JP2009522810A5

JP2009522810A5 -

Info

Publication number: JP2009522810A5
Application number: JP2008549523A
Authority: JP
Filing date: 2006-12-21
Publication date: 2009-10-15

Claims

In a method for processing a substrate,
Determining a processing target for the substrate;
Electrochemically treating the surface of the substrate;
Determining a deviation between a predicted process indicator and an actual process indicator during processing;
Changing at least one process variable during processing in response to the deviation;
With a method.

The method of claim 1, wherein determining the processing target further comprises determining a profile for the surface to be processed.

The method of claim 1, wherein determining the processing target further comprises determining a thickness of a film disposed at a plurality of locations on the substrate.

4. The method of claim 3, wherein the thickness is determined by a non-destructive measurement technique that is at least one of eddy current sensing, capacitive sensing, or interferometry .

The method of claim 1, wherein changing the at least one process variable further comprises adjusting a current or voltage to perform the electrochemical process.

The step of electrochemically treating the surface comprises:
Pressing the surface of the substrate against an abrasive material;
Establishing a relative motion between the abrasive material and the surface of the substrate;
The method of claim 1, further comprising:

The step of electrochemically treating the surface of the substrate comprises:
Biasing the surface of the substrate against an electrode spaced from the surface of the substrate;
Providing an electrolyte in contact with the electrode and the surface of the substrate;
The method of claim 1, further comprising:

The step of electrochemically treating the surface of the substrate comprises:
Pressing the surface of the substrate against the surface of the conductive polymer in the presence of an electrolyte;
Applying an electrical bias to the surface of the substrate through the conductive polymer surface;
Providing relative motion between the surface of the substrate and the surface of the conductive polymer;
The method of claim 1, further comprising:

The step of electrochemically treating the surface of the substrate comprises:
Pressing the surface of the substrate against an insulating polymer surface supported by a platen;
Establishing a conductive path via an electrolyte between the surface of the substrate and the electrode supported by the platen;
Applying an electrical bias to the surface of the substrate through the electrical contacts Ru extending beauty from said platen,
Providing relative motion between the surface of the substrate and the surface of the insulating polymer;
The method of claim 1, further comprising:

The determining step is
At least one of a step of comparing a predicted current with a measured current, comparing a predicted charge removed from the substrate with a measured charge, and comparing a predicted thickness with an actual thickness during the electrochemical process < The method of claim 1, further comprising:

The step of changing the at least one process variable adjusts the process variable in the first process zone independently of the process variable for the second process zone and controls the electrochemical removal rate in each process zone independently. The method of claim 1, further comprising the step of:

Voltage V _i to perform the electrochemical process, varying gills are in response to the deviation D _i, where, V _i is By A applied to each processing zone of the processing system in which the electrochemical treatment is carried out a scan voltage, D _i is the deviation between the actual processing index and prediction processing indicator in the processing zone of the processing system, i is, the number of treatment zones arranged in the lateral direction in the processing system The method according to claim 1, as described above.

Vi is expressed by the following equation:
here,
Ie _i is the current error for zone i,
Ce _i is the charge error for zone i,
P, I and D are constants,
The method of claim 16.

In a method for processing a substrate,
Determining a target profile and a predictive processing indicator for achieving the target profile;
Contacting the conductive surface of the substrate against a processing pad assembly comprising an electrode having a plurality of zones;
Establishing a conductive path via an electrolyte between the conductive surface of the substrate and at least one zone of the electrode;
A step of independently controlling the electrical bias applied to between each zone of the conductive surface and the electrode of the substrate,
Determining a deviation between a predicted process indicator and an actual process indicator during processing;
Changing at least one process variable during processing in response to the deviation;
With a method.

In a method for processing a substrate,
Determining a target profile and a predictive processing indicator for achieving the target profile;
Contacting the conductive surface of the substrate against a processing pad assembly comprising an electrode having a plurality of zones;
Establishing a conductive path via an electrolyte between the conductive surface of the substrate and at least one zone of the electrode;
A step of independently controlling the electrical bias applied to between each zone of the conductive surface and the electrode of the substrate,
Determining a change in predicted processing time required to achieve the target profile in at least one zone;
Adjusting the electrochemical treatment to compensate for the determined change;
With a method.