JP2009289914A5 - - Google Patents
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- Publication number
- JP2009289914A5 JP2009289914A5 JP2008139818A JP2008139818A JP2009289914A5 JP 2009289914 A5 JP2009289914 A5 JP 2009289914A5 JP 2008139818 A JP2008139818 A JP 2008139818A JP 2008139818 A JP2008139818 A JP 2008139818A JP 2009289914 A5 JP2009289914 A5 JP 2009289914A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- opening
- mounting area
- protective film
- mounted body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective Effects 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008139818A JP5015065B2 (ja) | 2008-05-28 | 2008-05-28 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008139818A JP5015065B2 (ja) | 2008-05-28 | 2008-05-28 | 配線基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009289914A JP2009289914A (ja) | 2009-12-10 |
JP2009289914A5 true JP2009289914A5 (zh) | 2011-05-12 |
JP5015065B2 JP5015065B2 (ja) | 2012-08-29 |
Family
ID=41458859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008139818A Active JP5015065B2 (ja) | 2008-05-28 | 2008-05-28 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5015065B2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009586A (ja) * | 2010-06-24 | 2012-01-12 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及び配線基板の製造方法 |
JP5732238B2 (ja) * | 2010-11-29 | 2015-06-10 | シャープ株式会社 | 固体撮像装置および電子情報機器 |
JP5915225B2 (ja) * | 2012-02-10 | 2016-05-11 | 凸版印刷株式会社 | 配線基板及びそれを用いた半導体装置 |
JP2014044979A (ja) * | 2012-08-24 | 2014-03-13 | Ngk Spark Plug Co Ltd | 配線基板 |
JP2014072372A (ja) * | 2012-09-28 | 2014-04-21 | Ibiden Co Ltd | プリント配線板の製造方法及びプリント配線板 |
TWI823452B (zh) | 2022-06-30 | 2023-11-21 | 頎邦科技股份有限公司 | 半導體封裝構造及其電路板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11111894A (ja) * | 1997-10-02 | 1999-04-23 | Fujitsu Ltd | フリップチップ実装用基板 |
JP3497464B2 (ja) * | 2000-11-24 | 2004-02-16 | 沖電気工業株式会社 | 半導体装置を実装する実装基板および実装構造 |
JP2005175113A (ja) * | 2003-12-10 | 2005-06-30 | Fdk Corp | フリップチップ実装用プリント配線基板 |
JP2007220740A (ja) * | 2006-02-14 | 2007-08-30 | Elpida Memory Inc | 半導体装置及びその製造方法 |
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2008
- 2008-05-28 JP JP2008139818A patent/JP5015065B2/ja active Active