JP2010042468A - 研磨方法 - Google Patents
研磨方法 Download PDFInfo
- Publication number
- JP2010042468A JP2010042468A JP2008207678A JP2008207678A JP2010042468A JP 2010042468 A JP2010042468 A JP 2010042468A JP 2008207678 A JP2008207678 A JP 2008207678A JP 2008207678 A JP2008207678 A JP 2008207678A JP 2010042468 A JP2010042468 A JP 2010042468A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- load
- surface plate
- workpiece
- gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 352
- 238000000034 method Methods 0.000 title claims abstract description 69
- 239000002002 slurry Substances 0.000 claims abstract description 54
- 238000007517 polishing process Methods 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims description 19
- 238000004904 shortening Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 21
- 239000013078 crystal Substances 0.000 description 18
- 239000010453 quartz Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007494 plate polishing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008207678A JP2010042468A (ja) | 2008-08-12 | 2008-08-12 | 研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008207678A JP2010042468A (ja) | 2008-08-12 | 2008-08-12 | 研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010042468A true JP2010042468A (ja) | 2010-02-25 |
| JP2010042468A5 JP2010042468A5 (enExample) | 2011-07-28 |
Family
ID=42014269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008207678A Withdrawn JP2010042468A (ja) | 2008-08-12 | 2008-08-12 | 研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010042468A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102398213A (zh) * | 2011-05-11 | 2012-04-04 | 上海双明光学科技有限公司 | 蓝宝石led衬底抛光超薄型不锈钢载体盘及设备 |
| CN104772692A (zh) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | 一种上盘万向调心加载机构 |
| CN114425741A (zh) * | 2020-10-29 | 2022-05-03 | 株式会社迪思科 | 晶片的磨削方法 |
-
2008
- 2008-08-12 JP JP2008207678A patent/JP2010042468A/ja not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102398213A (zh) * | 2011-05-11 | 2012-04-04 | 上海双明光学科技有限公司 | 蓝宝石led衬底抛光超薄型不锈钢载体盘及设备 |
| CN104772692A (zh) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | 一种上盘万向调心加载机构 |
| CN114425741A (zh) * | 2020-10-29 | 2022-05-03 | 株式会社迪思科 | 晶片的磨削方法 |
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