JP2009280882A5 - - Google Patents

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Publication number
JP2009280882A5
JP2009280882A5 JP2008136224A JP2008136224A JP2009280882A5 JP 2009280882 A5 JP2009280882 A5 JP 2009280882A5 JP 2008136224 A JP2008136224 A JP 2008136224A JP 2008136224 A JP2008136224 A JP 2008136224A JP 2009280882 A5 JP2009280882 A5 JP 2009280882A5
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JP
Japan
Prior art keywords
sputtering apparatus
target
vacuum chamber
disposed
earth shield
Prior art date
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Granted
Application number
JP2008136224A
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English (en)
Japanese (ja)
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JP5146106B2 (ja
JP2009280882A (ja
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Priority to JP2008136224A priority Critical patent/JP5146106B2/ja
Priority claimed from JP2008136224A external-priority patent/JP5146106B2/ja
Publication of JP2009280882A publication Critical patent/JP2009280882A/ja
Publication of JP2009280882A5 publication Critical patent/JP2009280882A5/ja
Application granted granted Critical
Publication of JP5146106B2 publication Critical patent/JP5146106B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008136224A 2008-05-26 2008-05-26 スパッタ装置 Expired - Fee Related JP5146106B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008136224A JP5146106B2 (ja) 2008-05-26 2008-05-26 スパッタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008136224A JP5146106B2 (ja) 2008-05-26 2008-05-26 スパッタ装置

Publications (3)

Publication Number Publication Date
JP2009280882A JP2009280882A (ja) 2009-12-03
JP2009280882A5 true JP2009280882A5 (https=) 2010-12-16
JP5146106B2 JP5146106B2 (ja) 2013-02-20

Family

ID=41451634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008136224A Expired - Fee Related JP5146106B2 (ja) 2008-05-26 2008-05-26 スパッタ装置

Country Status (1)

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JP (1) JP5146106B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010156018A (ja) * 2008-12-26 2010-07-15 Masahiko Naoe スパッタ装置
CN102719798B (zh) * 2012-06-04 2015-06-17 深圳市华星光电技术有限公司 磁控溅射系统
KR101348828B1 (ko) * 2012-06-21 2014-01-09 경희대학교 산학협력단 스퍼터링 방식을 이용한 ｌｅｄ의 투명 전도층 성막 장치
WO2014017682A1 (ko) * 2012-07-26 2014-01-30 주식회사 아비즈알 마그네트론 냉각부를 구비한 마그네트론 스퍼터링 장치
CN107058960B (zh) * 2016-12-30 2019-04-30 武汉华星光电技术有限公司 一种溅射机
JP7102260B2 (ja) * 2018-06-29 2022-07-19 株式会社アルバック 対向ターゲット式スパッタ成膜装置
CN114645256B (zh) * 2022-03-14 2023-09-15 苏州迈为科技股份有限公司 减少溅射镀膜损伤硅片衬底的装置及方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313575A (ja) * 1989-06-13 1991-01-22 Hitachi Ltd 対向ターゲツトスパツタ装置
JPH0734236A (ja) * 1993-07-19 1995-02-03 Canon Inc 直流スパッタリング装置およびスパッタリング方法
JP3972558B2 (ja) * 2000-06-23 2007-09-05 松下電器産業株式会社 スパッタリング装置
JP2007154224A (ja) * 2005-12-01 2007-06-21 Matsushita Electric Ind Co Ltd スパッタリング方法および装置

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