JP2010021481A - Method for manufacturing optical filter for display, and optical filter for display obtained by this method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical filter for display having a grounding electrode portion, which highly accurately and easily forms a grounding electrode portion for being easily attached on a display and grounded. <P>SOLUTION: The method for manufacturing an optical filter for display having a grounding electrode portion includes: a step (A) for forming a through-hole 102 on at least a part of a peripheral edge portion of a rectangular transparent substrate 101a; a step (B) for forming a grounding electrode portion 103 by filling a conductive material into the through-hole 102; a step (C) for forming a pattern-like electromagnetic shielding layer 104 on the entire one surface of the transparent substrate 101a; and a step (D) for forming a functional layer 105 on a center portion except the peripheral edge portion on the other surface of the transparent substrate 101a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is applicable to various displays such as a plasma display panel (PDP), a cathode ray tube (CRT) display, a liquid crystal display, an organic EL (electroluminescent) display, and a field emission display (FED) including a surface electric field display (SED). The present invention relates to a method for manufacturing an optical filter having various functions such as antireflection, near-infrared shielding, and electromagnetic wave shielding.

  In recent years, flat panel displays such as liquid crystal displays, plasma displays (PDPs), EL displays, and CRT displays have been mainly used for large-screen displays, and PDPs have become common as next-generation large-screen display devices. However, in this PDP, high-frequency pulse discharge is performed on the light emitting unit for image display, and there is a risk of unnecessary electromagnetic radiation and infrared radiation that may cause malfunction of an infrared remote controller or the like.

  For this reason, a filter having an electromagnetic wave shielding layer formed on a transparent substrate is known as a filter used for a display such as a PDP. In the electromagnetic wave shielding layer, for example, (1) a transparent conductive thin film containing metallic silver, (2) a conductive mesh in which a metal wire or conductive fiber is made into a net, (3) an opening is provided in a metal foil such as a copper foil. A mesh-like conductive layer, (4) a conductive layer in which conductive ink is printed in a mesh shape, or the like is used. Especially, since a high light transmittance is acquired by an opening part, the mesh-shaped electroconductive layer of (2)-(4) is used suitably. Electromagnetic waves are shielded by the conductive mesh portion, and light transmission is ensured by the opening.

  Furthermore, conventional optical filters for displays include a hard coat layer for imparting scratch resistance, and an antireflection layer for improving the visibility by suppressing the reflection of light emitted from an external light source such as a fluorescent lamp. Furthermore, a functional layer such as a near-infrared shielding layer is laminated to shield infrared rays.

  In order to produce such an optical filter for display, a method of forming a functional layer by coating on a transparent substrate on which an electromagnetic wave shielding layer is formed is used. According to such a coating method, productivity can be improved and costs can be reduced as compared with a method in which each functional layer is separately prepared and bonded.

  In the display optical filter, it is necessary to ground (earth) the electromagnetic wave shielding layer to the PDP body in order to improve the electromagnetic wave shielding property. Therefore, it is necessary to remove at least a part of the peripheral portion of the functional layer to expose the ground electrode portion of the electromagnetic wave shielding layer. However, when each functional layer is formed by coating as described above, there is a problem that the ground electrode portion cannot be exposed because the electromagnetic wave shielding layer is not exposed. Further, since the functional layer is a very thin film, it is difficult to accurately expose the electromagnetic wave shielding layer by adjusting the coating range.

  Therefore, Patent Document 1 discloses that a connection terminal is tightly connected to one end of a display optical filter in which a conductive film and a non-conductive film are formed on a plastic film substrate, and an earth electrode portion is provided by the connection terminal. Has been. Specifically, by sandwiching one end of the optical filter for display with the connection terminal and caulking and pressing strongly, the connection terminal breaks a part of the non-conductive film and comes into contact with the conductive film.

JP-A-10-138383

  In Patent Document 1, since the non-conductive film is broken by simply pressing the connection terminal, it is difficult to control the pressure when caulking with the connection terminal so as not to break the optical filter for display.

  Accordingly, an object of the present invention is to provide a method for producing an optical filter for a display having a ground electrode part, which can form the ground electrode part accurately and easily.

The first method of the present invention comprises:
Forming a through hole in at least a part of the peripheral edge of the rectangular transparent substrate;
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the other surface of the transparent substrate and on the central portion excluding the peripheral portion;
A method for producing an optical filter for a display having a ground electrode portion.

The second method of the present invention comprises:
Forming a through hole in at least a part of the peripheral edge of the rectangular transparent substrate;
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the electromagnetic shielding layer;
A method for producing an optical filter for a display having a ground electrode portion.

The third method of the present invention comprises:
A step of setting a plurality of rectangular unit regions on the long transparent base material in the longitudinal direction thereof, and forming a through hole in at least a part of the peripheral edge in the rectangular unit region of the transparent base material; ,
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the other surface of the transparent substrate and on a central portion excluding a peripheral edge in the rectangular region; and
Cutting the transparent substrate into the rectangular regions;
A method for producing an optical filter for a display having a ground electrode portion.

The fourth production method of the present invention comprises:
A step of setting a plurality of rectangular unit regions on the long transparent base material in the longitudinal direction thereof, and forming a through hole in at least a part of the peripheral edge in the rectangular unit region of the transparent base material; ,
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the electromagnetic shielding layer;
Cutting the transparent substrate into the rectangular regions;
A method for producing an optical filter for a display having a ground electrode portion.

  The method for producing an optical filter for display according to the present invention is characterized in that a grounding electrode is formed by filling a conductive material into a through-hole formed in a transparent substrate. Such an electrode for grounding can be easily formed with high accuracy and has good electrical contact with the electromagnetic wave shielding layer.

(First method)
The first manufacturing method of the optical filter for display according to the present invention will be described. FIG. 1 is a view for explaining an example of the first manufacturing method of the present invention.

The first production method of the present invention comprises:
A step (A) of forming a through hole 102 in at least a part of the peripheral edge of the rectangular transparent substrate 101a;
A step (B) of forming the ground electrode portion 103 by filling the through hole 102 with a conductive material;
A step (C) of forming a patterned electromagnetic wave shielding layer 104 on the entire surface of one surface of the transparent substrate 101a;
Forming the functional layer 105 on the other surface of the transparent substrate 101a and on the central portion excluding the peripheral portion (D);
including.

  FIG. 2 shows a top view on the surface on which the functional layer of the optical filter for display obtained by the first method of the present invention is formed. Further, the cross-sectional view of the display optical filter taken along line AA ′ in FIG. 2 corresponds to the cross-sectional view of the display optical filter obtained by the step (D) in FIG. According to the method of the present invention, the pattern-shaped electromagnetic wave shielding layer 104 is provided on the entire surface of one surface of the rectangular transparent substrate 101a, and the central portion excluding the peripheral portion on the other surface of the transparent substrate 101a. In addition, a through hole 102 is formed in at least a part of the peripheral portion of the transparent base material 101a, and a ground electrode portion formed by filling the through hole 102 with a conductive material. An optical filter for display having 103 can be provided.

  In the method of the present invention, first, in the step (A), a through hole is formed in at least a part of the peripheral edge of the rectangular transparent substrate.

  The position where the through-hole is formed in the transparent substrate is such that the obtained grounding electrode can sufficiently come into contact with the electromagnetic wave shielding layer formed on the transparent substrate and can be reliably grounded to the display body. Like that. Therefore, as shown in FIG. 2, it is preferable to intermittently form a plurality of through holes in the entire peripheral edge of the transparent substrate.

When the through holes are formed intermittently, the interval between the adjacent through holes (L ₁ in FIG. 2) is preferably _{1 to} 20 mm, particularly preferably 5 to 15 mm. Thereby, a through-hole and an electromagnetic wave shield layer can fully be made to contact.

  The through hole for forming the ground electrode portion may have any shape such as a circular shape or a rectangular shape as long as it can be filled and held with a conductive material. For example, when the shape of the through hole is circular, the diameter of the through hole is preferably 0.01 to 0.5 mm, particularly preferably 0.02 to 0.1 mm. Moreover, when the shape of a through-hole is a square, it is preferable that the length of one side of a through-hole shall be 0.01-0.5 mm, especially 0.02-0.1 mm.

  In order to form such a through hole in the transparent substrate, a known method such as drilling, punching, or laser processing can be used. Among these, it is preferable to use laser processing because minute through holes can be formed with high dimensional accuracy. In laser processing, it is preferable to use a pulse laser (pulse oscillation laser) as the laser.

  For example, in the case of using a continuous wave laser, a mask having an opening formed at a position corresponding to a through-hole formed in the transparent substrate is used, and the mask is laminated on the transparent substrate, and then the entire surface of the mask is used. A method of irradiating a continuous wave laser is used. Thereby, only the part exposed in the opening part which the mask of a transparent base material has is sublimated, and a through-hole can be formed in at least one part of the peripheral part of a transparent base material. Moreover, according to such a method, a some through-hole can be simultaneously formed in the desired position of a transparent base material.

  Moreover, according to the pulse laser, a plurality of through holes can be easily formed intermittently on the entire peripheral edge of the transparent substrate. Scanning the pulse laser along the peripheral edge of the transparent substrate can be easily performed by using a galvanometer mirror or a moving optical system unit.

The laser beam may be any laser beam that does not cause thermal damage to other parts of the transparent substrate in a short time or can be set as such. For example, a YAG laser (fundamental wave, second harmonic wave, third harmonic wave), ruby laser, excimer laser, semiconductor laser, CO ₂ laser, argon laser, or the like can be used. In particular, a YAG laser (fundamental wave), a semiconductor laser, and a CO ₂ laser are preferable.

  The laser light is preferably formed in a rectangular shape or an elliptical shape and irradiated onto the transparent substrate. In this way, the laser light can be shaped using a concave cylindrical lens or the like.

  The irradiation condition of the pulsed laser light is, for example, by irradiating a pulsed laser under the conditions of laser energy 50 to 200 mJ, pulse width 200 to 600 μsec, laser irradiation spot diameter 50 to 100 μm, and scanning speed 500 to 1500 mm / sec. Through holes can be formed without damaging other parts of the material.

  The transparent substrate used in the present invention is not particularly limited as long as it has transparency and flexibility and can withstand the subsequent treatment. Examples of the material for the transparent substrate include glass, polyester (eg, polyethylene terephthalate, (PET), polybutylene terephthalate), acrylic resin (eg, polymethyl methacrylate (PMMA)), polycarbonate (PC), polystyrene, and cellulose triacetate. , Polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion crosslinked ethylene-methacrylic acid copolymer, polyurethane, cellophane, etc. PET, PC, and PMMA, which are less transparent due to processing (heating, solvent, bending) and are highly transparent, are preferable. Among these, PET is preferable because it is inexpensive and has excellent durability. A transparent base material is used as a sheet | seat, a film, or a board which consists of these materials.

  The thickness of the transparent substrate is not particularly limited, but is preferably about 6 to 250 μm, particularly about 6 to 150 μm.

  Next, in the step (B), the ground electrode portion is formed by filling the through hole formed as described above with a conductive material.

  The conductive material filled in the through holes is preferably a cured product of a paste containing a binder resin and conductive particles.

  In order to fill such a conductive material into the through holes, for example, a method of curing the paste after filling the through holes of the transparent substrate is used.

  In order to fill the through hole of the transparent substrate with the paste, a method is used in which the paste is applied onto the peripheral portion of the transparent substrate in which the through hole is formed and pressed by pressing a slit die head or the like. . In addition, a screen printing method is preferably used.

  In order to fill the through hole with the conductive material by the screen printing method, first, a mask having an opening formed in a region corresponding to the through hole and having the same size and thickness as the through hole is prepared. The mask is laminated on the transparent substrate by aligning the through holes of the transparent substrate with the openings of the mask. Next, printing is performed while pressing the paste on the mask with a squeegee. Thereby, a paste can be filled in a through-hole.

  The step of filling the through holes with the paste is preferably performed under reduced pressure or under vacuum. Thereby, a paste can be reliably filled in a through-hole. The degree of vacuum or reduced pressure is preferably 100 to 10,000 Pa.

  The binder resin used for the conductive material is a thermoplastic, thermosetting, or light (generally ultraviolet) curable resin. Specific examples include an acrylic resin, a polyester resin, an epoxy resin, a urethane resin, a phenol resin, a maleic acid resin, a melamine resin, a urea resin, a polyimide resin, and a silicon-containing resin, and an acrylic resin is preferable.

  The conductive particles used for the conductive material include aluminum, nickel, indium, chromium, gold, vanadium, tin, cadmium, silver, platinum, copper, titanium, cobalt, lead and other metals and alloys; or ITO, indium oxide , Tin oxide, zinc oxide, indium oxide-tin oxide (ITO, so-called indium-doped tin oxide), tin oxide-antimony oxide (ATO, so-called antimony-doped tin oxide), zinc oxide-aluminum oxide (ZAO; so-called aluminum-doped zinc oxide) ) And the like.

  The average particle diameter of the conductive particles is preferably 10 to 10,000 nm, particularly 10 to 50 nm. If it is such electroconductive particle, it can disperse | distribute highly in a through-hole and can exhibit the outstanding electroconductivity.

  The content of the conductive particles in the conductive material is preferably 100 to 400 parts by mass, particularly 300 to 350 parts by mass with respect to 100 parts by mass of the binder resin.

  The paste is obtained by appropriately dispersing a binder resin and conductive particles in an organic solvent. Examples of the organic solvent include aromatic hydrocarbons such as toluene and xylene, ketones such as methyl ethyl ketone and methyl isobutyl ketone, esters such as ethyl acetate and butyl acetate, and alcohols such as isopropyl alcohol.

  The paste preferably has a viscosity of 1 to 20 Pa · s, particularly 5 to 10 Pa · s at 25 ° C. Thereby, a paste can be filled and hold | maintained in the through-hole of a transparent base material.

  In order to cure the paste, the paste preferably further contains a polymerization initiator and a crosslinking agent in addition to the binder resin and the conductive particles. For example, it is preferable to use a thermal polymerization initiator in the case of thermosetting, and to use a photopolymerization initiator, a polymerizable monomer, a polymerizable oligomer or the like in the case of ultraviolet curing.

  In order to cure the paste filled in the through holes, heating or irradiation with light such as ultraviolet rays, X-rays, γ-rays, or electron beams may be performed.

  In addition, in order to fill the through hole with the conductive material, a paste in which conductive particles are dispersed in a binder resin is molded into the same shape as the through hole previously formed on the transparent base material and cured, thereby obtaining You may carry out by filling the obtained hardened | cured material in a through-hole. Preferably, when the through hole is formed in the transparent substrate by punching, the cured product is charged at the tip of the punch so that the cured product can be filled simultaneously with the formation of the through hole during punching. .

  Next, in the step (C), a patterned electromagnetic shielding layer is formed on the entire surface of one surface of the transparent substrate.

  The electromagnetic wave shielding layer includes a metal and has conductivity. For example, (1) what consists of metals, such as copper, (2) what disperse | distributed electroconductive particle in binder resin can be mentioned.

  In the electromagnetic wave shielding layer made of (1) metal, copper, stainless steel, aluminum, nickel, iron, brass, or an alloy thereof, preferably copper, stainless steel, or aluminum is used as the metal.

  For example, (1) when forming a patterned electromagnetic shielding layer made of a metal such as copper, first, vapor deposition methods such as sputtering, ion plating, electron beam evaporation, vacuum evaporation, chemical vapor deposition, printing, Using a known method such as a method of forming a metal foil made of the metal on a transparent substrate using a method such as coating, and then forming an opening by etching the metal foil. Just do it.

  In order to produce the electromagnetic shielding layer of (1), in addition to the above method, dots are formed on a transparent substrate with a material soluble in a solvent, and the film surface is insoluble in a solvent. A method in which a conductive material layer made of a conductive material is formed and the film surface is brought into contact with a solvent to remove the dots and the conductive material layer on the dots may be used. Such a method is described in, for example, Japanese Patent Application Laid-Open No. 2001-332889.

  (2) In the electromagnetic wave shielding layer in which conductive particles are dispersed in a binder resin, examples of the conductive particles include aluminum, nickel, indium, chromium, gold, vanadium, tin, cadmium, silver, platinum, copper, Metals such as titanium, cobalt, lead, alloys; or ITO, indium oxide, tin oxide, zinc oxide, indium oxide-tin oxide (ITO, so-called indium-doped tin oxide), tin oxide-antimony oxide (ATO, so-called antimony-doped oxide) Tin), and conductive oxides such as zinc oxide-aluminum oxide (ZAO; so-called aluminum-doped zinc oxide). In particular, ITO is preferable.

  Examples of the binder resin include acrylic resin, polyester resin, epoxy resin, urethane resin, phenol resin, maleic acid resin, melamine resin, urea resin, polyimide resin, and silicon-containing resin. Furthermore, it is preferable that it is a thermosetting resin among these resins.

  (2) When forming a patterned electromagnetic shielding layer in which conductive particles are dispersed in a binder resin, a conductive ink in which conductive particles are dispersed in a binder resin is printed in a pattern on a transparent substrate. Can be used. In addition to the conductive particles and the binder resin, the conductive ink may further contain a solvent in order to adjust to an appropriate viscosity. In order to print the conductive ink in a pattern on the transparent substrate, a known method such as gravure printing, flexographic printing, gravure offset printing, screen printing, ink jet printing, or electrostatic printing may be used. Then, it is made to dry and harden at room temperature-120 degreeC as needed.

  As the electromagnetic wave shielding layer, it is preferable to use the electromagnetic wave shielding layer of (1) among the above-described ones because it is excellent in antiglare property and electrical conductivity.

  The pattern shape of the electromagnetic wave shielding layer is preferably a stripe shape or a mesh shape. An electromagnetic wave shielding layer having these patterns is preferable because conductivity can be secured by the pattern forming portion and light transmission can be secured by the opening.

  The shape of the mesh pattern in the electromagnetic wave shielding layer is not particularly limited, and examples thereof include a lattice shape in which square openings are formed, and a punching metal shape in which circular, hexagonal, triangular or elliptical openings are formed. It is done. Further, the openings are not limited to those regularly arranged, and may be a random pattern.

  The line width of the mesh-shaped electromagnetic wave shielding layer is generally 50 μm or less, preferably 5 to 45 μm, particularly 5 to 30 μm. The line pitch is preferably 200 μm or less. Moreover, it is preferable that an aperture ratio is 50 to 95%, and it is especially 55 to 80%. The aperture ratio is obtained by calculation from the line width of the mesh and the number of lines existing in 1 inch width.

  In order to improve the electromagnetic shielding effect by setting the electromagnetic shielding layer to a lower resistance value, it is preferable to form a metal plating layer on the electromagnetic shielding layer.

  The metal plating layer can be formed by a known electrolytic plating method or electroless plating method. Generally, copper, copper alloy, nickel, silver, gold, zinc or tin can be used as the metal used for plating. These can be used alone or as two or more kinds of alloys. You may do it. The thickness of the metal plating layer is preferably 0.01 to 5 μm.

  Moreover, you may provide anti-glare performance to an electromagnetic wave shield layer. This antiglare treatment may be performed by performing a blackening treatment on the surface of the electromagnetic wave shielding layer and providing a blackening layer. For example, it can be performed by oxidation treatment, black plating such as chromium alloy, application of black or dark ink, or the like.

  Next, in the step (D), a functional layer is formed on the other surface of the transparent substrate and on the central portion excluding the peripheral edge.

  In order to produce the functional layer on the other surface of the transparent substrate and excluding the peripheral portion where the through holes were formed, the functional layer was formed on the entire other surface of the transparent substrate. Thereafter, a method of removing the peripheral portion of the functional layer is preferably used. Thereby, a functional layer is formed on the center part except the peripheral part on the surface of a transparent base material, and the electrode part for earth | ground can be exposed.

  Examples of the functional layer include a near infrared absorption layer, a hard coat layer, and / or an antireflection layer. Examples of the antireflection layer include a low refractive index layer having a low refractive index and / or a high refractive index layer having a high refractive index. Especially, it is preferable that a functional layer contains a hard-coat layer at least. In the present invention, the hard coat layer means a layer having a hardness of H or more in a pencil hardness test specified by JIS 5600-5-4 (1999).

  In order to form a hard coat layer as a functional layer, a method of coating a coating liquid containing a synthetic resin composition on the surface of a transparent substrate and curing the obtained coating layer is preferably used.

  The synthetic resin composition used for forming the hard coat layer contains at least a synthetic resin. The synthetic resin is generally a thermosetting resin or an ultraviolet curable resin, and an ultraviolet curable resin is preferable. The ultraviolet curable resin can be cured in a short time, and a functional layer having excellent surface smoothness can be formed.

  Examples of the thermosetting resin include phenol resin, resorcinol resin, urea resin, melamine resin, epoxy resin, acrylic resin, urethane resin, furan resin, and silicon resin.

  Examples of the ultraviolet curable resin (monomer, oligomer) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 2-ethylhexyl polyethoxy (meth) acrylate. , Benzyl (meth) acrylate, isobornyl (meth) acrylate, phenyloxyethyl (meth) acrylate, tricyclodecane mono (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, acryloylmorpholine , N-vinylcaprolactam, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, o-phenylphenyloxyethyl (meth) acrylate, neopentylglyce Di (meth) acrylate, neopentyl glycol dipropoxy di (meth) acrylate, neopentyl glycol di (meth) acrylate hydroxypivalate, tricyclodecane dimethylol di (meth) acrylate, 1,6-hexanediol di (meth) Acrylate, nonanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, tris [(meth) acryloxyethyl] isocyanurate, ditrimethylolpropane (Meth) acrylate monomers such as tetra (meth) acrylate; polyol compounds (for example, ethylene glycol, propylene glycol, neopentyl glycol, , 6-hexanediol, 3-methyl-1,5-pentanediol, 1,9-nonanediol, 2-ethyl-2-butyl-1,3-propanediol, trimethylolpropane, diethylene glycol, dipropylene glycol, polypropylene Polyols such as glycol, 1,4-dimethylolcyclohexane, bisphenol A polyethoxydiol, polytetramethylene glycol, the polyols and succinic acid, maleic acid, itaconic acid, adipic acid, hydrogenated dimer acid, phthalic acid, isophthalic acid Polyester polyols which are reaction products of polybasic acids such as acid and terephthalic acid or acid anhydrides thereof, polycaprolactone polyols which are reaction products of the polyols and ε-caprolactone, the polyols and the above, Polybasic acid or this Reaction products of these acid anhydrides with ε-caprolactone, polycarbonate polyol, polymer polyol, etc.) and organic polyisocyanate (for example, tolylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, diphenylmethane-4,4′-diisocyanate, diisocyanate) Cyclopentanyl diisocyanate, hexamethylene diisocyanate, 2,4,4′-trimethylhexamethylene diisocyanate, 2,2′-4-trimethylhexamethylene diisocyanate, etc.) and a hydroxyl group-containing (meth) acrylate (for example, 2-hydroxyethyl (meta ) Acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate , Cyclohexane-1,4-dimethylol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, etc.) (Meth) such as bisphenol type epoxy (meth) acrylate, which is a reaction product of bisphenol type epoxy resin such as polyurethane (meth) acrylate, bisphenol A type epoxy resin, bisphenol F type epoxy resin and (meth) acrylic acid which is a reaction product Examples include acrylate oligomers. These compounds can be used alone or in combination. These ultraviolet curable resins may be used as a thermosetting resin together with a thermal polymerization initiator.

  Of the above UV curable resins (monomers and oligomers), hard polyfunctional monomers such as pentaerythritol tri (meth) acrylate, pentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate are mainly used. It is preferable.

  The synthetic resin composition used for forming the hard coat layer preferably further contains a photopolymerization initiator of an ultraviolet curable resin. As the photopolymerization initiator, any compound suitable for the properties of the ultraviolet curable resin can be used. For example, acetophenone such as 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropane-1 Benzoin series such as benzyl dimethyl ketal, benzophenone, 4-phenylbenzophenone, benzophenone series such as hydroxybenzophenone, thioxanthone series such as isopropylthioxanthone, 2-4-diethylthioxanthone, and other special types include methylphenyl glyoxylate Etc. can be used. Particularly preferably, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropane-1, Examples include benzophenone. These photopolymerization initiators may be optionally selected from one or more known photopolymerization accelerators such as benzoic acid type or tertiary amine type such as 4-dimethylaminobenzoic acid. It can be used by mixing at a ratio. Moreover, it can be used by 1 type, or 2 or more types of mixture of only a photoinitiator. In particular, 1-hydroxycyclohexyl phenyl ketone (manufactured by Ciba Specialty Chemicals, Irgacure (registered trademark) 184) is preferable.

  Generally content of a photoinitiator is 0.1-10 mass% with respect to a synthetic resin composition, Preferably it is 0.1-5 mass%.

  The synthetic resin composition used for forming the hard coat layer preferably further contains silicone oil. Thereby, it becomes possible to improve the surface smoothness of the functional layer. Preferred examples of the silicone oil include dimethyl silicone oil, methylphenyl silicone oil, and methylhydrogen silicone oil. These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  The content of the silicone oil is preferably 0.0005 to 0.1 parts by mass, more preferably 0.001 to 0.05 parts by mass with respect to 100 parts by mass of the synthetic resin. Thereby, the 1st functional layer excellent in transparency and surface smoothness is obtained.

  When the functional layer is a hard coat layer, the functional layer may contain only a synthetic resin, but other components such as an ultraviolet absorber, an infrared absorber, an anti-aging agent, a paint processing aid, and a colorant may be used. An ingredient may be further included. It is preferable to contain a UV absorber, particularly a benzotriazole UV absorber or a benzophenone UV absorber. Thereby, prevention of yellowing etc. of a filter can be performed efficiently. The content of other components is generally 0.1 to 10% by mass, preferably 0.1 to 5% by mass, based on the synthetic resin composition.

  The hard coat layer forming coating solution is obtained by dispersing or dissolving a synthetic resin composition in an organic solvent. Although it does not restrict | limit especially as an organic solvent, What is easy to dry is preferable. Specifically, ketones such as acetone, methyl ethyl ketone and methyl ethyl isobutyl ketone, esters such as methyl acetate, ethyl acetate and butyl acetate, aromatics such as toluene and xylene, and alcohols such as methanol and isopropyl alcohol are used. be able to. Acetone, methyl ethyl ketone, methyl acetate and ethyl acetate are preferred. These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  The content of the organic solvent in the hard coat layer forming coating solution is preferably 50 parts by mass or less, preferably 20 to 40 parts by mass, particularly preferably 25 to 35 parts by mass with respect to 100 parts by mass of the synthetic resin composition. It is. With such a content, it is possible to suppress unevenness that may occur on the surface due to volatilization of the organic solvent when the coating layer is cured, and to form a functional layer having excellent surface smoothness. It becomes possible.

  In order to apply the coating liquid for forming the hard coat layer onto the surface of the transparent substrate, for example, a gravure coater, roll coater (size press, gate roll coater, etc.), bar coater, air knife coater, blade coater, dipping, The coating can be performed using a coating means such as a bar coater, blade coater, knife coater, reverse roll coater, gravure roll coater, squeeze coater, curtain coater, spray coater, or die coater.

  What is necessary is just to perform using a means, such as a heating or ultraviolet irradiation, in order to make it harden | cure after applying the coating liquid for hard-coat layer formation. Thereby, a hard coat layer is obtained. Since a functional layer having excellent surface smoothness can be formed, it is preferable to use an ultraviolet curable synthetic resin composition and cure the coating layer by ultraviolet irradiation. Therefore, the ultraviolet curable synthetic resin composition preferably contains the above-described ultraviolet curable resin and a photopolymerization initiator.

  In the case of ultraviolet curing, many light sources that emit light in the ultraviolet to visible range can be used as the light source, such as ultra-high pressure, high pressure, low pressure mercury lamp, chemical lamp, xenon lamp, halogen lamp, mercury lamp, carbon arc lamp, incandescent lamp, A laser beam etc. can be mentioned. The irradiation time cannot be determined unconditionally depending on the type of lamp and the intensity of the light source, but is about several seconds to several minutes. Further, in order to accelerate curing, the coating layer may be preheated to 40 to 120 ° C. and irradiated with ultraviolet rays.

  When forming a hard-coat layer as a functional layer, the thickness of a hard-coat layer is 1-50 micrometers normally, Preferably it is 5-40 micrometers, Most preferably, it is 5-35 micrometers.

  In the method of the present invention, an antireflection layer may be further formed as another functional layer on the hard coat layer formed as described above. By forming the antireflection layer in this way, the antireflection property can be further improved.

  Examples of the antireflection layer include a low refractive index layer having a low refractive index and / or a high refractive index layer having a high refractive index. As the antireflection layer, (1) only a low refractive index layer having a lower refractive index than the hard coat layer may be formed on the hard coat layer, and (2) a high refractive index layer having a higher refractive index than the hard coat layer, The low refractive index layer having a refractive index lower than that of the high refractive index layer may be laminated in this order.

  In order to form the low refractive index layer, a coating liquid containing fine particles of silica, fluororesin, etc., preferably hollow silica, in addition to a synthetic resin, preferably an ultraviolet curable resin monomer, oligomer, photopolymerization initiator, is used. It is done.

In order to form a high refractive index layer, in addition to a synthetic resin, preferably an ultraviolet curable resin monomer, oligomer, photopolymerization initiator, ITO, ATO, Sb ₂ O ₃ , ZrO ₂ , SbO ₂ , In ₂ O ₃ A coating liquid containing fine metal oxide particles such as SnO ₂ , ZnO, Al-doped ZnO, and TiO ₂ is used. The metal oxide fine particles preferably have an average particle diameter of 10 to 10000 nm, preferably 10 to 50 nm. ITO, particularly those having an average particle size of 10 to 50 nm are preferred.

  The coating liquid used for forming the low refractive index layer and the high refractive index layer may each contain an organic solvent. The same synthetic resin, photopolymerization initiator, and organic solvent as those described above in the hard coat layer can be used for the coating liquid. Further, the low refractive index layer and the high refractive index layer can be formed by sequentially applying each coating solution on the hard coat layer and then curing it in the same manner as the hard coat layer.

  The thickness of the low refractive index layer is usually in the range of 10 to 500 nm, preferably 20 to 200 nm. The refractive index of the low refractive index layer is preferably 1.35 to 1.45. When the refractive index is more than 1.45, the antireflection characteristic of the antireflection film is deteriorated.

  The thickness of the high refractive index layer is usually 10 to 500 nm, preferably 20 to 200 nm. The refractive index of the high refractive index layer is preferably 1.64 or more. By setting the refractive index of the high refractive index layer to 1.64 or more, the minimum reflectance of the surface reflectance of the antireflection layer can be made within 1.5%, and it is 1.69 or more, preferably 1.69 to By setting it to 1.82, the minimum reflectance of the surface reflectance of the antireflection layer can be kept within 1.0%.

  Next, in order to remove the peripheral portion of the functional layer formed as described above and expose the ground electrode portion, a method of polishing and removing using a diamond wheel, sandblast, file, needle, etc., or hail processing A cutting method such as laser processing or a method such as laser processing is used.

  When using a hale processing method, it is preferable to remove the functional layer with a hail tool to which ultrasonic vibration is applied. Thereby, only the functional layer can be easily removed with high accuracy.

  As a method for removing the coating layer, it is preferable to use laser processing. The functional layer can be removed by scanning the laser spot irradiated on the functional layer along the peripheral edge of the surface of the functional layer.

Any laser can be used as long as it can remove the synthetic resin or the like of the functional layer by combustion, decomposition, or the like without causing thermal damage to the transparent substrate in a short time. As the laser light, a YAG laser (fundamental wave, second harmonic wave, third harmonic wave), ruby laser, excimer laser, semiconductor laser, CO ₂ laser, argon laser, or the like can be used. In particular, a YAG laser (fundamental wave), a semiconductor laser, and a CO ₂ laser are preferable because the synthetic resin layer can be removed in a short time.

  For example, the functional layer is partially removed by irradiating a pulse laser under the conditions of laser energy 30 to 50 mJ, pulse width 100 to 250 μsec, laser irradiation spot diameter 50 to 300 μm, and scan speed 200 to 1000 mm / sec. The surface of the transparent substrate can be partially exposed.

The width (L ₂ in FIG. ₂ ) of the peripheral portion of the transparent substrate exposed without forming the functional layer is preferably 1 to 100 mm, particularly preferably _{2 to} 50 mm. Thereby, the electrode part for earth | ground can be exposed reliably.

  The display optical filter obtained by the method of the present invention can easily and accurately form a ground electrode having good electrical contact with the electromagnetic wave shielding layer. Further, according to the grounding electrode, it is possible to ground the PDP main body from either the front surface or the back surface of the display optical filter. Furthermore, even if an electromagnetic wave shielding layer is placed on the back of the display optical filter, it can be easily grounded to the display body by the ground electrode, so a functional layer is formed directly on the surface of the display optical filter. can do. Therefore, such a functional layer has excellent surface smoothness and excellent antireflection properties.

(Second method)
In the 1st method of this invention mentioned above, although the process (D) which forms a functional layer on the center part except the peripheral part on the surface of a transparent base material was implemented, the position in which a functional layer is formed is It is not limited to this, It can also form on an electromagnetic wave shield layer. That is, in the second method of the present invention, as shown in the explanatory diagram of FIG. 3, the functional layer 105 is formed on the electromagnetic wave shielding layer 104 instead of the step (D) in the first method described above. Step (D ′) is performed. Thereby, a functional layer can be formed without restricting a formation position in order to expose the electrode part for earthing.

  In the 2nd method of this invention, it can implement similarly to the 1st method mentioned above except implementing the process (D ') of forming a functional layer on an electromagnetic wave shield layer. Therefore, hereinafter, only the step (D ′) will be described.

  The position for forming the functional layer on the electromagnetic wave shielding layer is not particularly limited, and may be a central portion excluding the peripheral edge of the transparent substrate, but the functional layer is formed on the entire electromagnetic wave shielding layer. Is preferred. Since there is no restriction | limiting in a formation position, a functional layer can be formed easily. The functional layer preferably includes at least a hard coat layer, and an antireflection layer may be further formed on the hard coat layer. In order to form such a functional layer, a method similar to the first method described above may be used.

  According to the second method of the present invention, there is a patterned electromagnetic shielding layer on the entire surface of one surface of the rectangular transparent substrate, a functional layer on the electromagnetic shielding layer, and a transparent substrate. A through-hole is formed in at least a part of the peripheral portion of the material, and an optical filter for a display having a ground electrode portion formed by filling the through-hole with a conductive material can be provided.

  As described above, the display optical filter obtained by the method of the present invention can easily and accurately form a ground electrode having good electrical contact with the electromagnetic wave shielding layer. In addition, the ground electrode portion is exposed on the surface of the display optical filter, so that it can be easily grounded to the PDP main body.

(Third method)
In the first and second methods described above, a display optical filter manufacturing method using a rectangular transparent substrate is used in advance, but a display optical filter is manufactured using a long transparent substrate. You can also

That is, the third method of the present invention
A step of setting a plurality of rectangular unit regions in the longitudinal direction on a long transparent base material, and forming a through hole in at least a part of a peripheral portion in the rectangular unit region of the transparent base material ( A) and
Forming a ground electrode portion by filling the through-hole with a conductive material; and
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate (C);
A step (D) of forming a functional layer on the other surface of the transparent substrate and on a central portion excluding a peripheral edge in the rectangular region;
A step (E) of cutting the transparent substrate into the rectangular regions;
A method for producing an optical filter for a display having a ground electrode portion.

  In the method of the present invention, first, a plurality of rectangular unit regions are set on the long transparent base material in the longitudinal direction, and at least a part of the peripheral edge in the rectangular unit region of the transparent base material is set. Step (A) of forming a through hole is performed.

Specifically, as shown in FIG. 4, a plurality of rectangular unit regions (regions S ₁ and S surrounded by a broken line portion and a side end portion of the transparent substrate 101b in FIG. 4) divided by a predetermined size. ₂ ,... S _n ) are continuously set in the longitudinal direction on the long transparent substrate 101b, and the through holes 102 are formed in at least a part of the peripheral edge in the rectangular unit region.

  What is necessary is just to determine the magnitude | size of a rectangular unit area | region so that the optical film obtained when a transparent base material is cut | disconnected by a post process may have a desired magnitude | size.

  The position where the through hole is formed may be at least a part of the peripheral edge in the rectangular unit region of the transparent substrate. As shown in FIG. 4, it is preferable to intermittently form a plurality of through holes in the entire peripheral edge portion in the rectangular unit region of the transparent substrate. Thereby, the obtained grounding electrode can sufficiently come into contact with the electromagnetic wave shielding layer formed on the transparent substrate, and can be reliably grounded to the display body.

  As shown in FIG. 4, such a through hole can be formed intermittently at the entire periphery of the rectangular unit region. Further, as shown in FIG. 5, first, through holes are intermittently formed in the band-like regions at both end portions of the transparent substrate, and then the through-holes are formed in the entire peripheral portion of the rectangular unit region in a later step. Thus, a step of forming a through hole may be further performed.

  The through hole for forming the ground electrode portion may have any shape such as a circular shape or a rectangular shape as long as it can be filled and held with a conductive material. For example, when the shape of the through hole is circular, the diameter of the through hole is preferably 0.01 to 0.5 mm, particularly preferably 0.02 to 0.1 mm. Moreover, when the shape of a through-hole is a square, it is preferable that the length of one side of a through-hole shall be 0.01-0.5 mm, especially 0.02-0.1 mm.

When the through holes are formed intermittently, the interval between the adjacent through holes (L ₁ in FIG. 2) is preferably _{1 to} 20 mm, particularly preferably 5 to 15 mm. Thereby, a through-hole and an electromagnetic wave shield layer can fully be made to contact.

  In order to form the through hole in the transparent substrate, the same method as the first method described above is used.

  Next, in the present invention, a step (B) of forming a ground electrode portion by filling the through hole with a conductive material, and a patterned electromagnetic shielding layer is formed on the entire surface of one surface of the transparent substrate. Step (C) is performed, but these steps can be performed in the same manner as in the first method described above.

  Next, in the present invention, as shown in FIG. 6, the functional layer 105 is formed on the other surface of the long transparent substrate 101 b and on the central portion excluding the peripheral portion in the rectangular region. Step (D) is performed.

  In order to produce the functional layer in this way, after forming the functional layer on the entire other surface of the long transparent substrate, the functional layer formed on the peripheral edge in the rectangular region is formed. A method of removing is preferably used.

  Examples of the functional layer include a near infrared absorption layer, a hard coat layer, and / or an antireflection layer. Examples of the antireflection layer include a low refractive index layer having a low refractive index and / or a high refractive index layer having a high refractive index. Especially, it is preferable that a functional layer contains a hard-coat layer at least. An antireflection layer may be further formed on the hard coat layer.

  A specific method for manufacturing these functional layers and a method for removing the functional layers formed on the peripheral edge in the rectangular region can be performed in the same manner as the first method described above. .

  In the third method of the present invention, a rectangular shape having the same structure as shown in FIG. 2 is obtained by carrying out the step (E) of cutting the long transparent substrate into each initially set rectangular region. Finally, an optical filter for display having a shape can be obtained.

  Moreover, in the 3rd method of this invention, it is preferable to implement all processes, running a transparent base material. In such a case, it is preferable to use a roll-to-roll method.

Also in the said 3rd method, it is preferable that the width | variety (L2 in FIG. ₂ ) of the peripheral part of a transparent base material exposed without forming a functional layer shall be 1-100 mm, especially 2-50 mm.

  The time for performing the step (E) of cutting the long transparent substrate is not particularly limited, and is performed any time after the step (A) for forming the through hole in the transparent substrate is performed. be able to.

(Fourth method)
In the third method of the present invention described above, the step (D) of forming a functional layer on the other surface of the long transparent substrate and on the central portion excluding the peripheral edge in the rectangular region. Although it implemented, the position in which a functional layer is formed is not limited to this, It can also form on an electromagnetic wave shield layer. That is, the fourth method of the present invention implements a step (D ′) of forming a functional layer on the electromagnetic wave shielding layer instead of the step (D) in the third method described above. Accordingly, the functional layer can be formed without limiting the formation position in order to expose the ground electrode portion.

  In the 2nd method of this invention, it can implement similarly to the 3rd method mentioned above except implementing the process (D ') of forming a functional layer on an electromagnetic wave shield layer. Therefore, hereinafter, only the step (D ′) will be described.

  The position at which the functional layer on the electromagnetic wave shielding layer is formed is not particularly limited, but the functional layer is preferably formed on the entire electromagnetic wave shielding layer. Since there is no restriction | limiting in a formation position, a functional layer can be formed easily. The functional layer preferably includes at least a hard coat layer, and an antireflection layer may be further formed on the hard coat layer. In order to form such a functional layer, a method similar to the first method described above may be used.

  According to the fourth method of the present invention, it is possible to provide a rectangular display optical filter having the same configuration as the display optical filter obtained by the second method.

  The optical filter for display obtained by the first to fourth methods of the present invention described above is not particularly limited, but using means such as bonding to the surface of the image display glass plate of the display via a transparent adhesive layer. Applicable to displays. Such displays include field emission displays (FED) including surface field display (SED), liquid crystal displays (LCD), plasma display panels (PDP), flat panel displays (FPD) such as EL displays, and CRTs. A display etc. are mentioned.

  In addition, the ground electrode portion of the optical filter for display is used for grounding to the electronic display main body. In order to perform grounding more reliably, a conductive adhesive tape may be attached on the ground electrode portion.

  As the conductive pressure-sensitive adhesive tape, one in which a coating layer of a conductive particle-containing adhesive is provided on one surface of a metal foil is used. The conductive material-containing adhesive is obtained by dispersing conductive particles in an adhesive and an appropriate organic solvent.

  As the conductive particles, the same particles as those described above in the electromagnetic wave shielding layer are used. Adhesives include acrylic adhesives made from butyl acrylate, rubber adhesives, thermoplastic elastomers (TPE) such as SEBS (styrene / ethylene / butylene / styrene) and SBS (styrene / butadiene / styrene). TPE-based pressure-sensitive adhesives, adhesives, and the like whose main component is) can also be used.

  As metal foil used as the base material of the conductive pressure-sensitive adhesive tape, foil of copper, silver, nickel, aluminum, stainless steel or the like can be used, and the thickness thereof is usually about 1 to 100 μm.

  The conductive material-containing adhesive layer is a roll coater, die coater, knife coater obtained by uniformly mixing the metal foil with the conductive particles, adhesive, and an appropriate organic solvent in a predetermined ratio. It can be easily formed by coating with a My Cover coater, a flow coater, a spray coater or the like. The thickness of the conductive particle-containing adhesive layer is usually about 5 to 100 μm.

  What is necessary is just to determine the site | part which adhere | attaches a conductive adhesive tape in the optical filter for displays so that earthing | grounding of the electronic display main body can be performed more reliably. Adhere one end of the conductive adhesive tape so that it covers at least part of the ground electrode part of the electromagnetic wave shielding layer, preferably the entire area, and adhere the other end of the conductive adhesive tape to the back of the optical filter It is preferable to do so. Thereby, the grounding to the electronic display main body can be reliably performed.

  Hereinafter, the present invention will be described with reference to examples. The present invention is not limited by the following examples.

Example 1
Circular through-holes with a diameter of 10 mm were intermittently formed by punching on the entire periphery of a polyethylene terephthalate (PET) film (thickness 100 μm, dimensions 600 mm × 400 mm). The interval (L ₁ ) between the through holes was 5 mm.

  Next, a paste (viscosity of 10 Pa · s at 25 ° C.) containing the following components was prepared, filled in the through-holes by screen printing, and then cured by ultraviolet irradiation.

Paste composition:
Dipentaerythritol hexaacrylate (DPHA) 30 parts by mass Irgacure 184 (manufactured by Ciba Specialty Chemicals) 5 parts by mass ITO (average particle size 100 nm) 50 parts by mass Methyl ethyl ketone 10 parts by mass Toluene 5 parts by mass

  Next, a 20% aqueous solution of polyvinyl alcohol was printed in dots on the entire back surface of the PET film. The size of one dot is a square shape with one side of 234 μm, the interval between the dots is 20 μm, and the dot arrangement is a square lattice. The printing thickness is 5 μm after drying. On top of that, copper was vacuum-deposited to an average film thickness of 4 μm. Next, it was immersed in water at room temperature, and the dot portion was dissolved and removed by rubbing with a sponge, then rinsed with water and dried. As a result, a mesh-shaped electromagnetic wave shielding layer was formed on the entire back surface of the PET film. This electromagnetic wave shielding layer had a square lattice shape corresponding exactly to the negative pattern of dots, and had an average thickness of 4 μm, an average line width of 20 μm, an average pitch of 254 μm, and an aperture ratio of 77%.

Next, a hard coat layer-forming coating solution containing the following components was prepared, applied onto the entire surface of the PET film with a bar coater, and cured by ultraviolet irradiation to form a hard coat layer. The entire periphery of the hard coat layer was condensed with an output of 30 W and a diameter of 0.5 mm at the focal position using a CO ₂ laser processing machine, and irradiated with laser at a moving speed of 100 mm / second.

  As a result, as shown in FIG. 2, the PET film 101a is exposed with a width (L) of 5 mm around the entire periphery of the hard coat layer 105, and the ground electrode portion 103 is intermittently continuously formed in the exposed region. Got an optical filter.

(Evaluation)
A resistance meter (Milliohm Hitester; manufactured by Hioki Electric Co., Ltd.) was connected to the electrode part for grounding (two opposing electrode parts) of the optical filter, and the resistance value was measured. The resistance value of the optical filter obtained in Example 1 was 87 mΩ.

  In addition, the optical filter obtained in Example 1 is not inferior to the conventional one in transparency and electromagnetic wave shielding properties even if it is actually applied to the PDP, and can be applied to the PDP very easily. It was.

It is a figure for demonstrating one example of the 1st manufacturing method of this invention. It is a top view on the surface in which the functional layer of the optical filter for displays obtained by the 1st and 3rd method of this invention was formed. It is a figure for demonstrating one example of the 2nd manufacturing method of this invention. It is a top view of the elongate transparent base material in which the through-hole was formed in the process (A) of the 3rd and 4th method of this invention. It is a top view of the elongate transparent base material in which the through-hole was formed in the process (A) of the 3rd and 4th method of this invention. It is a top view on the surface in which the functional layer of the elongate transparent base material was formed in the process (D) of the 3rd method of this invention.

Explanation of symbols

101a Rectangular transparent substrate,
101b long transparent substrate,
102 through-hole,
103 grounding electrode,
104 patterned electromagnetic shielding layer,
105 functional layers,
S ₁ rectangular unit area,
S ₂ Rectangular unit area.

Claims (9)

Forming a through hole in at least a part of the peripheral edge of the rectangular transparent substrate;
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the other surface of the transparent substrate and on the central portion excluding the peripheral portion;
A method for producing an optical filter for a display having a ground electrode portion. Forming a through hole in at least a part of the peripheral edge of the rectangular transparent substrate;
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the electromagnetic shielding layer;
A method for producing an optical filter for a display having a ground electrode portion.   The method according to claim 1 or 2, wherein a plurality of through holes are intermittently formed in the entire peripheral edge of the transparent substrate.   The method according to claim 1, wherein the functional layer is a hard coat layer. A step of setting a plurality of rectangular unit regions on the long transparent base material in the longitudinal direction thereof, and forming a through hole in at least a part of the peripheral edge in the rectangular unit region of the transparent base material; ,
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the other surface of the transparent substrate and on a central portion excluding a peripheral edge in the rectangular region; and
Cutting the transparent substrate into the rectangular regions;
A method for producing an optical filter for a display having a ground electrode portion. A step of setting a plurality of rectangular unit regions on the long transparent base material in the longitudinal direction thereof, and forming a through hole in at least a part of the peripheral edge in the rectangular unit region of the transparent base material; ,
Forming a ground electrode portion by filling the through hole with a conductive material;
Forming a patterned electromagnetic wave shielding layer on the entire surface of one surface of the transparent substrate;
Forming a functional layer on the electromagnetic shielding layer;
Cutting the transparent substrate into the rectangular regions;
A method for producing an optical filter for a display having a ground electrode portion.   The method according to claim 5 or 6, wherein a plurality of through holes are intermittently formed in the entire peripheral edge in the rectangular unit region.   The method according to claim 5, wherein the functional layer is a hard coat layer.   The display-use optical filter which has the electrode part for earth | grounding obtained by the method of any one of Claims 1-8.

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