TW200733216A - Electrochemical processing with dynamic process control - Google Patents

Electrochemical processing with dynamic process control

Info

Publication number
TW200733216A
TW200733216A TW095149050A TW95149050A TW200733216A TW 200733216 A TW200733216 A TW 200733216A TW 095149050 A TW095149050 A TW 095149050A TW 95149050 A TW95149050 A TW 95149050A TW 200733216 A TW200733216 A TW 200733216A
Authority
TW
Taiwan
Prior art keywords
processing
process control
substrate
dynamic process
electrochemical processing
Prior art date
Application number
TW095149050A
Other languages
English (en)
Chinese (zh)
Inventor
Eashwer Kollata
Antoine Manens
Pierre Fontarensky
Gregory C Lee
Alain Duboust
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200733216A publication Critical patent/TW200733216A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW095149050A 2006-01-06 2006-12-26 Electrochemical processing with dynamic process control TW200733216A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/326,646 US20070158201A1 (en) 2006-01-06 2006-01-06 Electrochemical processing with dynamic process control

Publications (1)

Publication Number Publication Date
TW200733216A true TW200733216A (en) 2007-09-01

Family

ID=38231698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149050A TW200733216A (en) 2006-01-06 2006-12-26 Electrochemical processing with dynamic process control

Country Status (4)

Country Link
US (1) US20070158201A1 (enrdf_load_stackoverflow)
JP (1) JP2009522810A (enrdf_load_stackoverflow)
TW (1) TW200733216A (enrdf_load_stackoverflow)
WO (1) WO2007120357A2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192605B2 (en) * 2009-02-09 2012-06-05 Applied Materials, Inc. Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures
WO2014149330A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ispc)
US9286930B2 (en) * 2013-09-04 2016-03-15 Seagate Technology Llc In-situ lapping plate mapping device
JP7500318B2 (ja) * 2020-03-23 2024-06-17 キオクシア株式会社 陽極化成装置
CN113622015B (zh) * 2021-10-12 2021-12-24 深圳市景星天成科技有限公司 在线式电解抛光监测系统
CN115142112A (zh) * 2022-09-01 2022-10-04 徐州千帆标识系统工程有限公司 一种金属标牌多角度高效电镀装置及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654116A (en) * 1968-08-07 1972-04-04 Inoue K Adaptive ion-control system for electrochemical machining
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6582281B2 (en) * 2000-03-23 2003-06-24 Micron Technology, Inc. Semiconductor processing methods of removing conductive material
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
JP2002110592A (ja) * 2000-09-27 2002-04-12 Sony Corp 研磨方法および研磨装置
US6866763B2 (en) * 2001-01-17 2005-03-15 Asm Nutool. Inc. Method and system monitoring and controlling film thickness profile during plating and electroetching
CN100398261C (zh) * 2001-04-24 2008-07-02 应用材料有限公司 用于电化学机械抛光的导电抛光部件
US6951599B2 (en) * 2002-01-22 2005-10-04 Applied Materials, Inc. Electropolishing of metallic interconnects
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
JP3843871B2 (ja) * 2002-03-26 2006-11-08 ソニー株式会社 電解研磨方法および半導体装置の製造方法
JP2005539384A (ja) * 2002-09-16 2005-12-22 アプライド　マテリアルズ　インコーポレイテッド 電気化学的に支援されたｃｍｐにおける除去プロファイルの制御
TWI285576B (en) * 2003-06-06 2007-08-21 Applied Materials Inc Conductive polishing article for electrochemical mechanical polishing
US20070108066A1 (en) * 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control

Also Published As

Publication number Publication date
US20070158201A1 (en) 2007-07-12
WO2007120357A2 (en) 2007-10-25
JP2009522810A (ja) 2009-06-11
WO2007120357A3 (en) 2008-01-03

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