JP2009533157A - 空隙のない埋め込み型密閉構造 - Google Patents
空隙のない埋め込み型密閉構造 Download PDFInfo
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- JP2009533157A JP2009533157A JP2009505514A JP2009505514A JP2009533157A JP 2009533157 A JP2009533157 A JP 2009533157A JP 2009505514 A JP2009505514 A JP 2009505514A JP 2009505514 A JP2009505514 A JP 2009505514A JP 2009533157 A JP2009533157 A JP 2009533157A
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Abstract
Description
本出願は、米国仮特許出願第60/791,244号(2006年4月12日出願)、および同第60/893,548号(2007年3月7日出願)の米国特許法119条(e)項の優先権を主張するものであり、両出願の開示内容は、参考として本明細書に援用される。
本発明は、概して、埋込み型医療機器に関する。
上述のように、本発明の埋込み型密閉構造は、構造の外面全体ではないが、実質的に全体に共形密閉層が存在する構造を含んでもよく、その構造は、密閉層に包み込まれる、または包装される、例えば、パッケージ化される構造であってもよい。代替として、密閉層は構造の一部、例えば上部分にのみ存在し、密閉層が構造の外面を部分的に被覆するようにしてもよい。これらの実施形態それぞれについて、ここで個別に詳述する。
図1を参照すると、本発明の側面に従うIC装置10の典型的な一実施形態が示されている。装置10は、例えばシリコン等であるがそれらに限定されない基板12上に形成してもよい。図1に示されるような単一ダイスを個別に形成するか、または複数のダイスを、例えばシリコンウエハ上でともに形成し、処理中または処理後に個別のダイスに単一化してもよい。
上述のように、本発明に従って様々な埋込み型構造を密閉することができる。2つの関心の構造は、集積回路および埋込み型パルス発生器である。これらの例示的実施形態それぞれについて、以下で個別に詳述する。
本発明の一実施形態において、ICチップをPt薄膜(例えば、層)、次に炭化ケイ素膜で被覆する。エッチングで炭化ケイ素膜に穴を開け、特定の領域において下位のPt膜を露出する。厚い耐食金属導体(Pt、PtIr、PtTi、PtTiIr、Tiまたはその他の耐食金属)を露出した薄いPt領域上のICチップに蒸着させる。これらの耐食層は、露出した薄いPt膜上に保護障壁を形成し、ICチップとの電気相互接続として機能する。次に、薄い炭化ケイ素またはその他の耐食誘電体(AIN、AIO、TiO2またはその他の適切な誘電体/セラミック)を厚い金属線の上に蒸着させる。第2の厚い金属または誘電体層をチップ上に選択的に蒸着させる。この層は、追加の耐食層として、および第1の厚い金属蒸着中に形成された電気相互接続の機械的支持構造として機能する。次に、薄い炭化ケイ素またはその他の耐食誘電体をチップの裏面に蒸着させる。続いて、第3の厚い金属または誘電体層をチップの裏面に蒸着させ、共形パッケージを完了する。第2および第3の厚い金属蒸着により、電気導体およびICチップの周囲にシェルが形成される。
図26に示されるように、本発明の方法を使用し、様々な構成要素を持つ完全な複数の単位装置を単一の密閉パッケージに封入することができる。例えば、厚金属蒸着プロセスを採用し、IPG/ICD装置構成全体を封入できる。複数の構成要素を封入する本発明の実施形態により、単一の基板を作成し、バッテリ、IC、個別の構成要素(コンデンサ)、およびIS1コネクタブロックを取り付けることが可能になる。厚い金属を作成し、その金属をパターン化する能力により、厚く幅広い金属線が形成され、そこにIS1コネクタブロックを直接溶接できる。
上述のように、多種の異なるプロトコルのいずれかを採用し、密閉構造およびその構成要素を製造してもよい。例えば、鋳造、蒸着および材料除去、例えば、微小電気機械システム(MEMS)等の平坦化処理技術を採用してもよい。構造製造の特定の側面において採用してもよい蒸着技術は、電気メッキ、陰極アーク蒸着、プラズマ溶射、スパッタリング、電子ビーム蒸着、物理蒸着、化学蒸着、プラズマ化学蒸着等を含むがそれらに限定されない。材料除去技術は、反応性イオンエッチング、異方性化学エッチング、等方性化学エッチング、例えば、化学機械研磨、レーザアブレーション、電子放射機械加工(EDM)等による平坦化等を含むがそれらに限定されない。またリソグラフプロトコルも興味深い。特定の実施形態において、平坦化処理プロトコルを使用することも興味深い。ここで、構造は構築され、および/または連続的に基板に適用される様々な異なる材料除去および蒸着プロトコルを使用して、初期平坦基板の1つまたは複数の表面から除去される。
上述のように、本発明は、上述のような密閉集積回路構造を含む埋込み型医療機器を提供する。埋込み型医療機器とは、生体上または生体内に配置されるよう構成される装置を意味する。特定の実施形態において、埋込み型医療機器は生体内に埋め込まれるよう構成される。埋込み型装置の実施形態は、体内に見られる高塩、高湿度環境を含む生理的環境に2日以上、例えば約1週間以上、約4週間以上、約6ヶ月以上、約1年以上、例えば約5年以上存在する場合に機能性を維持するよう構成される。特定の実施形態において、埋込み型装置は、約1年〜約80年以上、例えば約5年〜約70年以上の範囲の期間、および約10年〜約50年以上の範囲の期間、生理的部位に埋め込まれる場合に機能性を維持するよう構成される。本発明の埋込み型医療機器の寸法は異なることがある。しかし、埋込み型医療機器は埋め込み可能であるため、装置の特定実施形態の寸法は、成人の体内に配置できないような大きさではない。
関心の埋込み型医療機器の1つのタイプは、電極を含む装置である。そのような装置において、1つ以上の電極は集積回路に電気的に連結される。特定の実施形態において、電極を含む装置は、以下に詳述されるように、分割電極集合体等の電極集合体を含む。
本発明の密閉構造の実施形態の使用が認められるさらに別タイプの医療機器およびシステムは、血液検体検出装置等の検体検出装置、例えば、血糖検出装置である。多種の異なる光ベース、例えば、赤外線または近赤外線ベースの検体検出装置が開発されており、例えば血液等の液体標本を証明するための赤外線または近赤外線光源等の光源と、標本から反射、屈折する光等の戻る光を検出するための検出器を含む。ここで、標本からの光に応答して検出器により生成された信号が処理され(例えば、参照または対照と比較することにより)、標本に含まれる1つ以上の検体、例えば血液標本中の糖を質的または量的に検出する。密閉構造を含む、例えば赤外線光源および/または検出器を含むよう適合されてもよい赤外線または近赤外線血液検体検出装置は、次の出願の明細書に記載されるものを含むがそれらに限定されない:米国特許出願公開第20040206905号、同第20040077950号、同第20040024321号、同第20020193671号、同第20020067476号、同第20020027649号、同第20050267346号、同第20050192493号、同第20050171413号、同第20050131286号、同第20050124869号、同第20050043603号、同第20050027183号、同第20040242977号、同第20040220458号、同第20040193031号、同第20040162470号、同第20040133086号、同第20040106163号、同第20030220581号、同第20030191377号、同第20030105391号、同第20030100846号、同第20030076508号、同第20030050541号、同第20030032885号、同第20030023152号、同第20030013947号、同第20020193673号、同第20020173709号、同第20020103423号、同第20020091324号、同第20020084417号、同第20020082487号、同第20020072658号、同第20020055671号、同第20020041166号、同第20020038080号、同第20020035341号、同第20020026106号、同第20020019055号、同第20020016534号、および同第20010018560号。これらの開示は参照により本明細書に組み込まれる。上述の公開済み出願の多くは、埋込み型装置またはシステムではない装置およびシステムについて説明している。本密閉構造は、これらの装置およびシステムを容易に埋込み型形式に修正することができる。例えば、本発明の特定実施形態において、埋込み型光学ベースの血糖検体検出装置を提供する。ここで、光源、例えば赤外線光源は、赤外線を通すシリコンホルダにおいて密閉される。密閉光源は、適切な血管の第1側面に配置され、密閉された光源からの光が血管内の血液を照明できるようにする。血管の反対側には密閉検出器が配置される。この検出器は、血管に存在する血液からの光を検出し、それに応じて電気信号を生成する。密閉光源および検出器は、例えば、後次処理のための起動信号を光源に提供し、検出器から信号を受信して、例えば血管における血液中の糖等の検体を質的または量的に特定する少なくとも1つの導体を介して、それぞれ制御装置に連結される。
対象密閉構造の使用が認められるさらに別タイプの医療機器およびシステムは、視力回復装置およびシステム、例えば、検出された光を電気信号に変換し、例えば視神経を刺激する埋込み型光検出器要素を含む装置およびシステムである。本発明の実施形態にしたがって、集積回路および光センサ、例えば光電池を関心の波長を十分に通す構造において密閉でき、装置およびシステムの長期の埋め込み可能性を提供する。対象の密閉構造が組み込まれてもよい代表的な埋込み型視力回復装置およびシステムは、以下の明細書等に記載される装置およびシステムを含むがそれらに限定されない:米国特許第4,628,933号、同第5,042,223号、同第5,397,350号、同第6,230,057および国際公開第01/74444号(名称「Multi−Phasic Microphotodetector Retinal Implant With Variable Voltage And Current Capability And Apparatus For Insertion」)、同第01/83026号(名称「Artificial Retina Device With Stimulating And Ground Return Electrodes Disposed On Opposite Sides Of The Neuroretina And Method Of Attachment」)、同第03/002190号(名称「Methods For Improving Damaged Retinal Cell Function」)、同第03/002070号(名称「Methods For Improving Damaged Retinal Cell Function Using Physical And/Or Mechanical Stimulation」)、同第2004/071338号(名称「Implantable Device Using Diamond−Like Carbon Coating」)、同第2004/112893号(名称「Implant Instalment」)、同第2005/004985号(名称「Treatment Of Degenerative Retinal Disease Via Electrical Stimulation Of Surface Structures」)、同第2005/004985号(名称「Device For Treatment Of Degenerative Retinal Disease Via Electrical Stimulation Of Surface Structures Of The Eyeball」)、および同第2005/110326号(名称「Mechanically Activated Objects For Treatment Of Degenerative Retinal Disease」)。
また上述の装置、埋込み型パルス発生器を1つ以上含むシステムも提供する。本発明のシステムは、対象、例えばヒトの体内で情報通信するシステムと見なしてもよい。システムは、信号を送信および/または受信するよう構成されたトランシーバを含む上述のIPG装置等の第1埋込み型医療機器と、信号を送信および/または受信するよう構成されたトランシーバを含む第2装置と、を含む。第2装置は、体内、体表面、または使用中に体から隔離される装置であってもよい。
埋込み型装置またはシステム、例えば埋込み型パルス発生器の1つ以上の構成要素の一部として、例えば上述のように対象の電極構造を含むキットも提供する。特定の実施形態において、キットには、少なくとも1つの制御装置が、例えば、ペースメーカ缶の携帯でさらに含まれる。これらの特定の実施形態において、構造および制御装置を細長い導電部材により電気的に連結してもよい。特定の実施形態において、電極構造は心血管リード等のリードに存在してもよい。
Claims (24)
- 埋込み型密閉構造を提供するために、該構造の外面の少なくとも一部の上に共形の密閉層を含む、埋込み型密閉構造。
- 前記共形の密閉層は、前記構造の外面の全体を被覆する、請求項1に記載の構造。
- 前記共形の密閉層は、前記構造の外面の一部のみを被覆する、請求項1に記載の構造。
- 前記構造は集積回路である、請求項1に記載の構造。
- 基板と、
集積回路含む回路層であって、該回路層が該基板の上面上および/または上面内にある、回路層と、
該回路層の上面上にある密閉層であって、該回路層を密閉することにより、埋込み型密閉集積回路装置を提供する、密閉層と
を含む、請求項4に記載の集積回路。 - 前記密閉層は、前記密閉回路層と該密閉回路層の外部位置との間に電気通信を提供する電気ビアを含む、請求項5に記載の埋込み型密閉集積回路装置。
- 前記ビアは耐食性の伝導体要素を含む、請求項6に記載の埋込み型密閉集積回路装置。
- 前記回路層は傾斜端を含む、請求項5に記載の埋込み型密閉集積回路装置。
- 前記構造は埋込み型パルス発生器である、請求項1に記載の埋込み型密閉構造。
- 埋込み型密閉集積回路を製造する方法であって、
回路層を基板の上面に提供することと、
該回路層を密閉する該回路層の上面上に密閉層を生成することにより、該埋込み型密閉集積回路装置を提供することと
を含む、方法。 - 前記密閉層を前記基板の上面上に生成する、請求項10に記載の方法。
- 前記密閉層を生成することは、前記回路層の上面上に密閉層材料を蒸着させることを含む、請求項11に記載の方法。
- 前記密閉層は、プラズマ蒸着、プラズマ助長化学蒸着、スパッタリング、電子ビーム蒸着、メッキ、陰極アーク蒸着および低圧化学蒸着をから成る群から選択されるプロセスにより蒸着される、請求項12に記載の方法。
- 請求項5に記載の密閉集積回路装置を含む埋込み型医療機器。
- 前記埋込み型医療機器は、埋込み型パルス発生器のリードである、請求項14に記載の埋込み型医療機器。
- 請求項5に記載の埋込み型密閉集積回路を含む電極集合体。
- 前記電極集合体は、2つ以上の電極を含む分割電極である、請求項16に記載の電極集合体。
- 前記分割電極は4つの電極を含む、請求項17に記載の電極集合体。
- 近位端と遠位端、および請求項18に記載の電極集合体を少なくとも1つ含む、細長い柔軟構造。
- 前記構造は血管リードである、請求項19に記載の細長い柔軟構造。
- 前記血管リードは2つ以上の電極集合体を含む、請求項20に記載の細長い柔軟構造。
- 前記血管リードは3本以下のワイヤを有する多重リードである、請求項21に記載の細長い柔軟構造。
- (a)電源および電気刺激制御要素を含むハウジングと、
(b)請求項20〜22のいずれか1項に記載の血管リードと
を含む、埋込み型パルス発生器。 - 請求項23のいずれかに記載の埋込み型パルス発生器を対象に埋め込むことと、
該埋め込まれたパルス発生器を使用することと
を含む、方法。
Applications Claiming Priority (3)
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US79124406P | 2006-04-12 | 2006-04-12 | |
US89354807P | 2007-03-07 | 2007-03-07 | |
PCT/US2007/009270 WO2007120884A2 (en) | 2006-04-12 | 2007-04-12 | Void-free implantable hermetically sealed structures |
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JP2012146983A Division JP5539448B2 (ja) | 2006-04-12 | 2012-06-29 | 空隙のない埋め込み型密閉構造 |
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JP2009533157A true JP2009533157A (ja) | 2009-09-17 |
JP2009533157A5 JP2009533157A5 (ja) | 2010-05-06 |
Family
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JP2009505514A Pending JP2009533157A (ja) | 2006-04-12 | 2007-04-12 | 空隙のない埋め込み型密閉構造 |
JP2012146983A Expired - Fee Related JP5539448B2 (ja) | 2006-04-12 | 2012-06-29 | 空隙のない埋め込み型密閉構造 |
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US (2) | US20100016928A1 (ja) |
EP (2) | EP2520331A3 (ja) |
JP (2) | JP2009533157A (ja) |
WO (1) | WO2007120884A2 (ja) |
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Also Published As
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US20130018434A1 (en) | 2013-01-17 |
EP2030210A2 (en) | 2009-03-04 |
JP5539448B2 (ja) | 2014-07-02 |
JP2012183384A (ja) | 2012-09-27 |
WO2007120884A3 (en) | 2008-03-27 |
US20100016928A1 (en) | 2010-01-21 |
EP2030210A4 (en) | 2010-04-14 |
EP2520331A2 (en) | 2012-11-07 |
EP2520331A3 (en) | 2013-02-20 |
WO2007120884A2 (en) | 2007-10-25 |
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