JP2009283606A - Connection structure of wiring member, and connection method of wiring member - Google Patents

Connection structure of wiring member, and connection method of wiring member Download PDF

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JP2009283606A
JP2009283606A JP2008133007A JP2008133007A JP2009283606A JP 2009283606 A JP2009283606 A JP 2009283606A JP 2008133007 A JP2008133007 A JP 2008133007A JP 2008133007 A JP2008133007 A JP 2008133007A JP 2009283606 A JP2009283606 A JP 2009283606A
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conductive
wiring member
connection
back electrode
wiring
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JP5509542B2 (en
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Koji Hamaguchi
宏治 濱口
Toshiaki Tanaka
俊明 田中
Kazuhiko Kurabuchi
和彦 蔵渕
Naoki Fukushima
直樹 福嶋
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Resonac Corp
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Hitachi Chemical Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E10/50Photovoltaic [PV] energy

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of a wiring member capable of improving the yield of a wiring member connection body by suppressing occurrence of warpage; and a connection method of wiring members. <P>SOLUTION: This connection structure of a wiring member is composed by connecting the wiring members to both a light reception surface and a back electrode of a solar cell through conductive connection materials. In relation to the connection structure of a wiring member using the conductive connection material where the elastic modulus on the light reception side is larger than that on the back electrode side, and this connection method of a wiring member for connecting the wiring members to both the light reception surface and the back electrode of the solar cell through the conductive connection materials, the connection method of a wiring member is characterized in that the conductive connection material where the elastic modulus on the light reception side is larger than that on the back electrode side is arranged on the surface of the solar cell with electrodes formed thereon, and tentatively subjected to press-bonding, and thereafter the wiring member is mounted on the conductive connection material, and then subjected to thermo compression bonding. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、太陽電池セルに配線部材を接続した場合に生じる反りを低減した配線部材の接続構造体及び配線部材の接続方法に関する。   The present invention relates to a wiring member connection structure and a wiring member connection method in which warpage generated when a wiring member is connected to a solar battery cell is reduced.

図1に太陽電池セル1と配線部材3が導電性接続材料2を介して接続される配線部材の接続構造体を示す。従来、導電性接続材料2としてははんだが用いられてきた。はんだは、導通性、固着強度等の接続信頼性に優れ、安価で汎用性があることから広く使われている(例えば、特許文献1及び2参照)。   FIG. 1 shows a wiring member connection structure in which solar cells 1 and a wiring member 3 are connected via a conductive connecting material 2. Conventionally, solder has been used as the conductive connecting material 2. Solder is widely used because it is excellent in connection reliability such as conductivity and fixing strength, is inexpensive and versatile (see, for example, Patent Documents 1 and 2).

また、はんだを使用しない配線の接続方法としては、導電性接着剤を使用した接続方法や導電性フィルムを用いた接続方法が知られている(例えば、特許文献3〜6参照)。   Moreover, as a wiring connection method that does not use solder, a connection method using a conductive adhesive or a connection method using a conductive film is known (see, for example, Patent Documents 3 to 6).

従来の方法では、受光面と裏面電極の両方に、はんだ又は導電フィルム若しくは導電ペーストを介して配線材料を接続している。このような接続を行った場合、接続前と比較して反りは大きくなる。この反りはその後の太陽電池モジュールの製造過程において太陽電池セルの割れる原因となり、歩留まりの低下を引き起こす。   In the conventional method, a wiring material is connected to both the light receiving surface and the back electrode through solder, a conductive film, or a conductive paste. When such a connection is made, the warpage is greater than before the connection. This warpage causes cracking of the solar battery cells in the subsequent manufacturing process of the solar battery module and causes a decrease in yield.

特開2004−204256号公報JP 2004-204256 A 特開2005−050780号公報JP-A-2005-050780 特開2000−286436号公報JP 2000-286436 A 特開2001−357897号公報JP 2001-357897 A 特許第3448924号公報Japanese Patent No. 3448924 特開2005−101519号公報JP 2005-101519 A 特開2007−214533号公報JP 2007-214533 A

本発明は、反りの発生を抑制し、配線部材接続体の歩留まりを向上させることが可能な配線部材の接続構造体及び配線部材の接続方法を提供することを目的とするものである。   An object of the present invention is to provide a wiring member connection structure and a wiring member connection method capable of suppressing the occurrence of warpage and improving the yield of the wiring member connection body.

本発明は、太陽電池セルの受光面と裏面電極の両方に、配線部材を、導電性接続材料を介して接続してなる配線部材の接続構造体において、受光面側に裏面電極側よりも弾性率の大きな導電性接続材料を用いた配線部材の接続構造体に関する。   The present invention provides a wiring member connection structure in which a wiring member is connected to both a light receiving surface and a back electrode of a solar battery cell via a conductive connecting material, and is more elastic on the light receiving surface side than the back electrode side. The present invention relates to a connection structure for a wiring member using a conductive connection material having a high rate.

また、本発明は、前記導電性接続材料が、はんだ又は絶縁樹脂層に導電粒子を分散・含有して導電特性付与した導電フィルム又は導電ペーストである上記の配線部材の接続構造体に関する。   The present invention also relates to the connection structure for a wiring member as described above, wherein the conductive connection material is a conductive film or a conductive paste in which conductive particles are dispersed and contained in a solder or insulating resin layer to impart conductive characteristics.

また、本発明は、太陽電池セルの受光面と裏面電極の両方に、配線部材を、導電性接続材料を介して接続する配線部材の接続方法において、太陽電池セルの電極が形成されている面上の受光面側に裏面電極側よりも弾性率の大きな導電性接続材料を配置し、仮圧着後、導電性接続材料上に配線部材を載置し、次いで熱圧着することを特徴とする配線部材の接続方法に関する。   In addition, the present invention provides a method for connecting a wiring member that connects a wiring member to both the light receiving surface and the back electrode of the solar battery cell via a conductive connection material. A wiring characterized in that a conductive connecting material having a higher elastic modulus than that of the back electrode side is disposed on the light receiving surface side, a wiring member is placed on the conductive connecting material after provisional pressure bonding, and then thermocompression bonding is performed. The present invention relates to a method for connecting members.

さらに、本発明は、前記太陽電池セルと配線部材との電気的接続に用いられる前記導電性接続材料が、はんだ又は絶縁樹脂層に導電粒子を分散・含有して導電特性付与した導電フィルム又は導電ペーストである上記の配線部材の接続方法に関する。   Furthermore, the present invention provides the conductive film or conductive material in which the conductive connecting material used for electrical connection between the solar battery cell and the wiring member has conductive properties dispersed and contained in a solder or insulating resin layer. It is related with the connection method of said wiring member which is a paste.

本発明によれば、配線部材接続体の反りを十分効率的に抑制できる配線部材の接続構造体及び配線部材の接続方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the connection structure of a wiring member which can suppress the curvature of a wiring member connection body sufficiently efficiently, and the connection method of a wiring member can be provided.

以下、図面を引用して本発明を詳細に説明する。なお、図面の説明において同一の要素には同一の符号を付し、重複する説明は省略する。また図面の便宜上、図面の寸法比率は説明のものと必ずしも一致しない。   Hereinafter, the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted. For the convenience of the drawings, the dimensional ratios in the drawings do not necessarily match those described.

図2は、本発明になる配線部材の接続構造体の工程の一例を示す概略断面図である。この図2に示す熱圧着装置10を用いて、平線状の配線部材3を太陽電池セル1上に実装する方法について説明する。本発明における配線部材実装方法においては、圧着ヘッド5及び加熱ステージ4によって配線部材3を太陽電池セル1に加熱圧着を行う。   FIG. 2: is a schematic sectional drawing which shows an example of the process of the connection structure of the wiring member which becomes this invention. A method for mounting the flat wiring member 3 on the solar battery cell 1 using the thermocompression bonding apparatus 10 shown in FIG. 2 will be described. In the wiring member mounting method in the present invention, the wiring member 3 is thermocompression bonded to the solar battery cell 1 by the crimping head 5 and the heating stage 4.

まず、図2の(a)に示すように、太陽電池セル1を熱圧着装置10のステージ4上に載置する。そして、太陽電池セル1の電極1aが形成されている面上に導電性接続材料2を配置し、圧着ヘッド5を降下させて導電性接続材料2を太陽電池セル1に仮圧着する。   First, as shown in FIG. 2A, the solar battery cell 1 is placed on the stage 4 of the thermocompression bonding apparatus 10. And the conductive connection material 2 is arrange | positioned on the surface in which the electrode 1a of the photovoltaic cell 1 is formed, the crimping | compression-bonding head 5 is dropped, and the conductive connection material 2 is temporarily crimped | bonded to the photovoltaic cell 1. FIG.

このときの圧力は、配線部材に損傷を与えない範囲であれば特に制限はないが、一般的には0.1〜30.0MPaとすることが好ましい。また加熱しながら加圧してもよく、加熱温度は、導電性接続材料2が実質的に硬化しない温度とする。これらの加熱及び加圧は、0.5〜120秒間の範囲で行うことが好ましい。   The pressure at this time is not particularly limited as long as it does not damage the wiring member, but is generally preferably 0.1 to 30.0 MPa. Moreover, you may pressurize, heating, and let heating temperature be the temperature which the electroconductive connection material 2 does not harden | cure substantially. These heating and pressurization are preferably performed in the range of 0.5 to 120 seconds.

次いで、図2の(b)に示すように、配線部材3を導電性接続材料2上に載置した後、圧着ヘッド5を降下させると共に、圧着ヘッド5の熱(熱圧着工程)によって導電性接続材料2を硬化させる(図2の(c))。   Next, as shown in FIG. 2B, after placing the wiring member 3 on the conductive connecting material 2, the pressure-bonding head 5 is lowered, and the heat is applied by the heat of the pressure-bonding head 5 (thermo-compression process). The connecting material 2 is cured ((c) in FIG. 2).

圧着ヘッド5による押圧力は、配線部材3や太陽電池セル1に損傷を与えない範囲であれば特に制限はないが、一般的には0.1〜30.0MPaとすることが好ましい。
また、圧着ヘッド5及び加熱ステージ4による加熱温度は、導電性接続材料2が硬化可能な温度とする。
The pressing force by the pressure-bonding head 5 is not particularly limited as long as the wiring member 3 and the solar battery cell 1 are not damaged, but it is generally preferable that the pressure is 0.1 to 30.0 MPa.
The heating temperature by the pressure bonding head 5 and the heating stage 4 is a temperature at which the conductive connecting material 2 can be cured.

加熱温度は、60〜350℃が好ましく、70〜300℃がより好ましく、80〜260℃がさらに好ましい。加熱温度が60℃未満であると硬化速度が遅くなる傾向があり、350℃を超えると望まない副反応が進行し易い傾向がある。加熱時間は、0.1〜180秒が好ましく、0.5〜180秒がより好ましく、1〜180秒がさらに好ましい。   The heating temperature is preferably 60 to 350 ° C, more preferably 70 to 300 ° C, and further preferably 80 to 260 ° C. If the heating temperature is less than 60 ° C, the curing rate tends to be slow, and if it exceeds 350 ° C, unwanted side reactions tend to proceed. The heating time is preferably from 0.1 to 180 seconds, more preferably from 0.5 to 180 seconds, and further preferably from 1 to 180 seconds.

なお、熱圧着工程における導電性接続材料2の加熱は、圧着ヘッド5と加熱ステージ4の両面からの加熱によるものに限定されるものではない。例えば、圧着ヘッド5又は加熱ステージ4のどちらか一方からのみ加熱してもよい。   The heating of the conductive connecting material 2 in the thermocompression bonding step is not limited to heating by heating from both surfaces of the pressure bonding head 5 and the heating stage 4. For example, the heating may be performed only from either the pressure-bonding head 5 or the heating stage 4.

熱圧着工程における導電性接続材料2の硬化によって、太陽電池セル1上に配線部材3が実装された配線部材接続構造体が得られる。図3は、配線部材接続構造体50の接続部を拡大して示す模式断面図である。配線部材接続構造体50の接続部は導電性接続材料2に含まれる接着剤成分2aの硬化物2Aと、これに分散している導電粒子2bとを備える。   By curing the conductive connection material 2 in the thermocompression bonding step, a wiring member connection structure in which the wiring member 3 is mounted on the solar battery cell 1 is obtained. FIG. 3 is a schematic cross-sectional view showing an enlarged connection portion of the wiring member connection structure 50. The connection part of the wiring member connection structure 50 includes a cured product 2A of the adhesive component 2a contained in the conductive connection material 2 and conductive particles 2b dispersed therein.

配線部材接続構造体50においては、対向する太陽電池セル1の電極1aと配線部材3が、導電粒子2bを介して電気的に接続されている。すなわち、導電粒子2bが電極1a及び配線部材3の双方に直接接触している。   In the wiring member connection structure 50, the electrode 1a of the opposing solar battery cell 1 and the wiring member 3 are electrically connected via the conductive particles 2b. That is, the conductive particles 2 b are in direct contact with both the electrode 1 a and the wiring member 3.

このため、電極1a、3間の接続抵抗が十分に低減され、電極1a、配線部材3間の良好な電気的接続が可能となる。従って、電極1a、配線部材3間の電流の流れを円滑にすることができ、配線部材の持つ機能を十分に発揮することができる。   For this reason, the connection resistance between the electrodes 1a and 3 is sufficiently reduced, and a good electrical connection between the electrode 1a and the wiring member 3 becomes possible. Therefore, the flow of current between the electrode 1a and the wiring member 3 can be made smooth, and the function of the wiring member can be fully exhibited.

(導電性接続材料)
図4に示す接着剤フィルム15は、テープ状の基材6と、その一方面上に設けられた導電性接続材料2とを備える。導電性接続材料2は、熱硬化性樹脂を含む接着剤成分2aと、接着剤成分2a中に分散した導電粒子2bとを含有する接着剤組成物をフィルム状に成形したものである。導電性接続材料2を使用する際には、テープ状の基材6は剥離される。
(Conductive connection material)
The adhesive film 15 shown in FIG. 4 includes a tape-like substrate 6 and the conductive connection material 2 provided on one surface thereof. The conductive connecting material 2 is obtained by molding an adhesive composition containing an adhesive component 2a containing a thermosetting resin and conductive particles 2b dispersed in the adhesive component 2a into a film shape. When the conductive connecting material 2 is used, the tape-like base material 6 is peeled off.

導電性接続材料2の接着剤成分2aに含まれる熱硬化性樹脂としては、例えば、アクリル樹脂、メタクリル樹脂、ウレタン樹脂、不飽和ポリエステル樹脂、エポキシ樹脂、フェノール樹脂等が挙げられる。   Examples of the thermosetting resin contained in the adhesive component 2a of the conductive connecting material 2 include acrylic resin, methacrylic resin, urethane resin, unsaturated polyester resin, epoxy resin, and phenol resin.

また、熱硬化性樹脂の硬化反応の形態は特に制限はなく、二重結合のラジカル重合、イオン重合、重付加等のいずれの重合形態であってもよい。   The form of the curing reaction of the thermosetting resin is not particularly limited, and any polymerization form such as double bond radical polymerization, ionic polymerization, and polyaddition may be used.

接着剤成分2aは、熱硬化性樹脂以外の成分を含んでもよい。かかる成分としては、フィルム形成ポリマー、ラジカル重合開始剤、エポキシ硬化剤、シランカップリング剤、触媒、充填剤等が挙げられる。
熱硬化性樹脂、フィルム形成ポリマー及びその他成分の種類又は配合量を適宜調整することで、熱硬化型接続材料の硬化物のガラス転移温度Tgを制御することができる。
The adhesive component 2a may include components other than the thermosetting resin. Examples of such components include a film-forming polymer, a radical polymerization initiator, an epoxy curing agent, a silane coupling agent, a catalyst, and a filler.
The glass transition temperature Tg of the cured product of the thermosetting connection material can be controlled by appropriately adjusting the type or blending amount of the thermosetting resin, the film-forming polymer, and other components.

導電性接続材料2に含まれる導電粒子2bとしては、例えば、Au、Ag、Pt、Ni、Cu、W、Sb、Sn、はんだ等の金属やカーボンの粒子が挙げられるが、これらの他に非導電性のガラス、セラミック、プラスチック等を核とし、この核を上記の金属やカーボンで被覆した被覆粒子を使用してもよい。   Examples of the conductive particles 2b included in the conductive connection material 2 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, and carbon particles. Coated particles in which conductive glass, ceramic, plastic, or the like is used as a core and the core is coated with the above metal or carbon may be used.

導電粒子の平均粒径は分散性、導電性の観点から1〜18μmであることが好ましい。なお、導電粒子を絶縁層で被覆してなる絶縁被覆粒子を使用してもよい。   The average particle diameter of the conductive particles is preferably 1 to 18 μm from the viewpoints of dispersibility and conductivity. Insulating coating particles obtained by coating conductive particles with an insulating layer may be used.

導電粒子2bの配合割合は、導電性接続材料2の接着剤成分100体積部に対して、0.01〜30体積部であることが好ましく、0.1〜10体積部であることがより好ましい。この配合割合が0.01体積部未満であると対向する電極間の接続抵抗が高くなる傾向があり、30体積部を超えると隣接する電極間の短絡が生じやすくなる傾向がある。   The blending ratio of the conductive particles 2b is preferably 0.01 to 30 parts by volume and more preferably 0.1 to 10 parts by volume with respect to 100 parts by volume of the adhesive component of the conductive connection material 2. . If the blending ratio is less than 0.01 part by volume, the connection resistance between the opposing electrodes tends to increase, and if it exceeds 30 parts by volume, a short circuit between adjacent electrodes tends to occur.

導電性接続材料2の厚さは、使用する接着剤成分及び被接着物の種類等に合わせて適宜選択すればよいが、5〜100μmであることが好ましい。
また、導電性接続材料2の幅は、使用用途に合わせて調整すればよいが、一般には0.5〜5mm程度である。
What is necessary is just to select the thickness of the electroconductive connection material 2 according to the adhesive agent component to be used, the kind of to-be-adhered object, etc., but it is preferable that it is 5-100 micrometers.
Moreover, what is necessary is just to adjust the width | variety of the electroconductive connection material 2 according to a use application, but generally it is about 0.5-5 mm.

接着剤フィルム15の基材6はテープ状の形状を有する。基材6は、長さが1〜300mm程度であり、厚さが4〜200μm程度であり、幅が0.5〜30mm程度である。基材6の長さ、厚さ及び幅は上記の範囲に限定されるものではない。但し、太陽電池の発電効率向上の観点から導電性接続材料2の幅は配線部材3の幅と同じことが望ましく、基材6の幅は、その上に付設される導電性接続材料2の幅よりも広いことが好ましい。   The substrate 6 of the adhesive film 15 has a tape shape. The substrate 6 has a length of about 1 to 300 mm, a thickness of about 4 to 200 μm, and a width of about 0.5 to 30 mm. The length, thickness, and width of the substrate 6 are not limited to the above ranges. However, from the viewpoint of improving the power generation efficiency of the solar cell, the width of the conductive connection material 2 is preferably the same as the width of the wiring member 3, and the width of the base member 6 is the width of the conductive connection material 2 provided thereon. It is preferable that the width is wider.

基材6は、例えば、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリエチレンイソフタレート、ポリブチレンテレフタレート、ポリオレフィン、ポリアセテート、ポリカーボネート、ポリフェニレンサルファイド、ポリアミド、エチレン・酢酸ビニル共重合体、ポリ塩化ビニル、ポリ塩化ビニリデン、合成ゴム系、液晶ポリマー等からなる各種テープを使用することが可能である。但し、基材6を構成する材質はこれらに制限するものではなく、また基材6として、導電性接続材料2との当接面などに離型処理が施されたものを使用してもよい。   The substrate 6 is, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, Various tapes made of synthetic rubber or liquid crystal polymer can be used. However, the material constituting the base material 6 is not limited to these, and as the base material 6, a material having a release treatment applied to the contact surface with the conductive connecting material 2 may be used. .

なお、導電性接続材料2として、市販されている種々の導電性フィルム(CF)、導電性ペースト(CP)、非導電性フィルム(NCF)等を用いてもよい。
以上、本発明の好適な実施の形態について説明したが、本発明は上記の実施の形態に制限するものではない。本発明は、その要旨を逸脱しない範囲で様々な変形が可能である。
As the conductive connection material 2, various commercially available conductive films (CF), conductive pastes (CP), non-conductive films (NCF), and the like may be used.
The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

例えば、上記の実施の形態では、単層構造の導電性接続材料2を使用する場合を例示したが、多層構造の導電性接続材料を使用してもよい。多層構造の導電性接続材料は、接着剤成分及び導電粒子の種類又はこれらの含有量が異なる層を基材6上に複数積層することによって製造することができる。   For example, in the above embodiment, the case where the conductive connection material 2 having a single layer structure is used is exemplified, but a conductive connection material having a multilayer structure may be used. The conductive connection material having a multilayer structure can be produced by laminating a plurality of layers having different types of adhesive components and conductive particles or different contents thereof on the substrate 6.

図5に示す接着材フィルム15は、基材6と、その一方面上に形成された二層構造の導電性接続材料18とを備える。この導電性接続材料18は、導電粒子を含有しない導電粒子非含有層18a及び導電粒子を含有する導電粒子含有層18bからなる。なお、導電粒子非含有層18a及び導電粒子含有層18bの接着剤成分としては、上述の回路接続材料2の接着剤成分2aと同様のものを使用できる。   The adhesive film 15 shown in FIG. 5 includes a base material 6 and a conductive connection material 18 having a two-layer structure formed on one surface thereof. The conductive connecting material 18 includes a conductive particle non-containing layer 18a containing no conductive particles and a conductive particle containing layer 18b containing conductive particles. In addition, as the adhesive component of the conductive particle non-containing layer 18a and the conductive particle-containing layer 18b, the same adhesive component as the adhesive component 2a of the circuit connecting material 2 described above can be used.

さらに、太陽電池セル1に実装する配線部材は、配線部材に限定されるものではない。例えば、ガラス繊維強化エポキシ基板などのガラス繊維強化有機基板又は紙フェノール基板、セラミック基板、積層板、ポリイミドフィルム等の配線板上に本発明に係る導電性接続材料によって実装してもよい。   Furthermore, the wiring member mounted on the solar battery cell 1 is not limited to the wiring member. For example, the conductive connecting material according to the present invention may be mounted on a wiring board such as a glass fiber reinforced organic substrate such as a glass fiber reinforced epoxy substrate or a paper phenol substrate, a ceramic substrate, a laminate, or a polyimide film.

以下、実施例及び比較例により、本発明をさらに詳細に説明するが、本発明は以下の実施例に制限するものではない。
(実施例1)
図2に示す熱圧着装置と同様の構成の装置を使用し、下記のようにして配線部材を太陽電池セル上に実装し、配線部材接続構造体を作製した。
EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in detail, this invention is not restrict | limited to a following example.
Example 1
An apparatus having the same configuration as the thermocompression bonding apparatus shown in FIG. 2 was used, and the wiring member was mounted on the solar battery cell as described below to produce a wiring member connection structure.

まず、配線部材(角型銅リボン線、150mm×2mm、厚さ0.16mm)、太陽電池セル(多結晶シリコン、125mm×125mm、厚さ0.2mm)熱硬化型の導電性接続材料として導電フィルムを準備した。   First, wiring member (square copper ribbon wire, 150 mm × 2 mm, thickness 0.16 mm), solar cell (polycrystalline silicon, 125 mm × 125 mm, thickness 0.2 mm), conductive as a thermosetting conductive connection material A film was prepared.

熱圧着装置のステージ上に太陽電池セルを載置し、その上に導電フィルムを仮圧着した。次いで、導電フィルムの上に配線部材を搭載し、その後、上方から圧着ヘッドを降下させ、熱圧着を行った。   A solar battery cell was placed on the stage of a thermocompression bonding apparatus, and a conductive film was temporarily pressure-bonded thereon. Next, a wiring member was mounted on the conductive film, and then the crimping head was lowered from above to perform thermocompression bonding.

圧着ヘッドの当接面によって2MPaにて配線部材を押圧すると共に、圧着ヘッドと加熱ステージの熱によって導電フィルムの温度が15秒で170℃に到達するように加熱して回路接続体を得た。   The wiring member was pressed at 2 MPa by the contact surface of the pressure-bonding head, and heated by the heat of the pressure-bonding head and the heating stage so that the temperature of the conductive film reached 170 ° C. in 15 seconds to obtain a circuit connection body.

本実施例で使用した導電フィルム1の室温(25℃)における弾性率は3.5GPa、導電フィルム2の室温(25℃)における弾性率は1.1GPaであった。なお、当該弾性率は、導電フィルムを180℃のオーブンに1時間置いて完全硬化させた後、動的粘弾性測定装置DMS6100(SII製)を用いて、昇温速度5℃/分、周波数10Hz、振幅5μm、引張モードの条件で測定したものである。   The elastic modulus at room temperature (25 ° C.) of the conductive film 1 used in this example was 3.5 GPa, and the elastic modulus at room temperature (25 ° C.) of the conductive film 2 was 1.1 GPa. The elastic modulus is determined by placing the conductive film in an oven at 180 ° C. for 1 hour and completely curing it, and then using a dynamic viscoelasticity measuring device DMS6100 (manufactured by SII) with a heating rate of 5 ° C./min and a frequency of 10 Hz. , Measured under conditions of amplitude 5 μm and tensile mode.

<太陽電池セルの反り量の測定>
上記のようにして作製した太陽電池セルの反りを以下のようにして測定した。まず、太陽電池セルの裏面を上にして非接触変位計の可動ステージ上に置き、セルの中心を基準にXY方向にそれぞれ+−60mmを10mm間隔で高さ方向の変位を測定した。
<Measurement of solar cell warpage>
The warpage of the solar battery cell produced as described above was measured as follows. First, the solar cell was placed on the movable stage of a non-contact displacement meter with the back surface facing up, and the displacement in the height direction was measured at 10 mm intervals in the XY directions with respect to the center of the cell.

次に、その測定結果を2次元の最小二乗法を用いて平均面を計算し、測定結果の4角の平均面からの残差の平均値と平均面から測定結果を引いた最小値との差を反りと定義した。この反りの配線部材の接続前後の差を接続後の反りと定義した。   Next, an average surface is calculated from the measurement results using a two-dimensional least-squares method, and an average value of residuals from the average surface of the four corners of the measurement results and a minimum value obtained by subtracting the measurement results from the average surface are calculated. The difference was defined as warpage. The difference between the warp before and after the connection of the wiring member was defined as the warp after the connection.

実施例1及び比較例1、2において使用した導電フィルムの物性を表1に示す。   Table 1 shows the physical properties of the conductive films used in Example 1 and Comparative Examples 1 and 2.

Figure 2009283606
Figure 2009283606

また、上記で作製した配線部材接続構造体の評価結果(実施例1及び比較例1、2)を表2に示す。   Table 2 shows the evaluation results (Example 1 and Comparative Examples 1 and 2) of the wiring member connection structure produced above.

Figure 2009283606
Figure 2009283606

本発明になる配線部材の接続構造体の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the connection structure of the wiring member which becomes this invention. 本発明になる配線部材の接続構造体の工程の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the process of the connection structure of the wiring member which becomes this invention. 配線部材の接続構造体の接続部を拡大して示す模式断面図である。It is a schematic cross section which expands and shows the connection part of the connection structure of a wiring member. 導電性接続材料の一例を示す断面図である。It is sectional drawing which shows an example of an electroconductive connection material. 導電性接続材料の他の一例を示す断面図である。It is sectional drawing which shows another example of an electroconductive connection material.

符号の説明Explanation of symbols

1 太陽電池セル
1a 電極
2 導電性接続材料
2A 導電性成分の硬化物
2a 接着剤成分
2b 導電粒子
3 配線部材
3a 電極
4 加熱ステージ
5 圧着ヘッド
6 基材
10 熱圧着装置
15 接着剤フィルム
18 導電性接続材料
18a 導電粒子非含有層
18b 導電粒子含有層
50 配線部材接続構造体。
DESCRIPTION OF SYMBOLS 1 Solar cell 1a Electrode 2 Conductive connection material 2A Hardened | cured material of a conductive component 2a Adhesive component 2b Conductive particle 3 Wiring member 3a Electrode 4 Heating stage 5 Crimp head 6 Base material 10 Thermocompression bonding apparatus 15 Adhesive film 18 Conductivity Connection material 18a Conductive particle-free layer 18b Conductive particle-containing layer 50 Wiring member connection structure.

Claims (4)

太陽電池セルの受光面と裏面電極の両方に、配線部材を、導電性接続材料を介して接続してなる配線部材の接続構造体において、受光面側に裏面電極側よりも弾性率の大きな導電性接続材料を用いた配線部材の接続構造体。   In a wiring member connection structure in which a wiring member is connected to both a light receiving surface and a back electrode of a solar battery cell via a conductive connecting material, a conductive material having a higher elastic modulus than the back electrode side on the light receiving surface side. Wiring member connection structure using a conductive connecting material. 前記導電性接続材料が、はんだ又は絶縁樹脂層に導電粒子を分散・含有して導電特性付与した導電フィルム又は導電ペーストである請求項1記載の配線部材の接続構造体。   The wiring member connection structure according to claim 1, wherein the conductive connection material is a conductive film or conductive paste obtained by dispersing and containing conductive particles in a solder or insulating resin layer to impart conductive characteristics. 太陽電池セルの受光面と裏面電極の両方に、配線部材を、導電性接続材料を介して接続する配線部材の接続方法において、太陽電池セルの電極が形成されている面上の受光面側に裏面電極側よりも弾性率の大きな導電性接続材料を配置し、仮圧着後、導電性接続材料上に配線部材を載置し、次いで熱圧着することを特徴とする配線部材の接続方法。   In the wiring member connection method in which the wiring member is connected to both the light receiving surface and the back electrode of the solar battery cell via the conductive connection material, the light receiving surface on the surface on which the electrode of the solar battery cell is formed A wiring member connecting method, comprising: arranging a conductive connecting material having a larger elastic modulus than the back electrode side, placing a wiring member on the conductive connecting material after provisional pressure bonding, and then thermocompression bonding. 前記導電性接続材料が、はんだ又は絶縁樹脂層に導電粒子を分散・含有して導電特性付与した導電フィルム又は導電ペーストである請求項3記載の配線部材の接続方法。   The method for connecting wiring members according to claim 3, wherein the conductive connection material is a conductive film or conductive paste in which conductive particles are dispersed and contained in a solder or insulating resin layer to impart conductive characteristics.
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