JP2010050173A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010050173A5 JP2010050173A5 JP2008211269A JP2008211269A JP2010050173A5 JP 2010050173 A5 JP2010050173 A5 JP 2010050173A5 JP 2008211269 A JP2008211269 A JP 2008211269A JP 2008211269 A JP2008211269 A JP 2008211269A JP 2010050173 A5 JP2010050173 A5 JP 2010050173A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- forming
- electrode
- emitting device
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 13
- 230000015572 biosynthetic process Effects 0.000 claims 10
- 238000005755 formation reaction Methods 0.000 claims 10
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 239000010409 thin film Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 2
- 239000000835 fiber Substances 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000000116 mitigating Effects 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008211269A JP5042163B2 (ja) | 2008-08-20 | 2008-08-20 | 発光装置の作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008211269A JP5042163B2 (ja) | 2008-08-20 | 2008-08-20 | 発光装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012154209A Division JP5523510B2 (ja) | 2012-07-10 | 2012-07-10 | 発光装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010050173A JP2010050173A (ja) | 2010-03-04 |
| JP2010050173A5 true JP2010050173A5 (de) | 2011-09-29 |
| JP5042163B2 JP5042163B2 (ja) | 2012-10-03 |
Family
ID=42067043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008211269A Expired - Fee Related JP5042163B2 (ja) | 2008-08-20 | 2008-08-20 | 発光装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5042163B2 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102040242B1 (ko) * | 2011-05-12 | 2019-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 이용한 전자 기기 |
| KR101963229B1 (ko) | 2011-12-05 | 2019-03-29 | 삼성전자주식회사 | 접을 수 있는 박막 트랜지스터 |
| JP5674707B2 (ja) * | 2012-05-22 | 2015-02-25 | 株式会社東芝 | 表示装置 |
| WO2016012900A1 (en) * | 2014-07-25 | 2016-01-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| US10003023B2 (en) * | 2016-04-15 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| CN110518144B (zh) * | 2019-08-20 | 2021-10-15 | 武汉天马微电子有限公司 | 柔性封装盖板、其制作方法、柔性显示面板及显示装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002329584A (ja) * | 2001-02-28 | 2002-11-15 | Print Labo Kk | Ｅｌ発光装置 |
| JP2005109307A (ja) * | 2003-10-01 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 回路部品内蔵基板およびその製造方法 |
| JP4181013B2 (ja) * | 2003-11-04 | 2008-11-12 | シャープ株式会社 | 表示装置およびその製造方法 |
| JP4233433B2 (ja) * | 2003-11-06 | 2009-03-04 | シャープ株式会社 | 表示装置の製造方法 |
| JP5354884B2 (ja) * | 2006-10-19 | 2013-11-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
-
2008
- 2008-08-20 JP JP2008211269A patent/JP5042163B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010050173A5 (de) | ||
| JP2010041045A5 (de) | ||
| JP2010016362A5 (ja) | 半導体装置の作製方法及び半導体装置 | |
| JP2009055055A5 (de) | ||
| JP2018501650A5 (de) | ||
| JP2008510966A5 (de) | ||
| JP2006253289A5 (de) | ||
| JP2010519780A5 (de) | ||
| JP2010199528A5 (de) | ||
| CN102420204A (zh) | 聚合物芯丝线 | |
| JP2008141167A5 (de) | ||
| JP2011097582A5 (de) | ||
| JP2010015550A5 (de) | ||
| JP2008277798A5 (de) | ||
| JP2012514340A5 (de) | ||
| JP2013033894A5 (de) | ||
| JP2008124077A5 (de) | ||
| JP2008103653A5 (de) | ||
| JP2007149810A5 (de) | ||
| JP2018506171A5 (de) | ||
| JP6589985B2 (ja) | Ｌｅｄ搭載基板の製造方法 | |
| JP5889623B2 (ja) | マイクロワイヤを付着させるためのシステム | |
| JP2009164176A5 (de) | ||
| WO2011082778A3 (de) | Verfahren zur herstellung eines in ein isolierendes material eingebetteten bauteils mit bumps und mit die bumps überlappenden leiterzügen und entsprechende vorrichtung | |
| WO2011057745A3 (de) | Verfahren zum abscheiden einer für das drahtbonden geeigneten palladiumschicht auf leiterbahnen einer schaltungsträgerplatte und palladiumbad zur verwendung in dem verfahren |