TW200733216A - Electrochemical processing with dynamic process control - Google Patents

Electrochemical processing with dynamic process control

Info

Publication number
TW200733216A
TW200733216A TW095149050A TW95149050A TW200733216A TW 200733216 A TW200733216 A TW 200733216A TW 095149050 A TW095149050 A TW 095149050A TW 95149050 A TW95149050 A TW 95149050A TW 200733216 A TW200733216 A TW 200733216A
Authority
TW
Taiwan
Prior art keywords
processing
process control
substrate
dynamic process
electrochemical processing
Prior art date
Application number
TW095149050A
Other languages
Chinese (zh)
Inventor
Eashwer Kollata
Antoine Manens
Pierre Fontarensky
Gregory C Lee
Alain Duboust
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200733216A publication Critical patent/TW200733216A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Embodiments of the invention generally provide a method for electrochemically removing material from a substrate. In one embodiment, a method for electrochemically processing a substrate includes determining a process target for a substrate; electrochemically processing the substrate; determining a deviation between expected and actual process indicators while processing, and changing at least one process variable during processing in response to the variation.
TW095149050A 2006-01-06 2006-12-26 Electrochemical processing with dynamic process control TW200733216A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/326,646 US20070158201A1 (en) 2006-01-06 2006-01-06 Electrochemical processing with dynamic process control

Publications (1)

Publication Number Publication Date
TW200733216A true TW200733216A (en) 2007-09-01

Family

ID=38231698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149050A TW200733216A (en) 2006-01-06 2006-12-26 Electrochemical processing with dynamic process control

Country Status (4)

Country Link
US (1) US20070158201A1 (en)
JP (1) JP2009522810A (en)
TW (1) TW200733216A (en)
WO (1) WO2007120357A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192605B2 (en) * 2009-02-09 2012-06-05 Applied Materials, Inc. Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures
WO2014149330A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ispc)
US9286930B2 (en) * 2013-09-04 2016-03-15 Seagate Technology Llc In-situ lapping plate mapping device
JP7500318B2 (en) * 2020-03-23 2024-06-17 キオクシア株式会社 Anodizing Equipment
CN113622015B (en) * 2021-10-12 2021-12-24 深圳市景星天成科技有限公司 Online electrolytic polishing monitoring system
CN115142112A (en) * 2022-09-01 2022-10-04 徐州千帆标识系统工程有限公司 Multi-angle efficient electroplating device and method for metal label

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA929891A (en) * 1968-08-07 1973-07-10 Inoue Kiyoshi Adaptive ion-control system for electrochemical machining
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6582281B2 (en) * 2000-03-23 2003-06-24 Micron Technology, Inc. Semiconductor processing methods of removing conductive material
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
JP2002093761A (en) * 2000-09-19 2002-03-29 Sony Corp Polishing method, polishing system, plating method and plating system
JP2002110592A (en) * 2000-09-27 2002-04-12 Sony Corp Polishing method and apparatus
US6866763B2 (en) * 2001-01-17 2005-03-15 Asm Nutool. Inc. Method and system monitoring and controlling film thickness profile during plating and electroetching
ATE327864T1 (en) * 2001-04-24 2006-06-15 Applied Materials Inc CONDUCTIVE POLISHING BODY FOR ELECTROCHEMICAL-MECHANICAL POLISHING
US6951599B2 (en) * 2002-01-22 2005-10-04 Applied Materials, Inc. Electropolishing of metallic interconnects
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
JP3843871B2 (en) * 2002-03-26 2006-11-08 ソニー株式会社 Electropolishing method and semiconductor device manufacturing method
KR20050043972A (en) * 2002-09-16 2005-05-11 어플라이드 머티어리얼스, 인코포레이티드 Control of removal profile in electrochemically assisted cmp
KR20070104686A (en) * 2003-06-06 2007-10-26 어플라이드 머티어리얼스, 인코포레이티드 Conductive polishing article for electrochemical mechanical polishing
US20070108066A1 (en) * 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control

Also Published As

Publication number Publication date
WO2007120357A2 (en) 2007-10-25
JP2009522810A (en) 2009-06-11
US20070158201A1 (en) 2007-07-12
WO2007120357A3 (en) 2008-01-03

Similar Documents

Publication Publication Date Title
TW200733216A (en) Electrochemical processing with dynamic process control
WO2008067552A3 (en) Method and apparatus for biological sample analysis
WO2007143408A3 (en) Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same
TW200744806A (en) Robot system
EP1868088A3 (en) Program update control apparatus
WO2007101216A3 (en) Floating-point processor with reduced power requirements for selectable subprecision
EP1848028A4 (en) Substrate processing method, substrate processing apparatus and control program
TW200605210A (en) Method and processing system for controlling a chamber cleaning process
WO2008042760A3 (en) Method and system for dynamically updating calibration parameters for an analyte sensor
EP2114241A4 (en) Method and system for providing analyte monitoring
EP2043116A4 (en) Method for pretreating electrochemical capacitor negative electrode, method for manufacturing the electrochemical capacitor negative electrode, and method for manufacturing electrochemical capacitor using the method for manufacturing the electrochemical capacitor negative electrode
EP3912740A4 (en) Production specification determination method, production method, and production specification determination device for metal material
TW200614408A (en) Endpoint compensation in electroprocessing
MX2011009896A (en) Biosensor with predetermined dose response curve and method of manufacturing.
WO2009139912A3 (en) In-line effluent analysis method and apparatus for cmp process control
WO2008027311A3 (en) Method and apparatus for determining a solution group of parts in an assembly
GB201014466D0 (en) Equivalent material constant calculation system, an equivalent material constant calculation program, equivalent material constant calculation method,
WO2008096721A1 (en) Method and apparatus for applying liquid material, and program
TW200730328A (en) Sheet forming apparatus and method of controlling the same
EP4001908A4 (en) Electrochemical sensor unit, electrode for electrochemical sensor, and method for manufacturing electrode for electrochemical sensor
EA200900452A1 (en) A METHOD OF INCREASING THE CONGENITIVE PRODUCTIVITY OF PLANTS
AU2013252445A8 (en) Assays, methods and apparatus for assessing RNA disruption
SG144088A1 (en) Method for determining initial burnishing parameters
EP1980641B8 (en) Method and measurement system for the control of an active charge surface in the low pressure carburizing process
WO2009156234A3 (en) Method for establishing a machine code, the execution of which generates an optimized rolling model