JP2009522810A5 - - Google Patents

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Publication number
JP2009522810A5
JP2009522810A5 JP2008549523A JP2008549523A JP2009522810A5 JP 2009522810 A5 JP2009522810 A5 JP 2009522810A5 JP 2008549523 A JP2008549523 A JP 2008549523A JP 2008549523 A JP2008549523 A JP 2008549523A JP 2009522810 A5 JP2009522810 A5 JP 2009522810A5
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JP
Japan
Prior art keywords
substrate
processing
zone
determining
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008549523A
Other languages
English (en)
Japanese (ja)
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JP2009522810A (ja
Filing date
Publication date
Priority claimed from US11/326,646 external-priority patent/US20070158201A1/en
Application filed filed Critical
Publication of JP2009522810A publication Critical patent/JP2009522810A/ja
Publication of JP2009522810A5 publication Critical patent/JP2009522810A5/ja
Pending legal-status Critical Current

Links

JP2008549523A 2006-01-06 2006-12-21 動的処理制御による電気化学処理 Pending JP2009522810A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/326,646 US20070158201A1 (en) 2006-01-06 2006-01-06 Electrochemical processing with dynamic process control
PCT/US2006/062476 WO2007120357A2 (en) 2006-01-06 2006-12-21 Electrochemical processing with dynamic process control

Publications (2)

Publication Number Publication Date
JP2009522810A JP2009522810A (ja) 2009-06-11
JP2009522810A5 true JP2009522810A5 (enrdf_load_stackoverflow) 2009-10-15

Family

ID=38231698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008549523A Pending JP2009522810A (ja) 2006-01-06 2006-12-21 動的処理制御による電気化学処理

Country Status (4)

Country Link
US (1) US20070158201A1 (enrdf_load_stackoverflow)
JP (1) JP2009522810A (enrdf_load_stackoverflow)
TW (1) TW200733216A (enrdf_load_stackoverflow)
WO (1) WO2007120357A2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192605B2 (en) * 2009-02-09 2012-06-05 Applied Materials, Inc. Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures
WO2014149330A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ispc)
US9286930B2 (en) * 2013-09-04 2016-03-15 Seagate Technology Llc In-situ lapping plate mapping device
JP7500318B2 (ja) * 2020-03-23 2024-06-17 キオクシア株式会社 陽極化成装置
CN113622015B (zh) * 2021-10-12 2021-12-24 深圳市景星天成科技有限公司 在线式电解抛光监测系统
CN115142112A (zh) * 2022-09-01 2022-10-04 徐州千帆标识系统工程有限公司 一种金属标牌多角度高效电镀装置及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654116A (en) * 1968-08-07 1972-04-04 Inoue K Adaptive ion-control system for electrochemical machining
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6582281B2 (en) * 2000-03-23 2003-06-24 Micron Technology, Inc. Semiconductor processing methods of removing conductive material
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
JP2002110592A (ja) * 2000-09-27 2002-04-12 Sony Corp 研磨方法および研磨装置
US6866763B2 (en) * 2001-01-17 2005-03-15 Asm Nutool. Inc. Method and system monitoring and controlling film thickness profile during plating and electroetching
CN100398261C (zh) * 2001-04-24 2008-07-02 应用材料有限公司 用于电化学机械抛光的导电抛光部件
US6951599B2 (en) * 2002-01-22 2005-10-04 Applied Materials, Inc. Electropolishing of metallic interconnects
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
JP3843871B2 (ja) * 2002-03-26 2006-11-08 ソニー株式会社 電解研磨方法および半導体装置の製造方法
JP2005539384A (ja) * 2002-09-16 2005-12-22 アプライド　マテリアルズ　インコーポレイテッド 電気化学的に支援されたｃｍｐにおける除去プロファイルの制御
TWI285576B (en) * 2003-06-06 2007-08-21 Applied Materials Inc Conductive polishing article for electrochemical mechanical polishing
US20070108066A1 (en) * 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control

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