JP2009518629A5 - - Google Patents

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Publication number
JP2009518629A5
JP2009518629A5 JP2008543585A JP2008543585A JP2009518629A5 JP 2009518629 A5 JP2009518629 A5 JP 2009518629A5 JP 2008543585 A JP2008543585 A JP 2008543585A JP 2008543585 A JP2008543585 A JP 2008543585A JP 2009518629 A5 JP2009518629 A5 JP 2009518629A5
Authority
JP
Japan
Prior art keywords
flow meter
proportional valve
valve
drawer
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008543585A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009518629A (ja
Filing date
Publication date
Priority claimed from US11/292,839 external-priority patent/US7297047B2/en
Application filed filed Critical
Publication of JP2009518629A publication Critical patent/JP2009518629A/ja
Publication of JP2009518629A5 publication Critical patent/JP2009518629A5/ja
Pending legal-status Critical Current

Links

JP2008543585A 2005-12-01 2006-12-01 超音波流量計を備えた気泡抑制流量コントローラ Pending JP2009518629A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/292,839 US7297047B2 (en) 2005-12-01 2005-12-01 Bubble suppressing flow controller with ultrasonic flow meter
PCT/US2006/061443 WO2008036108A2 (en) 2005-12-01 2006-12-01 Bubble suppressing flow controller with ultrasonic flow meter

Publications (2)

Publication Number Publication Date
JP2009518629A JP2009518629A (ja) 2009-05-07
JP2009518629A5 true JP2009518629A5 (enExample) 2009-10-15

Family

ID=38119412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008543585A Pending JP2009518629A (ja) 2005-12-01 2006-12-01 超音波流量計を備えた気泡抑制流量コントローラ

Country Status (3)

Country Link
US (1) US7297047B2 (enExample)
JP (1) JP2009518629A (enExample)
WO (1) WO2008036108A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
DE102006056623A1 (de) * 2006-11-30 2008-06-05 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern des chemisch-mechanischen Polierens durch steuerbares Bewegen eines Schleifmittelauslasses
US8893519B2 (en) * 2008-12-08 2014-11-25 The Hong Kong University Of Science And Technology Providing cooling in a machining process using a plurality of activated coolant streams
JP5505713B2 (ja) * 2010-04-26 2014-05-28 株式会社Ｓｕｍｃｏ 研磨液分配装置及びこれを備えた研磨装置
TWI549779B (zh) * 2014-01-02 2016-09-21 A slurry transfer device for chemical mechanical grinding
CN106695491B (zh) * 2015-11-16 2019-02-19 浙江莱宝科技有限公司 一种基板处理装置及其处理方法
CN109159009B (zh) * 2018-09-07 2019-12-20 江西思派思香料化工有限公司 一种便于更换抛光盘的抛光机
CN111230700B (zh) * 2020-02-12 2021-10-01 浙江云达流体智控股份有限公司 一种阀门加工用抛光装置
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

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JPS57147063A (en) * 1981-03-06 1982-09-10 Hitachi Ltd Ultrasonic doppler flow meter
US4391149A (en) * 1981-05-15 1983-07-05 Fischer & Porter Company Doppler-type ultrasonic flowmeter
US5433650A (en) * 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
JP3734289B2 (ja) * 1995-01-24 2006-01-11 株式会社荏原製作所 ポリッシング装置
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
JP4051116B2 (ja) * 1997-12-25 2008-02-20 不二越機械工業株式会社 ウェーハの研磨装置
US5897426A (en) * 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
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US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6315635B1 (en) * 1999-03-31 2001-11-13 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for slurry temperature control in a polishing process
JP2000317811A (ja) * 1999-05-11 2000-11-21 Toshiba Corp スラリ供給装置とスラリ供給方法、及びポリッシング装置とポリッシング方法
US6418960B1 (en) * 1999-10-06 2002-07-16 Applied Materials, Inc. Ultrasonic enhancement for solvent purge of a liquid delivery system
US6604849B2 (en) * 1999-12-03 2003-08-12 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6629881B1 (en) * 2000-02-17 2003-10-07 Applied Materials, Inc. Method and apparatus for controlling slurry delivery during polishing
US6517414B1 (en) * 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6398627B1 (en) * 2001-03-22 2002-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dispenser having multiple adjustable nozzles
US20030027505A1 (en) * 2001-08-02 2003-02-06 Applied Materials, Inc. Multiport polishing fluid delivery system
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
EP1284369A1 (de) * 2001-08-16 2003-02-19 Levitronix LLC Verfahren und Pumpvorrichtung zum Erzeugen eines einstellbaren, im wesentlichen konstanten Volumenstroms
US6516675B1 (en) * 2002-01-15 2003-02-11 Taiwan Semiconductor Manufacturing Co., Ltd Bubble ultrasonic flow meter
US20030176151A1 (en) * 2002-02-12 2003-09-18 Applied Materials, Inc. STI polish enhancement using fixed abrasives with amino acid additives
US6926584B2 (en) * 2002-10-09 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Dual mode hybrid control and method for CMP slurry
US7063597B2 (en) * 2002-10-25 2006-06-20 Applied Materials Polishing processes for shallow trench isolation substrates
JP2007222949A (ja) * 2004-03-24 2007-09-06 Nikon Corp 液体供給装置、研磨装置及び半導体デバイス製造方法
US20060025049A1 (en) * 2004-07-30 2006-02-02 Applied Materials, Inc. Spray slurry delivery system for polish performance improvement and cost reduction

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