JP2010027404A - Electronic device with camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device on whose substrate a camera module can easily be mounted without solder joining. <P>SOLUTION: A plurality of protrusion electrodes 24 formed in a matrix-shape on the backside of the camera module 2 are inserted into through-holes formed on the substrate 1, respectively, and locked to the backside of the substrate 1. In this locking state, the protrusion electrodes 24 and terminals formed on the backside of the substrate 1 are made into contact with each other, and the camera module 2 is simultaneously positioned on the substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device including a camera module. More specifically, the present invention relates to an electronic device capable of mounting a camera module in a non-heated state on a substrate of the electronic device main body.

  A camera module including a lens and a solid-state image sensor is mounted on an electronic device such as a camera-equipped mobile phone or a digital still camera. The camera module is mounted on a board (for example, a relay connection board (printed circuit board) or a mother board) of the electronic device main body. Usually, the camera module is mounted on the substrate by solder bonding.

  In order to perform solder joining, heating of the solder is indispensable in order to melt the solder. For example, in solder bonding using lead-free solder, a peak heating temperature of about 245 ° C. is required. Even if lead-free low-temperature solder is used, the heating temperature at the peak time needs to be about 200 ° C.

  However, the camera module includes a lens and optical components that are vulnerable to heat, such as an infrared cut filter. For example, the temperature resistance of the lens is about 90 ° C. For this reason, if the camera module is mounted on the substrate under the normal reflow conditions in which electronic components such as resistors and capacitors are mounted by solder bonding, the optical component cannot withstand heat. Therefore, it is necessary to mount the camera module on the substrate without applying heat to the optical component.

  Therefore, in order to mount the camera module on the substrate by solder bonding, for example, the following two methods are employed.

  The first method is a method of fitting the lens after mounting the camera module excluding the lens on the substrate by reflow. In this method, since the lens is fitted after reflow, the optical component such as the lens is not affected by heat even under normal reflow conditions.

  On the other hand, the second method is a method of placing a camera module on a substrate and locally heating a solder joint. In this method, since the solder joint is locally heated, the optical component such as a lens is not affected by heat.

  In mounting the camera module on the substrate, the positional relationship between the camera module and the substrate is particularly important. When solder bonding is performed, the camera module and the substrate can be aligned using the surface tension and viscosity of the solder melted by heating. Such alignment by molten solder is called self-alignment. The availability of such self-alignment is the biggest reason why the camera module is mounted on the substrate by solder bonding.

  By the way, Patent Document 1 discloses a method of electrically connecting two circuit boards using two connectors without performing solder bonding (without applying heat). However, Patent Document 1 is an invention related to a connector and does not belong to the technical field of camera modules.

FIG. 10 is a perspective view showing the substrate connection structure of Patent Document 1. In FIG. As shown in FIG. 10, in Patent Document 1, the circuit board 204 and the circuit board 205 are electrically connected to each other by the male connector 202 and the female connector 203. Specifically, the bumps 211 arranged in a row on the male connector 202 pass through the locking holes 231 formed in the female connector 203. And in this penetration state, male connector 202 and female connector 203 are latched. Thereby, the circuit board 204 and the circuit board 205 are electrically connected.
JP 2007-134169 A (published May 31, 2007)

  However, mounting the camera module on the board by solder bonding complicates the manufacturing process, requires dedicated equipment, and has low production efficiency.

  Specifically, in the first method, the camera module is mounted on the substrate by reflow without mounting the lens, and the lens is fitted after the reflow. For this reason, the manufacturing process of a 1st method will increase. If a camera module without a lens is transported, dust enters the camera module. Therefore, in practice, the camera module into which the lens is fitted must be sold to the user while mounted on the substrate.

  On the other hand, unlike the first method, the second method can mount the camera module on the substrate with the lens mounted. For this reason, the process of fitting a lens like the 1st method is unnecessary.

  However, in the second method, a special dedicated facility is required to locally heat the solder joint. For this reason, the cost for capital investment becomes enormous. Furthermore, in the second method, the solder joint portions of a plurality of camera modules cannot be heated simultaneously. That is, a plurality of electronic devices cannot be manufactured at the same time. For this reason, each single camera module is mounted on the substrate. Furthermore, since the mounting is performed while pressing the camera module, the camera module is likely to be misaligned with respect to the substrate.

  In any method, it takes time because the molten solder needs to be cooled until it cools and hardens.

  As described above, the mounting of the camera module on the substrate by solder bonding is complicated because the number of manufacturing steps increases and dedicated equipment is required. In such solder mounting, the amount of solder (thickness of preliminary solder) heating time and cooling time conditions must be set for each model of the camera module, which is very time consuming. For this reason, production efficiency is also low.

  On the other hand, as described above, the positional relationship between the camera module and the substrate is particularly important in mounting the camera module on the substrate.

  However, as described above, Patent Document 1 is an invention related to connectors (male connector 202 and female connector 203) for electrically connecting two circuit boards 204 and 205. For this reason, in Patent Document 1, it is only necessary to electrically connect the two circuit boards 204 and 205, and strict alignment is not necessary. In Patent Document 1, the male connector 202 and the female connector 203 are positioned by the boss 220 and the guide hole 239. That is, the male connector 202 and the female connector 203 themselves do not have a positioning function.

  In Patent Document 1, bumps 211 are arranged only in one direction (only in one row). For this reason, the strength (tensile strength) against the force acting in the arrangement direction of the bumps 211 is relatively high. However, the strength against the force acting in the direction perpendicular to the arrangement direction of the bumps 211 is weak. For this reason, when a force in a weak direction is applied, the male connector 202 and the female connector 203 are displaced or separated from each other.

  Accordingly, the present invention has been made in view of the above-described problems, and an object thereof is to provide an electronic apparatus capable of simply mounting a camera module on a substrate without performing solder bonding. .

In order to solve the above problems, an electronic device of the present invention is an electronic device in which a camera module is mounted on a substrate.
A plurality of protruding electrodes are formed on the back surface of the camera module (however, not all protruding electrodes are arranged on the same straight line)
A through-hole penetrating in the thickness direction is formed in the substrate corresponding to each protruding electrode,
Terminals are formed around each through hole,
The protruding electrode is inserted into the through hole and is locked to the back surface of the substrate,
In the state where the protruding electrode is locked to the back surface of the substrate, the protruding electrode and the terminal are in contact with each other, and the camera module is aligned on the substrate.

  According to said structure, the protruding electrode formed in the back surface of the camera module is inserted in the through-hole formed in the board | substrate, and is latched by the back surface of the board | substrate. Further, in this locked state, the protruding electrode and the terminal formed around the through hole come into contact with each other. Thereby, the camera module and the substrate are electrically connected to each other. Furthermore, the camera module is aligned on the substrate in this locked state.

  Moreover, according to said structure, all the protruding electrodes are scattered and arrange | positioned so that it may not be arrange | positioned on the same straight line. For example, the protruding electrode may be arranged in a matrix shape or in a ring shape on the back surface of the camera module, or may be disposed along the outer edge portion of the back surface of the camera module. Thereby, such a protruding electrode is locked to the back surface of the substrate, whereby the camera module can be firmly mounted on the substrate.

  Thus, according to the above configuration, the camera module and the substrate are electrically connected to each other by inserting the protruding electrode into the through hole and locking the protruding electrode to the back surface of the substrate, and on the substrate. A camera module is mounted at an appropriate position. Therefore, the camera module can be simply mounted on the substrate without using solder bonding.

In the electronic device of the present invention, the protruding electrode has an insertion portion that is inserted into the through hole, and a locking portion that has an outer diameter larger than that of the insertion portion and is locked to the back surface of the substrate.
The through hole has a large diameter portion having a larger outer diameter than the locking portion and a small diameter portion having a smaller outer diameter than the locking portion, which are in communication with each other.
The protruding electrode is preferably locked to the back surface of the substrate when the locking portion is disposed in the small diameter portion.

  According to the above configuration, the protruding electrode has the insertion portion and the locking portion, while the through hole has the large diameter portion and the small diameter portion that communicate with each other. Further, the outer diameter of the locking portion is smaller than the large diameter portion of the through hole and larger than the small diameter portion of the through hole. Thus, when the protruding electrode is inserted into the large diameter portion of the through hole and moved to the small diameter portion, the protruding electrode can be locked to the back surface of the substrate. Therefore, the camera module can be mounted on the substrate more easily.

  In the electronic device of the present invention, it is preferable that the protruding electrodes are disposed asymmetrically.

  According to said structure, since the protruding electrode is arrange | positioned asymmetrically, the arrangement | positioning relationship between a board | substrate and a camera module is prescribed | regulated to a specific direction. That is, the protruding electrode is locked to the back surface of the substrate only when the through hole and the protruding electrode are in a specific arrangement relationship. For this reason, it is possible to prevent the camera module from being erroneously attached to the substrate.

  In the electronic device of the present invention, it is preferable that a resin is applied around the camera module mounted on the substrate.

  According to said structure, a camera module is fixed on a board | substrate by the resin part provided around the camera module. In addition, the resin part maintains the state in which the protruding electrode is locked to the back surface of the substrate. Therefore, the mounting strength of the camera module on the substrate can be increased.

  In the electronic device of the present invention, the substrate is preferably a flexible printed circuit board.

  According to said structure, a camera module is mounted in a flexible printed circuit board (FPC (Flexible printed circuit board)). Accordingly, even if the FPC has flexibility and a large warp, the camera module and the FPC can be electrically connected with high reliability by locking the protruding electrode to the back surface of the substrate.

  In the electronic device of the present invention, the substrate may be a flexible printed circuit board.

  According to said structure, a camera module is mounted in a flexible printed circuit board (FPC (Flexible printed circuit board)). Accordingly, even if the FPC has flexibility and a large warp, the camera module and the FPC can be electrically connected with high reliability by locking the protruding electrode to the back surface of the substrate.

  The electronic device of the present invention has a configuration in which the protruding electrode and the terminal are in contact with each other and the camera module is aligned on the substrate in a state where the protruding electrode is locked to the back surface of the substrate. Therefore, there is an effect that the camera module can be simply mounted on the substrate without using solder bonding.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. Note that the present invention is not limited to this.

  In the electronic device according to the present invention, the camera module and the substrate are electrically connected to each other in a state where the bumps (projection electrodes) formed on the back surface of the camera module are locked in the through holes formed in the substrate of the electronic device body. It is connected to the. This makes it possible to mount the camera module on the substrate in a non-heated state.

  The electronic device of the present invention is suitable as various portable terminals capable of photographing such as a mobile phone with a camera, a digital still camera, and a security camera. In this embodiment, a camera-equipped mobile phone will be described as an example of an electronic device.

  FIG. 1 is a side view showing a state where a camera module is mounted on a substrate in a camera-equipped mobile phone according to an embodiment of the present invention.

  As shown in FIG. 1, the camera-equipped mobile phone 100 of this embodiment has a configuration in which an imaging camera module 2 is mounted on a substrate 1 mounted in the camera-equipped mobile phone 100. In the present embodiment, the resin 3 is applied around the camera module 2 on the substrate 1. Note that the appearance of the camera-equipped mobile phone 100 is the same as that of a known mobile phone, and a description thereof will be omitted.

  The substrate 1 is mounted on the camera-equipped mobile phone 100 main body, and the camera module 2 is mounted. For example, the substrate 1 is a mother board or a relay connection substrate of the camera-equipped mobile phone 100. In a mobile phone with a camera, a flexible printed circuit board (FPC) is often applied as the substrate 1 in order to arrange the camera module 2 at a specific position. The board | substrate 1 becomes various shapes according to the model of the mobile telephone 100 with a camera.

  The camera module 2 is an imaging device mounted on the camera-equipped mobile phone 100. A plurality of protruding electrodes 24 are formed on the back surface of the camera module 2. By this protruding electrode 24, the substrate 1 and the camera module 2 are electrically connected to each other.

  The resin 3 reinforces the mounting of the camera module 2 on the substrate 1. The camera module 2 is securely fixed on the substrate 1 by the resin 3.

  Although not shown, in addition to the camera module 2, various electronic components such as a resistor, a capacitor, and a connector that transmits image data captured by the camera module 2 to another member are mounted on the substrate 1.

  More specifically, FIG. 2 is a cross-sectional view of the camera module. FIG. 3 is a rear view of the camera module 2.

  As shown in FIG. 2, the camera module 2 includes an imaging unit 21 and a lens unit 22. Although not shown, the imaging unit 21 cuts off the infrared rays incident on the solid-state imaging device and a solid-state imaging device (for example, a CCD sensor or a CMOS sensor) that converts external scene information (picture) into an electrical signal on the base substrate 23. An IR cut filter, a DSP for processing signals from the solid-state image sensor, DSP peripheral components, and the like are mounted.

  On the other hand, the lens unit 22 includes a lens that connects an image on a solid-state imaging device provided in the imaging unit 21.

  As shown in FIG. 2, a plurality of protruding electrodes 24 are formed on the back surface of the camera module 2 (the back surface of the base substrate 23). The protruding electrode 24 is made of a conductive material and is electrically connected to the substrate 1. The protruding electrode 24 is inserted into a through hole formed in the substrate 1 as described later. The shape of the protruding electrode 24 is not particularly limited as long as it is a shape that can be locked to the back surface of the substrate 1. In the present embodiment, the protruding electrode 24 includes a locking portion 24a and an insertion portion 24b. The locking portion 24 a is a portion that is locked to the substrate 1. The cross section of the locking portion 24a has a dome shape. On the other hand, the insertion portion 24 b has a smaller outer diameter than the locking portion 24 a and is inserted into the through hole of the substrate 1.

  The arrangement state of the protruding electrodes 24 is not particularly limited as long as all the protruding electrodes 24 are scattered so as not to be arranged on the same straight line. In the present embodiment, as shown in FIG. 3, the protruding electrodes 24 are arranged in a matrix on the back surface of the camera module 2 (the back surface of the base substrate 23). The number of the protruding electrodes 24 is not particularly limited as long as the camera module 2 functions. For example, the number of protruding electrodes 24 is preferably 16 or more as shown in FIG. It is more preferable that the number is 24 or more.

  On the other hand, FIG. 4 is a plan view showing the back surface of the substrate 1. A plurality of through-holes 11 that penetrate the substrate 1 in the thickness direction are formed on the back surface of the substrate 1. The through hole 11 is provided at a position corresponding to the protruding electrode 24. In the present embodiment, the through-hole 11 has a large-diameter portion 11a having a larger outer diameter than the locking portion 24a and a small-diameter portion 11b having a smaller outer diameter than the locking portion 24a. The large diameter part 11a and the small diameter part 11b communicate with each other. Moreover, all the through-holes 11 have the same arrangement direction of the large diameter part 11a and the small diameter part 11b.

  Further, terminals 12 are formed around (through the outer edge) of each through hole 11. When the terminal 12 and the protruding electrode 24 come into contact with each other, the substrate 1 and the camera module 2 are electrically connected to each other.

  FIG. 5 is a plan view showing a state in which the protruding electrode 24 is locked to the substrate 1. The outer diameter of the large diameter portion 11 a is larger than the locking portion 24 a of the protruding electrode 24. For this reason, the latching | locking part 24a and the insertion part 24b are inserted in the large diameter part 11a. On the other hand, the outer diameter of the small diameter portion 11 b is smaller than the locking portion 24 a of the protruding electrode 24. For this reason, when the protruding electrode 24 is moved from the large diameter portion 11 a to the small diameter portion 11 b, the protruding electrode 24 is locked to the substrate 1. In this locked state, the locking portion 24a contacts the terminal 12 formed around the small diameter portion 11b. That is, since the protruding electrode 24 and the terminal 12 are in contact with each other, the camera module 2 and the substrate 1 are electrically connected to each other. At the same time, the camera module 2 is aligned with the substrate 1 in this locked state.

  Since the protruding electrode 24 is inserted into the through hole 11 and locked to the back surface of the substrate 1, it is easy to confirm the locked state of the protruding electrode 24 to the substrate 1. Further, in the example of FIG. 5, the locked state of the protruding electrode 24 can be released. That is, the protruding electrode 24 locked by the small diameter portion 11b can be moved again to the large diameter portion 11a. Therefore, for example, when the protruding electrode 24 is broken, the camera module 2 can be replaced.

  As described above, according to the camera-equipped mobile phone 100 of the present embodiment, the protruding electrode 24 formed on the back surface of the camera module 2 is inserted into the through hole 11 formed in the substrate 1 and the substrate 1 Locked to the back. Further, in this locked state, the protruding electrode 24 and the terminal 12 formed around the through hole 11 come into contact with each other. Thereby, the camera module 2 and the board | substrate 1 are mutually electrically connected. Further, the camera module 2 is aligned on the substrate 1 in this locked state.

  Further, all the protruding electrodes 24 are arranged in a scattered manner so as not to be arranged on the same straight line. Thereby, the projection module 24 is locked to the back surface of the substrate 1, whereby the camera module 2 can be firmly mounted on the substrate 1. Therefore, the camera module 2 is not shifted from or separated from the substrate 1 no matter which direction the force is applied.

  Thus, according to the camera-equipped mobile phone 100 of the present embodiment, the projecting electrode 24 is inserted into the through hole 11, and the projecting electrode 24 is locked to the back surface of the substrate 1. Are electrically connected to each other, and the camera module 2 is mounted at an appropriate position on the substrate 1. Therefore, the camera module 2 can be simply mounted on the substrate 1 without using solder bonding.

  Further, in the present embodiment, the protruding electrode 24 has an insertion portion 24b that is inserted into the through hole 11 and a locking portion 24a that has a larger outer diameter than the insertion portion 24b and is locked to the back surface of the substrate 1. Yes. On the other hand, the through-hole 11 has a large-diameter portion 11a having a larger outer diameter than the locking portion 24a and a small-diameter portion 11b having a smaller outer diameter than the locking portion 24a. And the large diameter part 11a and the small diameter part 11b are mutually connected. Furthermore, the protruding electrode 24 is locked to the back surface of the substrate 1 when the locking portion 24a is disposed in the small diameter portion 11b. Thus, when the protruding electrode 24 is inserted into the large diameter portion 11a of the through hole 11 and moved to the small diameter portion 11b, the protruding electrode 24 is locked by the small diameter portion 11b. Therefore, the camera module 2 can be mounted on the substrate 1 more easily.

  In the present embodiment, the resin 3 is applied around the camera module 2 mounted on the substrate 1. For this reason, the camera module 2 is fixed on the substrate 1 by the resin 3 provided around the camera module 2. For this reason, the state in which the protruding electrode 24 is locked to the back surface of the substrate 1 is maintained by the resin 3. Therefore, the mounting strength of the camera module 2 on the substrate 1 can be increased.

  If the resin 3 is made of, for example, an ultraviolet curable adhesive, the camera module 2 is securely attached to the substrate 1 by irradiating the adhesive portion 14 with ultraviolet rays while the camera module 2 is locked to the substrate 1. Can be implemented. As the resin 3, a thermosetting adhesive having a low curing temperature can also be used. For example, if a thermosetting resin that cures at 90 ° C. or lower is used, it does not affect optical components such as lenses.

  Further, in the present embodiment, even if the substrate 1 is flexible and is a flexible printed circuit board having a large warp, the camera module 2 and the substrate 1 can be connected by locking the protruding electrode 24 to the back surface of the substrate 1. It is highly reliable and can be electrically connected.

  Moreover, the shape of the through-hole 11 formed in the board | substrate 1 can also be made as follows. 6 to 8 are plan views showing another through-hole 11.

  The through-hole 11 in FIG. 4 and the like described above has a configuration in which the large diameter portion 11a and the small diameter portion 11b partially overlap each other. On the other hand, in the through hole 11 shown in FIGS. 6 and 7, the large diameter portion 11a and the small diameter portion 11b are independent of each other. Moreover, the large diameter part 11a and the small diameter part 11b are connected by the linear path | route 11c. While the path 11c in FIG. 6 is linear (band-shaped), the path 11c in FIG. 7 is gradually narrowed from the large diameter part 11a to the small diameter part 11b. The locking part 24a of the protruding electrode 24 cannot move along the path 11c, but the insertion part 24b can move along the path 11c. That is, in the configuration of FIG. 6 and FIG. 7, once the locking portion 24 a is locked to the substrate 1, the locked state is difficult to be released (close to fitting). Therefore, the camera module 2 can be more firmly mounted on the substrate 1 and the camera module 2 can be prevented from being displaced.

  On the other hand, in the configuration of FIG. 8, the shape of the through hole 11 is a keyhole shape. Also in this case, similarly to the configuration of FIGS. 6 and 7, once the locking portion 24a is locked to the substrate 1, the locked state is difficult to be released (close to fitting). Therefore, the camera module 2 can be more firmly mounted on the substrate 1 and the camera module 2 can be prevented from being displaced.

  In FIG. 6, the path 11c connecting the large diameter portion 11a and the small diameter portion 11b has a linear shape. However, the path 11c can also be formed in a non-linear shape. FIG. 9 is a plan view showing the through hole 11 having the non-linear path 11c. In this case, the large-diameter portion 11a and the small-diameter portion 11b are communicated with each other through the non-linear path 11c. Thereby, once the locking portion 24a is disposed on the small diameter portion 11b and the protruding electrode 24 is locked to the back surface of the substrate 1, the locked state is difficult to be released. Therefore, the mounting strength of the camera module 2 on the substrate 1 can be increased.

  In the present embodiment, the protruding electrodes 24 are arranged in a matrix on the back surface of the camera module 2. Further, the protruding electrodes 24 are arranged in a line-symmetric manner. However, the protruding electrodes 24 may be arranged asymmetrically. FIG. 10 is a rear view of the camera module 2. For example, in FIG. 10, 25 protruding electrodes 24 are arranged in a matrix on the back surface of the base substrate 23. In this case, if any one other than the central protruding electrode 24 is lost, the protruding electrode 24 is disposed asymmetrically. Further, it is preferable to lose any one of the painted bump electrodes 24. Thereby, even if the protruding electrode 24 is lost, the connection strength can be maintained.

  When the protruding electrodes 24 are arranged asymmetrically in this way, the arrangement relationship between the substrate 1 and the camera module 2 is defined in a specific direction. That is, the protruding electrode 24 is locked to the back surface of the substrate 1 only when the through hole 11 and the protruding electrode 24 are in a specific arrangement relationship. For this reason, it is possible to prevent the camera module 2 from being erroneously attached to the substrate 1.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  According to the present invention, by locking the protruding electrode to the back surface of the substrate, the camera module and the substrate can be electrically connected, and the camera module can be aligned on the substrate. For this reason, the camera module can be easily mounted on the substrate without soldering. Therefore, the camera module can be mounted in a non-heated state without using special equipment, and the manufacturing process is simplified. Therefore, it is easy to expand overseas and inexpensive manufacturing is possible.

It is a side view of the electronic device of the present invention. It is sectional drawing of the camera module mounted in the electronic device of FIG. FIG. 3 is a rear view of the camera module of FIG. 2. It is a back view of the board | substrate with which the camera module of the electronic device of FIG. 1 is mounted. It is a top view which shows the latching state of the protrusion electrode to the board | substrate of FIG. FIG. 6 is a plan view showing a state in which the protruding electrode formed on the camera module is locked to the through hole formed on the substrate in the electronic device of the present invention. It is a top view which shows another through-hole in the electronic device of this invention. It is a top view which shows another through-hole in the electronic device of this invention. It is a top view which shows another through-hole in the electronic device of this invention. It is a reverse view of another camera module. It is a perspective view which shows the board | substrate connection structure of patent document 1. FIG.

Explanation of symbols

1 Board (flexible printed circuit board)
2 Camera module 3 Reinforced resin (resin)
DESCRIPTION OF SYMBOLS 11 Through-hole 11a Large diameter part 11b Small diameter part 11c Path | route 12 Terminal 21 Lens part 22 Imaging part 23 Base board 24 Projection electrode 24a Locking part 24b Insertion part 100 Cellular phone with a camera (electronic device)

Claims (5)

In an electronic device with a camera module mounted on a board,
A plurality of protruding electrodes are formed on the back surface of the camera module (however, not all protruding electrodes are arranged on the same straight line)
A through-hole penetrating in the thickness direction is formed in the substrate corresponding to each protruding electrode,
Terminals are formed around each through hole,
The protruding electrode is inserted into the through hole and is locked to the back surface of the substrate,
An electronic apparatus, wherein a protruding electrode and a terminal are in contact with each other in a state where the protruding electrode is locked to the back surface of the substrate, and the camera module is aligned on the substrate. The protruding electrode has an insertion portion that is inserted into the through hole, and a locking portion that has a larger outer diameter than the insertion portion and is locked to the back surface of the substrate.
The through hole has a large diameter portion having a larger outer diameter than the locking portion and a small diameter portion having a smaller outer diameter than the locking portion, which are in communication with each other.
The electronic device according to claim 1, wherein the protruding electrode is locked to the back surface of the substrate when the locking portion is disposed in the small diameter portion.   The electronic device according to claim 1, wherein the protruding electrodes are disposed asymmetrically.   The electronic apparatus according to claim 1, wherein a resin is applied around the camera module mounted on the substrate.   The electronic device according to claim 1, wherein the substrate is a flexible printed circuit board.

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