JP2010021292A - Substrate lifting/transporting device and substrate processing/transporting system - Google Patents

Substrate lifting/transporting device and substrate processing/transporting system Download PDF

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JP2010021292A
JP2010021292A JP2008179554A JP2008179554A JP2010021292A JP 2010021292 A JP2010021292 A JP 2010021292A JP 2008179554 A JP2008179554 A JP 2008179554A JP 2008179554 A JP2008179554 A JP 2008179554A JP 2010021292 A JP2010021292 A JP 2010021292A
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substrate
processing apparatus
posture
lifting
lowering
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JP5169557B2 (en
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Yoshiyuki Wada
芳幸 和田
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IHI Corp
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IHI Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To allow effective utilization of factory space, by fully reducing the occupied area of a substrate lifting/transporting device 7. <P>SOLUTION: A lifting guide frame 29 which extends vertically is provided upright near a first substrate transporting/processing device 3; the lifting guide 29 is provided with a lifting body 31 to allow ascending/descending; the lifting body 31 comprises a sucking pad 43 for holding a substrate W and is provided with a substrate-receiving member 35 for swinging around a horizontal axis; and the substrate-receiving member 35 switches to an upright attitude or toppled attitude due to the substrate-receiving member undergoing swinging motion. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、クリーン搬送等の分野において用いられる基板昇降移送装置及び基板処理移送システムに関する。   The present invention relates to a substrate lifting and lowering transfer apparatus and a substrate processing transfer system used in the field of clean transfer and the like.

等に関する。 Etc.

クリーン搬送の分野において、下階フロアに配設された第1基板処理装置と上階フロアに配設された第2基板処理装置との間で、ガラス基板等の基板の昇降移送(移送)を行う基板昇降移送装置が用いられることがあり、一般的な基板昇降移送装置の構成等は、次のようになる。   In the field of clean transfer, a substrate such as a glass substrate is moved up and down (transfer) between a first substrate processing apparatus disposed on a lower floor and a second substrate processing apparatus disposed on an upper floor. A substrate lifting / lowering transfer device to be performed may be used, and a configuration of a general substrate lifting / lowering transfer device is as follows.

即ち、第1基板処理装置の近傍には、上下方向へ延びた昇降ガイドが設けられており、この昇降ガイドには、基板を支持する昇降テーブルが昇降可能に設けられている。また、昇降ガイドの適宜位置には、昇降テーブルを昇降させる昇降用モータが設けられている。ここで、昇降テーブルは、第1基板処理装置に対応する高さ位置に位置したときに、第1基板処理装置に対して基板を引き出し及び送り出し可能になっており、第2基板処理装置に対応する高さ位置に位置したときに、第2基板処理装置に対して基板を引き出し及び送り出し可能になっている。   That is, an elevating guide extending in the vertical direction is provided in the vicinity of the first substrate processing apparatus, and an elevating table for supporting the substrate is provided in the elevating guide so as to be raised and lowered. Further, a lifting motor for lifting the lifting table is provided at an appropriate position of the lifting guide. Here, when the lifting table is positioned at a height corresponding to the first substrate processing apparatus, the substrate can be drawn out and sent out from the first substrate processing apparatus, and is compatible with the second substrate processing apparatus. The substrate can be pulled out and sent out to the second substrate processing apparatus when positioned at the height position.

従って、昇降用モータの駆動によって昇降体を下降させて、第1基板処理装置に対応する高さ位置に位置させる。次に、第1基板処理装置から昇降テーブルに基板を引き出す。そして、昇降用モータの駆動によって昇降体を上昇させて、第2基板処理装置に対応する高さ位置に位置させる。更に、昇降テーブルから第2基板処理装置に基板を送り出す。   Accordingly, the elevating body is lowered by driving the elevating motor and is positioned at a height position corresponding to the first substrate processing apparatus. Next, the substrate is pulled out from the first substrate processing apparatus to the lifting table. And the raising / lowering body is raised by the drive of the raising / lowering motor, and is located in the height position corresponding to a 2nd substrate processing apparatus. Further, the substrate is sent from the lifting table to the second substrate processing apparatus.

以上により、第1基板処理装置から第2基板処理装置への基板の昇降移送を行うことができる。また、基板昇降移送装置に前述の動作と逆の動作をさせることにより、前記第2基板処理装置から前記第1基板処理装置への基板の昇降移送を行うことができる。   As described above, the substrate can be moved up and down from the first substrate processing apparatus to the second substrate processing apparatus. In addition, by causing the substrate lifting / lowering apparatus to perform an operation reverse to the above-described operation, the substrate can be moved up and down from the second substrate processing apparatus to the first substrate processing apparatus.

なお、本発明に関連する先行技術として特許文献1に示すものがある。
特開平1−318247号公報
In addition, there exists a thing shown to patent document 1 as a prior art relevant to this invention.
JP-A-1-318247

ところで、前述のように、一般的な基板昇降移送装置にあっては、昇降ガイドに基板を支持する昇降テーブルが昇降可能に設けられているため、基板を倒伏姿勢に保ちつつ昇降させることになり、基板昇降移送装置の平面スペース(設置スペース)として少なくとも基板一枚分の平面積(平面スペース)以上必要になる。そのため、基板昇降移送装置の平面スペースが増大して、工場のスペースの有効利用を図ることが難しくなる。特に、近年、基板の大型化が急速に進んでおり、前述の問題はより顕著になってきている。   By the way, as described above, in a general substrate lifting / lowering transfer device, the lifting guide for supporting the substrate is provided on the lifting guide so that it can be lifted, so that the substrate is lifted and lowered while maintaining the lying posture. The plane space (installation space) of the substrate lifting / lowering apparatus is required to be at least a plane area (plane space) equivalent to one substrate. Therefore, the plane space of the substrate lifting / lowering apparatus increases, making it difficult to effectively use the factory space. In particular, in recent years, the increase in the size of substrates has been rapidly progressing, and the above-mentioned problems have become more prominent.

そこで、本発明は、前述の問題を解決することができる、新規な構成の基板昇降移送装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a substrate lifting / lowering transfer device having a novel configuration that can solve the above-described problems.

本発明の第1の特徴は、下階フロアに配設されかつ基板に対して処理を行う第1基板処理装置と、上階フロアに配設されかつ基板に対して処理を行う第2基板処理装置との間で、基板の昇降移送を行う基板昇降移送装置において、前記第1基板処理装置の近傍に立設され、上下方向へ延びた昇降ガイドと、前記昇降ガイドに昇降可能に設けられた昇降体と、前記昇降体を昇降させる昇降用アクチュエータと、前記昇降体に水平な軸心周りに揺動可能に設けられ、基板を保持する保持具を有し、揺動によって起立姿勢/倒伏姿勢(起立姿勢又は倒伏姿勢)に切り替わるように構成され、基板の受取り及び受渡しを行う基板受け部材と、前記基板受け部材を揺動させる揺動用アクチュエータと、を備えたことを要旨とする。   The first feature of the present invention is that a first substrate processing apparatus disposed on the lower floor and processing a substrate, and a second substrate processing disposed on the upper floor and performing processing on the substrate. In a substrate lifting / lowering apparatus that moves a substrate up and down with respect to the apparatus, the substrate is vertically installed in the vicinity of the first substrate processing apparatus and extends in the up-down direction, and can be moved up and down on the lifting guide. A lifting body, a lifting actuator for moving the lifting body, and a swinging tool provided on the lifting body so as to be swingable around a horizontal axis, and holding a substrate. The gist of the invention is that the apparatus includes a substrate receiving member that receives and delivers a substrate and a swing actuator that swings the substrate receiving member.

なお、本願の特許請求の範囲及び明細書中において、「設けられ」とは、直接的に設けられたことの他に、介在部材を介して間接的に設けられたことを含む意である。また、「基板の処理」とは、基板の搬送処理、基板のプロセス処理、基板の保管処理等を含む意であって、プロセス処理には、エッチング処理、CVD処理、PVD処理等が含まれる。   In the claims and specification of the present application, “provided” means not only directly provided but also indirectly provided via an interposition member. In addition, “substrate processing” means substrate transport processing, substrate process processing, substrate storage processing, and the like, and the process processing includes etching processing, CVD processing, PVD processing, and the like.

第1の特徴によると、(前記昇降用アクチュエータの駆動によって前記昇降体を下降させて、前記第1基板処理装置に対応する高さ位置に位置させる。次に)、前記昇降体を前記第1基板処理装置に対応する高さ位置に位置させた状態で、前記保持具によって前記第1基板処理装置の所定位置に位置した基板を保持する。そして、前記揺動用アクチュエータの駆動によって前記基板受け部材を揺動させて倒伏姿勢から起立姿勢に切り替えることにより、前記第1基板処理装置から基板を受け取ることができる。   According to the first feature (the lowering body is lowered by driving the elevating actuator to be positioned at a height corresponding to the first substrate processing apparatus. Next), the lifting body is moved to the first. The substrate positioned at a predetermined position of the first substrate processing apparatus is held by the holding tool in a state where the substrate is positioned at a height corresponding to the substrate processing apparatus. The substrate can be received from the first substrate processing apparatus by swinging the substrate receiving member by driving the swinging actuator and switching from the lying posture to the standing posture.

前記第1基板処理装置から基板を受け取った後に、前記基板受け部材を起立姿勢に保ちつつ、換言すれば、基板を起立姿勢に保ちつつ、前記昇降用アクチュエータの駆動によって前記昇降体を上昇させて、前記第2基板処理装置に対応する高さ位置に位置させる。そして、前記揺動用アクチュエータの駆動によって前記基板受け部材を揺動させて起立姿勢から倒伏姿勢に切り替え、前記保持具による保持状態を解除することにより、前記第2基板処理装置に基板を受け渡すことができる。   After receiving the substrate from the first substrate processing apparatus, the lifting member is lifted by driving the lifting actuator while maintaining the substrate receiving member in an upright position, in other words, maintaining the substrate in a standing position. And a height position corresponding to the second substrate processing apparatus. Then, the substrate receiving member is swung by driving the swinging actuator to switch from the standing posture to the lying posture, and the holding state by the holder is released, so that the substrate is delivered to the second substrate processing apparatus. Can do.

以上により、前記第1基板処理装置から前記第2基板処理装置への基板の昇降移送を行うことができる。なお、前記昇降体を上昇させる途中に、前記基板受け部材を起立姿勢に切り替えても構わない。   As described above, the substrate can be moved up and down from the first substrate processing apparatus to the second substrate processing apparatus. In addition, the substrate receiving member may be switched to a standing posture while raising the elevating body.

また、前記基板昇降移送装置に前述の動作と逆の動作をさせることにより、前記第2基板処理装置から前記第1基板処理装置への基板の昇降移送を行うことができる。   Further, the substrate can be moved up and down from the second substrate processing apparatus to the first substrate processing apparatus by causing the substrate lifting and lowering apparatus to perform an operation reverse to the above-described operation.

要するに、前記昇降体に前記保持具を有した前記基板受け部材が水平な軸心周りに揺動可能に設けられ、前記基板受け部材が揺動によって起立姿勢/倒伏姿勢に切り替わるように構成されているため、前述のように、基板を起立姿勢に保ちつつ昇降させることができ、前記基板昇降移送装置の平面スペースを基板一枚分の平面積未満に抑えることができる。   In short, the substrate receiving member having the holder is provided on the elevating body so as to be swingable around a horizontal axis, and the substrate receiving member is configured to switch between a standing posture and a lying posture by swinging. Therefore, as described above, the substrate can be moved up and down while maintaining an upright posture, and the planar space of the substrate lifting and transferring apparatus can be suppressed to less than the plane area of one substrate.

本発明の第2の特徴は、下階フロアに配設されかつ基板に対して処理を行う第1基板処理装置と、上階フロアに配設されかつ基板に対して処理を行う第2基板処理装置との間で、基板の昇降移送を行う基板昇降移送装置において、前記第1基板処理装置の一側に水平な軸心周りに揺動可能に設けられ、基板を保持する第1姿勢切替用保持具を有し、基板の姿勢を倒伏姿勢/起立姿勢に切り替える第1姿勢切替部材と、前記第1姿勢切替部材を揺動させる第1姿勢切替用アクチュエータと、前記第2基板処理装置の一側に水平な軸心周りに揺動可能に設けられ、基板を保持する第2姿勢切替用保持具を有し、基板の姿勢を倒伏姿勢/起立姿勢に切り替える第2姿勢切替部材と、前記第2姿勢切替部材を揺動させる第2姿勢切替用アクチュエータと、前記第1姿勢切替部材の近傍に立設され、上下方向へ延びた昇降ガイドと、前記昇降ガイドに昇降可能に設けられ、基板を保持する昇降用保持具を有した昇降ユニットと、前記昇降ユニットを昇降させる昇降用アクチュエータと、を備えたことを要旨とする。   The second feature of the present invention is that the first substrate processing apparatus is disposed on the lower floor and performs processing on the substrate, and the second substrate processing is disposed on the upper floor and performs processing on the substrate. In a substrate lifting / lowering transfer apparatus that moves a substrate up and down with respect to the apparatus, it is provided on one side of the first substrate processing apparatus so as to be swingable around a horizontal axis, and holds a substrate. A first posture switching member that has a holder and switches the posture of the substrate between a lying posture and a standing posture; a first posture switching actuator that swings the first posture switching member; and a second substrate processing apparatus. A second posture switching member that is provided so as to be swingable about a horizontal axis on the side, and has a second posture switching holder for holding the substrate, and switches the posture of the substrate between a lying posture and a standing posture; Second posture switching actuator for swinging the two posture switching member An elevating guide that is erected in the vicinity of the first posture switching member and extends in the vertical direction; an elevating unit that is provided in the elevating guide so as to be movable up and down; The gist of the invention is that it includes an elevating actuator for elevating and lowering the unit.

第2の特徴によると、前記第1姿勢切替用保持具によって前記第1基板処理装置の所定位置に位置した基板を保持する。次に、前記第1姿勢切替用アクチュエータの駆動によって前記第1姿勢切替部材を揺動させて、基板の姿勢を倒伏姿勢から起立姿勢に切り替える。そして、前記昇降ユニットを前記第1基板処理装置に対応する高さ位置に位置させた状態で、前記昇降用保持具によって基板を保持し、前記第1姿勢切替用保持具による保持状態を解除する。   According to the second feature, the substrate positioned at a predetermined position of the first substrate processing apparatus is held by the first posture switching holder. Next, the first posture switching member is swung by driving the first posture switching actuator to switch the substrate posture from the lying posture to the standing posture. Then, the substrate is held by the lifting holder while the lifting unit is positioned at a height corresponding to the first substrate processing apparatus, and the holding state by the first posture switching holder is released. .

前記第1姿勢切替用保持具による保持状態を解除した後に、基板を起立姿勢に保ちつつ、前記昇降用アクチュエータの駆動によって前記昇降ユニットを上昇させて、前記第2基板処理装置に対応する高さ位置に位置させる。次に、前記第2姿勢切替用保持具によって基板を保持し、前記昇降用保持具による保持状態を解除する。そして、前記第2姿勢切替用アクチュエータの駆動によって前記第2姿勢切替部材を揺動させて、基板の姿勢を起立姿勢から倒伏姿勢に切り替え、前記第2姿勢切替用保持具による保持状態を解除する。   After releasing the holding state by the first posture switching holder, the elevation unit is raised by driving the elevation actuator while keeping the substrate in a standing posture, and the height corresponding to the second substrate processing apparatus To position. Next, a board | substrate is hold | maintained by the said 2nd attitude | position switching holder, and the holding state by the said raising / lowering holder is cancelled | released. Then, by driving the second posture switching actuator, the second posture switching member is swung to switch the substrate posture from the standing posture to the lying posture, and the holding state by the second posture switching holder is released. .

以上により、前記第1基板処理装置から前記第2基板処理装置への基板の昇降移送を行うことができる。   As described above, the substrate can be moved up and down from the first substrate processing apparatus to the second substrate processing apparatus.

また、前記基板昇降移送装置に前述の動作と逆の動作をさせることにより、前記第2基板処理装置から前記第1基板処理装置への基板の昇降移送を行うことができる。   Further, the substrate can be moved up and down from the second substrate processing apparatus to the first substrate processing apparatus by causing the substrate lifting and lowering apparatus to perform an operation reverse to the above-described operation.

要するに、前記第1基板処理装置の一側に前記第1姿勢切替用保持具を有した前記第1姿勢切替部材が水平な軸心周りに揺動可能に設けられ、前記第2基板処理装置の一側に前記第2姿勢切替用保持具を有した前記第2姿勢切替部材が水平な軸心周りに揺動可能に設けられているため、前述のように、基板を起立姿勢に保ちつつ昇降させることができ、前記基板昇降移送装置の平面スペースを基板一枚分の平面積未満に抑えることができる。   In short, the first posture switching member having the first posture switching holder is provided on one side of the first substrate processing device so as to be swingable around a horizontal axis, and the second substrate processing device includes: Since the second posture switching member having the second posture switching holder on one side is provided so as to be swingable around a horizontal axis, as described above, the substrate is moved up and down while maintaining the standing posture. Therefore, the plane space of the substrate lifting / lowering apparatus can be suppressed to less than the plane area of one substrate.

本発明の第3の特徴は、基板に対して処理及び昇降移送を行う基板処理移送システムにおいて、下段フロアに配設され、基板に対して処理を行う第1基板処理装置と、上段フロアに配設され、基板に対して処理を行う第2基板処理装置と、前記第1基板処理装置と前記第2基板処理装置の間で基板の昇降移送を行う第1の特徴又は第2の特徴からなる基板昇降移送装置と、を備えたことを要旨とする。   A third feature of the present invention is a substrate processing transfer system that performs processing and up-and-down transfer with respect to a substrate, and is arranged on the lower floor, and is disposed on the upper floor. A second substrate processing apparatus configured to process a substrate, and a first feature or a second feature for moving the substrate up and down between the first substrate processing apparatus and the second substrate processing apparatus. The gist of the present invention is that it includes a substrate lifting and lowering transfer device.

第3の特徴によると、第1の特徴又は第2の特徴による作用と同様の作用を奏する。   According to the 3rd characteristic, there exists an effect | action similar to the effect | action by the 1st characteristic or the 2nd characteristic.

本発明によれば、前記基板昇降移送装置の平面スペースを基板一枚分の平面積未満に抑えることができるため、前記基板昇降移送装置の平面スペースを十分に削減して、工場のスペースの有効利用を図ることができる。   According to the present invention, since the planar space of the substrate lifting / lowering transfer device can be suppressed to less than the plane area of one substrate, the planar space of the substrate lifting / lowering transporting device can be sufficiently reduced to effectively use the factory space. Can be used.

(第1実施形態)
第1実施形態について図1から図5を参照して説明する。
(First embodiment)
A first embodiment will be described with reference to FIGS. 1 to 5.

ここで、図1は、第1実施形態に係る基板処理移送システムの斜視図、図2及び図3は、第1実施形態に係る基板処理移送システムの動作を示す側断面図、図4は、図2におけるIV-IV線に沿った図、図5は、図2におけるV-V線に沿った図である。なお、図面中、「FF」は、前方向、「FR」は、後方向、「L」は、左方向、「R」は、右方向を指してある。   Here, FIG. 1 is a perspective view of the substrate processing transfer system according to the first embodiment, FIGS. 2 and 3 are side sectional views showing the operation of the substrate processing transfer system according to the first embodiment, and FIG. FIG. 5 is a view taken along line IV-IV in FIG. 2, and FIG. 5 is a view taken along line VV in FIG. In the drawings, “FF” indicates the forward direction, “FR” indicates the backward direction, “L” indicates the left direction, and “R” indicates the right direction.

図1に示すように、第1実施形態に係る基板処理移送システム1は、例えばガラス基板等の基板Wに対して搬送処理(処理の一例)及び昇降移送を行うシステムである。そして、基板処理移送システム1は、下階フロアLFに配設されかつ基板Wに対して搬送処理を行う第1基板搬送処理装置(第1基板処理装置の一例)3と、上階フロアUFに配設されかつ基板Wに対して搬送処理を行う第2基板搬送処理装置(第2基板処理装置の一例)5と、第1基板搬送処理装置3と第2基板搬送処理装置5の間で基板Wに対して昇降移送を行う基板昇降移送装置7とを備えている。   As shown in FIG. 1, the substrate processing transfer system 1 according to the first embodiment is a system that performs transfer processing (an example of processing) and up-down transfer for a substrate W such as a glass substrate. Then, the substrate processing transfer system 1 is arranged on the lower floor LF and the first substrate transport processing apparatus (an example of the first substrate processing apparatus) 3 that performs transport processing on the substrate W, and the upper floor UF. A second substrate transfer processing apparatus (an example of a second substrate processing apparatus) 5 that is disposed and performs transfer processing on the substrate W, and a substrate between the first substrate transfer processing apparatus 3 and the second substrate transfer processing apparatus 5 And a substrate up-and-down transfer device 7 that performs up-and-down transfer with respect to W.

基板処理移送システム1の第1基板搬送処理装置3の構成は、次のようになる。   The configuration of the first substrate transfer processing apparatus 3 of the substrate processing transfer system 1 is as follows.

即ち、図2及び図4に示すように、下階フロアLFには、第1処理装置本体9が設けられており、この第1処理装置本体9は、第1基板搬送処理装置3のベースを構成するものである。また、第1処理装置本体9には、基板Wをエアの圧力によって浮上させる複数の第1浮上ユニット11が設けられており、各第1浮上ユニット11の上面には、エアを噴出する枠状のノズル11nがそれぞれ形成されており、各ノズル11nは、特開2006−182563号公報に示すように、鉛直方向に対してユニット中心側へ傾斜するように構成されている。   That is, as shown in FIGS. 2 and 4, the lower floor LF is provided with a first processing apparatus main body 9, and the first processing apparatus main body 9 serves as a base of the first substrate transfer processing apparatus 3. It constitutes. The first processing apparatus main body 9 is provided with a plurality of first levitation units 11 for levitation of the substrate W by the pressure of air, and a frame shape for ejecting air is formed on the upper surface of each first levitation unit 11. Nozzles 11n are respectively formed, and each nozzle 11n is configured to be inclined toward the unit center with respect to the vertical direction as disclosed in JP-A-2006-182563.

なお、各第1浮上ユニット11の上面に枠状のノズル11nが形成される代わりに、複数の丸穴状のノズルが形成されるようにしても構わない。   Instead of forming the frame-shaped nozzle 11n on the upper surface of each first levitation unit 11, a plurality of nozzles having a round hole shape may be formed.

第1処理装置本体9には、搬送方向(左右方向)へ延びた一対の第1ローラ支持部材13が搬送幅方向(前後方向)に離隔して設けられており、各第1ローラ支持部材13には、基板Wを搬送可能に支持する複数の第1搬送ローラ15が水平な軸心周りに回転可能かつ搬送方向に沿って間隔を置いてそれぞれ設けられている。そして、各第1ローラ支持部材13の適宜位置には、複数の第1搬送ローラ15を回転させる第1搬送用モータ17がそれぞれ設けられており、各第1搬送用モータ17の出力軸(図示省略)は、複数の第1搬送ローラ15の回転軸(図示省略)にウォーム及びホイール等からなる連動機構(図示省略)を介して連動連結してある。   The first processing apparatus main body 9 is provided with a pair of first roller support members 13 extending in the transport direction (left-right direction) and spaced apart in the transport width direction (front-rear direction). The plurality of first transport rollers 15 that support the substrate W so as to be transportable are provided so as to be rotatable around a horizontal axis and at intervals along the transport direction. A first transport motor 17 that rotates the plurality of first transport rollers 15 is provided at an appropriate position of each first roller support member 13, and an output shaft (illustrated) of each first transport motor 17 is provided. (Not shown) is linked to the rotation shafts (not shown) of the plurality of first transport rollers 15 via a linkage mechanism (not shown) composed of a worm and a wheel.

基板処理移送システム1の第2基板搬送処理装置5の構成は、次のようになる。   The configuration of the second substrate transfer processing apparatus 5 of the substrate processing transfer system 1 is as follows.

即ち、図2及び図5に示すように、上階フロアUFには、第2処理装置本体19が設けられており、この第2処理装置本体19は、第2基板搬送処理装置5のベースを構成するものである。また、第2処理装置本体19には、基板Wをエアの圧力によって浮上させる複数の第2浮上ユニット21が設けられており、各第2浮上ユニット21の上面には、第1浮上ユニット11と同様に、エアを噴出する枠状のノズル21nがそれぞれ形成されている。   That is, as shown in FIGS. 2 and 5, the upper floor UF is provided with a second processing apparatus main body 19, and the second processing apparatus main body 19 serves as a base of the second substrate transfer processing apparatus 5. It constitutes. Further, the second processing apparatus main body 19 is provided with a plurality of second levitation units 21 for levitation of the substrate W by the pressure of air, and on the upper surface of each second levitation unit 21, the first levitation unit 11 and Similarly, a frame-like nozzle 21n for ejecting air is formed.

第2処理装置本体19には、搬送方向へ延びた一対の第2ローラ支持部材23が搬送幅方向に離隔して設けられており、各第2ローラ支持部材23には、基板Wを搬送可能に支持する複数の第2搬送ローラ25が水平な軸心周りに回転可能かつ搬送方向に沿って間隔を置いてそれぞれ設けられている。そして、各第2ローラ支持部材23の適宜位置には、複数の第2搬送ローラ25を回転させる第2搬送用モータ27がそれぞれ設けられており、各第2搬送用モータ27の出力軸(図示省略)は、複数の第2搬送ローラ25の回転軸(図示省略)にウォーム及びホイール等からなる連動機構(図示省略)を介して連動連結してある。   The second processing apparatus main body 19 is provided with a pair of second roller support members 23 extending in the transport direction so as to be separated from each other in the transport width direction, and the substrate W can be transported to each second roller support member 23. A plurality of second transport rollers 25 that are supported by each other are rotatably provided around a horizontal axis and spaced from each other along the transport direction. A second transport motor 27 for rotating the plurality of second transport rollers 25 is provided at an appropriate position of each second roller support member 23, and an output shaft (illustrated) of each second transport motor 27 is provided. (Not shown) is linked to the rotation shafts (not shown) of the plurality of second transport rollers 25 via an interlocking mechanism (not shown) made up of a worm and a wheel.

基板処理移送システム1の基板昇降移送装置7の具体的な構成は、次のようになる。   A specific configuration of the substrate lifting / lowering transfer device 7 of the substrate processing transfer system 1 is as follows.

図1から図4に示すように、第1基板搬送処理装置3の左側近傍には、上下方向へ延びた昇降ガイドフレーム(昇降ガイド)29が立設されており、この昇降ガイドフレーム29には、前後方向へ延びた昇降体31が昇降可能に設けられている。そして、昇降ガイドフレーム29の上部には、昇降体31を昇降(上下方向へ移動)させる昇降用モータ(昇降用アクチュエータの一例)33が設けられており、昇降用モータ33の出力軸(図示省略)は、上下方向へ延びたボールねじ又はチェーン等の昇降機構(図示省略)に連動連結してある。   As shown in FIGS. 1 to 4, an elevating guide frame (elevating guide) 29 extending in the vertical direction is erected in the vicinity of the left side of the first substrate transfer processing apparatus 3. The elevating body 31 extending in the front-rear direction is provided so as to be able to move up and down. An elevating motor (an example of an elevating actuator) 33 that raises and lowers (moves up and down) the elevating body 31 is provided at the upper portion of the elevating guide frame 29, and an output shaft (not shown) of the elevating motor 33 is omitted. ) Is interlocked with a lifting mechanism (not shown) such as a ball screw or a chain extending in the vertical direction.

昇降体31の右側面には、基板Wの受取り及び受渡しを行う基板受け部材35が一対のブラケット37を介して水平な軸心周りに揺動可能(回動可能)に設けられている。また、基板受け部材35は、昇降体31の右側面に一対のブラケット37を介して回転可能に設けられた揺動シャフト39と、この揺動シャフト39の外周面に一体的に形成されかつ平行に延びた一対の揺動アーム41と、各揺動アーム41に長手方向に沿って間隔を置いてそれぞれ設けられかつ基板Wの裏面を吸着(保持の一例)する複数の吸着パッド(保持具の一例)43とを備えている。更に、基板受け部材35は、揺動によって起立姿勢(図2において仮想線で示す姿勢、図3において実線で示す姿勢)/倒伏姿勢(図2において実線で示す姿勢、図3において仮想線で示す姿勢)に切り替わるように構成されている。そして、一方のブラケット37には、基板受け部材35を揺動させる揺動用モータ(揺動用アクチュエータの一例)45が設けられており、この揺動用モータ45の出力軸(図示省略)は、揺動シャフト39にカップリング(図示省略)等を介して連動連結してある。ここで、昇降体31を第1基板搬送処理装置3に対応する高さ位置(図2に示す高さ位置)又は第2基板搬送処理装置5に対応する高さ位置(図3に示す高さ位置)に位置させたときに、基板受け部材35を起立姿勢から倒伏姿勢に切り替えても、一対の揺動アーム41は第1浮上ユニット11及び第2浮上ユニット21に干渉しないようになっている。   A substrate receiving member 35 for receiving and transferring the substrate W is provided on the right side surface of the elevating body 31 so as to be swingable (rotatable) around a horizontal axis via a pair of brackets 37. The substrate receiving member 35 is integrally formed on and parallel to the swing shaft 39 rotatably provided on the right side surface of the elevating body 31 via a pair of brackets 37. And a plurality of suction pads (an example of holding) that are provided on each of the swing arms 41 at intervals along the longitudinal direction and suck the back surface of the substrate W (an example of holding). One example) 43 is provided. Further, the substrate receiving member 35 is erected by swinging (posture shown in phantom line in FIG. 2, posture shown in solid line in FIG. 3) / falling posture (posture shown in solid line in FIG. 2, shown in phantom line in FIG. 3). (Posture). One bracket 37 is provided with a swinging motor (an example of a swinging actuator) 45 that swings the substrate receiving member 35, and an output shaft (not shown) of the swinging motor 45 swings. The shaft 39 is connected to the shaft 39 through a coupling (not shown) or the like. Here, the elevation body 31 is at a height position corresponding to the first substrate transfer processing apparatus 3 (height position shown in FIG. 2) or at a height position corresponding to the second substrate transfer processing apparatus 5 (height shown in FIG. 3). When the substrate receiving member 35 is switched from the standing posture to the lying posture, the pair of oscillating arms 41 does not interfere with the first levitation unit 11 and the second levitation unit 21. .

なお、揺動アーム41に吸着パッド43が設けられる代わりに、他の保持具として、基板Wの裏面を非接触で保持するベルヌーイチャック(図示省略)又は基板Wの端部を把持(保持の一例)するクランパ(図示省略)が設けられるようにしても構わない。   Instead of providing the suction pad 43 on the swing arm 41, as another holding tool, a Bernoulli chuck (not shown) that holds the back surface of the substrate W in a non-contact manner or an end portion of the substrate W (an example of holding) A clamper (not shown) may be provided.

続いて、第1実施形態の作用及び効果について説明する。   Then, the effect | action and effect of 1st Embodiment are demonstrated.

複数の第1浮上ユニット11のノズル11nからエアを噴出させつつ、一対の第1搬送用モータ17の駆動によって複数の第1搬送ローラ15を回転させることにより、基板Wを左方向へ浮上搬送し、待機した一対の揺動アーム41の上側(第1基板搬送処理装置3の所定位置)に位置させることができる。ここで、昇降体31は、図2に示すように、第1基板搬送処理装置3に対応する高さ位置に位置してあって、基板受け部材35の姿勢は、図2において実線で示すように、倒伏姿勢になっている。   While ejecting air from the nozzles 11n of the plurality of first levitation units 11, the plurality of first conveyance rollers 15 are rotated by driving the pair of first conveyance motors 17 so that the substrate W is levitated and conveyed leftward. Then, it can be positioned on the upper side (a predetermined position of the first substrate transfer processing apparatus 3) of the pair of swinging arms 41 that are waiting. Here, as shown in FIG. 2, the elevating body 31 is located at a height position corresponding to the first substrate transfer processing apparatus 3, and the posture of the substrate receiving member 35 is shown by a solid line in FIG. Moreover, it is in a lying posture.

基板Wを待機した一対の揺動アーム41の上側に位置させた後に、昇降体31を第1基板搬送処理装置3に対応する高さ位置に位置させた状態で、複数の吸着パッド43によって基板Wを吸着する。そして、図2において仮想線で示すように、揺動用モータ45の駆動によって基板受け部材35を揺動させて倒伏姿勢から起立姿勢に切り替えることにより、第1基板搬送処理装置3から基板Wを受け取ることができる。   After positioning the substrate W on the upper side of the pair of swinging arms 41 waiting, the substrate 31 is moved by the plurality of suction pads 43 in a state where the elevating body 31 is positioned at a height corresponding to the first substrate transfer processing device 3. Adsorb W. 2, the substrate receiving member 35 is swung by driving the swinging motor 45 to switch from the lying posture to the standing posture, thereby receiving the substrate W from the first substrate transport processing apparatus 3. be able to.

第1基板搬送処理装置3から基板Wを受け取った後に、図2及び図3に示すように、基板受け部材35を起立姿勢に保ちつつ、換言すれば、基板Wを起立姿勢に保ちつつ、昇降用モータ33の駆動によって昇降体31を上昇させて、第2基板搬送処理装置5に対応する高さ位置に位置させる。そして、図3において仮想線で示すように、揺動用モータ45の駆動によって基板受け部材35を揺動させて起立姿勢から倒伏姿勢に切り替え、複数の吸着パッド43による吸着状態を解除することにより、第2基板搬送処理装置5に基板Wを受け渡すことができる。   After receiving the substrate W from the first substrate transfer processing device 3, as shown in FIG. 2 and FIG. 3, the substrate receiving member 35 is kept upright, in other words, the substrate W is kept upright while moving up and down. The elevating body 31 is raised by driving the motor 33 and positioned at a height position corresponding to the second substrate transfer processing apparatus 5. Then, as shown by phantom lines in FIG. 3, by swinging the substrate receiving member 35 by driving the swing motor 45 to switch from the standing posture to the lying posture, and releasing the suction state by the plurality of suction pads 43, The substrate W can be delivered to the second substrate transfer processing apparatus 5.

第2基板搬送処理装置5に基板を受け渡した後に、複数の第2浮上ユニット21のノズル21nからエアを噴出させつつ、一対の第2搬送用モータ27の駆動によって複数の第2搬送ローラ25を回転させることにより、基板Wを右方向へ浮上搬送して、第2基板搬送処理装置5の所定位置に位置させることができる。   After delivering the substrate to the second substrate transfer processing device 5, the plurality of second transfer rollers 25 are driven by driving the pair of second transfer motors 27 while ejecting air from the nozzles 21 n of the plurality of second levitation units 21. By rotating, the substrate W can be lifted and conveyed rightward and positioned at a predetermined position of the second substrate conveyance processing apparatus 5.

以上により、第1基板搬送処理装置3による基板Wの搬送処理、第1基板搬送処理装置3から第2基板搬送処理装置5への基板Wの昇降移送、及び第2基板搬送処理装置5による基板Wの搬送処理を順次行うことができる。なお、昇降体31を上昇させる途中に、揺動用モータ45の駆動によって基板受け部材35を起立姿勢に切り替えても構わない。   As described above, the transfer processing of the substrate W by the first substrate transfer processing apparatus 3, the up-and-down transfer of the substrate W from the first substrate transfer processing apparatus 3 to the second substrate transfer processing apparatus 5, and the substrate by the second substrate transfer processing apparatus 5 W transport processing can be performed sequentially. In the middle of raising the elevating body 31, the substrate receiving member 35 may be switched to the standing posture by driving the swing motor 45.

また、基板処理移送システム1に前述の動作と逆の動作をさせることにより、第2基板搬送処理装置5による基板Wの搬送処理、第2基板搬送処理装置5から第1基板搬送処理装置3への基板Wの昇降移送、及び第1基板搬送処理装置3による基板Wの搬送処理を順次行うことができる。   Further, by causing the substrate processing transfer system 1 to perform the operation opposite to the above-described operation, the substrate W transfer processing by the second substrate transfer processing device 5, and from the second substrate transfer processing device 5 to the first substrate transfer processing device 3. The substrate W can be moved up and down, and the substrate W can be transferred by the first substrate transfer processing apparatus 3 in sequence.

要するに、昇降体31に複数の吸着パッド43を有した基板受け部材35が水平な軸心周りに揺動可能に設けられ、基板受け部材35が揺動によって起立姿勢/倒伏姿勢に切り替わるように構成されているため、前述のように、基板Wを起立姿勢に保ちつつ昇降させることができ、基板昇降移送装置7の平面スペースを基板W一枚分の平面積未満に抑えることができる。   In short, the substrate receiving member 35 having a plurality of suction pads 43 is provided on the elevating body 31 so as to be swingable around a horizontal axis, and the substrate receiving member 35 is configured to be switched between a standing posture and a lying posture by swinging. Therefore, as described above, the substrate W can be moved up and down while maintaining the standing posture, and the plane space of the substrate lifting and lowering transfer device 7 can be suppressed to less than the plane area of one substrate W.

従って、第1実施形態によれば、基板昇降移送装置7の平面スペースを基板W一枚分の平面積未満に抑えることができるため、基板昇降移送装置7の平面スペースを十分に削減して、工場のスペースの有効利用を図ることができる。   Therefore, according to the first embodiment, since the plane space of the substrate lifting and lowering transfer device 7 can be suppressed to less than the plane area of one substrate W, the plane space of the substrate lifting and lowering transfer device 7 can be sufficiently reduced, Effective use of factory space can be achieved.

(第2実施形態)
第2実施形態について図6から図9を参照して説明する。
(Second Embodiment)
A second embodiment will be described with reference to FIGS.

ここで、図6及び図7は、第2実施形態に係る基板処理移送システムの動作を示す側断面図、図8は、図6におけるVIII-VIII線に沿った図、図9は、図6におけるIX-IX線に沿った図である。なお、図面中、「FF」は、前方向、「FR」は、後方向、「L」は、左方向、「R」は、右方向を指してある。   6 and 7 are side sectional views showing the operation of the substrate processing transfer system according to the second embodiment, FIG. 8 is a view taken along the line VIII-VIII in FIG. 6, and FIG. It is the figure in alignment with the IX-IX line. In the drawings, “FF” indicates the forward direction, “FR” indicates the backward direction, “L” indicates the left direction, and “R” indicates the right direction.

図6に示すように、第2実施形態に係る基板処理移送システム47は、第1実施形態に係る基板処理移送システム1と同様に、例えばガラス基板等の基板Wに対して搬送処理(処理の一例)及び昇降移送を行うシステムである。そして、基板処理移送システム47は、下階フロアLFに配設されかつ基板Wに対して搬送処理を行う第1基板搬送処理装置(第1基板処理装置の一例)49と、上階フロアUFに配設されかつ基板Wに対して搬送処理を行う第2基板搬送処理装置(第2基板処理装置の一例)51と、第1基板搬送処理装置49と第2基板搬送処理装置51の間で基板Wに対して昇降移送を行う基板昇降移送装置53とを備えている。   As shown in FIG. 6, the substrate processing transfer system 47 according to the second embodiment is similar to the substrate processing transfer system 1 according to the first embodiment, for example, with respect to a substrate W such as a glass substrate (processing process). An example) and a system for moving up and down. Then, the substrate processing transfer system 47 is arranged on the lower floor LF and the first substrate transfer processing apparatus (an example of the first substrate processing apparatus) 49 that performs the transfer processing on the substrate W, and the upper floor UF. A second substrate transport processing apparatus (an example of a second substrate processing apparatus) 51 that is disposed and performs transport processing on the substrate W; and a substrate between the first substrate transport processing apparatus 49 and the second substrate transport processing apparatus 51 A substrate lifting / lowering device 53 that moves the wafer up and down with respect to W is provided.

ここで、第1基板搬送処理装置49は、第1実施形態に係る基板処理移送システム1の第1基板搬送処理装置3と略同じ構成を有しており、第1基板搬送処理装置49の構成要素のうち、第1基板搬送処理装置3の構成要素と対応するものについては、同一番号を付して説明を省略する。同様に、第2基板搬送処理装置51は、第1実施形態に係る基板処理移送システム1の第2基板搬送処理装置5と略同じ構成を有しており、第2基板搬送処理装置51の構成要素のうち、第2基板搬送処理装置5の構成要素と対応するものについては、同一番号を付して説明を省略する。   Here, the first substrate transfer processing apparatus 49 has substantially the same configuration as the first substrate transfer processing apparatus 3 of the substrate processing transfer system 1 according to the first embodiment. Among the elements, the elements corresponding to the components of the first substrate transfer processing apparatus 3 are given the same numbers and the description thereof is omitted. Similarly, the second substrate transfer processing apparatus 51 has substantially the same configuration as the second substrate transfer processing apparatus 5 of the substrate processing transfer system 1 according to the first embodiment. Among the elements, the elements corresponding to the components of the second substrate transfer processing apparatus 5 are assigned the same numbers and the description thereof is omitted.

基板処理移送システム47の基板昇降移送装置53の具体的な構成は、次のようになる。   The specific configuration of the substrate lifting / lowering transfer device 53 of the substrate processing transfer system 47 is as follows.

図6及び図8に示すように、第1基板搬送処理装置49の第1処理装置本体9の左側近傍には、基板Wの姿勢を起立姿勢(図6において仮想線で示す姿勢)/倒伏姿勢(図6において実線で示す姿勢)に切り替える第1姿勢切替部材55が一対のブラケット57を介して水平な軸心周りに揺動可能(回動可能)に設けられている。また、第1姿勢切替部材55は、第1基板搬送処理装置49の第1処理装置本体9の左側近傍に一対のブラケット57を介して回転可能に設けられた第1揺動シャフト59と、この第1揺動シャフト59の外周面に一体的に形成されかつ平行に延びた一対の第1揺動アーム61と、各第1揺動アーム61に長手方向に沿って間隔を置いてそれぞれ設けられかつ基板Wの裏面を吸着する複数の第1姿勢切替用吸着パッド(第1姿勢切替用保持具の一例)63とを備えている。そして、一方のブラケット57には、第1姿勢切替部材55を揺動させる第1姿勢切替用モータ(第1姿勢切替用アクチュエータの一例)65が設けられており、この第1姿勢切替用モータ65の出力軸(図示省略)は、第1揺動シャフト59にカップリング(図示省略)等を介して連動連結してある。ここで、第1姿勢切替部材55を揺動させても、一対の第1揺動アーム61は第1浮上ユニット11に干渉しないようになっている。   As shown in FIGS. 6 and 8, in the vicinity of the left side of the first processing apparatus main body 9 of the first substrate transfer processing apparatus 49, the posture of the substrate W is in the standing posture (posture shown by a virtual line in FIG. 6) / the lying posture. A first attitude switching member 55 that switches to (an attitude shown by a solid line in FIG. 6) is provided to be swingable (rotatable) around a horizontal axis via a pair of brackets 57. The first posture switching member 55 includes a first swinging shaft 59 that is rotatably provided via a pair of brackets 57 in the vicinity of the left side of the first processing apparatus body 9 of the first substrate transfer processing apparatus 49. A pair of first oscillating arms 61 integrally formed on the outer peripheral surface of the first oscillating shaft 59 and extending in parallel are provided on the first oscillating arms 61 at intervals along the longitudinal direction. In addition, a plurality of first posture switching suction pads (an example of a first posture switching holder) 63 that sucks the back surface of the substrate W are provided. One bracket 57 is provided with a first posture switching motor 65 (an example of a first posture switching actuator) that swings the first posture switching member 55, and this first posture switching motor 65. The output shaft (not shown) is coupled to the first swing shaft 59 via a coupling (not shown) or the like. Here, even if the first posture switching member 55 is swung, the pair of first rocking arms 61 does not interfere with the first levitation unit 11.

なお、第1揺動アーム61に第1姿勢切替用吸着パッド63が設けられる代わりに、他の第1姿勢切替用保持具として、基板Wの裏面を非接触で保持する第1姿勢切替用ベルヌーイチャック(図示省略)又は基板Wの端部を把持(保持の一例)する第1姿勢切替用クランパ(図示省略)が設けられるようにしても構わない。   Instead of providing the first posture switching suction pad 63 on the first swing arm 61, as another first posture switching holder, a first posture switching Bernoulli for holding the back surface of the substrate W in a non-contact manner. A chuck (not shown) or a first posture switching clamper (not shown) for gripping (holding) an end of the substrate W may be provided.

図7及び図9に示すように、第2基板搬送処理装置51の第2処理装置本体19の左側近傍には、基板Wの姿勢を起立姿勢(図7において実線で示す姿勢)/倒伏姿勢(図7において仮想線で示す姿勢)に切り替える第2姿勢切替部材67が一対のブラケット69を介して水平な軸心周りに揺動可能(回動可能)に設けられており、第2姿勢切替部材67の取付位置は、第1姿勢切替部材55の取付位置に対して右方向に偏位してある。また、第2姿勢切替部材67は、第2基板搬送処理装置51の第2処理装置本体19の左側近傍に一対のブラケット69を介して回転可能に設けられた第2揺動シャフト71と、この第2揺動シャフト71の外周面に一体的に形成されかつ平行に延びた一対の第2揺動アーム73と、各第2揺動アーム73に長手方向に沿って間隔を置いてそれぞれ設けられかつ基板Wの裏面を吸着する複数の第2姿勢切替用吸着パッド(第2姿勢切替用保持具の一例)75とを備えている。そして、一方のブラケット69には、第2姿勢切替部材67を揺動させる第2姿勢切替用モータ(第2姿勢切替用アクチュエータの一例)77が設けられており、この第2姿勢切替用モータ77の出力軸(図示省略)は、第2揺動シャフト71にカップリング(図示省略)等を介して連動連結してある。ここで、第2姿勢切替部材67を揺動させても、一対の第2揺動アーム73は第2浮上ユニット21に干渉しないようになっている。   As shown in FIGS. 7 and 9, in the vicinity of the left side of the second processing apparatus main body 19 of the second substrate transport processing apparatus 51, the posture of the substrate W is set in the standing posture (the posture shown by the solid line in FIG. 7) / the lying posture ( A second posture switching member 67 that switches to a posture indicated by an imaginary line in FIG. 7 is provided so as to be swingable (rotatable) around a horizontal axis via a pair of brackets 69. The attachment position 67 is deviated rightward with respect to the attachment position of the first posture switching member 55. The second posture switching member 67 includes a second swing shaft 71 rotatably provided via a pair of brackets 69 in the vicinity of the left side of the second processing apparatus main body 19 of the second substrate transfer processing apparatus 51. A pair of second oscillating arms 73 that are integrally formed on the outer peripheral surface of the second oscillating shaft 71 and extend in parallel, and are provided on the second oscillating arms 73 at intervals along the longitudinal direction. In addition, a plurality of second posture switching suction pads (an example of a second posture switching holder) 75 for sucking the back surface of the substrate W are provided. One bracket 69 is provided with a second posture switching motor 77 (an example of a second posture switching actuator) 77 that swings the second posture switching member 67, and this second posture switching motor 77. The output shaft (not shown) is coupled to the second swing shaft 71 via a coupling (not shown) or the like. Here, even if the second posture switching member 67 is swung, the pair of second rocking arms 73 does not interfere with the second floating unit 21.

なお、第2揺動アーム73に第2姿勢切替用吸着パッド75が設けられる代わりに、他の第2姿勢切替用保持具として、基板Wの裏面を非接触で保持する第2姿勢切替用ベルヌーイチャック(図示省略)又は基板Wの端部を把持(保持の一例)する第2姿勢切替用クランパ(図示省略)が設けられるようにしても構わない。   Instead of providing the second posture switching suction pad 75 on the second swing arm 73, as another second posture switching holder, a second posture switching Bernoulli for holding the back surface of the substrate W in a non-contact manner. A chuck (not shown) or a second posture switching clamper (not shown) for gripping (an example of holding) the end of the substrate W may be provided.

図6及び図7に示すように、第1基板搬送処理装置49の左側近傍には、上下方向へ延びた昇降ガイドフレーム(昇降ガイド)79が立設されており、この昇降ガイドフレーム79には、昇降ユニット81が昇降可能に設けられている。また、昇降ユニット81は、昇降ガイドフレーム79に昇降可能に設けられた昇降ブロック83と、この昇降ブロック(昇降体)83の前後の両端部に設けられかつ移動用シリンダ等の移動用アクチュエータ(図示省略)の駆動によって左右方向へ移動する一対のスライドプレート85と、各スライドプレート85に設けられかつ基板Wの端部を把持(保持の一例)する昇降用クランパ(昇降用保持具の一例)87とを備えている。そして、昇降ガイドフレーム79の上部には、昇降ユニット81を昇降(上下方向へ移動)させる昇降用モータ(昇降用アクチュエータの一例)89が設けられており、昇降用モータ89の出力軸は、上下方向へ延びたボールねじ又はチェーン等の昇降機構(図示省略)に連動連結してある。   As shown in FIGS. 6 and 7, an elevating guide frame (elevating guide) 79 extending in the vertical direction is erected in the vicinity of the left side of the first substrate transfer processing device 49. The elevating unit 81 is provided so as to be movable up and down. The elevating unit 81 includes an elevating block 83 provided on the elevating guide frame 79 so as to be movable up and down, and a moving actuator such as a moving cylinder (illustrated) provided at both front and rear ends of the elevating block (elevating body) 83. And a pair of slide plates 85 that move in the left and right directions by driving, and an elevator clamp (an example of an elevator holder) 87 that is provided on each slide plate 85 and that grips (holds) an end of the substrate W. And. An elevating motor (an example of an elevating actuator) 89 that elevates (moves up and down) the elevating unit 81 is provided at the upper part of the elevating guide frame 79. The output shaft of the elevating motor 89 is It is linked to a lifting mechanism (not shown) such as a ball screw or a chain extending in the direction.

なお、昇降ブロック83に昇降用クランパ87が設けられる代わりに、他の昇降用用保持具として、基板Wの裏面を表面又は裏面を吸着する吸着パッド(図示省略)等が支持アーム(図示省略)を介して設けられるようにしても構わない。   Instead of providing the lifting block 87 on the lifting block 83, as another lifting holder, a suction pad (not shown) that sucks the back surface of the substrate W or the back surface is supported arm (not shown). It may be provided via.

続いて、第2実施形態の作用及び効果について説明する。   Then, the effect | action and effect of 2nd Embodiment are demonstrated.

複数の第1浮上ユニット11のノズル11nからエアを噴出させつつ、一対の第1搬送用モータ17の駆動によって複数の第1搬送ローラ15を回転させることにより、基板Wを左方向へ浮上搬送し、待機した一対の第1揺動アーム61の上側(第1基板搬送処理装置49の所定位置)に位置させることができる。ここで、昇降ユニット81は、図6に示すように、第1基板搬送処理装置49に対応する高さ位置に位置してある。   While ejecting air from the nozzles 11n of the plurality of first levitation units 11, the plurality of first conveyance rollers 15 are rotated by driving the pair of first conveyance motors 17 so that the substrate W is levitated and conveyed leftward. Then, it can be positioned above the pair of first swing arms 61 that have been waiting (a predetermined position of the first substrate transfer processing device 49). Here, as shown in FIG. 6, the elevating unit 81 is located at a height position corresponding to the first substrate transfer processing device 49.

基板Wを待機した一対の第1揺動アーム61の上側に位置させた後に、複数の第1姿勢切替用吸着パッド63によって基板Wの裏面を吸着する。次に、図6において仮想線で示すように、第1姿勢切替用モータ65の駆動によって第1姿勢切替部材55を揺動させて、基板Wの姿勢を倒伏姿勢から起立姿勢に切り替える。そして、昇降ユニット81を第1基板搬送処理装置49に対応する高さ位置に位置させた状態で、一対の昇降用クランパ87によって基板Wの端部を把持し、複数の第1姿勢切替用吸着パッド63による吸着状態を解除する。   After the substrate W is positioned on the upper side of the pair of first swing arms 61 that are waiting, the back surface of the substrate W is sucked by the plurality of first posture switching suction pads 63. Next, as indicated by a virtual line in FIG. 6, the first posture switching member 55 is swung by driving the first posture switching motor 65 to switch the posture of the substrate W from the lying posture to the standing posture. Then, in a state where the elevating unit 81 is positioned at a height position corresponding to the first substrate transfer processing device 49, the ends of the substrate W are gripped by the pair of elevating clampers 87, and a plurality of first posture switching adsorptions are performed. The suction state by the pad 63 is released.

複数の第1姿勢切替用吸着パッド63による吸着状態を解除した後に、図6及び図7に示すように、基板Wを起立姿勢に保ちつつ、昇降用モータ89の駆動によって昇降ユニット81を上昇させて、第2基板搬送処理装置51に対応する高さ位置に位置させる。次に、図7において実線で示すように、移動用シリンダの駆動によって一対のスライドプレート85を右方向へ移動させて、基板Wを第2基板搬送処理装置51に接近させる。そして、複数の第2姿勢切替用吸着パッド75によって基板Wの裏面を吸着し、一対の昇降用クランパ87による把持状態を解除する。更に、図7において仮想線で示すように、第2姿勢切替用モータ77の駆動によって第2姿勢切替部材67を揺動させて、基板Wの姿勢を起立姿勢から倒伏姿勢に切り替え、複数の第2姿勢切替用吸着パッド75による吸着状態を解除する。   After releasing the suction state by the plurality of first posture switching suction pads 63, as shown in FIGS. 6 and 7, the lifting unit 81 is lifted by driving the lifting motor 89 while keeping the substrate W in the standing posture. Then, it is positioned at a height position corresponding to the second substrate transfer processing apparatus 51. Next, as shown by a solid line in FIG. 7, the pair of slide plates 85 are moved to the right by driving the moving cylinder, and the substrate W is brought closer to the second substrate transfer processing apparatus 51. Then, the back surface of the substrate W is sucked by the plurality of second posture switching suction pads 75 and the gripping state by the pair of lifting clampers 87 is released. Further, as indicated by a virtual line in FIG. 7, the second posture switching member 67 is swung by driving the second posture switching motor 77, and the posture of the substrate W is switched from the standing posture to the lying posture. The suction state by the two-position switching suction pad 75 is released.

複数の第2姿勢切替用吸着パッド75による吸着状態を解除した後に、複数の第2浮上ユニット21のノズル21nからエアを噴出させつつ、一対の第2搬送用モータ27の駆動によって複数の第2搬送ローラ25を回転させることにより、基板Wを右方向へ浮上搬送して、第2基板搬送処理装置51の所定位置に位置させることができる。   After the suction state by the plurality of second posture switching suction pads 75 is released, air is ejected from the nozzles 21n of the plurality of second levitation units 21, and a plurality of second transport motors 27 are driven to drive a plurality of second By rotating the transport roller 25, the substrate W can be lifted and transported to the right and positioned at a predetermined position of the second substrate transport processing apparatus 51.

以上により、第1基板搬送処理装置49による基板Wの搬送処理、第1基板搬送処理装置49から第2基板搬送処理装置51への基板Wの昇降移送、及び第2基板搬送処理装置51による基板Wの搬送処理を順次行うことができる。   As described above, the transfer processing of the substrate W by the first substrate transfer processing device 49, the up-and-down transfer of the substrate W from the first substrate transfer processing device 49 to the second substrate transfer processing device 51, and the substrate by the second substrate transfer processing device 51. W transport processing can be performed sequentially.

また、基板処理移送システム47に前述の動作と逆の動作をさせることにより、第2基板搬送処理装置5による基板Wの搬送処理、第2基板搬送処理装置5から第1基板搬送処理装置3への基板Wの昇降移送、及び第1基板搬送処理装置3による基板Wの搬送処理を順次行うことができる。   Further, by causing the substrate processing transfer system 47 to perform an operation reverse to the above-described operation, the substrate W transfer processing by the second substrate transfer processing device 5, and from the second substrate transfer processing device 5 to the first substrate transfer processing device 3. The substrate W can be moved up and down, and the substrate W can be transferred by the first substrate transfer processing apparatus 3 in sequence.

要するに、第1基板搬送処理装置49の左側近傍に複数の第1姿勢切替用吸着パッド63を有した第1姿勢切替部材55が水平な軸心周りに揺動可能に設けられ、第2基板搬送処理装置51の左側近傍に複数の第2姿勢切替用吸着パッド75を有した第2姿勢切替部材67が水平な軸心周りに揺動可能に設けられているため、前述のように、基板Wを起立姿勢に保ちつつ昇降させることができ、基板昇降移送装置53の平面スペースを基板W一枚分の平面積未満に抑えることができる。   In short, a first posture switching member 55 having a plurality of first posture switching suction pads 63 is provided in the vicinity of the left side of the first substrate transfer processing device 49 so as to be swingable around a horizontal axis, and the second substrate transfer. Since the second posture switching member 67 having a plurality of second posture switching suction pads 75 is provided in the vicinity of the left side of the processing apparatus 51 so as to be swingable around a horizontal axis, as described above, the substrate W Can be moved up and down while maintaining a standing posture, and the plane space of the substrate lifting and lowering transfer device 53 can be suppressed to less than the plane area of one substrate W.

従って、第2実施形態によれば、基板昇降移送装置53の平面スペースを基板W一枚分の平面積未満に抑えることができるため、基板昇降移送装置53の平面スペースを十分に削減して、工場のスペースの有効利用を図ることができる。   Therefore, according to the second embodiment, since the planar space of the substrate lifting / lowering transfer device 53 can be suppressed to less than the plane area of one substrate W, the planar space of the substrate lifting / lowering transfer device 53 is sufficiently reduced, Effective use of factory space can be achieved.

なお、本発明は、前述の実施形態の説明に限られるものではなく、その他、種々の態様で実施可能である。また、本発明に包含される権利範囲は、これらの実施形態に限定されないものである。   In addition, this invention is not restricted to description of the above-mentioned embodiment, In addition, it can implement in a various aspect. Further, the scope of rights encompassed by the present invention is not limited to these embodiments.

第1実施形態に係る基板処理移送システムの斜視図である。It is a perspective view of the substrate processing transfer system concerning a 1st embodiment. 第1実施形態に係る基板処理移送システムの動作を示す側断面図である。It is a sectional side view which shows operation | movement of the substrate processing transfer system which concerns on 1st Embodiment. 第1実施形態に係る基板処理移送システムの動作を示す側断面図である。It is a sectional side view which shows operation | movement of the substrate processing transfer system which concerns on 1st Embodiment. 図2におけるIV-IV線に沿った図である。FIG. 4 is a view taken along line IV-IV in FIG. 2. 図2におけるV-V線に沿った図である。It is the figure along the VV line in FIG. 第2実施形態に係る基板処理移送システムの動作を示す側断面図である。It is a sectional side view which shows operation | movement of the substrate processing transfer system which concerns on 2nd Embodiment. 第2実施形態に係る基板処理移送システムの動作を示す側断面図である。It is a sectional side view which shows operation | movement of the substrate processing transfer system which concerns on 2nd Embodiment. 図6におけるVIII-VIII線に沿った図である。It is the figure along the VIII-VIII line in FIG. 図6におけるIX-IX線に沿った図である。It is the figure along the IX-IX line in FIG.

符号の説明Explanation of symbols

1 基板処理移送システム
3 第1基板搬送処理装置
5 第2基板搬送処理装置
7 基板昇降移送装置
29 昇降ガイドフレーム
31 昇降体
33 昇降用モータ
35 基板受け部材
43 吸着パッド
45 揺動用モータ
47 基板処理移送システム
49 第1基板搬送処理装置
51 第2基板搬送処理装置
53 基板昇降移送装置
55 第1姿勢切替部材
63 第1姿勢切替用吸着パッド
65 第1姿勢切替用モータ
67 第2姿勢切替部材
75 第2姿勢切替用吸着パッド
77 第2姿勢切替用モータ
79 昇降ガイドフレーム
81 昇降ユニット
87 昇降用クランパ
89 昇降用モータ
DESCRIPTION OF SYMBOLS 1 Substrate processing transfer system 3 1st substrate transfer processing apparatus 5 2nd substrate transfer processing apparatus 7 Substrate raising / lowering transfer apparatus 29 Lifting guide frame 31 Lifting body 33 Lifting motor 35 Substrate receiving member 43 Adsorption pad 45 Swing motor 47 Substrate processing transfer System 49 First substrate transfer processing device 51 Second substrate transfer processing device 53 Substrate lifting / lowering transfer device 55 First posture switching member 63 First posture switching suction pad 65 First posture switching motor 67 Second posture switching member 75 Second Posture switching suction pad 77 Second posture switching motor 79 Lifting guide frame 81 Lifting unit 87 Lifting clamper 89 Lifting motor

Claims (4)

下階フロアに配設されかつ基板に対して処理を行う第1基板処理装置と、上階フロアに配設されかつ基板に対して処理を行う第2基板処理装置との間で、基板の昇降移送を行う基板昇降移送装置において、
前記第1基板処理装置の近傍に立設され、上下方向へ延びた昇降ガイドと、
前記昇降ガイドに昇降可能に設けられた昇降体と、
前記昇降体を昇降させる昇降用アクチュエータと、
前記昇降体に水平な軸心周りに揺動可能に設けられ、基板を保持する保持具を有し、揺動によって起立姿勢/倒伏姿勢に切り替わるように構成され、基板の受取り及び受渡しを行う基板受け部材と、
前記基板受け部材を揺動させる揺動用アクチュエータと、を備えたことを特徴とする基板昇降移送装置。
Raising and lowering the substrate between the first substrate processing apparatus disposed on the lower floor and processing the substrate, and the second substrate processing apparatus disposed on the upper floor and processing the substrate In the substrate lifting / lowering transfer device for transferring,
An elevating guide which is erected in the vicinity of the first substrate processing apparatus and extends in the vertical direction;
An elevating body provided in the elevating guide so as to be movable up and down;
An elevating actuator for elevating the elevating body;
A substrate that is provided on the elevating body so as to be swingable around a horizontal axis, has a holder for holding the substrate, and is configured to switch between a standing posture and a lying posture by swinging, and for receiving and delivering the substrate. A receiving member;
A substrate lifting / lowering transfer device comprising: a swinging actuator for swinging the substrate receiving member.
下階フロアに配設されかつ基板に対して処理を行う第1基板処理装置と、上階フロアに配設されかつ基板に対して処理を行う第2基板処理装置との間で、基板の昇降移送を行う基板昇降移送装置において、
前記第1基板処理装置の一側に水平な軸心周りに揺動可能に設けられ、基板を保持する第1姿勢切替用保持具を有し、基板の姿勢を倒伏姿勢/起立姿勢に切り替える第1姿勢切替部材と、
前記第1姿勢切替部材を揺動させる第1姿勢切替用アクチュエータと、
前記第2基板処理装置の一側に水平な軸心周りに揺動可能に設けられ、基板を保持する第2姿勢切替用保持具を有し、基板の姿勢を倒伏姿勢/起立姿勢に切り替える第2姿勢切替部材と、
前記第2姿勢切替部材を揺動させる第2姿勢切替用アクチュエータと、
前記第1姿勢切替部材の近傍に立設され、上下方向へ延びた昇降ガイドと、
前記昇降ガイドに昇降可能に設けられ、基板を保持する昇降用保持具を有した昇降ユニットと、
前記昇降ユニットを昇降させる昇降用アクチュエータと、を備えたことを特徴とする基板昇降移送装置。
Raising and lowering the substrate between the first substrate processing apparatus disposed on the lower floor and processing the substrate, and the second substrate processing apparatus disposed on the upper floor and processing the substrate In the substrate lifting / lowering transfer device for transferring,
The first substrate processing apparatus includes a first posture switching holder that is provided on one side of the first substrate processing apparatus so as to be swingable around a horizontal axis, and that switches the posture of the substrate between a lying posture and a standing posture. 1 posture switching member;
A first posture switching actuator for swinging the first posture switching member;
The second substrate processing apparatus includes a second posture switching holder that is provided on one side of the second substrate processing apparatus so as to be swingable around a horizontal axis, and that switches the substrate posture between a lying posture and a standing posture. A two-position switching member;
A second posture switching actuator for swinging the second posture switching member;
An elevating guide standing in the vicinity of the first attitude switching member and extending in the up-down direction;
An elevating unit provided in the elevating guide so as to be movable up and down, and having an elevating holder for holding a substrate;
A substrate lifting / lowering transfer device comprising: a lifting / lowering actuator for lifting / lowering the lifting / lowering unit.
前記昇降用保持具は、前記第2姿勢切替部材に対して相対的に水平方向へ移動可能に構成されていることを特徴とする請求項2に記載の基板昇降移送装置。   The substrate lifting / lowering transfer apparatus according to claim 2, wherein the lifting / lowering holder is configured to be movable in a horizontal direction relative to the second posture switching member. 基板に対して処理及び昇降移送を行う基板処理移送システムにおいて、
下段フロアに配設され、基板に対して処理を行う第1基板処理装置と、
上段フロアに配設され、基板に対して処理を行う第2基板処理装置と、
前記第1基板処理装置と前記第2基板処理装置の間で基板の昇降移送を行う請求項1から請求項3のうちのいずれかの請求項に記載の基板昇降移送装置と、を備えたことを特徴とする基板処理移送システム。
In a substrate processing transfer system that performs processing and up / down transfer for a substrate,
A first substrate processing apparatus disposed on the lower floor for processing a substrate;
A second substrate processing apparatus disposed on the upper floor for processing a substrate;
The substrate lifting / lowering apparatus according to claim 1, wherein the substrate lifting / lowering transfer is performed between the first substrate processing apparatus and the second substrate processing apparatus. A substrate processing transfer system.
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JP2010238764A (en) * 2009-03-30 2010-10-21 Ihi Corp Substrate lifting and lowering apparatus and substrate processing and transfer system
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