JP4933494B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method. More specifically, the present invention reliably peels from an edge portion of an adhesive sheet and suppresses consumption of a peeling tape for peeling an adhesive sheet attached to an adherend. The present invention relates to a sheet peeling apparatus and a peeling method that can be used.

In a processing process of a semiconductor wafer (hereinafter simply referred to as “wafer”), an adhesive sheet is attached to protect the circuit surface and the like of the wafer. Such an adhesive sheet is peeled from the wafer using a sheet peeling device or the like after a predetermined processing step.
As a sheet peeling apparatus, it is disclosed by patent document 1, for example. The sheet peeling apparatus in the document adheres a strip-shaped peeling tape so as to cross the radial direction of a circular adhesive sheet affixed to the wafer, and winds the peeling tape to remove the adhesive sheet from the wafer. The structure which peels is employ | adopted.
JP 2007-43047 A

  However, in the sheet peeling apparatus disclosed in Patent Document 1, when the peeling tape is attached to the adhesive sheet, the adhesive of the peeling tape adheres to a portion other than the adhesive sheet, There are inconveniences in that peeling is hindered or the adhesive adheres to the table or the like on which the adherend is placed and becomes dirty. Further, since a peeling tape having a length longer than the diameter of the wafer is required, there is a disadvantage that the consumption of the peeling tape is large and the running cost is increased. In recent years, since a wafer having a large diameter is adopted, such inconvenience appears remarkably.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to prevent the adhesive sheet from being peeled off by adhering the adhesive of the peeling tape to a portion other than the adhesive sheet. An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of reliably peeling the adhesive sheet without contaminating a table or the like on which the body is placed with an adhesive.
Another object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of peeling an adhesive sheet while suppressing consumption of a peeling tape for peeling the adhesive sheet.

  In order to achieve the above-mentioned object, the present invention is applied to an adherend with a peeling tape having an adhesive portion provided with an adhesive layer in a predetermined region of a base sheet and a grip portion protruding from the adhesive portion. A sheet peeling apparatus that affixes to an adhesive sheet and peels the adhesive sheet from the adherend by relative movement between the peeling tape and the adherend, and supports the adherend to which the adhesive sheet is adhered. Means, a feeding means for feeding out the peeling tape, a sticking means for holding the peeling tape fed from the feeding means and sticking it to the adhesive sheet, a gripping means for gripping the gripping portion, and the gripping means, Moving means for moving the support means relative to each other, and the sticking means aligns at least a part of the outer edge of the adhesive part with at least a part of the outer edge of the adhesive sheet, and attaches the grip part to the adherend. While projecting outwardly sticking the peeling tape to the adhesive sheet, and employs a configuration that.

  In the present invention, the sticking means includes a suction head that can be separated and approached to the adherend, and the suction head has the same planar shape as the bonding portion.

  In addition, the present invention also applies a peeling tape to at least a partial region including the outer edge of a substantially circular adhesive sheet affixed to a semiconductor wafer, and the adhesive sheet is formed by a relative movement between the peeling tape and the adherend. A sheet peeling apparatus for peeling from a wafer, comprising: a supporting means for supporting a semiconductor wafer to which the adhesive sheet is affixed; an adhesive portion provided with an adhesive layer in a predetermined region of a base sheet; A feeding means for feeding out a peeling tape provided in a planar shape including an outer edge of the same shape as the outer edge of the adhesive sheet, and a gripping part protruding in the direction, and the same planar shape as the adhesive part And a sticking means having a suction head for sucking and holding the adhesive portion, a gripping means for gripping the gripping portion, and a moving means for relatively moving the gripping means and the support means. The sticking means attaches the peeling tape to the adhesive sheet in a state in which the outer edge of the adhesive part and the outer edge of the adhesive sheet coincide with each other and the grip part protrudes outward of the adherend. The configuration can be taken.

  Furthermore, the present invention is a sheet peeling method in which a peeling tape is affixed to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled from the adherend by relative movement between the peeling tape and the adherend. Using a peeling tape including an adhesive portion having a size corresponding to an outer peripheral portion of the adhesive sheet and a grip portion protruding from the adhesive portion, the grip portion is at least part of an outer edge of the adhesive portion and an adhesive sheet After adhering a peeling tape to the outer peripheral portion of the adhesive sheet in a state in which the gripping portion protrudes outward from the adherend, the gripping portion is gripped, and the adherend is gripped. The adhesive sheet is peeled off by relative movement.

According to the present invention, the peeling tape is attached in a state in which the sticking means aligns at least a part of the outer edge of the adhesive part with at least a part of the outer edge of the adhesive sheet and the grip part protrudes outward of the adherend. Since it is configured to be applied to the adhesive sheet, the adhesive of the peeling tape adheres to a portion other than the adhesive sheet to prevent peeling of the adhesive sheet, or the adhesive is applied to a table or the like on which the adherend is placed. The adhesive sheet can be peeled by eliminating the inconvenience of adhering and getting dirty, and gripping the grip portion and moving it relative to the adherend. In addition, when the peeling tape is a single-wafer type that is large enough to adhere to a part of the adhesive sheet, the peeling tape as compared with the conventional sheet peeling apparatus that applies the peeling tape along the direction crossing the adhesive sheet It becomes possible to suppress the consumption amount.
Further, in the configuration in which the suction head of the sticking means is provided in the same plane shape as the bonding portion, the peeling tape can be bonded with the outer edge of the bonding portion aligned with the outer edge of the bonding sheet, and the bonding sheet can be bonded to the outer edge. Can be reliably peeled off.
In particular, it is possible to reliably peel the adhesive sheet from the edge of the semiconductor wafer by making the adhesive sheet affixed to the semiconductor wafer an object to be peeled and matching the outer edge of the adhesive sheet with the outer edge of the adhesive part.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet peeling apparatus according to this embodiment. In this figure, a sheet peeling apparatus 10 includes a table 11 as a supporting means for supporting a semiconductor wafer W as an adherend to which an adhesive sheet S is stuck, a feeding means 12 for feeding out a peeling tape PT, and a peeling tape. The adhering means 14 for adsorbing and holding PT and adhering the peeling tape PT to the adhesive sheet S, the grasping means 15 for grasping a grasping portion to be described later of the peeling tape PT, and the grasping means 15 and the supporting means 11 A single-axis robot 17 as a moving means for relative movement is provided.

  As shown in FIG. 2, the peeling tape PT in the present embodiment is bonded to an adhesive portion 20 in which an adhesive layer A is provided in a predetermined region on one surface (lower surface in FIG. 2) of the base sheet BS. It consists of a gripping part 21 protruding outward from the adhesive part 20 without providing the agent layer A. As shown in FIG. 3, the bonding portion 20 includes a string edge portion 20a along the string L1 connecting the outer edge two points P1, P2 of the circular adhesive sheet S corresponding to the shape of the wafer W, and the two points P1, The planar shape corresponding to the area | region enclosed by the arc edge 20b along the arc L2 between P2 is provided.

  The table 11 has a substantially square planar shape, and the upper surface side is formed as a suction surface (not shown), and is supported by the single-axis robot 17 so as to be movable in the left-right direction in FIG.

  As shown in FIG. 1, the feeding means 12 supports a roll-shaped raw fabric R in which a sheet-like peeling tape PT is temporarily attached to one surface of a strip-like peeling sheet RL at predetermined intervals. Peeling is performed between the roller 26, the peel plate 27 that reverses the feeding direction of the release sheet RL to peel the release tape PT from the release sheet RL, the drive roller 28 that is rotated by the motor M, and the drive roller 28. A pinch roller 29 that sandwiches the sheet RL and a winding roller 30 that rotates synchronously with the driving roller 28 and winds the release sheet RL are configured. The feeding means 12 is supported by a frame (not shown).

  As shown in FIGS. 1 and 4, the sticking means 14 is fixed to a linear motion motor 35 and the tip (lower end) of the output shaft 36 of the linear motion motor 35 and connected to a decompression pump (not shown). And a suction head 37 provided so that the peeling tape PT can be sucked and held. The suction head 37 of the sticking means 14 is arranged so that the lower right side right end in FIG. 1 is located on the front end side of the peel plate 27. Further, the suction head 37 has the same planar shape as the bonding portion 20, and the bonding portion 20 is sucked and held by the suction head 37 in a state where the gripping portion 21 protrudes outside the surface of the suction head 37. Thereby, the adhesive part 20 is affixed to the adhesive sheet S in a state where the arc edge part 20b coincides with the outer edge of the adhesive sheet S. In the present embodiment, the operation of matching the arc edge 20b and the outer edge of the adhesive sheet S is controlled by counting pulses output from the single-axis robot 17 by a control means (not shown). May be configured to move relative to the table 11, or both the table 11 and the pasting means 14 may be moved so that the arc edge portion 20b and the outer edge of the adhesive sheet S coincide with each other.

  As shown in FIG. 5, the gripping means 15 includes a chuck holder 40, an upper claw member 41 that is supported by the chuck holder 40 and that can be rotated about a rotation shaft 43 via a driving means (not shown), And a lower claw member 42 that can move up and down via a drive means (not shown). As a result, the upper claw member 41 and the lower claw member 42 are provided so that the grip portion 21 can be gripped. The gripping means 15 is supported by a moving means such as a robot arm (not shown), and is provided so as to be movable up and down and left and right with respect to the same position when the position shown in FIG. Yes.

  Next, the sheet peeling method by the sheet peeling apparatus 10 will be described with reference to FIGS.

  As shown in FIG. 1, when the wafer W having the adhesive sheet S stuck on the table 11 is placed on the table 11 by a transport unit (not shown), the wafer W is sucked and held on the table 11.

  When the suction holding of the wafer W is confirmed, the motor M of the feeding means 12 is driven to wind up the release sheet RL, and the release head PT is peeled off from the release sheet RL by the peel plate 27. 37 is held by suction.

  In a state where the peeling tape PT is attracted to the suction head 37, the adhesive portion 20 is sucked and held in a state where it matches the planar shape of the suction head 37, and the grip portion 21 protrudes from the suction head 37.

  On the other hand, when the table 11 moves via the single-axis robot 17 and detects that the wafer W has reached a predetermined position below the attaching means 14 via the pulse of the single-axis robot 17, the single-axis robot 17 is driven. To stop. At this time, as shown in FIG. 1, the left end portion of the wafer W is located on the right side of the lower claw member 42 of the gripping means 15.

  When the linear motion motor 35 of the sticking means 14 is driven, the suction head 37 is lowered, and the adhesive portion 20 is attached to the outer peripheral portion of the adhesive sheet S. At this time, as shown in FIG. 3, the adhesive layer A is bonded by attaching the arc edge portion 20 b of the bonding portion 20 so as to coincide with the arc L <b> 2 between the two outer edges P <b> 1 and P <b> 2 of the wafer W. Bonding to parts other than the sheet S is prevented.

  When the application of the peeling tape PT is completed, the suction head 37 returns to the raised position, and the upper claw member 41 and the lower claw member 42 of the gripping means 15 interact to grip the grip portion 21 (FIG. 6). reference).

  Next, the gripping means 15 rises in the direction of arrow a in FIG. 6 so that the lower surface of the chuck holder 40 does not interfere with the wafer W, and then the table 11 moves to the left as shown in FIG. S is peeled off from the wafer W.

  Therefore, according to such an embodiment, the adhesive of the peeling tape PT adheres to a portion other than the adhesive sheet S to prevent peeling of the adhesive sheet S, or the table 11 on which the wafer W is placed is adhesive. In addition to preventing the contamination, the consumption of the peeling tape PT for peeling the adhesive sheet S is suppressed, and the adhesive sheet S can be peeled off.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the configuration in which a part of the outer edge of the adhesive part 20 and the part of the outer edge of the adhesive sheet S are illustrated and described is illustrated, but the entire outer edge of the adhesive part 20 and the entire outer edge of the adhesive sheet S are illustrated. It is good also as a structure in which. Even in this case, it is possible to eliminate the disadvantage that the adhesive A protruding from the outer edge of the adhesive sheet S adheres to a portion other than the adhesive sheet S to prevent peeling or stain the periphery.

  Further, the relative movement between the gripping means 15 and the table 11 when the adhesive sheet S is peeled can be achieved by at least one movement.

  Further, the moving means is not limited to the single-axis robot 17, and a linear motor, a cylinder, or the like may be employed. The gripping means 15 is sufficient if it can grip the grip portion 21.

  In addition, the planar shapes of the bonding portion 20 and the grip portion 21 can be arbitrarily changed, and the planar shape of the suction head 37 can be changed according to the shape of the bonding portion 20. That is, when the adhesive sheet affixed to the adherend is non-circular, it may have a planar shape corresponding to the shape of the outer edge portion of the planar shape.

  Further, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound wafer. It may be.

  Furthermore, the adhesive layer A can employ a pressure-sensitive adhesive or a heat-sensitive adhesive, and the composition is not limited at all.

  The gripping means 15 can be provided on the suction head 37. With such a configuration, the linear motion motor 35 can be substituted without separately providing a driving means for raising the gripping means 15 in the direction of arrow a in FIG.

  Furthermore, in the said embodiment, although the peeling part PT in which the holding part 21 was formed in the drawing | feeding direction downstream of the original fabric R was illustrated and demonstrated, the holding part 21 is the drawing direction upstream of the original fabric R, and the left-right direction. The raw material currently formed in may be sufficient. In this case, the gripping means 15 may be disposed in the direction in which the grip portion 21 is formed.

The schematic front view of the sheet peeling apparatus which concerns on this embodiment. The schematic perspective view which shows the state which a holding means hold | grips the holding part of the peeling tape. The principal part top view which shows the state which affixed the tape for peeling on the adhesive sheet. The schematic perspective view which looked at the state by which the tape for peeling was hold | maintained at the sticking means from the adhesive layer side. The partial side view of FIG. Action | operation explanatory drawing which shows the initial stage which starts peeling of an adhesive sheet. Operation | movement explanatory drawing which shows the middle of peeling the adhesive sheet.

Explanation of symbols

10 Sheet peeling device 11 Table (support means)
12 Feeding means 14 Sticking means 15 Holding means 17 Single-axis robot (moving means)
DESCRIPTION OF SYMBOLS 20 Adhesive part 20a String edge part 20b Arc edge part 21 Holding part 37 Adsorption head BS Base material sheet A Adhesive layer L2 Arc P1, P2 Point PT Peeling tape S Adhesive sheet W Semiconductor wafer (adhered body)

Claims (4)

A peeling tape having an adhesive portion provided with an adhesive layer in a predetermined region of the base sheet and a gripping portion protruding from the adhesive portion is attached to an adhesive sheet attached to an adherend, and the peeling tape A sheet peeling device for peeling the adhesive sheet from the adherend by relative movement between the adherend and the adherend,
A support means for supporting the adherend to which the adhesive sheet is affixed; a feeding means for feeding out the peeling tape; and an affixing means for holding and affixing the peeling tape fed from the feeding means to the adhesive sheet; A gripping means for gripping the gripping portion; and a moving means for relatively moving the gripping means and the support means;
The affixing means bonds at least a part of the outer edge of the adhesive part with at least a part of the outer edge of the adhesive sheet, and adheres the peeling tape in a state where the grip part protrudes outward of the adherend. A sheet peeling apparatus, which is attached to a sheet.   The sheet peeling apparatus according to claim 1, wherein the sticking unit includes a suction head capable of separating and approaching the adherend, and the suction head has the same planar shape as the adhesive portion. Sheet peeling that affixes a peeling tape to at least a partial region including the outer edge of a substantially circular adhesive sheet affixed to a semiconductor wafer, and peels the adhesive sheet from the semiconductor wafer by relative movement between the peeling tape and the adherend. A device,
A support means for supporting the semiconductor wafer to which the adhesive sheet is attached;
A plane including an adhesive portion provided with an adhesive layer in a predetermined region of the base sheet and a grip portion protruding outward from the adhesive portion, the adhesive portion including an outer edge having the same shape as the outer edge of the adhesive sheet; A feeding means for feeding out the peeling tape provided in the shape;
Affixing means having the same plane shape as the adhesive part and having an adsorption head for adsorbing and holding the adhesive part;
A gripping means for gripping the gripping portion;
Moving means for relatively moving the gripping means and the support means,
The affixing means aligns the outer edge of the adhesive part and the outer edge of the adhesive sheet, and affixes the peeling tape to the adhesive sheet in a state where the grip part protrudes outward of the adherend. Sheet peeling device. In the sheet peeling method in which a peeling tape is attached to the adhesive sheet affixed to the adherend, and the adhesive sheet is peeled off the adherend by relative movement between the peeling tape and the adherend,
Support the adherend to which the adhesive sheet is attached,
Using a peeling tape provided with an adhesive portion having a size corresponding to the outer peripheral portion of the adhesive sheet, and a grip portion protruding from the adhesive portion,
The gripping part is aligned with at least a part of the outer edge of the adhesive part and at least a part of the outer edge of the adhesive sheet, and the gripping part protrudes outward from the adherend to be peeled to the outer peripheral part of the adhesive sheet. After sticking a tape, the adhesive sheet is peeled off by gripping the grip part and moving the grip part relative to the adherend.

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