JP2010034295A5 - - Google Patents

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Publication number
JP2010034295A5
JP2010034295A5 JP2008194918A JP2008194918A JP2010034295A5 JP 2010034295 A5 JP2010034295 A5 JP 2010034295A5 JP 2008194918 A JP2008194918 A JP 2008194918A JP 2008194918 A JP2008194918 A JP 2008194918A JP 2010034295 A5 JP2010034295 A5 JP 2010034295A5
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JP
Japan
Prior art keywords
light emitting
package
emitting device
lead frame
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008194918A
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Japanese (ja)
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JP2010034295A (en
JP5444654B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2008194918A external-priority patent/JP5444654B2/en
Priority to JP2008194918A priority Critical patent/JP5444654B2/en
Priority to TW098121659A priority patent/TWI456784B/en
Priority to US13/056,580 priority patent/US8525208B2/en
Priority to KR1020117004530A priority patent/KR101602977B1/en
Priority to BRPI0916438 priority patent/BRPI0916438B1/en
Priority to PCT/JP2009/003192 priority patent/WO2010013396A1/en
Priority to CN200980129910.7A priority patent/CN102113139B/en
Priority to EP09802646.1A priority patent/EP2315263B1/en
Publication of JP2010034295A publication Critical patent/JP2010034295A/en
Publication of JP2010034295A5 publication Critical patent/JP2010034295A5/ja
Publication of JP5444654B2 publication Critical patent/JP5444654B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (8)

正面に凹部を有するパッケージと、前記凹部の底面に露出するリードフレームと、前記リードフレームに載置された発光素子と、前記凹部に充填される封止樹脂と、を有する発光装置であって、
前記リードフレームは、前記凹部内にて前記パッケージの正面側に向かって屈曲された屈曲部と、
前記パッケージから外部に突出されて屈曲され前記パッケージの正面と反対側の面に配置されてなる突出部と、
を有することを特徴とする発光装置。 A light emitting device comprising: a package having a concave portion on a front surface; a lead frame exposed on a bottom surface of the concave portion; a light emitting element placed on the lead frame; and a sealing resin filled in the concave portion,
The lead frame has a bent portion bent toward the front side of the package in the recess,
A protruding portion that protrudes outward from the package and is bent and disposed on a surface opposite to the front surface of the package;
A light emitting device comprising: 前記パッケージの正面と反対側の面に切欠部を有し、前記切欠部に前記突出部が収納される請求項１に記載の発光装置。   2. The light emitting device according to claim 1, wherein the light emitting device has a notch on a surface opposite to the front surface of the package, and the protrusion is accommodated in the notch. 前記リードフレームは、前記屈曲部を挟んで、前記パッケージに埋設される支持部を少なくとも一対有する請求項１または２に記載の発光装置。   The light emitting device according to claim 1, wherein the lead frame has at least a pair of support portions embedded in the package with the bent portion interposed therebetween. 前記突出部は、前記リードフレームの前記発光素子載置部の両側から延出して設けられた請求項１ないし３のいずれかに記載の発光装置。  4. The light emitting device according to claim 1, wherein the protruding portion is provided to extend from both sides of the light emitting element mounting portion of the lead frame. 前記パッケージは、前記凹部の内壁に前記屈曲部の端部を係止する係止部を有する請求項１ないし４のいずれかに記載の発光装置。  The light emitting device according to claim 1, wherein the package includes a locking portion that locks an end of the bent portion on an inner wall of the recess. 前記突出部は、前記パッケージから突出する箇所に溝部が設けられている請求項１ないし５のいずれかに記載の発光装置。  The light emitting device according to claim 1, wherein the protruding portion is provided with a groove at a position protruding from the package. 前記突出部は、前記パッケージの底面及び／又は上面から突出された請求項１ないし６のいずれかに記載の発光装置。  The light emitting device according to claim 1, wherein the protruding portion protrudes from a bottom surface and / or a top surface of the package. 前記リードフレームは、前記突出部とは別に外部電源と接続するための端子部を有し、  The lead frame has a terminal part for connecting to an external power source separately from the protruding part,
前記端子部は、前記パッケージの左右の側面に沿うように一体形成されている請求項１ないし７のいずれかに記載の発光装置。  The light emitting device according to claim 1, wherein the terminal portion is integrally formed along left and right side surfaces of the package.
JP2008194918A 2008-07-29 2008-07-29 Light emitting device Active JP5444654B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2008194918A JP5444654B2 (en) 2008-07-29 2008-07-29 Light emitting device
TW098121659A TWI456784B (en) 2008-07-29 2009-06-26 Light emitting device
CN200980129910.7A CN102113139B (en) 2008-07-29 2009-07-08 Light-emitting device
KR1020117004530A KR101602977B1 (en) 2008-07-29 2009-07-08 Light-emitting device
BRPI0916438 BRPI0916438B1 (en) 2008-07-29 2009-07-08 light emitting device
PCT/JP2009/003192 WO2010013396A1 (en) 2008-07-29 2009-07-08 Light-emitting device
US13/056,580 US8525208B2 (en) 2008-07-29 2009-07-08 Light emitting device
EP09802646.1A EP2315263B1 (en) 2008-07-29 2009-07-08 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008194918A JP5444654B2 (en) 2008-07-29 2008-07-29 Light emitting device

Publications (3)

Publication Number Publication Date
JP2010034295A JP2010034295A (en) 2010-02-12
JP2010034295A5 true JP2010034295A5 (en) 2011-09-08
JP5444654B2 JP5444654B2 (en) 2014-03-19

Family

ID=41738431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008194918A Active JP5444654B2 (en) 2008-07-29 2008-07-29 Light emitting device

Country Status (1)

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JP (1) JP5444654B2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012079723A (en) * 2010-09-30 2012-04-19 Toyoda Gosei Co Ltd Light-emitting device
WO2012108356A1 (en) * 2011-02-10 2012-08-16 日亜化学工業株式会社 Light emitting device, method for manufacturing light emitting device, and package array
CN103988323B (en) * 2011-06-08 2017-04-05 首尔半导体株式会社 Light emission diode package member
JP5796394B2 (en) 2011-07-29 2015-10-21 日亜化学工業株式会社 Light emitting device
JP5909915B2 (en) * 2011-08-05 2016-04-27 日亜化学工業株式会社 Light emitting device
JP5978572B2 (en) 2011-09-02 2016-08-24 日亜化学工業株式会社 Light emitting device
JP5864190B2 (en) * 2011-10-03 2016-02-17 スタンレー電気株式会社 Semiconductor light emitting device and manufacturing method thereof
KR101908656B1 (en) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 A light emitting device package
JP6138574B2 (en) * 2013-05-15 2017-05-31 ローム株式会社 LED module
KR102101400B1 (en) * 2013-08-20 2020-04-16 엘지디스플레이 주식회사 Light emitting diode package and liquid crystal display device using the same
KR200476946Y1 (en) * 2013-09-04 2015-04-20 아이-치운 프리시젼 인더스트리 씨오., 엘티디. Light emitting diode and light emitting diode leadframe
JP6374339B2 (en) 2015-03-26 2018-08-15 日亜化学工業株式会社 Light emitting device
US9917076B2 (en) 2016-06-16 2018-03-13 Allix Co., Ltd. LED package
KR101897007B1 (en) * 2016-11-08 2018-09-12 주식회사 올릭스 Led package
JP6435011B2 (en) * 2017-04-26 2018-12-05 ローム株式会社 LED module
JP7057512B2 (en) * 2019-08-30 2022-04-20 日亜化学工業株式会社 Light emitting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3708026B2 (en) * 2001-04-12 2005-10-19 豊田合成株式会社 LED lamp
JP3991961B2 (en) * 2002-09-05 2007-10-17 日亜化学工業株式会社 Side-emitting type light emitting device
KR100550856B1 (en) * 2003-06-03 2006-02-10 삼성전기주식회사 Method for manufacturing light emitting diode device
JP5032747B2 (en) * 2005-02-14 2012-09-26 日亜化学工業株式会社 Semiconductor device
JP2007317974A (en) * 2006-05-29 2007-12-06 Enomoto Co Ltd Side-view led device and its manufacturing method
KR100772433B1 (en) * 2006-08-23 2007-11-01 서울반도체 주식회사 Light emitting diode package employing lead terminal with reflecting surface
JP4914710B2 (en) * 2006-12-27 2012-04-11 日立ケーブルプレシジョン株式会社 Lead frame for light emitting element mounting package and method for manufacturing the same

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