JP2009289914A5 - - Google Patents

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Publication number
JP2009289914A5
JP2009289914A5 JP2008139818A JP2008139818A JP2009289914A5 JP 2009289914 A5 JP2009289914 A5 JP 2009289914A5 JP 2008139818 A JP2008139818 A JP 2008139818A JP 2008139818 A JP2008139818 A JP 2008139818A JP 2009289914 A5 JP2009289914 A5 JP 2009289914A5
Authority
JP
Japan
Prior art keywords
wiring board
opening
mounting area
protective film
mounted body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008139818A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009289914A (ja
JP5015065B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008139818A priority Critical patent/JP5015065B2/ja
Priority claimed from JP2008139818A external-priority patent/JP5015065B2/ja
Publication of JP2009289914A publication Critical patent/JP2009289914A/ja
Publication of JP2009289914A5 publication Critical patent/JP2009289914A5/ja
Application granted granted Critical
Publication of JP5015065B2 publication Critical patent/JP5015065B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008139818A 2008-05-28 2008-05-28 配線基板 Active JP5015065B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008139818A JP5015065B2 (ja) 2008-05-28 2008-05-28 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008139818A JP5015065B2 (ja) 2008-05-28 2008-05-28 配線基板

Publications (3)

Publication Number Publication Date
JP2009289914A JP2009289914A (ja) 2009-12-10
JP2009289914A5 true JP2009289914A5 (zh) 2011-05-12
JP5015065B2 JP5015065B2 (ja) 2012-08-29

Family

ID=41458859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008139818A Active JP5015065B2 (ja) 2008-05-28 2008-05-28 配線基板

Country Status (1)

Country Link
JP (1) JP5015065B2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009586A (ja) * 2010-06-24 2012-01-12 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法
JP5732238B2 (ja) * 2010-11-29 2015-06-10 シャープ株式会社 固体撮像装置および電子情報機器
JP5915225B2 (ja) * 2012-02-10 2016-05-11 凸版印刷株式会社 配線基板及びそれを用いた半導体装置
JP2014044979A (ja) * 2012-08-24 2014-03-13 Ngk Spark Plug Co Ltd 配線基板
JP2014072372A (ja) * 2012-09-28 2014-04-21 Ibiden Co Ltd プリント配線板の製造方法及びプリント配線板
TWI823452B (zh) 2022-06-30 2023-11-21 頎邦科技股份有限公司 半導體封裝構造及其電路板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111894A (ja) * 1997-10-02 1999-04-23 Fujitsu Ltd フリップチップ実装用基板
JP3497464B2 (ja) * 2000-11-24 2004-02-16 沖電気工業株式会社 半導体装置を実装する実装基板および実装構造
JP2005175113A (ja) * 2003-12-10 2005-06-30 Fdk Corp フリップチップ実装用プリント配線基板
JP2007220740A (ja) * 2006-02-14 2007-08-30 Elpida Memory Inc 半導体装置及びその製造方法

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