JP2009503851A - 応力mosデバイスの製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 37
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- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 32
- 229910052710 silicon Inorganic materials 0.000 claims description 32
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- 239000012535 impurity Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
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- 239000013078 crystal Substances 0.000 abstract description 7
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- 239000010408 film Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
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- 238000005468 ion implantation Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
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- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
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Abstract
Description
以下の詳細な説明は、本来例示的なものに過ぎず、本発明または本発明の用途および利用を限定することを意図したものではな。更に、上記の技術分野、背景技術、発明の開示、あるいは以下の詳細な説明に明示または暗示した理論により拘束されることを意図するものではない。
また、このような応力は、応力誘起材料の厚みと同じ大きさのオーダーの距離しかチャネル内に広がらない。結果的に、高い横方向の応力はチャネルのごく一部だけに誘起され、デバイスのパフォーマンスには殆ど影響を及ぼさない。本発明の実施形態によれば、このような問題は、チャネル幅の広いMOSトランジスタを、並列に結合された複数の幅の狭いチャネルMOSトランジスタに置き換えることで克服することができる。チャネルの端部に埋め込まれた応力誘起材料を有する狭いチャネルトランジスタは、チャネル領域全体にわたって圧縮した縦方向の応力と横方向の引張り応力の両方を受ける。圧縮した縦方向の応力はチャネル中の正孔移動度を増加させ、電子移動度を低下させる。一方で、横方向の引張応力は、チャネル中の正孔移動度と電子移動度の両方を増加させる。
例えば、SiGeの場合、SiGeの格子定数はシリコンよりも大きく、また、トランジスタチャネルに圧縮した縦方向の応力を有する。圧縮した縦方向の応力は、それだけでチャネル中の正孔移動度を増加させ、これによりPチャネルMOSトランジスタのパフォーマンスを向上させる。しかし、圧縮した縦方向の応力は、NチャネルMOSトランジスタのチャネル中の電子移動度を低下させる。本発明の実施形態に従ってPチャネルMOSトランジスタ32およびNチャネルトランジスタ34の両方のチャネル幅を縮小することで、トランジスタのチャネルに横方向の引張応力が加えられ、また、このような応力は正孔および電子双方の移動度を増加させる。PチャネルMOSトランジスタに対しては、圧縮した縦方向の応力によって正孔移動度が増加することに加えて、横方向の引張応力によって多数キャリア正孔の移動度が増加する。NチャネルMOSトランジスタに対しては、横方向の引張応力がもたらす電子移動度の増加により、圧縮した縦方向の応力が引き起こす電子移動度の低下をオフセットするように支援する。埋め込まれた応力誘起材料によって生じる引張応力によって電子移動度が増加するので、同様のプロセスをPチャネルトランジスタとNチャネルトランジスタの両方に適用することができる。両トランジスタに同様のプロセスを適用するので、Nチャネルトランジスタはエッチングおよび選択成長ステップにおいてマスクされずに済み、その結果、全体のプロセスがより簡単で信頼できるものとなり、これにより低価格になる。
Claims (10)
- 応力がかけられたMOSデバイス(30)をシリコン基板(36)に製造する方法であって、
前記シリコン基板(36)上にゲート絶縁層(60)を形成するステップと、
前記ゲート絶縁層(60)上にゲート電極材料62を堆積し、対向側面(72)を有するゲート電極を形成するために、前記ゲート電極(66)の層をパターニングするステップと、
互いに離間されて前記ゲート電極の前記対向側面に対して自己整合される前記シリコン基板の第1トレンチ(82)と、第2トレンチ(84)と、をエッチングするステップと、
前記第1トレンチ(82)および前記第2トレンチ(84)に応力誘起材料(90)の層を選択的に成長させるステップと、
ソース領域(92)を形成するために前記第1トレンチ(82)の前記応力誘起材料(90)に導電性を決定する不純物をイオン注入し、ドレイン領域(94)を形成するために前記第2トレンチ(84)の前記応力誘起材料(90)に導電性を決定する不純物をイオン注入するステップと、
前記ゲート電極(66)の下方の前記ソース領域(92)と前記ドレイン領域(94)との間に延びる前記シリコン基板に複数の並列チャネル領域(50)を画定するステップと、を含む方法。 - 前記選択的に成長させるステップは、格子定数がシリコンの格子定数よりも大きい半導体材料を含む層をエピタキシャル成長させるステップを含む、請求項1記載の方法。
- 前記複数の並列チャネル領域(50)を形成するステップは、前記ソース領域(92)から前記ドレイン領域(94)にまで延びる複数の互いに離間したシャロートレンチアイソレーション領域(52)を形成するステップを含む、請求項1記載の方法。
- 応力がかけられたMOSデバイス(30)をシリコン基板(36)に形成する方法であって、
前記第1領域(44)と第2領域(46)を画定するために前記シリコン基板に絶縁構造(42)を形成するステップと、
複数のPチャネル(50)を画定するために、前記第1領域(44)の前記シリコン基板に第1の複数の並列の絶縁構造(52)を形成するステップと、
複数のNチャネル(54)を画定するために、前記第4領域(46)の前記シリコン基板に第2の複数の並列の絶縁構造56を形成するステップと、
前記複数のPチャネル上に第1に対向面(72)を有する第1ゲート電極(66)を形成し、前記第2の複数のNチャネル上に第2の対向面(96)を有する第2ゲート電極(68)を形成するステップと、
前記複数のPチャネル(50)を横断する第1トレンチ(82)および第2トレンチ(84)を、前記第1ゲート電極(66)の前記第1の対向面(72)から離間した前記シリコン基板にエッチングするステップと、
前記複数のNチャネル(54)を横断する第3トレンチ(86)および第4トレンチ(88)を、前記ゲート電極(68)の前記対向面(76)から離間したシリコン表面にエッチングするステップと、
前記第1トレンチ(82)と第2トレンチ(84)および前記第3トレンチ(86)と第4トレンチ(88)に応力誘起材料(90)を選択的に成長させるステップと、
P型の導電性を決定する不純物イオンを、P型のソース領域(92)を形成するために前記第1トレンチ(82)の前記応力誘起材料(90)にイオン注入するとともに、P型のドレイン領域(94)を形成するために前記第2トレンチ(84)の前記応力誘起材料(90)にイオン注入するステップと、
N型の導電性を決定する不純物イオンを、N型のソース領域(96)を形成するために前記第3トレンチ(86)の前記応力誘起材料(90)にイオン注入するとともに、N型のドレイン領域(98)を形成するために前記第4トレンチ(88)の前記応力誘起材料にイオン注入するステップと、を含む方法。 - 前記選択的に応力誘起材料90を成長させるステップは、SiGe層をエピタキシャル成長させるステップを含む、請求項4記載の方法。
- 応力がかけられたMOSデバイス(30)を半導体基板に製造する方法であって、
前記半導体基板に、共通のソース領域(92)、共通のドレイン領域(94)および共通のゲート電極(66)を有する複数の並列MOSトランジスタを形成するステップと、
第1トレンチ(82)を前記半導体基板の前記共通のソース領域(92)に、かつ、第2トレンチ(84)を前記共通のドレイン領域(94)にエッチングするステップと、
前記第1トレンチおよび前記第2トレンチに、前記半導体基板と格子が一致しない応力誘起半導体材料(90)を選択的に成長させるステップと、を含む方法。 - 複数の並列MOSトランジスタを形成する前記ステップは、各々が所定の幅のチャネルを有する複数の並列のMOSトランジスタを形成するステップを含む、請求項6記載の方法。
- 前記選択的に成長させるステップは、前記所定の幅と同じ大きさのオーダーの厚みを有する半導体材料(90)の層を選択的に成長させるステップを含む、請求項7記載の方法。
- 前記選択的に成長させるステップは、SiGeから構成される層を選択的に成長させるステップを含む、請求項6記載の方法。
- 前記複数の並列のMOSトランジスタを形成するステップは、
アクティブエリア(44)を画定するためにシャロートレンチアイソレーション構造(42)を形成するステップと、
共通のソース領域(82)、共通のドレイン領域(84)および複数の並列のチャネル領域(50)に前記アクティブエリア(44)を分割するステップと、を含む請求項6記載の方法。
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US11/191,684 US20070026599A1 (en) | 2005-07-27 | 2005-07-27 | Methods for fabricating a stressed MOS device |
PCT/US2006/028171 WO2007015930A1 (en) | 2005-07-27 | 2006-07-20 | Methods for fabricating a stressed mos device |
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JP (1) | JP2009503851A (ja) |
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DE112006001979T5 (de) | 2008-05-21 |
WO2007015930A1 (en) | 2007-02-08 |
GB0802777D0 (en) | 2008-03-26 |
CN101233605A (zh) | 2008-07-30 |
GB2442689A (en) | 2008-04-09 |
US20070026599A1 (en) | 2007-02-01 |
TW200741976A (en) | 2007-11-01 |
GB2442689B (en) | 2011-04-13 |
KR20080035659A (ko) | 2008-04-23 |
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KR101243996B1 (ko) | 2013-03-18 |
CN101233605B (zh) | 2013-04-24 |
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