JP2010016204A - Sheet peeling apparatus and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling apparatus and a sheet peeling method capable of peeling an adhesive sheet by suppressing the amount of consumption of a peeling tape. <P>SOLUTION: The sheet peeling apparatus has: a table 11 for supporting a semiconductor wafer W to which the adhesive sheet S has been stuck; a delivery means 12 of a peeling tape base material TB including an adhesive section 20 having a planar shape corresponding the outer-periphery portion of the adhesive sheet and a gripping section formation piece 21 ranging with the adhesive section 20; a holding means 13 for holding the peeling tape base material TB; a folding means 14 for folding the gripping section formation piece 21 of the peeling tape base material to form the peeling tape PT; a sticking means 15 for sticking the adhesive section of the peeling tape to the adhesive sheet; a gripping means 16 at a gripping section 22; and a single-axis robot 17 relatively moving the gripping means and the table. The sticking means sticks the adhesive section to the adhesive sheet while the gripping section projects outside the adhesive sheet, and the adhesive sheet is peeled from the semiconductor wafer by relatively moving the gripping means and the table. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, while suppressing consumption of a peeling tape for peeling an adhesive sheet affixed to an adherend, the adhesive sheet is reliably peeled without breaking. The present invention relates to a sheet peeling apparatus and a peeling method.

2. Description of the Related Art In processing apparatuses for semiconductor wafers (hereinafter simply referred to as “wafers”), an adhesive sheet is attached to protect the circuit surface and the like of the wafer. Such an adhesive sheet is peeled from the wafer using a sheet peeling device or the like after a predetermined processing step.
As a sheet peeling apparatus, it is disclosed by patent document 1, for example. The sheet peeling apparatus in the document adheres a strip-shaped peeling tape so as to cross the radial direction of a circular adhesive sheet affixed to the wafer, and winds the peeling tape to remove the adhesive sheet from the wafer. The structure which peels is employ | adopted.
JP 2007-43047 A

  However, the sheet peeling apparatus disclosed in Patent Document 1 has a disadvantage that the consumption of the peeling tape is large and the running cost increases. In recent years, since a wafer having a large diameter is adopted, such inconvenience appears remarkably. In addition, since the peeling tape is provided in a band shape having a width smaller than the diameter of the adhesive sheet, when the peeling tape is pulled in the peeling direction, the adhesive sheet attached to the wafer is In addition to being easy to tear along, the peeling tape is separated from the adhesive sheet to cause a peeling failure.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose thereof is a sheet peeling apparatus capable of peeling an adhesive sheet while suppressing consumption of a peeling tape for peeling the adhesive sheet. And providing a peeling method.
Another object of the present invention is to prevent the adhesive sheet from being broken and to adhere the peeling tape even when a peeling tape smaller than the size of the adhesive sheet attached to the adherend is used. The object is to provide a sheet peeling apparatus and a peeling method capable of reliably peeling the adhesive sheet without separating from the sheet.

  In order to achieve the above-mentioned object, the present invention attaches the adhesive portion of a peeling tape having an adhesive portion and a gripping portion to an adhesive sheet affixed to an adherend, and provides the peeling tape and the adherend. A sheet peeling apparatus for peeling the adhesive sheet from the adherend by relative movement of the support member, the supporting means for supporting the adherend to which the adhesive sheet is affixed, the adhesive portion and a gripping portion forming piece connected thereto. A feeding means for feeding out the peeling tape base material, a holding means for holding the peeling tape base material, and a gripping portion forming piece of the peeling tape base material held by the holding means is folded to provide a gripping portion. Folding means for forming the peeling tape with, a sticking means for sticking the adhesive portion of the peeling tape to the adhesive sheet, a gripping means for gripping the gripping portion, and the gripping means and the supporting means are moved relative to each other. And moving means , It adopts a configuration that.

  In the present invention, the adhesive portion includes an outer edge corresponding to the outer edge shape of the adhesive sheet, while the grip portion is provided in a shape protruding from the outer edge of the adhesive portion, and the holding means can be separated and approached to the adherend. And a suction head having the same planar shape as that of the adhesive portion, and the suction head matches at least a part of the outer edge of the adhesive part with at least a part of the outer edge of the adhesive sheet. Further, it is possible to adopt a configuration in which the peeling tape is attached to an adhesive sheet in a state where the gripping portion protrudes outward from the adherend.

  Further, the folding means has a holding surface having the same plane shape as that of the gripping part forming piece, and is configured to fold the gripping part forming piece via a rotating means.

  Furthermore, the present invention is to apply a peeling tape to at least a partial region including the outer edge of the adhesive sheet affixed to the semiconductor wafer, and peel off the adhesive sheet from the semiconductor wafer by relative movement between the peeling tape and the adherend. A sheet peeling device for supporting a semiconductor wafer to which the adhesive sheet is attached, an adhesive portion provided with an adhesive layer on one surface of a base sheet, and a gripping portion connected to the adhesive portion And a peeling tape having a shape in which the adhesive portion has a planar shape including an outer edge having the same shape as the outer edge of the adhesive sheet, while the grip portion forming piece protrudes from an outer peripheral portion of the adhesive portion. By providing a gripping part by folding a feeding means for feeding out the base material, a holding means for holding the peeling tape base material, and a gripping portion forming piece of the peeling tape base material held by the holding means. Folding means for forming a release tape, sticking means for sticking the adhesive portion of the peeling tape to an adhesive sheet, gripping means for gripping the gripping portion, and movement for relatively moving the gripping means and the support means It is possible to adopt a configuration including a means.

  In the present invention, the adhesive portion of the peeling tape having an adhesive portion and a gripping portion is attached to an adhesive sheet attached to an adherend, and bonded by relative movement between the peeling tape and the adherend. In a sheet peeling method for peeling a sheet from an adherend, a peeling tape base material including a step of supporting the adherend to which the adhesive sheet is affixed, and the adhesive portion and a gripping portion forming piece connected thereto is fed out. A step of holding the peeling tape substrate, a step of forming a peeling tape by folding a holding portion forming piece of the held peeling tape substrate to provide a holding portion, and the peeling The method includes a step of attaching the adhesive portion of the tape to the adhesive sheet, a step of gripping the grip portion, and a step of peeling the adhesive sheet by relatively moving the grip portion and the adherend. ing.

According to the present invention, after the peeling tape base material is fed out from the feeding means, the gripping portion forming piece can be folded to form a gripping portion, and the gripping portion protrudes outward from the adherend. Therefore, the adhesive sheet can be peeled off by gripping the grip part and moving it relative to the adherend. At this time, since the peeling tape is sized so that the adhesive portion adheres to a part of the adhesive sheet, the consumption of the peeling tape is larger than that of a conventional sheet peeling apparatus that applies the peeling tape across the adhesive sheet. The amount can be suppressed.
In addition, the adhesive of the peeling tape can be bonded by applying the peeling tape to the adhesive sheet by aligning at least a part of the outer edge of the adhesive portion with at least a part of the outer edge of the adhesive sheet. Adhering to parts other than the sheet to prevent the adhesive sheet from being peeled off or preventing the adhesive from adhering to a table or the like on which the adherend is placed and fouling, the adhesive sheet is securely peeled from the outer edge. be able to.
In particular, the adhesive sheet affixed to the semiconductor wafer is to be peeled off, and a peeling tape having a planar adhesive portion corresponding to the outer edge portion of the adhesive sheet and a gripping portion connected thereto is applied to peel off the adhesive sheet. In the structure which performs, it can peel reliably from the outer edge of an adhesive sheet.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet peeling apparatus according to this embodiment. In this figure, a sheet peeling apparatus 10 forms a table 11 as a supporting means for supporting a wafer W as an adherend to which an adhesive sheet S is stuck, and a peeling tape PT (see FIG. 2B). The feeding means 12 for feeding out the peeling tape base material TB, the holding means 13 for sucking and holding the peeling tape base material TB, and a grip described later by folding a part of the peeling tape base material TB held by the holding means 13 Folding means 14 for forming the portion 22; pasting means 15 for sticking the peeling tape PT to the adhesive sheet S; gripping means 16 for gripping the gripping portion 22 of the peeling tape PT; and the gripping means 16 and supporting means. 11 and a single-axis robot 17 as a moving means for relatively moving the robot 11.

  As shown in FIGS. 2 and 3, the peeling tape base material TB in the present embodiment includes an adhesive portion 20 in which an adhesive layer A is provided on one surface (the lower surface in FIG. 2) of the base material sheet BS. It consists of a gripping part forming piece 21. The gripping portion forming piece 21 is folded by the folding means 14 to become the gripping portion 22, whereby the peeling tape base material TB has the adhesive portion 20 where the adhesive layer A is exposed and the adhesive layer A is not exposed. It is formed as a peeling tape PT composed of the grip portion 22 (see FIG. 2B). Here, when the gripping portion forming piece 21 is folded, the adhesive portion 20 is a string that connects between the two outer edges P1 and P2 of the circular adhesive sheet S corresponding to the shape of the wafer W as shown in FIG. A planar shape corresponding to a region surrounded by the chord edge portion 20a along L1 and the arc edge portion 20b along the arc L2 between the two points P1 and P2 via the outer edge forming portion 22a is provided.

  The table 11 has a substantially square planar shape, and its upper surface is formed as a suction surface (not shown) and is supported via a single-axis robot 17 so as to be movable in the left-right direction in FIG.

  The feeding means 12 includes a support roller 26 that supports a roll-shaped raw fabric R in which a peeling tape base material TB is temporarily attached to one surface of a strip-shaped peeling sheet RL at predetermined intervals, and feeding of the peeling sheet RL. A peel plate 27 that reverses the direction and peels the peeling tape substrate TB from the release sheet RL, a drive roller 28 that is rotated by a motor M, and a pinch roller 29 that sandwiches the release sheet RL between the drive roller 28. And a take-up roller 30 that rotates synchronously with the drive roller 28 and winds the release sheet RL. The feeding means 12 is supported by a frame (not shown).

  The holding means 13 is disposed on the tip side of the peel plate 27 and is connected to a decompression pump (not shown) so as to adsorb and hold the peeling tape base material TB or the peeling tape PT peeled off by the peel plate 27. The suction head 37 is configured. Note that the suction surface of the suction head 37 is provided in the same planar shape as the planar shape of the bonding portion 20. As a result, the arc edge 20b is made to coincide with the arc between the two points P1 and P2 of the adhesive sheet S, and the peeling tape PT is affixed to the adhesive sheet S with the gripping part 22 protruding from the outer edge of the adhesive sheet S. It is possible to do. In the present embodiment, the operation of matching the arc edge portion 20b and the outer edge of the adhesive sheet S is controlled by counting pulses output from the single-axis robot 17 by a control means (not shown). The 15 side may be configured to move with respect to the table 11, or both the table 11 and the pasting means 15 may be moved so that the arc edge 20 b and the outer edge of the adhesive sheet S coincide with each other.

  The folding means 14 includes a gripping part suction head 38A provided alongside the suction head 37, and a rotary suction head 38B that can rotate via a motor M1 as a rotation means. The rotary suction head 38 </ b> B forms the grip portion 22 by sucking and holding a substantially half region on the tip side of the grip portion forming piece 21 and rotating approximately 180 ° in the direction of the arrow a. The suction surface formed by the gripping part suction head 38 </ b> A and the rotary suction head 38 </ b> B is provided in the same planar shape as the planar shape of the gripping part forming piece 21. Further, the folding means 14 is supported via support means (not shown).

  The affixing means 15 includes a linear motion motor 35, and a suction head 37 is fixed to the output shaft 36 thereof. As a result, the peeling tape PT held by the suction head 37 can be attached to the adhesive sheet S on the table 11.

  As shown in FIGS. 1 and 5, the gripping means 16 is a chuck holder 40 and an upper claw member that is supported by the chuck holder 40 and can be rotated about a rotation shaft 43 via a driving means (not shown). 41 and a lower claw member 42 that can move up and down via a driving means (not shown). As a result, the upper claw member 41 and the lower claw member 42 are provided so that the grip portion 21 can be gripped. The gripping means 16 is supported by a moving means such as a robot arm (not shown), and is provided so as to be movable up and down and left and right with respect to the same position when the position shown in FIG. Yes.

  Next, a sheet peeling method by the sheet peeling apparatus 10 will be described with reference to FIGS.

  As shown in FIG. 1, when the wafer W having the adhesive sheet S stuck on the table 11 is placed on the table 11 by a transport unit (not shown), the wafer W is sucked and held on the table 11.

  When the suction holding of the wafer W is confirmed, the motor M of the feeding means 12 is driven to wind the release sheet RL, and the peeling tape base material TB is being peeled from the release sheet RL by the peel plate 27. The suction head 37 and the gripping part suction head 38A and the rotary suction head 38B of the folding means 14 are sucked and held.

  Next, the motor M1 of the folding means 14 is driven, the rotary suction head 38B rotates 180 ° in the direction of arrow a to fold the gripping portion forming piece 21 to form the gripping portion 22, and the peeling tape PT is formed. The rotary suction head 38 returns to the initial position (see FIG. 6). In a state where the peeling tape PT is attracted to the suction head 37, the adhesive portion 20 is sucked and held in a state where it matches the planar shape of the suction head 37.

  On the other hand, when the table 11 moves via the single axis robot 17 and detects that the wafer W has reached a predetermined position below the attaching means 15 via the pulse of the single axis robot 17, the single axis robot 17 is driven. To stop. At this time, as shown in FIG. 1, the left end portion of the wafer W is located on the right side of the lower claw member 42 of the gripping means 16.

  When the linear motion motor 35 of the sticking means 15 is driven, the suction head 37 is lowered, and the adhesive portion 20 is attached to the outer peripheral portion of the adhesive sheet S. At this time, as shown in FIG. 4, the adhesive layer A is bonded by sticking so that the arc edge portion 20 b of the bonding portion 20 coincides with the arc L <b> 2 between the two outer edges P <b> 1 and P <b> 2 of the wafer W. Bonding to parts other than the sheet S is prevented.

  When the application of the peeling tape PT is completed, the upper claw member 41 and the lower claw member 42 of the gripping means 16 interact to grip the grip portion 22 (see FIG. 7). Thereafter, the suction head 37 returns to the raised position.

  Next, after the gripping means 16 is lifted so as not to interfere with the wafer W, the adhesive sheet S is peeled from the wafer W by moving the table 11 to the left as shown in FIG.

  Therefore, according to such an embodiment, the gripping portion 22 can be formed by folding the gripping portion forming piece 21 of the peeling tape base material TB while being sucked and held by the suction head 37 and the folding means 14. In a state where the gripping portion 22 protrudes outward from the wafer W, the adhesive portion 20 can be attached to the adhesive sheet S and peeled off.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, the peeling tape base material TB in the above embodiment is provided with the adhesive layer A over the entire area of one surface of the base material sheet BS, but the region where the adhesive part 20 is formed and a part of the grip part forming piece 21 Those provided with the adhesive layer A in the region may be used.

  Further, in the above-described embodiment, the configuration in which a part of the outer edge of the adhesive part 20 and the part of the outer edge of the adhesive sheet S are matched is illustrated and described. It is good also as a structure in which. Even in this case, it is possible to eliminate the disadvantage that the adhesive A protruding from the outer edge of the adhesive sheet S adheres to a portion other than the adhesive sheet S to prevent peeling or stain the periphery.

  Further, the folding means 14 is not limited as long as the rotary suction head 38B can be rotated.

  Further, the relative movement between the gripping means 16 and the table 11 when the adhesive sheet S is peeled can be achieved by at least one movement.

  Furthermore, the moving means is not limited to the single-axis robot 17, and a linear motor, a cylinder, or the like may be employed. The gripping means 16 is sufficient if it can grip the grip portion 21.

  In addition, the planar shapes of the bonding portion 20 and the grip portion 22 can be arbitrarily changed, and the planar shape of the suction head 37 can be changed according to the shape of the bonding portion 20. That is, when the adhesive sheet affixed to the adherend is non-circular, it may have a planar shape corresponding to the shape of the outer edge portion of the planar shape.

  Furthermore, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can be targeted. The semiconductor wafer can be a silicon wafer or a compound wafer. It may be.

  The adhesive layer A can employ a pressure-sensitive adhesive or a heat-sensitive adhesive, and the composition is not limited at all.

  Furthermore, the gripping means 16 can be provided on the suction head 37. With this configuration, the linear motion motor 35 can be substituted without separately providing a driving means for raising the gripping means 16.

  Further, the folding means 14 can also be used as the gripping means 16. In this case, the folding means 14 is also configured to be movable up and down or left and right, and the adhesive sheet S can be peeled off from the wafer W by relative movement with the table 11 while holding the holding portion 22.

  Furthermore, in the said embodiment, although the peeling tape base material TB in which the holding part formation piece 21 was formed in the feed direction downstream of the original fabric R was illustrated and demonstrated, the holding part formation piece 21 is the supply of the original fabric R. The original fabric formed in the direction upstream and the left-right direction may be sufficient. In this case, the folding means 14 and the gripping means 16 may be arranged in the direction in which the gripping portion forming piece 21 is formed.

The schematic front view of the sheet peeling apparatus which concerns on this embodiment. (A) is a schematic perspective view of the tape base material for peeling, (B) is a schematic perspective view of the state which folded the holding part formation piece. Schematic perspective view of a peeling tape base material temporarily attached to a release sheet The principal part top view which shows the state which affixed the tape for peeling on the adhesive sheet. The schematic perspective view of a sticking means, a folding means, and a holding means. The operation | movement description which shows the state in which the holding part formation piece was folded and the tape for peeling was formed. Operation | movement explanatory drawing which shows the state which adhere | attached the peeling tape on the adhesive sheet. Operation | movement explanatory drawing which shows the middle of peeling of an adhesive sheet.

Explanation of symbols

10 Sheet peeling device 11 Table (support means)
12 feeding means 13 holding means 14 folding means 15 sticking means 16 gripping means 17 single-axis robot (moving means)
DESCRIPTION OF SYMBOLS 20 Adhesive part 20a String edge part 20b Arc edge part 21 Grasping part formation piece 22 Grasping part 37 Adsorption head 38 Rotation adsorption head BS Base material sheet A Adhesive layer P1, P2 Point L1 String L2 Arc M Motor (rotating means)
PT Peeling tape S Adhesive sheet TB Peeling tape substrate W Semiconductor wafer (Substrate)

Claims (5)

The adhesive part of the peeling tape having an adhesive part and a grip part is attached to an adhesive sheet attached to an adherend, and the adhesive sheet is removed from the adherend by relative movement of the peeling tape and the adherend. A sheet peeling device for peeling,
Holding means for supporting the adherend to which the adhesive sheet is affixed, feeding means for feeding out the peeling tape base material including the adhesive portion and a gripping portion forming piece connected thereto, and holding the peeling tape base material Holding means, folding means for forming a peeling tape by folding a holding part forming piece of a peeling tape base material held by the holding means and providing a holding part, and an adhesive part of the peeling tape A sheet peeling apparatus comprising: an attaching means for attaching to an adhesive sheet; a grasping means for grasping the grasping portion; and a moving means for relatively moving the grasping means and the supporting means. The adhesive portion includes an outer edge corresponding to the outer edge shape of the adhesive sheet, while the grip portion is provided in a shape protruding from the outer edge of the adhesive portion,
The holding means includes a suction head that is provided so as to be separated from and close to an adherend and has the same planar shape as the bonding portion. The suction head includes at least a part of an outer edge of the bonding portion. 2. The sheet according to claim 1, wherein at least a part of the outer edge of the adhesive sheet is made to coincide with the adhesive tape, and the peeling tape is attached to the adhesive sheet in a state in which the grip portion protrudes outward from the adherend. Peeling device.   3. The sheet peeling according to claim 1, wherein the folding means includes a holding surface having the same plane shape as the gripping part forming piece, and folds the gripping part forming piece via a rotating means. apparatus. A sheet peeling apparatus that affixes a peeling tape to at least a partial region including the outer edge of an adhesive sheet affixed to a semiconductor wafer, and peels the adhesive sheet from the semiconductor wafer by relative movement between the peeling tape and the adherend. And
A support means for supporting the semiconductor wafer to which the adhesive sheet is attached;
A plane including an adhesive portion provided with an adhesive layer on one surface of the base sheet and a grip portion forming piece continuous to the adhesive portion, and the adhesive portion including an outer edge of the same shape as the outer edge of the adhesive sheet While having a shape, a feeding means for feeding out the peeling tape base material having a shape in which the gripping portion forming piece protrudes from an outer peripheral portion of the adhesive portion, a holding means for holding the peeling tape base material, and the holding means Folding means for forming a peeling tape by folding a gripping portion forming piece of the peeling tape base material held in step and providing a gripping portion; and an attaching means for sticking the adhesive portion of the peeling tape to an adhesive sheet; A sheet peeling apparatus comprising: a gripping unit that grips the gripping unit; and a moving unit that relatively moves the gripping unit and the support unit. The adhesive part of the peeling tape having an adhesive part and a grip part is attached to an adhesive sheet attached to an adherend, and the adhesive sheet is removed from the adherend by relative movement of the peeling tape and the adherend. In the sheet peeling method to peel,
Supporting the adherend to which the adhesive sheet is affixed;
A step of feeding out a peeling tape base material including the adhesive portion and a grip portion forming piece connected to the adhesive portion;
Holding the peeling tape substrate;
A step of forming a peeling tape by folding a gripping portion forming piece of the held peeling tape base material to provide a gripping portion;
A step of attaching an adhesive portion of the peeling tape to an adhesive sheet;
Gripping the gripping part;
And a step of peeling the adhesive sheet by relatively moving the grip portion and the adherend.

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