JP2010035079A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator in which good frequency drift characteristics can be obtained. <P>SOLUTION: The piezoelectric oscillator includes: a container provided with a first concave space formed on one major surface of a substrate by the substrate and a first frame, and a second concave space formed on the other major surface of the substrate by the substrate and a second frame; a piezoelectric vibration element provided with an oscillation electrode, which is mounted on a pair of two piezoelectric vibration element-mounting pads provided on the major surface of the substrate exposed in the first concave space; an integrated circuit element mounted on an integrated circuit element-mounting pad provided on the other major surface of the substrate exposed in the second concave space; and a cover for airtight sealing of the first concave space. It further includes a via conductor connected to the integrated circuit element-mounting pad provided to be exposed in the second frame in the second concave space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator used in an electronic device or the like.

FIG. 7 is a cross-sectional view showing a conventional piezoelectric oscillator. FIG. 8A is a perspective plan view showing one main surface of a substrate portion of a container body constituting the conventional piezoelectric oscillator, and FIG. 8B is a substrate of the container body constituting the conventional piezoelectric oscillator. FIG. 8C is a perspective plan view showing the other main surface of the substrate portion of the container body constituting the conventional piezoelectric oscillator.
As shown in FIGS. 7 to 8, a conventional piezoelectric oscillator 200 mainly includes a container body 201, a piezoelectric vibration element 207, an integrated circuit element 209, and a lid body 208 as an example.
The container body 201 includes a substrate part 201a and two frame parts 201b and 201c.
The container body 201 is provided with a frame portion 201b on one main surface of the substrate portion 201a to form a first recessed space 202, and a frame portion 201c is provided on the other main surface of the substrate portion 201a to form a second portion. A recessed space 204 is formed.
As shown in FIG. 8A, a pair of piezoelectric vibration element mounting pads 203a and 203b are provided on one main surface of the substrate portion 201a exposed in the first recess space 202.
Further, as shown in FIG. 8C, an integrated circuit element mounting pad 205 is provided on the other main surface of the substrate portion 201a exposed in the second recess space 204.
Further, the substrate portion 201a has a laminated structure, and as shown in FIG. 8B, a first wiring pattern 212a, a second wiring pattern 212b, and the like are provided in the inner layer of the substrate portion 201a. Yes.
On the piezoelectric vibration element mounting pads 203a and 203b, a piezoelectric vibration element 207 having a pair of excitation electrodes electrically connected via a conductive adhesive 206 on the front and back main surfaces is mounted. The top surface of the frame portion 201b of the container body 201 that surrounds the piezoelectric vibration element 207 is covered with a metal lid 208 and joined. Thereby, the first recess space 202 is hermetically sealed.
Further, the integrated circuit element 209 is electrically and mechanically bonded to the integrated circuit element mounting pad 205 via a conductive bonding material such as solder. This state is called loading.

  In addition, the integrated circuit element 209 compensates for a variation in the oscillation frequency of the oscillation circuit due to a temperature change by applying a control voltage according to the ambient temperature to the variable capacitance element, so that the temperature compensation is performed by the cubic function generation circuit and the storage element unit. A circuit unit is provided, and a temperature sensor is connected to the cubic function generation circuit. This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit. Such a piezoelectric oscillator 200 is known (see, for example, Patent Document 1).

Japanese Patent No. 3406845

  However, in the conventional piezoelectric oscillator 200, the temperature sensed by the temperature sensor built in the integrated circuit element 209 and the actual ambient temperature of the piezoelectric vibration element 207 are different due to the heat generated in the integrated circuit element. is there. As a result, the conventional piezoelectric oscillator 200 is corrected by an erroneous temperature data signal (voltage value), and therefore, the oscillation frequency at the time when the voltage is applied to the piezoelectric oscillator and a certain time has elapsed since the voltage was applied. There has been a problem that the frequency drift characteristic indicating the frequency fluctuation difference from the oscillation frequency at the time becomes worse.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the piezoelectric oscillator with a favorable frequency drift characteristic.

  The piezoelectric oscillator of the present invention includes a first recessed space formed on one main surface of the substrate portion by the substrate portion and the first frame portion, and the other main surface of the substrate portion by the substrate portion and the second frame portion. Mounted on a pair of piezoelectric vibration element mounting pads provided on one main surface of the substrate body exposed in the first concave space and the container body provided with the second concave space formed in A piezoelectric vibration element provided with an excitation electrode; an integrated circuit element mounted on an integrated circuit element mounting pad provided on the other main surface of the substrate portion exposed in the second recess space; And a via conductor connected to an integrated circuit element mounting pad provided so as to be exposed to the second frame portion in the second recess space. It is characterized by that.

  In addition, a protective film covering the via conductor exposed on the main surface of the second frame portion is provided.

According to the piezoelectric oscillator of the present invention, by including the via conductor connected to the integrated circuit element mounting pad provided so as to be exposed to the second frame portion in the second recess space, Heat generated in the integrated circuit element can be dissipated into the air through the via conductor.
The temperature of the integrated circuit element is lowered by radiating heat, and the temperature of the integrated circuit element and the piezoelectric vibrating element are close to each other at the lowered temperature. As a result, the temperature sensed by the temperature sensor built in the integrated circuit element and the temperature around the actual piezoelectric vibration element approach the same value. Therefore, since the correction is made with the correct temperature data signal (voltage value), the frequency drift characteristic of the piezoelectric oscillator can be improved.

  By providing the protective film that covers the via conductor exposed on the main surface of the second frame portion, it is possible to prevent a conductive foreign matter from adhering between the via conductors, thereby preventing a short circuit. .

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described.

(First embodiment)
FIG. 1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a perspective view of the piezoelectric oscillator according to the first embodiment of the present invention as viewed from the integrated circuit element mounting side. FIG. 4A is a perspective plan view showing one main surface of the substrate portion of the container body constituting the piezoelectric oscillator according to the first embodiment of the present invention, and FIG. FIG. 4C is a perspective plan view showing an inner layer surface of a substrate portion of a container body constituting the piezoelectric oscillator according to the first embodiment, and FIG. 4C constitutes the piezoelectric oscillator according to the first embodiment of the present invention. It is a see-through plan view showing the other principal surface of the substrate part of a container body, and (d) is a top view showing the other principal surface of a container object which constitutes a piezoelectric oscillator concerning a 1st embodiment of the present invention. . In addition, the illustrated dimensions are partially exaggerated.

  As shown in FIGS. 1 and 2, the piezoelectric oscillator 100 according to the first embodiment of the present invention is mainly configured by a container body 10, a piezoelectric vibration element 20, a lid body 30, and an integrated circuit element 50. In the piezoelectric oscillator 100, the piezoelectric vibration element 20 is mounted in the first recess space 11 formed in the container body 10, and the integrated circuit element 50 is mounted in the second recess space 14. . The first recessed space 11 is hermetically sealed by the lid 30.

As shown in FIGS. 1 and 2, the piezoelectric vibration element 20 is formed by adhering and forming an excitation electrode 22 on a crystal base plate 21, and an alternating voltage from the outside passes through the excitation electrode 22 to form a crystal base plate. When applied to 21, excitation occurs in a predetermined vibration mode and frequency.
The quartz base plate 21 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 22 is formed by depositing and forming metal in a predetermined pattern on both the front and back main surfaces of the quartz base plate 21.
Such a piezoelectric vibration element 20 includes a lead electrode extending from the excitation electrode 22 attached to both main surfaces of the piezoelectric vibration element 20 and a piezoelectric vibration element mounting pad 13 formed on the inner bottom surface of the first recess space 11. Are electrically and mechanically connected through the conductive adhesive 40 to be mounted in the first recessed space 11. At this time, an end side which is a free end opposite to the side on which the extraction electrode is provided is defined as a tip portion 23 of the piezoelectric vibration element 20.

As shown in FIGS. 1 to 3, the integrated circuit element 50 is provided with an oscillation circuit for generating an oscillation output from the piezoelectric vibration element 20 on the circuit formation surface, and an output signal generated by the oscillation circuit. Is output to the outside of the piezoelectric oscillator 100 through the external connection electrode terminal 19, and is used as a reference signal such as a clock signal, for example.
In addition, the integrated circuit element 50 is applied with a control voltage according to the ambient temperature to the variable capacitance element to compensate for fluctuations in the oscillation frequency of the oscillation circuit due to temperature changes, by means of a cubic function generating circuit and a storage element unit. A compensation circuit unit is provided, and a temperature sensor is connected to the cubic function generation circuit.
This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit.
The integrated circuit element 50 is mounted on the integrated circuit element mounting pad 15 formed on the substrate portion 10a exposed in the second recessed space 14 of the container body 10 via a conductive bonding material such as solder.

As shown in FIGS. 1 to 3, the container body 10 is mainly composed of a substrate portion 10 a, a first frame portion 10 b, and a second frame portion 10 c.
In the container body 10, a first frame portion 10 b is provided on one main surface of the substrate portion 10 a to form a first recessed space 11. A second frame portion 10 c is provided on the other main surface of the container body 10 to form a second recessed space 14.
In addition, the board | substrate part 10a and the 2nd frame part 10c which comprise this container body 10 are formed by laminating | stacking multiple ceramic materials, such as an alumina ceramic and glass-ceramic, for example. The substrate portion 10a has a structure in which ceramic materials are stacked.
The first frame portion 10b is, for example, a seal ring. In this case, the first frame portion 10b is made of a metal such as 42 alloy or Kovar, and has a frame shape with the center punched out.
The first frame portion 10b is connected to the sealing conductor film 12 provided so as to surround the outer periphery of one main surface of the substrate portion 10a by brazing or the like.
Two pairs of piezoelectric vibration element mounting pads 13 a and 13 b are provided on one main surface of the substrate portion 10 a exposed in the first recess space 11.
Moreover, as shown in FIGS. 1-3, the container body 10 has the 2nd recessed space 14 formed of the other main surface of the board | substrate part 10a, and the 2nd frame part 10c.
As shown in FIG. 4B, wiring patterns 17a, 17b and the like are provided in the inner layer of the substrate portion 10a.
As shown in FIGS. 4C and 4D, the other main surface of the substrate portion 10a exposed in the second recess space 14 is provided with a plurality of integrated circuit element mounting pads 15 and two pairs. Piezoelectric vibration element measurement pads 16a and 16b are formed.
As shown in FIGS. 3 and 4D, an external connection electrode terminal 19 and a via conductor 18c are provided on the main surface of the second frame portion 10c. That is, external connection electrode terminals 19 are provided at the four corners of the main surface of the second frame portion 10c parallel to the main surface of the substrate portion 10a where the integrated circuit element mounting pads 15 are provided. Between the electrode terminals 19, the end portions of the via conductors 18 c are provided so as to be exposed.

As shown in FIGS. 4A to 4D, one piezoelectric vibration element mounting pad 13 a is formed on the inner layer of the substrate portion 10 a of the container body 10 by one substrate portion side via conductor 18 a. It is connected to the wiring pattern 17a. Further, as shown in FIGS. 4A to 4D, the wiring pattern 17a is connected to the other piezoelectric vibration element measuring pad 16b through a board portion side via conductor 18b. Thus, the one piezoelectric vibration element mounting pad 13a is connected to the other piezoelectric vibration element measurement pad 16b.
The other piezoelectric vibration element mounting pad 13b is connected to the wiring pattern 17b provided in the inner layer of the substrate portion 10a of the container body 10 by one substrate portion side via conductor 18a.
The wiring pattern 17b is connected to one piezoelectric vibration element measuring pad 16a by a board portion side via conductor 18b. As a result, the other piezoelectric vibration element mounting pad 13b is connected to the one piezoelectric vibration element measurement pad 16a.
The integrated circuit element mounting pad 15 and the external connection electrode terminal 19 include a wiring pattern (not shown) having a portion formed in the substrate portion 10 a in the second recessed space 14 of the container body 10 and a second frame. They are connected by via conductors (not shown) formed inside the portion 10c.

  As shown in FIGS. 3 and 4D, the via conductor 18c is provided so as to be exposed to the second frame portion 10c. Specifically, for example, a U-shaped groove is provided in the thickness direction of the second frame portion 10c, and a conductor such as tungsten is formed in the groove to form the via conductor 18c. Provide. The length from the main surface of the second frame portion 10c to the main surface of the substrate portion 10a is provided. The main surface of the substrate portion 10a is the other main surface of the substrate portion 10a on which the integrated circuit element mounting pad 15 is provided. That is, the via conductor 18c is provided so as to be exposed on the same plane as the surface on which the external connection electrode terminal 19 is provided, and is exposed on the surface facing the integrated circuit element 50 of the second frame portion 10c. Is provided. The via conductor 18 c is connected to the integrated circuit element mounting pad 15.

The two pairs of piezoelectric vibration element measurement pads 16a and 16b are provided on the exposed substrate portion 10a in the second recessed space 14 of the container body 10, and are provided substantially at the center of the substrate portion 10a. .
The piezoelectric vibration element measuring pads 16a and 16b are used for measuring characteristics such as an oscillation frequency and crystal impedance of the piezoelectric vibration element 20 mounted in the first recessed space 11 of the container body 10.

As shown in FIG. 4B, the wiring pattern 17a is drawn out near the center of the container body 10 when viewed from the opening side of the first recessed space 11 of the container body 10, and is interposed via the substrate part side via conductor 18b. The other piezoelectric vibration element measurement pad 16b is connected.
As shown in FIG. 4B, the wiring pattern 17b is drawn toward the center of the container body 10 when viewed from the opening side of the first recessed space 11 of the container body 10, and is connected to the via on the board part side. It is connected to one piezoelectric vibration element measuring pad 16a through a conductor 18b.

  The lid 30 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like. Such a lid 30 hermetically seals the first recessed space 11 with nitrogen gas or vacuum. Specifically, the lid 30 is placed on the seal ring 10b of the container body 10 in a predetermined atmosphere so that the metal on the surface of the seal ring 10b and a part of the metal of the lid 30 are welded. The seam welding is performed by applying a predetermined current to join the seal ring 10b.

  The conductive adhesive 40 contains conductive powder as a conductive filler in a binder such as a silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W ), Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used. .

  When the container body 10 is made of alumina ceramic, a sealing conductor film 12, a piezoelectric vibration element is formed on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a predetermined ceramic material powder. Conventionally known screens include a conductive paste that becomes the mounting pad 13, the electrode terminal 19 for external connection, and the like, and a conductive paste that becomes a via conductor in a through-hole that has been punched in advance in the ceramic green sheet. It is manufactured by applying by printing, laminating a plurality of these and press-molding them, followed by firing at a high temperature.

According to the piezoelectric oscillator according to the first embodiment of the present invention, the integration is performed on the main surface of the second frame portion 10 c of the container body 10 and the side surface of the second frame portion 10 c in the second recessed space 14. Since the via conductor 18c connected to the circuit element mounting pad 15 is exposed, the heat generated in the integrated circuit element 50 is radiated into the air via the via conductor 18c. The temperature of the integrated circuit element 50 is lowered by the heat dissipation, and the temperature of the integrated circuit element 50 and the piezoelectric vibration element 20 becomes a value close to that temperature. Therefore, the temperature sensed by the temperature sensor built in the integrated circuit element 50 and the actual temperature around the piezoelectric vibration element 20 approach the same value. Therefore, since the correction is made with the correct temperature data signal (voltage value), the frequency drift characteristic of the piezoelectric oscillator can be improved.
The good frequency drift characteristic means that there is little difference in fluctuation between the oscillation frequency when a voltage is applied to the piezoelectric oscillator 100 and the oscillation frequency when a certain time has elapsed after the voltage is applied. For example, when the elapsed time is on the horizontal axis and the frequency fluctuation difference is on the vertical axis, the closer the frequency fluctuation difference is to 0, the better the frequency drift characteristic is.

(Second Embodiment)
The piezoelectric oscillator according to the second embodiment of the present invention is different from the first embodiment in that a protective film is formed on the main surface of the second frame portion so as to cover the via conductor.
FIG. 5 is a perspective view of the piezoelectric oscillator according to the second embodiment of the present invention as viewed from the integrated circuit element mounting side.

As shown in FIG. 5, the container body 10 is mainly configured by a substrate portion 10a, a first frame portion 10b, and a second frame portion 10c.
In the container body 10, a first frame portion 10 b is provided on one main surface of the substrate portion 10 a to form a first recessed space 11. A second frame portion 10 c is provided on the other main surface of the container body 10 to form a second recessed space 14.
As shown in FIG. 5, an external connection electrode terminal 19 and a via conductor 18c are provided on the main surface of the second frame portion 10c. That is, external connection electrode terminals 19 are provided at the four corners of the main surface of the second frame portion 10c parallel to the main surface of the substrate portion 10a where the integrated circuit element mounting pads 15 are provided. Between the electrode terminals 19, the end portions of the via conductors 18 c are provided so as to be exposed.
As shown in FIG. 5, the via conductor 18c is provided so as to be exposed to the second frame portion 10c. Specifically, for example, a U-shaped groove is provided in the thickness direction of the second frame portion 10c, and a conductor such as tungsten is formed in the groove to form the via conductor 18c. Provide. The length from the main surface of the second frame portion 10c to the main surface of the substrate portion 10a is provided.
A protective film M is formed on the main surface of the second frame portion 10c so as to cover the via conductor 18c. This protective film M is formed of, for example, alumina ceramics or the like using conventionally known screen printing.

  According to the piezoelectric oscillator according to the second embodiment of the present invention, the protective film M covering the via conductor 18c exposed on the main surface of the second frame portion 10c is provided, so that the conductive material is provided between the via conductors 18c. This prevents the occurrence of short-circuiting foreign matter and prevents a short circuit.

(Example)
Examples of the piezoelectric oscillator according to the first embodiment of the present invention and the conventional piezoelectric oscillator will be described below.
FIG. 6 is a diagram showing frequency drift characteristics of the piezoelectric oscillator according to the first embodiment of the present invention and the conventional piezoelectric oscillator.
As an example, according to the structure of the piezoelectric oscillator 100 according to the first embodiment of the present invention shown in FIGS. 1 and 2, the main surface of the second frame portion 10 c and the second in the second recessed space 14. A via conductor 18c connected to the integrated circuit element mounting pad 15 is exposed on the side surface of the frame portion 10c.

  Further, as a comparative example, it was provided according to the structure of the conventional piezoelectric oscillator 200 shown in FIGS.

Note that the reference oscillation frequency f ₀ of the piezoelectric oscillator 100 according to the first embodiment of the present invention and the conventional piezoelectric oscillator 200 manufactured this time was 27.456 MHz.

First, the oscillation frequencies of the piezoelectric oscillator 100 of the present invention and the conventional piezoelectric oscillator 200 were measured.
The measurement method is to first measure 0.15 seconds after applying power to the piezoelectric oscillator 100 of the present invention and the conventional piezoelectric oscillator 200, and measure the oscillation frequency fs in 0.1 second steps after 0.15 seconds. To do. At this time, the oscillation frequency f ₁ measured after 0.15 seconds and the oscillation frequency fs after 0.15 seconds were substituted into the calculation formula (1) to calculate the frequency fluctuation difference (df / f).
df / f = (fs−f ₁ ) / f ₁ (1)
The frequency fluctuation difference (df / f) at this time was calculated as a frequency drift value.

As a result, as shown in FIG. 6, in the piezoelectric oscillator 100 of the present invention, the maximum value of the calculated frequency drift value was 11.93 ppb. Further, as shown in FIG. 6, in the conventional piezoelectric oscillator 200, the maximum value of the calculated frequency drift value was 21.19 ppb.
Accordingly, it can be seen that the piezoelectric oscillator 100 of the present invention has better frequency drift characteristics because the frequency fluctuation difference is closer to zero. That is, the via conductor connected to the integrated circuit element mounting pad 15 provided so as to be exposed to the second frame portion 10c in the second recessed space 14 of the piezoelectric oscillator 100 according to the first embodiment of the present invention. It can be seen that the frequency drift characteristic is improved by being provided with 18c.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the case where crystal is used as the piezoelectric material constituting the piezoelectric vibration element 20 has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element used may be used.
Further, the protective film M may be formed of an insulating resin such as an epoxy resin, for example.
Further, although the shape of the groove of the via conductor 18c is U-shaped, it may be formed in a V-shape.

1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. It is AA sectional drawing of FIG. It is the perspective view seen from the integrated circuit element mounting side which shows the piezoelectric oscillator which concerns on the 1st Embodiment of this invention. (A) is a see-through | perspective plan view which shows one main surface of the board | substrate part of the container body which comprises the piezoelectric oscillator which concerns on the 1st Embodiment of this invention, (b) is 1st implementation of this invention. It is a perspective top view which shows the inner layer surface of the board | substrate part of the container body which comprises the piezoelectric oscillator which concerns on a form, (c) is the board | substrate part of the container body which comprises the piezoelectric oscillator which concerns on the 1st Embodiment of this invention. It is a see-through | perspective plan view which shows the other main surface, (d) is a top view which shows the other main surface of the container body which comprises the piezoelectric oscillator which concerns on the 1st Embodiment of this invention. It is the perspective view seen from the integrated circuit element mounting side which shows the piezoelectric oscillator which concerns on the 2nd Embodiment of this invention. It is a figure which shows the frequency drift characteristic of the piezoelectric oscillator which concerns on the 1st Embodiment of this invention, and the conventional piezoelectric oscillator. It is sectional drawing which shows the conventional piezoelectric oscillator. (A) is a see-through | perspective top view which shows one main surface of the board | substrate part of the container body which comprises the conventional piezoelectric oscillator, (b) is the inner-layer surface of the board | substrate part of the container body which comprises the conventional piezoelectric oscillator. FIG. 7C is a perspective plan view showing the other main surface of the substrate portion of the container body constituting the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 10a ... Board | substrate part 10b ... 1st frame part (seal ring)
10c ... 2nd frame part 11 ... 1st recessed part space 12 ... Conductive film 13 for sealing 13a, 13b ... Piezoelectric vibration element mounting pad 14 ... 2nd recessed part space 15 ... Integrated circuit element mounting pads 16a, 16b ... Piezoelectric vibration element measurement pads 17a, 17b ... Wiring patterns 18a, 18b ... Substrate side via conductors 18c ... Via conductors 19 ... For external connection Electrode terminal M ... Protective film 20 ... Piezoelectric vibration element 21 ... Crystal base plate 22 ... Excitation electrode 23 ... Tip 30 ... Lid 40 ... Conductive adhesive 50 ... Integrated circuit element 100 ... Piezoelectric oscillator

Claims (2)

A first recess space formed on one main surface of the substrate portion by the substrate portion and the first frame portion, and formed on the other main surface of the substrate portion by the substrate portion and the second frame portion. A container body provided with a second recess space;
A piezoelectric vibration element mounted on two pairs of piezoelectric vibration element mounting pads provided on one main surface of the substrate portion exposed in the first recess space and provided with an excitation electrode;
An integrated circuit element mounted on an integrated circuit element mounting pad provided on the other main surface of the substrate portion exposed in the second recess space;
A lid for hermetically sealing the first recess space;
A piezoelectric oscillator comprising a via conductor connected to an integrated circuit element mounting pad provided so as to be exposed to a second frame portion in the second recess space.   The piezoelectric oscillator according to claim 1, further comprising a protective film that covers the via conductor exposed on the main surface of the second frame portion.

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