outer periphery of the mounting plate 53, and the seal member 65 that fits the size of the inside is provided.

  The seal member 65 has a base portion 65B and a lip portion 65L. The tip of the lip 65L is formed so as to protrude above the surface of the mounting plate 53. Further, it is formed so as to gradually become thinner from the base portion 65B to the tip of the lip portion 65L. For example, when the mounting plate 53 of about 2 mm is used, the rectangular groove 68 is formed with a depth of about 1.6 mm and houses a seal member 65 formed with a height of about 1.6 mm. The lip portion 65L is formed so as to gradually become thinner upward from about half the thickness of the base portion 65B. Further, the tip of the lip portion 65L is located at an upper portion of about 0.2 mm to 0.5 mm from the surface of the mounting plate 53. The outer diameter formed at the tip of the lip portion 65L is equal to or smaller than the outer diameter of the substrate SW by several millimeters. Since the substrate SW is formed in a rectangular shape, the four corners of the substrate SW protrude from the arc-shaped sealing member 65C. Further, in the corner portion that is easily affected by the deterioration of the elastic material, the arc-shaped seal member 65C is joined to the seal member 65S using an epoxy adhesive or the like. These joints are not provided at the four corners of the substrate SW. For this reason, the crack of the lip portion 65L is reduced. The seal member 65C is not necessarily limited to the arc shape. Even if the rectangular shape has the same shape as the four corners of the substrate SW, the joints are not provided at the four corners of the substrate SW, so that the lip portion 65L is less cracked.

  By using the mounting plate 53 described above, the exposure drawing apparatus 100 can accurately measure the position by exposing the substrate SW to a uniform plane, and can expose a precise pattern. For example, as illustrated in FIG. 5A, the control unit of the exposure drawing apparatus 100 places the substrate SW so that the outer periphery of the seal member 65 of the placement plate 53 and the outer periphery of the substrate SW are aligned. At this time, even if the periphery of the substrate SW is warped upward by heat treatment or the like, the periphery of the substrate SW is in contact with the lip portion 65L because the lip portion 65L is located above the surface of the mounting plate 53. When vacuum exhaust is performed through the suction hole 66 by the vacuum suction device, since the periphery of the substrate SW is in contact with the lip portion 65L of the seal member 65, an airtight space is created and the substrate SW is placed by continuing the vacuum exhaust. Adsorbed on the plate 53. At this time, the substrate SW is pulled down by evacuating the lip portion 65L, and the lip portion 65L is lowered downward by the gravity of the substrate SW. Therefore, the lip portion 65L spreads and is fixed on the same horizontal plane as the surface of the mounting plate 53, as shown in FIG. Therefore, the entire substrate can be fixed on the uniform plane along the mounting plate 53. The substrate fixed on the uniform plane along the mounting plate 53 is measured with the alignment camera AC at two positions of the exposure drawing apparatus 100, and is exposed by the exposure drawing unit installed inside the gate-like structure 12. A precise pattern can be exposed. When the lip portion 65L is positioned on the same horizontal plane as the placement plate 53, the tip of the lip portion 65L is formed so as to touch the end portion of the rectangular groove 68, thereby making it easy to ensure a uniform plane of the substrate SW. be able to.

  The mounting plate 53 can protect the lip portion 65L of the thin seal member 65C by forming the outer frame 67. Since the mounting plate 53 forms the guide hole 64 at the edge of the outer frame 67, the guide hole 64 is formed by making the width of the outer frame 67 wider or narrower even when the size of the substrate SW is changed. The position of the guide pin 63 formed on the base table 52 need not be changed. For this reason, the replacement | exchange operation | work of the mounting plate 53 suitable for a several board | substrate size can be performed easily.

  FIG. 6 is a top view of the mounting plate 53 used when the substrate size is small. For example, as shown in FIG. 6, the outer frame 67W is formed so that the outer frame 67 is wide. Therefore, the mounting plate 53 suitable for a small substrate size is prepared without changing the position of the guide pin 63. be able to. Further, in the seal member 65, four arc-shaped seal members 65C and a linear seal member 65S having an adjusted length are connected to surround the outer periphery. In addition, although the linear seal member 65S uses one linear seal member 65S per side, it may be divided and used.

<< Second Embodiment >>
The mounting plate 153 of this embodiment shows an outer frame 67T formed narrow. FIG. 7 shows a top view of the mounting plate 153. 8A is an enlarged view of the BB cross section of FIG. 7, and FIG. 8B is a cross sectional view of a mounting plate 155 which is a modified example of FIG. In addition, about the same structure as 1st Embodiment, description is abbreviate | omitted and the same code | symbol is used. Hereinafter, differences from the mounting plate 53 of the first embodiment will be described with reference to FIGS. 7 and 8.

  The mounting plate 153 shown in FIG. 8A does not form the rectangular groove 68. The mounting plate 155 shown in FIG. 8B forms a rectangular groove 68, and the outer periphery of the rectangular groove 68 is formed thin. In the mounting plate 153 and the mounting plate 155, a guide hole 164 is formed on the inner side of the seal member 65, and the guide hole 164 is formed on the upper portion (substrate side) of the guide hole 64 penetrating the substrate shown in the first embodiment. The observation window 165 is formed of a transparent material.

  The upper surface of the observation window 165 is adhered at the same height as the mounting plate 153 and the upper surface of the mounting plate 155, and is formed of a transparent material such as polycarbonate. The guide pins 63 of the base table 52 are formed at a height that does not contact the observation window 165. The observation window 165 is attached airtight with rubber packing or the like so that there is no air leakage during evacuation.

  The observation window 165 uses a transparent material so that the operator can fit the guide pin 63 of the lower base table 52 while using the position of the guide hole 164 as an index. However, this is not limited to the case where the base table 52, the mounting plate 153, and the mounting plate 155 are fixed using another index, and the position of the guide hole 164 and the guide pin 63 is changed, or opaque observation is performed. It is possible to eliminate the guide hole 164 and the guide pin 63 by using the window 165.

≪Third embodiment≫
The mounting plate 253 according to the present embodiment can adjust the position of the substrate SW by forming the light source 262 therein and observing the light transmitted through the substrate SW by the exposure drawing apparatus 100. Since the light source 262 may be installed on either the mounting plate of the first embodiment or the second embodiment, the case where the light source 262 is formed inside the mounting plate 53 of the first embodiment will be described.

  FIG. 9 is an enlarged sectional view of the mounting plate 253. Also in the present embodiment, the same components as those in the first embodiment are not described and the same reference numerals are used. Hereinafter, differences from the mounting plate 53 of the first embodiment will be described with reference to FIG. In FIG. 9, the substrate SW and the mounting plate 253 are illustrated separately in order to explain how the light passing through the alignment mark AM is observed by the alignment camera AC. FIG. 10 is a diagram in which a planar light source 262 is formed on the upper portion of the suction hole 66.

  An ordinary substrate SW has an alignment mark AM for measuring position information at a predetermined position. For example, the alignment mark AM is formed so that a through hole of about 1 mmφ penetrates the substrate SW, whereby the light of the light source 262 irradiated from the lower part of the substrate SW can be measured.

  The mounting plate 253 has a power source 261 disposed in a rectangular groove 68 formed on the outer periphery thereof, and a light source 262 formed on the surface of the mounting plate 253. The power source 261 and the light source 262 are connected by an electrode 263, and can emit light at a timing measured by the alignment camera AC.

  The alignment camera AC can easily detect a precise position by observing light passing from the alignment mark AM penetrating the substrate SW. For example, the alignment camera AC measures the intensity distribution of light passing therethrough. The center position of the alignment mark AM can be accurately measured.

  The light source 262 uses a thin surface emitting light source such as an LED or an organic EL. Further, light emitted from the light source 262 irradiates a wavelength at which the resist applied to the substrate SW is not exposed. For example, the light sources 262 are formed at four corners of the mounting plate 253, and the alignment marks formed on the substrate SW are passed by irradiating light with a long wavelength such as red or yellow when measuring the position of the substrate SW. In FIG. 9, a light source is installed between the seal member 65 and the suction hole 66, but a planar light source may be formed in the region where the suction hole 66 is formed as shown in FIG. Further, a power source 261 and a light source 262 may be provided in the groove, and the light from the light source 262 may be bent by an optical fiber or the like to irradiate the back surface of the substrate SW.

It is the figure which showed the whole structure of the exposure drawing apparatus. 4 is a cross-sectional view showing the configuration of an XY stage 51, a base table 52, a mounting plate 53, and a substrate SW. 3 is a top view of a base table 52. FIG. 6 is a top view of the mounting plate 53. FIG. It is an enlarged view of the AA cross section of FIG. 4, (a) is an enlarged view of the sealing member 65 before adsorb | sucking board | substrate SW. (B) is an enlarged view of the seal member 65 in a state where the substrate SW is adsorbed. It is a top view of the mounting plate 53 used when a board | substrate size is small. A top view of the mounting plate 153 is shown. (A) is an expanded view of the BB cross section of FIG. 7, (b) is sectional drawing of the mounting plate 155 which is a modification of (a). 5 is an enlarged cross-sectional view of a mounting plate 253. FIG. FIG. 6 is a diagram in which a planar light source 262 is formed on the upper portion of the suction hole 66.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Housing | casing 12 ... Gate-like structure 20 ... Light source part 51 ... XY stage 52 ... Base table 53,153,155,253 ... Installation plate 61 ... Gas piping 62 ... Gas groove 62 ... Lip 63 ... Guide pin 64, 164 ... Guide hole 65 ... Seal member 65B ... Base 65C ... Corner seal member 65L ... Lip part 65S ... Linear seal member 66 ... Suction hole 67 ... Outer frame 67W ... Wide outer frame 67T ... Narrow outer frame 68 ... Rectangular groove 100 ... Exposure drawing device 165 Observation window 261 ... Power source 262 ... Light source 263 ... Electrode AC ... Alignment camera AM ... Alignment mark SW ... Substrate

Claims (10)

A detachable mounting plate mounted on a base table for each substrate to be exposed having a different size,
This mounting plate
A plurality of suction holes communicating with gas passages formed in the base table for mounting the substrate to be exposed are formed on the surface,
A mounting plate, wherein a sealing member having a lip portion protruding above the surface on which the mounting plate is mounted is formed outside the surface on which the plurality of suction holes are formed. . 2. The mounting plate according to claim 1, wherein the lip portion has a cross-sectional shape in which a thickness decreases from a main body portion having a predetermined thickness toward an outer side, and is configured by a soft material. The substrate to be exposed has a rectangular shape, and the seal member is formed by connecting a plurality of seal members,
The seal member forms a lip portion for a corner portion in a region corresponding to the corner portion of the rectangular shape, and there is no joint in the lip portion for the corner portion. The mounting plate described. 4. The mounting according to claim 3, wherein when the substrate to be exposed is placed, the tip of the lip portion is formed to be at the same position or inside as the outer peripheral end of the substrate to be exposed. Plate. The mounting plate according to claim 3, wherein a length of a linear seal member among the plurality of seal members is changed to match a size of the substrate to be exposed. The mounting plate according to any one of claims 1 to 5, wherein an outer frame and a groove portion are formed on an outer periphery of the mounting plate, and the seal member is disposed in the groove portion. The said mounting plate has an alignment light source for aligning the said to-be-exposed board | substrate to the inner side and the surface of the said sealing member, The Claim 1 characterized by the above-mentioned. Mounting plate. The mounting plate according to claim 7, wherein the alignment light source is a planar light source. In an exposure drawing apparatus that exposes a pattern on a substrate to be exposed,
A base table in which a gas passage is formed;
A mounting plate that is detachably supported by the base table and has a plurality of suction holes that communicate with the gas passage for mounting the substrate to be exposed;
An exposure drawing apparatus, comprising: a seal member having a lip portion protruding from a surface on which the mounting plate is placed on the outer periphery of the mounting plate. The exposure drawing apparatus according to claim 9, wherein guide pins are formed on the base table, and guide holes are formed on the mounting plate to match the guide pins.

Images