JP2010046761A - プラトー面加工用レジノイド超砥粒砥石ホイール - Google Patents
プラトー面加工用レジノイド超砥粒砥石ホイール Download PDFInfo
- Publication number
- JP2010046761A JP2010046761A JP2008213374A JP2008213374A JP2010046761A JP 2010046761 A JP2010046761 A JP 2010046761A JP 2008213374 A JP2008213374 A JP 2008213374A JP 2008213374 A JP2008213374 A JP 2008213374A JP 2010046761 A JP2010046761 A JP 2010046761A
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- grinding wheel
- resinoid
- grinding
- superabrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 90
- 239000006061 abrasive grain Substances 0.000 title abstract description 58
- 230000002093 peripheral effect Effects 0.000 claims abstract description 30
- 239000011148 porous material Substances 0.000 claims abstract description 17
- 239000011230 binding agent Substances 0.000 claims description 42
- 238000012545 processing Methods 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 20
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000000057 synthetic resin Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 19
- 229920005989 resin Polymers 0.000 description 37
- 239000011347 resin Substances 0.000 description 37
- 230000008569 process Effects 0.000 description 15
- 229910003460 diamond Inorganic materials 0.000 description 9
- 239000010432 diamond Substances 0.000 description 9
- 238000003825 pressing Methods 0.000 description 9
- 239000003921 oil Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000004794 expanded polystyrene Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006248 expandable polystyrene Polymers 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
【解決手段】砥石ホイール10によれば、砥石部16が10〜60容積%の気孔率と2〜15GPaの弾性率とを有することから、適度な軟らかさで超砥粒が結合されるとともに適度の割合で気孔が形成されているので、外周面で研削する通常の砥石ホイールと同様の研削手法を用いて、被削材28の表面の拡大断面において図5に示すように深い油溝gと平坦なプラトー面部pとが精度良く、一挙に且つ能率良く形成される。
【選択図】図5
Description
・寸法 :φ420×t150×φ228.6(mm)
・コア部:φ405×t150×φ228.6(mm)、ビトリファイド砥石製コア
・研削盤 :センタレス研削盤
・砥石周速度 :2000(m/min)
・ドレス切込み:R2(μm/pass)、スパークアウト3pass
・ドレスリード:0.06(mm/rev.of.wheel)
・ドレッサ :単石ドレッサ
・ドレス方式 :湿式ドレス
・被削材 :SUJ−2焼材(HRc60)、前加工粗さ:0.4μmRz
・被削材寸法:φ9×L14(mm)
・取代 :φ10(μm)
・研削方式 :湿式スルーフィードセンタレス研削
・砥石周速度:2700(m/min)
・送り角 :1.0°
・修正角 :0.5°
14:コア部(基台)
16:砥石部
18:砥粒
20:樹脂結合剤
22:有機質中空体
32:ワーク外周面
34:研削面
Claims (5)
- 厚肉円板状の基台と、多数の超砥粒が合成樹脂結合剤により相互に結合して形成された砥石部が該基台の外周面に固着されて成り、拡大断面において平坦なプラトー面部と油溜まりとして機能する溝とを有するプラトー面加工用レジノイド超砥粒砥石ホイールであって、
前記砥石部が、10〜60容積%の気孔率と2〜15GPaの弾性率とを有することを特徴とするプラトー面加工用レジノイド超砥粒砥石ホイール。 - 前記超砥粒は、#600〜#12000の範囲内の粒度を有するものである請求項1のプラトー面加工用レジノイド超砥粒砥石ホイール。
- 前記砥石部は、該砥石部の軸心方向において1/5〜4/5の幅を有して#600〜#2000の範囲内の粒度を有する超砥粒から構成される粗粒部と、該粗粒部を除く4/5〜1/5の幅を有して#3000〜#12000の範囲内の粒度を有する超砥粒から構成される細粒部とから構成されることを特徴とする請求項1または2のプラトー面加工用レジノイド超砥粒砥石ホイール。
- 前記基台は、無機結合剤の溶融温度よりも高い温度の焼成によって無機骨材粒子が該無機結合剤により相互に固着された焼結体である請求項1乃至3のいずれか1のプラトー面加工用レジノイド超砥粒砥石ホイール。
- 前記砥石部には、気孔形成剤が含まれることを特徴とする請求項1乃至4のいずれか1のプラトー面加工用レジノイド超砥粒砥石ホイール。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008213374A JP5155774B2 (ja) | 2008-08-21 | 2008-08-21 | プラトー面加工用レジノイド超砥粒砥石ホイール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008213374A JP5155774B2 (ja) | 2008-08-21 | 2008-08-21 | プラトー面加工用レジノイド超砥粒砥石ホイール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010046761A true JP2010046761A (ja) | 2010-03-04 |
| JP5155774B2 JP5155774B2 (ja) | 2013-03-06 |
Family
ID=42064295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008213374A Expired - Fee Related JP5155774B2 (ja) | 2008-08-21 | 2008-08-21 | プラトー面加工用レジノイド超砥粒砥石ホイール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5155774B2 (ja) |
Cited By (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012011522A (ja) * | 2010-07-02 | 2012-01-19 | Noritake Co Ltd | ホーニング砥石 |
| JP2014050908A (ja) * | 2012-09-06 | 2014-03-20 | Ngk Spark Plug Co Ltd | 軸部材のセンタレス研削方法、及び円軸部材の製造方法 |
| CN106102983A (zh) * | 2014-01-27 | 2016-11-09 | 康宁股份有限公司 | 通过机械加工激光切割玻璃来进行边缘斜切 |
| US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
| US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
| US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| CN114364479A (zh) * | 2019-08-29 | 2022-04-15 | 株式会社则武 | 齿轮磨削用多层磨石 |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| EP4363163A4 (en) * | 2021-06-30 | 2025-04-23 | Saint-gobain Abrasives, Inc | ABRASIVE ARTICLES AND METHODS OF FORMING SUCH ARTICLES |
| WO2025164226A1 (ja) * | 2024-01-31 | 2025-08-07 | 住友ベークライト株式会社 | ブレーキピストンの研摩方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02145264A (ja) * | 1988-11-29 | 1990-06-04 | Ibiden Co Ltd | センターレス研削盤の砥石車 |
| JPH0680547U (ja) * | 1993-04-20 | 1994-11-15 | ジューキ株式会社 | プラトー表面加工用砥石工具 |
| JPH0947957A (ja) * | 1995-08-08 | 1997-02-18 | Asahi Daiyamondo Kogyo Kk | ホーニング砥石 |
| JP2003014067A (ja) * | 2001-06-29 | 2003-01-15 | Nissan Motor Co Ltd | トラクションドライブ用転動体およびトラクションドライブ用転動体の転動面加工方法ならびに自動車用無段変速機 |
| JP2005246569A (ja) * | 2004-03-05 | 2005-09-15 | Noritake Co Ltd | 鏡面研削用レジノイド砥石 |
| JP2006320992A (ja) * | 2005-05-18 | 2006-11-30 | Noritake Co Ltd | 固体潤滑剤を含む鏡面研磨用レジノイド砥石の製造方法 |
-
2008
- 2008-08-21 JP JP2008213374A patent/JP5155774B2/ja not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02145264A (ja) * | 1988-11-29 | 1990-06-04 | Ibiden Co Ltd | センターレス研削盤の砥石車 |
| JPH0680547U (ja) * | 1993-04-20 | 1994-11-15 | ジューキ株式会社 | プラトー表面加工用砥石工具 |
| JPH0947957A (ja) * | 1995-08-08 | 1997-02-18 | Asahi Daiyamondo Kogyo Kk | ホーニング砥石 |
| JP2003014067A (ja) * | 2001-06-29 | 2003-01-15 | Nissan Motor Co Ltd | トラクションドライブ用転動体およびトラクションドライブ用転動体の転動面加工方法ならびに自動車用無段変速機 |
| JP2005246569A (ja) * | 2004-03-05 | 2005-09-15 | Noritake Co Ltd | 鏡面研削用レジノイド砥石 |
| JP2006320992A (ja) * | 2005-05-18 | 2006-11-30 | Noritake Co Ltd | 固体潤滑剤を含む鏡面研磨用レジノイド砥石の製造方法 |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012011522A (ja) * | 2010-07-02 | 2012-01-19 | Noritake Co Ltd | ホーニング砥石 |
| JP2014050908A (ja) * | 2012-09-06 | 2014-03-20 | Ngk Spark Plug Co Ltd | 軸部材のセンタレス研削方法、及び円軸部材の製造方法 |
| US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
| US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US11028003B2 (en) | 2013-01-15 | 2021-06-08 | Corning Laser Technologies GmbH | Method and device for laser-based machining of flat substrates |
| US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US10597321B2 (en) | 2013-12-17 | 2020-03-24 | Corning Incorporated | Edge chamfering methods |
| CN106102983A (zh) * | 2014-01-27 | 2016-11-09 | 康宁股份有限公司 | 通过机械加工激光切割玻璃来进行边缘斜切 |
| US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11972993B2 (en) | 2017-05-25 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| CN114364479A (zh) * | 2019-08-29 | 2022-04-15 | 株式会社则武 | 齿轮磨削用多层磨石 |
| CN114364479B (zh) * | 2019-08-29 | 2024-01-02 | 株式会社则武 | 齿轮磨削用多层磨石 |
| EP4363163A4 (en) * | 2021-06-30 | 2025-04-23 | Saint-gobain Abrasives, Inc | ABRASIVE ARTICLES AND METHODS OF FORMING SUCH ARTICLES |
| WO2025164226A1 (ja) * | 2024-01-31 | 2025-08-07 | 住友ベークライト株式会社 | ブレーキピストンの研摩方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5155774B2 (ja) | 2013-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5155774B2 (ja) | プラトー面加工用レジノイド超砥粒砥石ホイール | |
| EP2219824B1 (en) | Abrasive processing of hard and/or brittle materials | |
| KR100359401B1 (ko) | 연삭 공구 | |
| EP1066134B1 (en) | Abrasive tools | |
| KR100416330B1 (ko) | 전자 부품 연삭용 연마 도구 | |
| US6019668A (en) | Method for grinding precision components | |
| JP3795778B2 (ja) | 水添ビスフェノールa型エポキシ樹脂を用いたレジノイド研削砥石 | |
| JP3791610B2 (ja) | 鏡面加工用超砥粒ホイール | |
| JP2001205566A (ja) | 樹脂含浸ビトリファイド砥石およびその製造方法 | |
| JP2005246569A (ja) | 鏡面研削用レジノイド砥石 | |
| JP2003136410A (ja) | 超砥粒ビトリファイドボンド砥石 | |
| JP3553810B2 (ja) | 固体潤滑剤を含む樹脂含浸ビトリファイド砥石 | |
| JP2001300856A (ja) | 超砥粒工具 | |
| JP2006320992A (ja) | 固体潤滑剤を含む鏡面研磨用レジノイド砥石の製造方法 | |
| JP2000024934A (ja) | 鏡面加工用超砥粒砥石 | |
| JP2006297528A (ja) | 塊状砥粒を有するレジノイド砥石の製造方法 | |
| JP2003053668A (ja) | ビトリファイドボンド砥石 | |
| JP2004130464A (ja) | レジノイド研削砥石 | |
| IE20060634A1 (en) | Porous abrasive segments and tools incorporating the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100714 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120306 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120308 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120411 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121113 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121207 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151214 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5155774 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |