JP2010021564A - 集合基板及びその製造方法 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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Abstract
【解決手段】ワークボード100は、略矩形状の基板11の一方面に絶縁層21を備え、絶縁層21の内部に、電子部品41、及び板状一体枠51が埋設されたものである。板状一体枠51は、複数の凹部53が内周壁52aに並設されたものであり、電子部品41の非載置部に、複数の電子部品41(群)を取り囲むように配置されている。
【選択図】図2
Description
図1及び図2は、本発明による集合基板の第1実施形態の構造を概略的に示す要部拡大平面図及び断面図である。ワークボード100は、複数の個別基板を作製可能なワークシート(集合体)をシート面内の面方向に複数包含する電子部品内蔵集合基板であり、略矩形状の基板11の一方の面(図示上面)に絶縁層21を備え、絶縁層21の内部の所定位置に電子部品41及び板状一体枠51(枠体)が埋設されたものである。
α1 < α3 且つ α2 < α3 ・・・ (1)、
(式中、α1は、電子部品41の線熱膨張係数(ppm/K)を示し、α2は、板状一体枠51の線熱膨張係数(ppm/K)を示し、α3は、上記の基板11、各配線層又は各絶縁層の線熱膨張係数(ppm/K)を示す。)を満たすものであれば、特に制限なく用いることができる。この種の用途に用いられる電子部品、基板、配線層及び絶縁層においては、一般的に、α1が1〜8ppm/K程度でありα3が14〜20程度であるので、α2は、3〜16(ppm/K)であることが好ましい。より具体的には、線熱膨張係数が3〜16(ppm/K)の金属、合金及び樹脂等が挙げられ、例えば、SUS400(11ppm/K)、SUS410(11ppm/K)、SUS430(10.5ppm/K)、SUS630(11ppm/K)、SUS631(10ppm/K)、SUS316(16ppm/K)、42アロイ(4.5ppm/K)、インコネル(14ppm/K)、ニッケル(12.5ppm/K)、ニッケルクロムモリブデン鋼(11ppm/K)、鉄(11ppm/K)、鋳鉄(10ppm/K)、チタン(9ppm/K)、芳香族ポリアミド(製品名:ミクトロンGQ;13ppm/K)、芳香族ポリアミド(製品名:ミクトロンML;3ppm/K)、PET(15ppm/K)、ポリイミド(3〜15ppm/K)等が挙げられ、これらの中でも、加工性や入手性、剛直性、コスト等の観点から、SUS430又はインコネルを用いることが好ましく、これらのなかでは、SUS430を用いることがより好ましい。
Claims (5)
- 面方向に個別基板を複数包含する集合基板であって、
基板と、
前記個別基板に対応して各々形成された配線層と、
少なくとも1つ以上の前記個別基板を包含する複数の集合体に対して、各集合体の外周を取り囲むように配置され、複数の凹部が内周に沿って並設された枠体と、
を備え、
前記枠体は、複数の窓を有する板状一体格子枠であり、且つ、前記各窓の内周に、前記複数の凹部が設けられたものである、
集合基板。 - 前記凹部は、該凹部の開口から内部に向かって拡開されたものである、
請求項1に記載の集合基板。 - 前記枠体は、前記隣接する凹部を結ぶ直線上に孔を有するものである、
請求項1又は2に記載の集合基板。 - さらに、絶縁層を有し、
前記板状一体格子枠が、前記絶縁層内に埋設されている、
請求項1〜3のいずれか一項に記載の集合基板。 - 面方向に個別基板を複数包含する集合基板の製造方法であって、
前記個別基板に対応して各々形成された配線層を有する基板を準備する工程と、
少なくとも1つ以上の前記個別基板を包含する複数の集合体に対して、各集合体の外周を取り囲むように、複数の凹部が内周に沿って並設された枠体を配置する工程と、
を有し、
前記枠体は、複数の窓を有する板状一体格子枠であり、且つ、前記各窓の内周に、前記複数の凹部が設けられたものである、
集合基板の製造方法。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000228566A (ja) * | 1999-02-04 | 2000-08-15 | Matsushita Electric Ind Co Ltd | 集合プリント配線板 |
JP2005019647A (ja) * | 2003-06-25 | 2005-01-20 | Sumitomo Metal Mining Package Materials Co Ltd | 補強板付きフレキシブルプリント配線板およびその製造方法 |
JP2005217099A (ja) * | 2004-01-29 | 2005-08-11 | Kyocera Corp | 多数個取り配線基板 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000228566A (ja) * | 1999-02-04 | 2000-08-15 | Matsushita Electric Ind Co Ltd | 集合プリント配線板 |
JP2005019647A (ja) * | 2003-06-25 | 2005-01-20 | Sumitomo Metal Mining Package Materials Co Ltd | 補強板付きフレキシブルプリント配線板およびその製造方法 |
JP2005217099A (ja) * | 2004-01-29 | 2005-08-11 | Kyocera Corp | 多数個取り配線基板 |
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