JP2010053204A5 - - Google Patents
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- JP2010053204A5 JP2010053204A5 JP2008217745A JP2008217745A JP2010053204A5 JP 2010053204 A5 JP2010053204 A5 JP 2010053204A5 JP 2008217745 A JP2008217745 A JP 2008217745A JP 2008217745 A JP2008217745 A JP 2008217745A JP 2010053204 A5 JP2010053204 A5 JP 2010053204A5
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- JP
- Japan
- Prior art keywords
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- mol
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- hydrogen
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 5
- 229920006243 acrylic copolymer Polymers 0.000 claims description 3
- -1 polydimethylsiloxane structure Polymers 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008217745A JP5168485B2 (ja) | 2008-08-27 | 2008-08-27 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008217745A JP5168485B2 (ja) | 2008-08-27 | 2008-08-27 | 熱硬化性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010053204A JP2010053204A (ja) | 2010-03-11 |
| JP2010053204A5 true JP2010053204A5 (enExample) | 2011-10-13 |
| JP5168485B2 JP5168485B2 (ja) | 2013-03-21 |
Family
ID=42069452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008217745A Expired - Fee Related JP5168485B2 (ja) | 2008-08-27 | 2008-08-27 | 熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5168485B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5168491B2 (ja) * | 2008-09-30 | 2013-03-21 | 日油株式会社 | 熱硬化性樹脂組成物 |
| JP6922349B2 (ja) * | 2016-10-12 | 2021-08-18 | 三菱ケミカル株式会社 | 防汚塗料組成物および防汚塗料組成物の製造方法 |
| JP7404838B2 (ja) * | 2019-03-15 | 2023-12-26 | Ａｇｃ株式会社 | 硬化性組成物及び硬化物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3092256B2 (ja) * | 1991-10-09 | 2000-09-25 | 日本油脂株式会社 | 熱硬化性樹脂組成物 |
| JPH10219123A (ja) * | 1997-02-12 | 1998-08-18 | Nof Corp | 硬化性組成物、塗装仕上げ方法及び塗装物品 |
| JP2004338350A (ja) * | 2003-05-19 | 2004-12-02 | Nof Corp | 感熱型極性変換材料およびそれを用いたパターンの形成方法 |
| WO2009119469A1 (ja) * | 2008-03-24 | 2009-10-01 | 昭和電工株式会社 | エポキシ化合物およびその製造方法 |
| JP5611544B2 (ja) * | 2008-06-20 | 2014-10-22 | 昭和電工株式会社 | （メタ）アクリロイルオキシ基含有篭状シルセスキオキサン化合物およびその製造方法 |
| JP2010006955A (ja) * | 2008-06-27 | 2010-01-14 | Nof Corp | 光半導体封止用熱硬化性樹脂組成物 |
| JP5109873B2 (ja) * | 2008-08-27 | 2012-12-26 | 日油株式会社 | 熱硬化性樹脂組成物 |
| JP5168491B2 (ja) * | 2008-09-30 | 2013-03-21 | 日油株式会社 | 熱硬化性樹脂組成物 |
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2008
- 2008-08-27 JP JP2008217745A patent/JP5168485B2/ja not_active Expired - Fee Related