JP2009503593A - 線焦点を作成する光学システム、この光学システムを用いる走査システム、および基板のレーザ加工方法 - Google Patents

線焦点を作成する光学システム、この光学システムを用いる走査システム、および基板のレーザ加工方法 Download PDF

Info

Publication number
JP2009503593A
JP2009503593A JP2008524395A JP2008524395A JP2009503593A JP 2009503593 A JP2009503593 A JP 2009503593A JP 2008524395 A JP2008524395 A JP 2008524395A JP 2008524395 A JP2008524395 A JP 2008524395A JP 2009503593 A JP2009503593 A JP 2009503593A
Authority
JP
Japan
Prior art keywords
optical element
dimension
light beam
input light
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008524395A
Other languages
English (en)
Japanese (ja)
Inventor
ヘルコマー，アロイス
ミュンツ，ホルガー
キーレイ，ホルガー
マイレ，ミヒェル レ
ヴァイクル，ベルンハルト
Original Assignee
カール ツァイス レーザー オプティクス ゲーエムベーハー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by カール ツァイス レーザー オプティクス ゲーエムベーハー filed Critical カール ツァイス レーザー オプティクス ゲーエムベーハー
Publication of JP2009503593A publication Critical patent/JP2009503593A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0933—Systems for active beam shaping by rapid movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Lenses (AREA)
JP2008524395A 2005-08-02 2006-07-22 線焦点を作成する光学システム、この光学システムを用いる走査システム、および基板のレーザ加工方法 Pending JP2009503593A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70476905P 2005-08-02 2005-08-02
PCT/EP2006/007233 WO2007014662A1 (en) 2005-08-02 2006-07-22 Optical system for creating a line focus scanning system using such optical system and method for laser processing of a substrate

Publications (1)

Publication Number Publication Date
JP2009503593A true JP2009503593A (ja) 2009-01-29

Family

ID=37020171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008524395A Pending JP2009503593A (ja) 2005-08-02 2006-07-22 線焦点を作成する光学システム、この光学システムを用いる走査システム、および基板のレーザ加工方法

Country Status (3)

Country Link
JP (1) JP2009503593A (ko)
KR (1) KR20080039449A (ko)
WO (1) WO2007014662A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016541A (ja) * 2007-07-04 2009-01-22 Semiconductor Energy Lab Co Ltd レーザアニール装置及びレーザアニール方法
JP2022539890A (ja) * 2019-07-08 2022-09-13 フラウンホーファー－ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マルチチャネル光学機械アドレス指定部

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101762879B (zh) * 2010-01-25 2012-03-14 深圳市大族激光科技股份有限公司 一种激光扩束系统
CN101788716B (zh) * 2010-02-24 2011-09-28 深圳市大族激光科技股份有限公司 一种激光扩束系统
DE102010027196B4 (de) 2010-07-07 2012-03-08 Carl Zeiss Laser Optics Gmbh Optisches System zum Erzeugen eines Linienfokus sowie Vorrichtung zum Behandeln eines Substrats mit einem solchen optischen System
CN102928982B (zh) * 2011-08-10 2017-04-05 上海雄博精密仪器股份有限公司 一种大口径平行光扩束装置及方法
KR102459817B1 (ko) 2015-10-01 2022-10-27 삼성디스플레이 주식회사 레이저 결정화 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824127C2 (de) * 1988-07-15 1994-09-29 Fraunhofer Ges Forschung Vorrichtung zur Wärmebehandlung der Oberfläche eines Substrates, insbesondere zum Kristallisieren von polykristallinem oder amorphem Substratmaterial
US5237149A (en) * 1992-03-26 1993-08-17 John Macken Laser machining utilizing a spacial filter
US5818645A (en) * 1996-07-16 1998-10-06 Management Graphics, Inc. Multimode optical source and image scanning apparatus using the same
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
EP0995144A1 (en) * 1997-07-08 2000-04-26 Etec Systems, Inc. Anamorphic scan lens for laser scanner
US6396616B1 (en) * 2000-10-10 2002-05-28 3M Innovative Properties Company Direct laser imaging system
WO2006066687A1 (en) * 2004-12-22 2006-06-29 Carl Zeiss Laser Optics Gmbh Optical system for creating a line focus, a scanning system for producing a scanning beam focus and a method for laser processing of a substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016541A (ja) * 2007-07-04 2009-01-22 Semiconductor Energy Lab Co Ltd レーザアニール装置及びレーザアニール方法
JP2022539890A (ja) * 2019-07-08 2022-09-13 フラウンホーファー－ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マルチチャネル光学機械アドレス指定部
JP7418138B2 (ja) 2019-07-08 2024-01-19 フラウンホーファー－ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マルチチャネル光学機械アドレス指定部

Also Published As

Publication number Publication date
KR20080039449A (ko) 2008-05-07
WO2007014662A1 (en) 2007-02-08

Similar Documents

Publication Publication Date Title
US6700709B1 (en) Configuration of and method for optical beam shaping of diode laser bars
US9927622B2 (en) Multiple beam combiner for laser processing apparatus
US20080297912A1 (en) Vario-astigmatic beam expander
JP2009503593A (ja) 線焦点を作成する光学システム、この光学システムを用いる走査システム、および基板のレーザ加工方法
WO2017187609A1 (ja) 平行光発生装置
US20210402515A1 (en) Laser machining system
KR102178770B1 (ko) 경사면들에서의 스팟 어레이의 발생
US20110280017A1 (en) Optical system for shaping a laser beam, and laser system having such an optical system
JP6093388B2 (ja) 合波装置、合波装置の製造方法、及び、ｌｄモジュール
TWI743493B (zh) 光學組件和雷射系統
WO2006066687A1 (en) Optical system for creating a line focus, a scanning system for producing a scanning beam focus and a method for laser processing of a substrate
US20090323176A1 (en) Single wavelength ultraviolet laser device
JP3955587B2 (ja) レーザ照射装置
US11105961B2 (en) Apparatus for generating a line-shaped intensity distribution of a laser radiation
JP4818958B2 (ja) ビーム照射装置、及び、ビーム照射方法
JP6949289B1 (ja) レーザ装置
JP7453328B2 (ja) レーザ放射用の変換装置
TWI834736B (zh) 雷射加工系統
KR102666258B1 (ko) 레이저 머시닝 시스템
JP6693680B2 (ja) 平行光発生装置
US20230208095A1 (en) Lighting optical system
CN115407612A (zh) 照明系统及光刻机
CN112513706A (zh) 用于激光辐射的转变设备
JP2002050823A (ja) 半導体レーザ素子および半導体レーザ装置
JP2008016712A (ja) レーザ光学系およびレーザアニール装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090717

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110920

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111108

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120208

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120215

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120703