JP2009518629A - 超音波流量計を備えた気泡抑制流量コントローラ - Google Patents

超音波流量計を備えた気泡抑制流量コントローラ Download PDF

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Publication number
JP2009518629A
JP2009518629A JP2008543585A JP2008543585A JP2009518629A JP 2009518629 A JP2009518629 A JP 2009518629A JP 2008543585 A JP2008543585 A JP 2008543585A JP 2008543585 A JP2008543585 A JP 2008543585A JP 2009518629 A JP2009518629 A JP 2009518629A
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Japan
Prior art keywords
polishing
flow meter
fluid
slurry
substrate
Prior art date
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JP2008543585A
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English (en)
Japanese (ja)
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JP2009518629A5 (enExample
Inventor
ソンジャイ リー，
ホ セオン シン，
ドナルド ジェイ． ケー． オルガド，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2009518629A publication Critical patent/JP2009518629A/ja
Publication of JP2009518629A5 publication Critical patent/JP2009518629A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Measuring Volume Flow (AREA)
  • Flow Control (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
JP2008543585A 2005-12-01 2006-12-01 超音波流量計を備えた気泡抑制流量コントローラ Pending JP2009518629A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/292,839 US7297047B2 (en) 2005-12-01 2005-12-01 Bubble suppressing flow controller with ultrasonic flow meter
PCT/US2006/061443 WO2008036108A2 (en) 2005-12-01 2006-12-01 Bubble suppressing flow controller with ultrasonic flow meter

Publications (2)

Publication Number Publication Date
JP2009518629A true JP2009518629A (ja) 2009-05-07
JP2009518629A5 JP2009518629A5 (enExample) 2009-10-15

Family

ID=38119412

Family Applications (1)

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JP2008543585A Pending JP2009518629A (ja) 2005-12-01 2006-12-01 超音波流量計を備えた気泡抑制流量コントローラ

Country Status (3)

Country Link
US (1) US7297047B2 (enExample)
JP (1) JP2009518629A (enExample)
WO (1) WO2008036108A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106695491A (zh) * 2015-11-16 2017-05-24 浙江金徕镀膜有限公司 一种基板处理装置及其处理方法

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* Cited by examiner, † Cited by third party
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JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
DE102006056623A1 (de) * 2006-11-30 2008-06-05 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern des chemisch-mechanischen Polierens durch steuerbares Bewegen eines Schleifmittelauslasses
US8893519B2 (en) * 2008-12-08 2014-11-25 The Hong Kong University Of Science And Technology Providing cooling in a machining process using a plurality of activated coolant streams
JP5505713B2 (ja) * 2010-04-26 2014-05-28 株式会社Ｓｕｍｃｏ 研磨液分配装置及びこれを備えた研磨装置
TWI549779B (zh) * 2014-01-02 2016-09-21 A slurry transfer device for chemical mechanical grinding
CN109159009B (zh) * 2018-09-07 2019-12-20 江西思派思香料化工有限公司 一种便于更换抛光盘的抛光机
CN111230700B (zh) * 2020-02-12 2021-10-01 浙江云达流体智控股份有限公司 一种阀门加工用抛光装置
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

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JPS54102688A (en) * 1978-01-31 1979-08-13 Hitachi Zosen Corp Compound electrolytic and buff grinder
JPH11188612A (ja) * 1997-12-25 1999-07-13 Fujikoshi Mach Corp ウェーハの研磨方法及び研磨装置
JP2000317811A (ja) * 1999-05-11 2000-11-21 Toshiba Corp スラリ供給装置とスラリ供給方法、及びポリッシング装置とポリッシング方法
JP2007222949A (ja) * 2004-03-24 2007-09-06 Nikon Corp 液体供給装置、研磨装置及び半導体デバイス製造方法

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JPS57147063A (en) * 1981-03-06 1982-09-10 Hitachi Ltd Ultrasonic doppler flow meter
US4391149A (en) * 1981-05-15 1983-07-05 Fischer & Porter Company Doppler-type ultrasonic flowmeter
US5433650A (en) * 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
JP3734289B2 (ja) * 1995-01-24 2006-01-11 株式会社荏原製作所 ポリッシング装置
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US5897426A (en) * 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
EP1068928A3 (en) * 1999-02-11 2003-08-13 Applied Materials, Inc. Chemical mechanical polishing processes and components
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6315635B1 (en) * 1999-03-31 2001-11-13 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for slurry temperature control in a polishing process
US6418960B1 (en) * 1999-10-06 2002-07-16 Applied Materials, Inc. Ultrasonic enhancement for solvent purge of a liquid delivery system
US6604849B2 (en) * 1999-12-03 2003-08-12 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6629881B1 (en) * 2000-02-17 2003-10-07 Applied Materials, Inc. Method and apparatus for controlling slurry delivery during polishing
US6517414B1 (en) * 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6398627B1 (en) * 2001-03-22 2002-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dispenser having multiple adjustable nozzles
US20030027505A1 (en) * 2001-08-02 2003-02-06 Applied Materials, Inc. Multiport polishing fluid delivery system
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
EP1284369A1 (de) * 2001-08-16 2003-02-19 Levitronix LLC Verfahren und Pumpvorrichtung zum Erzeugen eines einstellbaren, im wesentlichen konstanten Volumenstroms
US6516675B1 (en) * 2002-01-15 2003-02-11 Taiwan Semiconductor Manufacturing Co., Ltd Bubble ultrasonic flow meter
US20030176151A1 (en) * 2002-02-12 2003-09-18 Applied Materials, Inc. STI polish enhancement using fixed abrasives with amino acid additives
US6926584B2 (en) * 2002-10-09 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Dual mode hybrid control and method for CMP slurry
US7063597B2 (en) * 2002-10-25 2006-06-20 Applied Materials Polishing processes for shallow trench isolation substrates
US20060025049A1 (en) * 2004-07-30 2006-02-02 Applied Materials, Inc. Spray slurry delivery system for polish performance improvement and cost reduction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102688A (en) * 1978-01-31 1979-08-13 Hitachi Zosen Corp Compound electrolytic and buff grinder
JPH11188612A (ja) * 1997-12-25 1999-07-13 Fujikoshi Mach Corp ウェーハの研磨方法及び研磨装置
JP2000317811A (ja) * 1999-05-11 2000-11-21 Toshiba Corp スラリ供給装置とスラリ供給方法、及びポリッシング装置とポリッシング方法
JP2007222949A (ja) * 2004-03-24 2007-09-06 Nikon Corp 液体供給装置、研磨装置及び半導体デバイス製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106695491A (zh) * 2015-11-16 2017-05-24 浙江金徕镀膜有限公司 一种基板处理装置及其处理方法

Also Published As

Publication number Publication date
US7297047B2 (en) 2007-11-20
US20070128982A1 (en) 2007-06-07
WO2008036108A2 (en) 2008-03-27
WO2008036108A3 (en) 2008-05-08

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