JP2009298963A - Conductive adhesive agent and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive adhesive agent which has suppressed gelling or thickening during manufacture or before usage and has an excellent conductivity even when an agent for eliminating an oxide film is included in the conductive adhesive agent containing a phenol resin and an epoxy resin, liquid at room temperature, and also to provide an electronic component using the same. <P>SOLUTION: The conductive adhesive agent includes an epoxy resin which is liquid at room temperature, a phenol resin which is liquid at room temperature, a reactive diluent, an imidazol compound, a silver powder and/or a silver coated adhesive agent and a diacid. The diacid is at least one selected from a diacid having a side chain composed of an alkyl group and a diacid having an alicyclic structure and contained in the conductive adhesive agent in an amount of 0.01-3 mass%. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a conductive adhesive and an electronic component using the same.

Conventionally, a conductive adhesive is often used when an electronic element chip such as a capacitor element is bonded to an external electrode.
As such a conductive adhesive, a conductive adhesive containing an epoxy resin, a phenol resin, an imidazole compound, and conductive metal particles has been proposed (for example, Patent Document 1).
Also known is a technique for improving the conductivity by removing an oxide film removing agent such as organic carboxylic acid in the conductive adhesive to remove the surface oxide film of the conductive metal particles (for example, Patent Document 2).
JP 2000-192000 A Japanese Patent Laid-Open No. 8-30212

However, in the conventional conductive adhesive containing a phenol resin, as described in Patent Document 1, it is necessary to mix each component under heating of, for example, about 50 ° C. during the production of the conductive adhesive. , It took time to manufacture. In addition, in order to dissolve the phenol resin, it was necessary to use a large amount of reactive diluent, but the conductive adhesive containing a large amount of reactive diluent has insufficient adhesive strength of the cured product. There was a problem of becoming.
Accordingly, the present inventors have improved the labor during production and the adhesive strength of the cured product by selecting liquid epoxy resins and phenolic resins at room temperature, and further oxidized such conductive adhesives. We are investigating a technique to achieve higher conductivity by blending a film remover.

  However, a conductive adhesive using a liquid epoxy resin and a phenol resin at room temperature has a very high reactivity, and when a known oxide film remover such as an organic carboxylic acid is blended with this, a conductive adhesive is used. The oxide film remover reacts with the epoxy resin during the manufacture and before use, and further acts as an accelerator for the reaction between the epoxy resin and the phenol resin, causing gelation or thickening. There was a problem.

  The present invention has been made in view of the above circumstances, and even when an oxide film remover is blended with a conductive adhesive containing a liquid epoxy resin and a phenol resin at room temperature, the gel before production or use It is an object of the present invention to provide a conductive adhesive that can be prevented from being thickened and thickened and has good conductivity, and an electronic component using the same.

  As a result of intensive studies, the present inventors have determined that a specific amount of at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure is used as an oxide film removing agent. Even in the case of a conductive adhesive containing an epoxy resin and a phenol resin, it has been found that gelation and thickening before production and before use are suppressed, and the conductivity is improved, and the present invention has been completed.

That is, the conductive adhesive of the present invention includes an epoxy resin that is liquid at room temperature, a phenol resin that is liquid at room temperature, a reactive diluent, an imidazole compound, silver powder and / or silver-coated metal powder, and a dibasic acid. The dibasic acid is at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure.
The dibasic acid having a side chain composed of the alkyl group is preferably glutaric acid having 1 to 4 carbon atoms in the alkyl group.
The dibasic acid having the alicyclic structure is preferably cyclohexanedicarboxylic acid.
The electronic component of the present invention is manufactured using the conductive adhesive.
In the present invention, “room temperature” means a range of 10 to 40 ° C.

  According to the present invention, even when an oxide film remover is added to a conductive adhesive containing an epoxy resin and a phenol resin that are liquid at room temperature, gelation and thickening before production and use are suppressed. Further, it is possible to provide a conductive adhesive having good conductivity and an electronic component using the same.

Hereinafter, the present invention will be described in detail.
The conductive adhesive of the present invention contains an epoxy resin, a phenol resin, a reactive diluent, an imidazole compound, and silver powder and / or silver-coated metal powder acting as conductive metal particles, and further an oxide film The removing agent contains at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure.

The epoxy resin used in the present invention is contained in the conductive adhesive as a binder and is liquid at room temperature.
Such epoxy resins include bisphenol F-type epoxy resins, bisphenol A-type epoxy resins, urethane-modified epoxy resins, rubber-modified epoxy resins, naphthalene-based, phenol novolac-based epoxy resins, dimer acid-modified epoxy resins, phthalic acid Examples include ester type epoxy resins. Of these, bisphenol F type epoxy resins and phthalate ester type epoxy resins are preferred. These epoxy resins may be used alone or in combination of two or more.
The content of the epoxy resin is preferably 2 to 10% by mass and more preferably 3 to 8% by mass in 100% by mass of the conductive adhesive. When the lower limit value of the content of the epoxy resin is smaller than the above value, the adhesive strength becomes weak and it becomes difficult to function as an adhesive. On the other hand, when the upper limit value of the content is larger than the above value, the connection of silver powder and / or silver-coated metal powder becomes poor, and it becomes difficult to obtain conductivity.

The phenol resin used in the present invention is contained in a conductive adhesive as a curing agent and is liquid at room temperature. Since the phenol resin that is liquid at room temperature readily dissolves in other components, it is not necessary to use a large amount of the reactive diluent described later, and the content of the reactive diluent can be reduced. As a result, the adhesive strength of the cured product obtained by curing the conductive adhesive can be improved.
Moreover, a conductive adhesive can be made into a solventless type adhesive by using a liquid phenol resin at room temperature.

Examples of such a phenol resin include a liquid novolac type phenol resin.
The content of the phenol resin is preferably 2 to 10% by mass and more preferably 3 to 8% by mass in 100% by mass of the conductive adhesive. When the lower limit of the phenol resin content is smaller than the above value, the adhesive strength of the conductive adhesive cannot be sufficiently increased. On the other hand, when the upper limit value of the content is larger than the above value, the resistance under high temperature and high humidity or heat cycle increases.

    Moreover, it is preferable that 50-250 mass parts is contained with respect to 100 mass parts of said epoxy resins, and, more preferably, a phenol resin is 80-150 mass parts. If the content of the phenol resin with respect to the epoxy resin is within the above range, the balance between the content of the epoxy resin (main agent) and the phenol resin (curing agent) becomes better, the conductive adhesive is easily cured, and the adhesive strength It will be easier to improve.

In the present invention, the phenol resin that is liquid at room temperature may contain one or more phenol resins that are solid at room temperature within a range that does not impair the properties of the phenol resin.
Examples of the phenol resin solid at room temperature include cresol novolac resin, dicyclopentadiene phenol resin, terpene phenol resin, triphenolmethane resin, and phenol aralkyl resin.
The content of the phenol resin that is solid at room temperature is preferably 0 to 20 parts by mass with respect to 100 parts by mass of the phenol resin that is liquid at room temperature.

    Reactive diluents include glycidyl orthotoluidine, ethylene glycol diglycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl methacrylate, cyclohexanedimethanol diglycidyl ether, trimethylolpropane triglycidyl ether, neopentyl glycol diglycidyl ether, phenyl glycidyl ether Polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, and the like. Of these, glycidyl orthotoluidine is preferable. These reactive diluents may be used alone or in combination of two or more.

    The content of the reactive diluent is preferably 2 to 10% by mass and more preferably 3 to 8% by mass in 100% by mass of the conductive adhesive. When the lower limit value of the content of the reactive diluent is smaller than the above value, the viscosity of the conductive adhesive becomes too high, and the dispersibility of silver powder and / or silver-coated metal powder described later is lowered. As a result, the conductive adhesive is difficult to apply, and workability is reduced. On the other hand, when the upper limit value of the content is larger than the above value, the cured product of the conductive adhesive becomes brittle and the adhesive strength decreases.

The imidazole compound is contained in the conductive adhesive as a curing accelerator.
When the imidazole compound is contained, the curability of the conductive adhesive becomes good, and as a result, the heat resistance of the cured product is improved.
Examples of such imidazole compounds include 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 4,4′-methylenebis (2-ethyl-5-methylimidazole). And imidazole-based epoxy curing accelerators such as 2-heptadecylimidazole. These imidazole compounds may be used alone or in combination of two or more.

    The content of the imidazole compound is preferably 0.05 to 0.9 mass%, more preferably 0.1 to 0.5 mass%, and 0.2 to 0.4 mass% in 100 mass% of the conductive adhesive. % Is more preferable. When the lower limit of the content of the imidazole compound is smaller than the above value, curability is lowered. On the other hand, when the upper limit value of the content is larger than the above value, when the conductive adhesive is temporarily cured, the setting range of the temporary curing conditions (such as the temporary curing time and the temporary curing temperature) is narrowed, and the workability is lowered.

As the conductive metal particles, at least one of silver powder and silver-coated metal powder is used. Examples of the silver-coated metal powder that can be used include copper powder, silver-plated copper powder obtained by applying silver plating to nickel powder, and silver-plated nickel powder.
The shape of the silver powder and / or silver-coated metal powder may be substantially spherical or flaky, but is preferably flaky. Although there is no restriction | limiting in particular in a particle diameter, 1-20 micrometers is preferable from a conductive point, and 3-10 micrometers is more preferable. Moreover, the tap density of silver powder and / or silver-coated metal powder is preferably 4.2~6.0g / cm ^3, more preferably 4.5~5.8g / cm ^3. When the lower limit value of the tap density is smaller than the above value, the viscosity of the obtained conductive adhesive is increased, and workability is lowered. On the other hand, when the upper limit of the tap density is larger than the above value, the production of silver powder and / or silver-coated metal powder tends to be difficult.
The content of the silver powder and / or the silver-coated metal powder is preferably 70 to 92% by mass and more preferably 75 to 90% by mass in 100% by mass of the conductive adhesive. When the lower limit of the content of silver powder and / or silver-coated metal powder is smaller than the above value, the connection of silver powder and / or silver-coated metal powder becomes poor, and it becomes difficult to obtain conductivity. On the other hand, when the upper limit of the content is larger than the above value, the adhesive strength is weakened and the cost is increased more than necessary.
In addition to silver powder and / or silver coat metal powder, other particles such as nickel powder and copper powder may be used as the conductive metal particles as long as the characteristics are not impaired.

    The mass ratio (solid content ratio) of the silver powder and / or silver-coated metal powder and the resin component (that is, the total of the epoxy resin and the phenol resin) is as follows: silver powder and / or silver-coated metal powder: resin component = 80 : 20 to 96: 4 is preferable, and 85:15 to 93: 7 is more preferable. If the mass ratio of the silver powder and the resin component is within the above range, the cured product is excellent in both conductivity and adhesive strength.

In the present invention, at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure is used as the oxide film removing agent. These dibasic acids may be used individually by 1 type, or may use 2 or more types together.
In the conductive adhesive containing such a dibasic acid, high conductivity is exhibited and the adhesive strength is kept high without causing gelation or thickening during the production or use of the conductive adhesive. be able to.
The reason why gelation or thickening does not occur during the production or use of the conductive adhesive is considered to be due to steric hindrance of the alkyl group or alicyclic structure of these dibasic acids. That is, at the time when these dibasic acids are blended in the conductive adhesive, the dibasic acid reacts with the epoxy resin due to steric hindrance, or acts as an accelerator for the reaction between the epoxy resin and the phenol resin. do not do. On the other hand, when conductive adhesives containing these dibasic acids are heated and cured at the time of use, the reactivity of the dibasic acid is increased by heating and acts as an oxide film removing agent. It is thought that the improvement effect is manifested.
Moreover, among these dibasic acids, when a dibasic acid having an alicyclic structure is used, there is a tendency that a higher conductivity improvement effect is obtained and the adhesive strength is also good.
In addition, when a dibasic acid having an aromatic ring is used, when a tribasic acid and a tetrabasic acid having an alicyclic structure are used, there is a tendency that an effect of improving conductivity is not obtained. The reason for this is not clear, but when these are used, the oxide film of the silver powder and / or the silver-coated metal powder is removed, but the conductive adhesive is prevented from curing and shrinking, so that the silver powder and / or the silver-coated metal is removed. This is probably because the contact between the powders becomes insufficient.
In order to obtain a certain level of conductivity, the conductivity of the conductive adhesive is improved by blending at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure. The amount of silver powder and / or silver-coated metal powder to be used can be kept low, and a conductive adhesive that is advantageous in terms of cost can be provided.

Examples of the dibasic acid having a side chain composed of an alkyl group include malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, etc. Glutaric acid having 1 to 4 carbon atoms is preferred. When the carbon number of the alkyl group in the side chain exceeds 4, the production of the dibasic acid tends to be difficult. More preferably, glutaric acid having 1 or 2 carbon atoms in the side chain alkyl group, such as 2,4-diethylglutaric acid, 2,2-dimethylglutaric acid, and 3,3-dimethylglutaric acid, is preferable.
Examples of the dibasic acid having an alicyclic structure include cyclohexane dicarboxylic acid, norbornane dicarboxylic acid, tricyclodecane dicarboxylic acid, and pentacyclododecane dicarboxylic acid. Among these, cyclohexane dicarboxylic acid is preferable.

  The content of at least one of the dibasic acid having a side chain composed of an alkyl group and the dibasic acid having an alicyclic structure is 0.01 to 3% by mass in 100% by mass of the conductive adhesive, and 0.02 -2 mass% is preferable. When the lower limit value of the content is smaller than the above value, it is difficult to obtain the conductivity improving effect by the oxide film removing agent. On the other hand, when the upper limit of the content is larger than the above value, the adhesive strength is weakened and the hardness of the cured product tends to be lowered.

The conductive adhesive of the present invention may appropriately contain an optional component such as a coupling agent as long as the effects of the present invention are not impaired.
In the present invention, a solvent-type adhesive may be prepared by containing a solvent. In this case, the solvent is not particularly limited as long as it is used for an adhesive, and known solvents can be used.
However, since the conductive adhesive of the present invention contains an epoxy resin that is liquid at room temperature as an epoxy resin and a phenol resin that is liquid at room temperature as a phenol resin, as described above, as a solvent-free adhesive that does not contain a solvent. Can be used. The conductive adhesive of the present invention may be a solventless type or a solvent type, but is preferably used as a solventless type adhesive.

When the conductive adhesive is a solventless type, an increase in the viscosity of the conductive adhesive due to the volatilization of the solvent can be suppressed as compared with the solvent type. For this reason, even when the conductive adhesive is applied on the electrode by screen printing or metal mask printing, it is possible to effectively prevent the printed surface from being blurred. Further, even in the case of a coating method using a dispenser, the needle tip can be prevented from drying, so that the discharge amount of the conductive adhesive can be kept constant.
However, since the application method using a dispenser is usually suitable for applying a conductive adhesive having a low viscosity, the conductive adhesive easily spreads on the electrode after application. On the other hand, screen printing and metal mask printing can be applied to a conductive adhesive having a high viscosity. Therefore, when a conductive adhesive is applied, it is preferably applied by screen printing or metal mask printing. Among these, screen printing is preferable.

The conductive adhesive of the present invention is a planetary mixer comprising the above-described epoxy resin, phenol resin, reactive diluent, imidazole compound, silver powder and / or silver-coated metal powder, and the above-mentioned dibasic acid. Or by mixing with a roll mill. Under the present circumstances, it is preferable to prepare so that the viscosity of the conductive adhesive obtained may be 80-800 dPa * s.
In such a conductive adhesive, a phenol resin that is liquid at room temperature is used, so it is not necessary to preheat the epoxy resin in advance, and it is not necessary to use a large amount of reactive diluent. . Therefore, simple manufacture and improvement in adhesive strength are possible.
Furthermore, as the oxide film removing agent, at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure is blended. Therefore, before the conductive adhesive is manufactured or used, it does not gel and thicken due to the reaction between the oxide film removing agent and the epoxy resin, and is 72 hours at 23 ° C. The viscosity after holding is also maintained at 80 to 800 dPa · s, and the coating property of the conductive adhesive is kept good. And when a conductive adhesive is heated and hardened, a dibasic acid acts as an oxide film removal agent by heating, and it can be set as the conductive adhesive excellent in electroconductivity.

The conductive adhesive of the present invention can be used for various applications, but is suitable for bonding an electronic element chip to an external electrode.
Since the electronic component of the present invention is manufactured by using the above-described conductive adhesive, the adhesive strength is high. Applications of electronic components include, for example, passive components such as capacitors, coils, and transformers, and semiconductor device components such as LSIs (Large Scale Integrated Circuits), diodes, and transistors.
Examples of the electronic element chip include capacitor elements, semiconductor chips such as CSP, BGA, and FC. Moreover, it does not restrict | limit especially as an external electrode which apply | coats a conductive adhesive, For example, the electrode containing metals, such as gold | metal | money, silver, tin, copper, is mentioned.

    The method for producing the electronic component is not particularly limited. For example, after applying a conductive adhesive on the external electrode by the printing method described above, an electronic element chip is placed on the conductive adhesive, and the conductive component is conductive. Examples include a method of curing (main curing) the adhesive. In addition, for the purpose of improving the adhesive strength, a load process for applying a load to the electronic element chip is provided before the conductive adhesive is fully cured to improve the wettability of the surface of the electronic element chip. Further, a temporary curing step for temporarily curing the conductive adhesive may be further provided.

    The thickness of the conductive adhesive applied on the external electrode is preferably 20 to 500 μm, more preferably 20 to 120 μm, and even more preferably 30 to 100 μm. When the lower limit of the film thickness is smaller than the above value, the adhesive strength is weakened, and the adhesion between the electronic element chip and the external electrode tends to be lowered. On the other hand, if the upper limit value of the film thickness is larger than the above value, the cost increases more than necessary.

The main curing temperature when the conductive adhesive is main-cured is not particularly limited, but is preferably 130 to 250 ° C, and more preferably 140 to 200 ° C. When the lower limit value of the main curing temperature is smaller than the above value, the conductive adhesive is not sufficiently cured, and the adhesion between the electronic element and the electrode is lowered. On the other hand, when the upper limit value of the main curing temperature is larger than the above value, the cost is increased more than necessary.
The main curing time is not particularly limited, but is preferably 5 to 60 minutes, for example, and more preferably 10 to 40 minutes. When the lower limit of the main curing time is smaller than the above value, the conductive adhesive is not sufficiently cured, and the adhesion between the electrode and the electronic element tends to be lowered. On the other hand, if the upper limit value of the main curing time is larger than the above value, the cost is increased more than necessary.

<Examples 1-13, Comparative Examples 1-9>
(Manufacture of conductive adhesive)
Bisphenol F type epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., “EP807”) as a liquid epoxy resin at room temperature and liquid novolak type as a liquid phenol resin at room temperature with the blending amount (mass%) shown in the table Phenolic resin (Maywa Kasei Co., Ltd., “MEH8005”), glycidyl orthotoluidine (Nippon Kayaku Co., Ltd., “GOT”) as a reactive diluent, and imidazole epoxy (curing accelerator) as an imidazole compound A curing accelerator (manufactured by Shikoku Kasei Kogyo Co., Ltd., “2PHZ”), as conductive metal particles, flake silver powder (manufactured by Ferro Japan, “SF38”, tap density: 4.8 g / cm ³ ), Each oxide film removing agent shown in the table was mixed with a roll mill to produce a conductive adhesive.

<Measurement>
About the obtained conductive adhesive, the initial viscosity and the viscosity after hold | maintaining at 23 degreeC x 72 hours were measured by the following method.
Also, the obtained conductive adhesive was applied on a glass plate so as to have a width of 1 cm, a length of 8 cm, and a thickness of 30 μm, and cured under conditions of 180 ° C. × 10 minutes, and the pencil hardness of the cured product. The specific resistance was measured by the following method. In addition, the measurement result about the electronic component manufactured using each conductive adhesive shows the same tendency as each measurement result about these conductive adhesives. Therefore, the measurement for each conductive adhesive is used as a substitute test for the measurement of the electronic component.

(Initial viscosity and viscosity after holding at 23 ° C. for 72 hours)
The initial viscosity was measured with a TV-type viscometer (manufactured by Toki Sangyo Co., Ltd.) for the conductive adhesive obtained in each test example. The measurement with a TV viscometer was carried out using a 3 ° cone, a rotation speed of 5 rpm, and a measurement temperature of 23 ° C.
The viscosity after holding at 23 ° C. for 72 hours was measured in the same manner as the initial viscosity after holding the conductive paste obtained in each test example under the conditions of 23 ° C. for 72 hours.
The results are shown in the table. In addition, ○ is a pass.
○: 80 dPa · s or more and less than 800 dPa · s ×: Less than 80 dPa · s or 800 dPa · s or more

(Pencil hardness)
About the hardened | cured material, pencil hardness was measured based on JISK5600.
The results are shown in the table. In addition, ○ is a pass.
○: F or more ×: HB or less

(Adhesive strength)
Conductive adhesive is coated on a glass plate to a width of 1 cm, length of 8 cm, and thickness of 30 μm, and five stainless nuts (made by Nishi Seiko Co., Ltd., “M3”) are arranged on it. And cured at 180 ° C. for 10 minutes. After returning to room temperature, the end of the push-pull gauge shaft made by Aiko Engineering is placed perpendicular to one surface of the nut, and the nut is pushed in the horizontal direction at a speed of 5 ± 0.5 mm / min. The strength at the time was determined. The strength was similarly determined for the five nuts, and the average value of the five nuts was defined as the adhesive strength.
○: 5 N / mm ² or more ×: Less than 5 N / mm ²

(Specific resistance)
For the cured product, the resistance value (R), the film thickness (A), the electrode width (B), and the inter-electrode distance (C) were measured, and the specific resistance was calculated by the following formula. The resistance value was measured using a digital multimeter (trade name: R6581D) manufactured by ADVANTEST, and the film thickness was measured using a surface roughness meter (trade name: SE3500) manufactured by Kosaka Laboratory.
ρ = R × {(A × B) / C}
○: Less than 3 × 10 ⁻⁵ Ω · cm ×: 3 × 10 ⁻⁵ Ω · cm or more

<Example 14>
As shown in the table, in the same manner as in Example 1 except that a phthalate-based epoxy resin (“AK601” manufactured by Nippon Kayaku Co., Ltd.) was used as the liquid epoxy resin at room temperature, the conductivity was An adhesive was produced.

＊ただし実施例１４では、ビスフェノールＦ型のエポキシ樹脂（ジャパンエポキシレジン(株)製、「ＥＰ８０７」）の代わりに、フタル酸エステル系のエポキシ樹脂（日本化薬(株)製、「ＡＫ６０１」）を使用している。

* However, in Example 14, instead of a bisphenol F type epoxy resin (Japan Epoxy Resin Co., Ltd., “EP807”), a phthalate ester epoxy resin (Nippon Kayaku Co., Ltd., “AK601”) Is used.

As is apparent from the table, the conductive adhesive of each Example in which an appropriate amount of at least one of a dibasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure was blended as an oxide film removing agent was manufactured. No gelation or the like was observed at the time or before curing, both the initial viscosity and the viscosity after being kept under the condition of 23 ° C. × 72 hours are appropriate, the conductivity is excellent, the adhesive strength and the pencil hardness are also good. there were.
On the other hand, in the comparative example in which dicarboxylic acid having no steric hindrance is blended as an oxide film removing agent, gelation is remarkable, and in the comparative example using tribasic acid and tetrabasic acid having an alicyclic structure, gelation is Although not recognized, the specific resistance increased and the conductivity decreased.

Claims (4)

A conductive adhesive comprising an epoxy resin that is liquid at room temperature, a phenol resin that is liquid at room temperature, a reactive diluent, an imidazole compound, silver powder and / or silver-coated metal powder, and a dibasic acid. ,
The dibasic acid is at least one of a dibasic acid having a side chain consisting of an alkyl group and a dibasic acid having an alicyclic structure, and is contained in 0.01 to 3% by mass in the conductive adhesive. Characteristic conductive adhesive.   The conductive adhesive according to claim 1, wherein the dibasic acid having a side chain composed of the alkyl group is glutaric acid having 1 to 4 carbon atoms in the alkyl group.   The conductive adhesive according to claim 1, wherein the dibasic acid having an alicyclic structure is cyclohexanedicarboxylic acid.   An electronic component manufactured using the conductive adhesive according to any one of claims 1 to 3.