JP2009277750A - Method of manufacturing mounting structure, method of manufacturing droplet discharge head, mounting structure, and droplet discharge head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of positioning a plurality of substrates on a base plate at less imaging frequency, for securing. <P>SOLUTION: The method of manufacturing a mounting structure includes a first mark measuring step in which alignment marks 6d and 7d of flexible substrates 6 and 7 where a wiring is arranged are imaged, for measuring positions of the alignment marks 6d and 7d, a second mark measuring step in which an alignment mark 2a of a base plate 2 where a wiring and the alignment mark 2a are arranged is imaged, for measuring position of the alignment mark 2a, a base aligning step in which, using the measurement results of the first mark measuring step and the measurement results of the second mark measuring step, the flexible substrates 6 and 7 and the base plate 2 are relatively moved to the places where the wiring of the flexible substrates 6 and 7 and the wiring of the base plate 2 face each other, and a mounting step in which the wiring of the flexible substrates 6 and 7 and the wiring of the base plate 2 are connected together for securing. In the first mark measuring step, the measurement marks 6d and 7d are imaged in a single image, for measuring position of the alignment marks 6d and 7d. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting structure manufacturing method, a droplet discharging head manufacturing method, a mounting structure, and a droplet discharging head, and more particularly to a method for mounting a substrate with high productivity.

  A droplet discharge method is used as one of methods for forming a fine pattern such as a color filter of a liquid crystal television. This droplet discharge method is a method of forming a fine pattern on a substrate by discharging functional liquid as droplets from a droplet discharge head onto the substrate. A structure capable of manufacturing this droplet discharge head with high productivity is disclosed in Patent Document 1. According to this, in the droplet discharge head, a pressure generating chamber is formed between the nozzle substrate on which nozzles for discharging droplets are formed and the vibration plate. The piezoelectric element is disposed on the diaphragm, and the piezoelectric element expands and contracts to vibrate the diaphragm. As the vibration plate vibrates, the functional liquid present in the pressure generating chamber is pressurized, and the functional liquid is discharged as droplets.

  A reservoir forming substrate having a recess formed thereon is disposed on the diaphragm, and the piezoelectric element is hermetically sealed by the recess and the diaphragm. An electrode of a piezoelectric element is formed on the diaphragm, and a part of the electrode is formed at a place not covered by the reservoir forming substrate. And the electrode of a piezoelectric element and the flexible substrate are electrically connected to the diaphragm. A plurality of piezoelectric elements are arranged on the diaphragm, and a plurality of electrodes of the piezoelectric elements are also formed. A plurality of wirings are formed on the flexible substrate, and the electrodes of the plurality of piezoelectric elements and the plurality of electrodes of the flexible substrate are connected. Accordingly, since a plurality of electrodes are connected by one flexible substrate, the wiring of the piezoelectric element can be connected with high productivity.

JP 2006-68989 A

  Two flexible substrates are arranged on the diaphragm with the wiring interposed therebetween, and alignment marks used for alignment are arranged on the flexible substrate and the diaphragm. And the position of the flexible substrate and the diaphragm was measured by the imaging device imaging the alignment mark. At this time, after moving the alignment mark to a predetermined range for accurate measurement, the imaging device images the alignment mark. And the position of the alignment mark was measured.

  At this time, since the alignment marks on the two flexible substrates are arranged apart from each other, the same number of images as the alignment marks are taken, and the positions of the alignment marks are measured. A method of aligning and fixing the flexible substrate to the diaphragm with a small number of times of imaging has been desired.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
A method for manufacturing a mounting structure according to this application example, wherein the alignment marks of a plurality of first wiring boards on which wirings and alignment marks are arranged are imaged, and the positions of the alignment marks are determined. A first mark measurement step for measuring, a second mark measurement step for imaging the alignment mark on the second wiring board on which the wiring and the alignment mark are arranged, and measuring the position of the alignment mark; Using the measurement result of the first mark measurement step and the measurement result of the second mark measurement step, the first wiring is formed at a location where the wiring of the first wiring substrate and the wiring of the second wiring substrate are opposed to each other. A substrate alignment step of relatively moving the substrate and the second wiring substrate; and a mounting step of connecting and fixing the wiring of the first wiring substrate and the wiring of the second wiring substrate. In the mark measurement process Capturing a plurality of said alignment mark in one image, and measuring the position of the mark for the alignment.

  According to the manufacturing method of the mounting structure, the position of the alignment mark on the first wiring board is measured in the first mark measurement step. Similarly, the alignment mark on the second wiring board is measured in the second mark measurement step. In the substrate alignment step, the wiring on the first wiring board and the wiring on the second wiring board are arranged to face each other. At this time, alignment is performed using the measured value of the alignment mark on the first wiring board and the measured value of the alignment mark on the second wiring board. Therefore, the first wiring board and the second wiring board can be adjusted to a predetermined relative position. Then, in the mounting process, the first wiring board and the second wiring board are mounted by connecting and fixing the wiring of the first wiring board and the wiring of the second wiring board.

  In the first mark measurement step, the alignment mark on the first wiring board is imaged and the position of the alignment mark is measured. At this time, a plurality of alignment marks are captured in one image and measured. Therefore, the position of the alignment marks in a predetermined number can be measured with a small number of times of imaging as compared with the method of imaging one alignment mark in one image. As a result, the mounting structure can be manufactured with high productivity.

[Application Example 2]
The mounting structure manufacturing method according to the application example further includes a substrate moving step of moving a relative position of the plurality of first wiring boards to a predetermined position using the measurement result of the first mark measuring step. It is characterized by that.

  According to this method for manufacturing a mounting structure, the relative position of the first wiring board is adjusted to a predetermined position in the board moving step. Then, the relative positions of the plurality of first wiring boards and the second wiring boards are matched in the board matching step. In the mounting process, the plurality of first wiring boards and the second wiring board are fixed. Accordingly, after the plurality of first wiring boards are aligned one by one, the plurality of first wiring boards are mounted on the second wiring board with higher productivity than the method of fixing to the second wiring board in the mounting process. Can do.

[Application Example 3]
A method for manufacturing a droplet discharge head according to this application example is a method for manufacturing a droplet discharge head in which a driving unit for discharging droplets vibrates a diaphragm, and wiring and a plurality of alignment marks are provided. Imaging the alignment mark of the arranged diaphragm and measuring the position of the alignment mark, and a plurality of wiring boards on which the wiring and the alignment mark are arranged Using the wiring board mark measurement step of imaging the alignment mark and measuring the position of the alignment mark, the measurement result of the diaphragm mark measurement step, and the measurement result of the wiring substrate mark measurement step, Connecting the vibration plate and the wiring board to a location where the wiring of the vibration board and the wiring of the wiring board face each other, and connecting the wiring of the vibration board and the wiring of the wiring board; Includes a mounting step of fixing, a, in the wiring substrate mark measurement step, capturing a plurality of said alignment mark in one image, and measuring the position of the mark for the alignment.

  According to this method for manufacturing a droplet discharge head, the position of the alignment mark for the diaphragm is measured in the diaphragm mark measuring step. Similarly, the positioning mark of the wiring board is measured in the wiring board mark measuring step. In the substrate matching step, the wiring of the diaphragm and the wiring of the wiring board are arranged so as to face each other. At this time, alignment is performed using the measured value of the alignment mark on the diaphragm and the measured value of the alignment mark on the plurality of wiring boards. Therefore, the diaphragm and the plurality of wiring boards can be adjusted to a predetermined relative position. Then, in the mounting process, the diaphragm and the wiring board are mounted by connecting and fixing the wiring of the diaphragm and the wiring of the wiring board.

  In the wiring board mark measurement step, the alignment mark on the wiring board is imaged and the position of the alignment mark is measured. At this time, a plurality of alignment marks are captured in one image and measured. Therefore, the position of the alignment marks in a predetermined number can be measured with a small number of times of imaging as compared with the method of imaging one alignment mark in one image. As a result, the droplet discharge head can be manufactured with high productivity.

[Application Example 4]
The method for manufacturing a droplet discharge head according to the application example described above further includes a substrate moving step of moving a relative position of the plurality of wiring boards to a predetermined position using a measurement result of the wiring board mark measuring step. It is characterized by.

  According to this method for manufacturing a droplet discharge head, the relative position of the wiring board is adjusted to a predetermined position in the substrate moving step. And the relative position of a some wiring board and a diaphragm is match | combined at the board | substrate matching process. In the mounting process, the plurality of wiring boards and the diaphragm are fixed. Therefore, the plurality of wiring boards can be mounted on the diaphragm with higher productivity than the method of aligning the plurality of wiring boards one by one and then fixing to the diaphragm in the mounting process.

[Application Example 5]
A mounting structure according to this application example, comprising: a plurality of first wiring boards on which wirings and alignment marks are arranged; and a second wiring board on which wirings and positioning marks are arranged. The wiring of the first wiring board and the wiring of the second wiring board are connected and mounted, and at least two of the alignment marks in the plurality of the first wiring boards are The first wiring board and the second wiring board are arranged in an imaging range of an imaging device that images the alignment mark when the first wiring board and the second wiring board are mounted.

  According to this mounting structure, the first wiring board and the second wiring board are mounted with their relative positions aligned by the alignment marks. Since a plurality of alignment marks are arranged in the imaging range of the imaging apparatus, the positions of the plurality of alignment marks can be measured by one imaging. Therefore, it is possible to provide a mounting structure capable of measuring the position of the alignment mark with high productivity as compared with the case where a plurality of alignment marks are measured one by one.

[Application Example 6]
In the mounting structure according to the application example, at least one of the first wiring boards has a convex portion in a planar direction of the first wiring substrate, and the alignment mark is formed on the convex portion. It is characterized by.

  According to this mounting structure, the alignment mark is arranged on the convex portion of the first wiring board. Therefore, even when there is an obstacle, a plurality of alignment marks can be arranged close to each other by arranging the convex portion while avoiding the obstacle.

[Application Example 7]
The liquid droplet ejection head according to this application example is a liquid droplet ejection head in which a driving unit for ejecting liquid droplets vibrates a vibration plate, and wiring and alignment marks are arranged on the vibration plate, A plurality of wiring boards on which wirings and alignment marks are arranged, wherein the wiring of the diaphragm and the wirings of the wiring board are connected and mounted, and among the positioning marks on the wiring boards At least two of the alignment marks are arranged in an imaging range of an imaging apparatus that images the alignment marks when the diaphragm and the wiring board are mounted.

  According to this droplet discharge head, the vibration plate and the wiring board are mounted with their relative positions aligned by the alignment marks. Since a plurality of alignment marks are arranged in the imaging range of the imaging apparatus, the positions of the plurality of alignment marks can be measured by one imaging. Therefore, compared to a case where a plurality of alignment marks are measured one by one, a droplet discharge head capable of measuring the position of the alignment marks with high productivity can be obtained.

[Application Example 8]
In the liquid droplet ejection head according to the application example, at least one of the wiring boards has a convex portion in a planar direction of the wiring substrate, and the alignment mark is formed on the convex portion. It is characterized by.

  According to this droplet discharge head, the alignment mark is arranged on the convex portion of the wiring board. Therefore, even when there is an obstacle, a plurality of alignment marks can be arranged close to each other by arranging the convex portion while avoiding the obstacle.

(First embodiment)
In the present embodiment, a characteristic mounting structure of the present invention and an example of manufacturing the mounting structure will be described with reference to FIGS. In the drawings used for the following description, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing.

(Mounting structure)
First, the mounting structure 1 will be described. FIG. 1A is a schematic perspective view showing the configuration of the mounting structure, and FIG. 1B is a schematic plan view of the mounting structure. As shown in FIG. 1, the mounting structure 1 includes a substrate 2 as a rectangular second wiring substrate on which wiring is formed. The longitudinal direction of the substrate 2 is defined as the Y direction, and the direction orthogonal to the Y direction in the planar direction of the substrate 2 is defined as the X direction. A direction perpendicular to the surface of the substrate 2 is taken as a Z direction. A rectangular plate-like first semiconductor element 3, second semiconductor element 4, and third semiconductor element 5 are disposed on the substrate 2 and are electrically connected by wiring.

  The second semiconductor element 4 is disposed in the center of the substrate 2, and the first semiconductor element 3 and the third semiconductor element 5 are disposed in the Y direction across the second semiconductor element 4. A flexible substrate 6 as a first wiring substrate is disposed on the substrate 2 and the first semiconductor element 3, and a flexible substrate 7 as a first wiring substrate is disposed on the substrate 2 and the third semiconductor element 5. Yes. The flexible substrate 6 and the flexible substrate 7 have flexibility and are arranged to face each other with the second semiconductor element 4 interposed therebetween. The flexible substrate 6 has a recess 6 a formed at a location facing the second semiconductor element 4, and the flexible substrate 7 has a recess 7 a formed at a location facing the second semiconductor element 4. And the 2nd semiconductor element 4 is arrange | positioned at the recessed part 6a and the recessed part 7a. Terminals are arranged in the X direction on the surface facing the substrate 2 in the recess 6a and the recess 7a. Similarly, a terminal is formed on the substrate 2 at a location facing this terminal. The terminals of the flexible substrate 6 and the terminals of the substrate 2 are electrically connected, and the terminals of the flexible substrate 7 and the terminals of the substrate 2 are electrically connected.

  Convex portions 6b and convex portions 6c are formed on both sides in the X direction of the concave portion 6a, and the convex portions 6b and the convex portions 6c are arranged with the second semiconductor element 4 sandwiched from the X direction. Similarly, also in the flexible substrate 7, convex portions 7b and convex portions 7c are formed on both sides of the concave portion 7a in the X direction, and the convex portions 7b and the convex portions 7c are arranged with the second semiconductor element 4 sandwiched from the X direction. . A circular alignment mark 6d is formed on the convex portion 6b, and a circular alignment mark 6e is also formed on the convex portion 6c. Similarly, a circular alignment mark 7d is formed on the convex portion 7b, and a circular alignment mark 7e is also formed on the convex portion 7c. In the substrate 2, an alignment mark 2a is formed between the alignment mark 6d and the alignment mark 7d, and an alignment mark 2b is formed between the alignment mark 6e and the alignment mark 7e. Is formed.

  The relative positions of the terminal formed on the flexible substrate 6, the alignment mark 6d, and the alignment mark 6e are formed with high accuracy. Similarly, the relative positions of the terminals formed on the flexible substrate 7, the alignment mark 7d, and the alignment mark 7e are formed with high accuracy. Also on the substrate 2, the terminals formed on the substrate 2, the alignment marks 2a, and the alignment marks 2b are formed with high accuracy.

(Mounting device)
Next, the mounting apparatus 10 for mounting in combination with substrates will be described. FIG. 2A is a schematic plan view of the mounting apparatus, and FIG. 2B is a schematic side view of the mounting apparatus. As shown in FIG. 2, the mounting apparatus 10 includes a base 11 formed in a rectangular parallelepiped plate shape. The longitudinal direction of the base 11 is the Y direction, and the direction orthogonal to the Y direction is the X direction. A direction orthogonal to the X direction and the Y direction is a Z direction, and the Z direction is a gravitational acceleration direction.

  A first fixed stage 12 is arranged in the Y direction on the base 11, and a pair of guide rails (not shown) extending in the Y direction are provided on the upper surface of the first fixed stage 12 so as to protrude over the entire width in the Y direction. A first Y stage 13 having a linear motion mechanism (not shown) corresponding to the pair of guide rails is attached to the upper side of the first fixed stage 12. The linear motion mechanism of the first Y stage 13 is, for example, a screw linear motion mechanism including a screw shaft (drive shaft) extending in the Y direction along the guide rail and a ball nut screwed to the screw shaft. The drive shaft is connected to a first Y-axis motor 13a that receives a predetermined pulse signal and rotates forward and backward in steps. When a drive signal corresponding to a predetermined number of steps is input to the first Y-axis motor 13a, the first Y-axis motor 13a rotates forward or reversely, and the first Y stage 13 corresponds to the same number of steps. It moves forward or backward at a predetermined speed along the Y direction.

  A pair of guide rails (not shown) extending in the X direction is provided on the upper surface of the first Y stage 13 so as to protrude over the entire width in the X direction. A first X stage 14 having a linear motion mechanism (not shown) corresponding to the pair of guide rails is attached to the upper side of the first Y stage 13. The linear motion mechanism of the first X stage 14 includes, for example, a mechanism similar to the first Y stage 13 and a first X-axis motor 14a, and moves forward or backward along the X direction at a predetermined speed. Yes.

  On the upper surface of the first X stage 14, a concentric guide rail (not shown) centered in the Z direction is provided. On the upper side of the first X stage 14, a first rotation stage 15 having a rotation mechanism that rotates around the center of a concentric guide rail as a rotation center is attached. The rotation mechanism of the first rotation stage 15 includes a reduction device (not shown) such as a harmonic drive (registered trademark), for example, and the reduction device reduces the rotation speed of the drive shaft and rotates the output shaft. The drive shaft is connected to a first rotation motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in steps. When a drive signal corresponding to a predetermined number of steps is input to the first rotation motor, the first rotation motor rotates forward or reverse, and the first rotation stage 15 is equivalent to the number of steps. , Normal rotation or reversal of a predetermined angle with the Z direction as the center.

  A first mounting table 16 is disposed on the upper surface of the first rotary stage 15. The first mounting table 16 is provided with a suction type substrate chuck mechanism (not shown). When the flexible substrate 6 is mounted on the first mounting table 16, the flexible substrate 6 is positioned and fixed at a predetermined position of the first mounting table 16 by the substrate chuck mechanism. The first stage 17 is constituted by the first fixed stage 12, the first Y stage 13, the first X stage 14, the first rotating stage 15, the first mounting table 16, and the like.

  A second stage 18 is arranged in a direction opposite to the Y direction of the first stage 17. The second stage 18 has the same configuration as the first stage 17, and a second fixed stage 19 is disposed on the base 11. A second Y stage 20 is disposed on the upper surface of the second fixed stage 19, and the second Y stage 20 includes a linear motion mechanism (not shown) and a second Y-axis motor 20a. When a drive signal corresponding to a predetermined number of steps is input to the second Y-axis motor 20a, the second Y stage 20 moves in the Y direction by an amount corresponding to the number of steps.

  A second X stage 21 is attached to the upper surface of the second Y stage 20, and the second X stage 21 includes a linear motion mechanism (not shown) and a second X axis motor 21a. When a drive signal corresponding to a predetermined number of steps is input to the second X-axis motor 21a, the second X stage 21 is moved in the X direction by an amount corresponding to the number of steps.

  A second rotary stage 22 is attached to the upper surface of the second X stage 21, and the second rotary stage 22 includes a rotation mechanism (not shown). The rotation mechanism includes a reduction gear and a second rotation motor similar to those of the first rotation stage 15, and the second rotation is performed when a drive signal corresponding to a predetermined number of steps is input to the second rotation motor. The stage 22 performs forward or reverse rotation at a predetermined angle around the Z direction by an amount corresponding to the number of steps.

  A second mounting table 23 is disposed on the upper surface of the second rotary stage 22. The second mounting table 23 is provided with a suction type substrate chuck mechanism (not shown). When the flexible substrate 7 is mounted on the second mounting table 23, the flexible substrate 7 is positioned and fixed at a predetermined position on the second mounting table 23 by the substrate chuck mechanism. The second stage 18 is constituted by the second fixed stage 19, the second Y stage 20, the second X stage 21, the second rotary stage 22, the second mounting table 23, and the like.

  A third stage 24 is arranged in a direction opposite to the Y direction of the second stage 18. The third stage 24 has the same configuration as the first stage 17 and is formed longer in the Y direction than the first stage 17 and the second stage 18. In the third stage 24, a third fixed stage 25 is disposed on the base 11. A third Y stage 26 is disposed on the upper surface of the third fixed stage 25, and the third Y stage 26 includes a linear motion mechanism (not shown) and a third Y-axis motor 26a. When a drive signal corresponding to a predetermined number of steps is input to the third Y-axis motor 26a, the third Y stage 26 moves in the Y direction by an amount corresponding to the number of steps.

  A third X stage 27 is attached to the upper surface of the third Y stage 26, and the third X stage 27 includes a linear motion mechanism (not shown) and a third X axis motor 27a. When a drive signal corresponding to a predetermined number of steps is input to the third X-axis motor 27a, the third X stage 27 moves in the X direction by an amount corresponding to the number of steps.

  A third rotary stage 28 is attached to the upper surface of the third X stage 27, and the third rotary stage 28 includes a rotation mechanism (not shown). The rotation mechanism includes a reduction device and a third rotation motor similar to those of the first rotation stage 15, and when a drive signal corresponding to a predetermined number of steps is input to the third rotation motor, the third rotation stage 28. Are rotated or reversed at a predetermined angle around the Z direction by an amount corresponding to the number of steps.

  A third mounting table 29 is disposed on the upper surface of the third rotary stage 28. The third mounting table 29 is provided with a suction type substrate chuck mechanism (not shown). When the substrate 2 is mounted on the third mounting table 29, the substrate 2 is positioned and fixed at a predetermined position of the third mounting table 29 by the substrate chuck mechanism. The third stage 24 is configured by the third fixed stage 25, the third Y stage 26, the third X stage 27, the third rotary stage 28, the third mounting table 29, and the like.

  A pair of guide rails 32 and guide rails 33 extending in the Y direction are provided on the upper surfaces of both ends in the X direction of the base 11 so as to protrude over the entire width in the Y direction. A fourth stage 34 provided with a linear motion mechanism (not shown) corresponding to the pair of guide rails 32 and the guide rails 33 is attached to the upper side of the base 11. The fourth stage 34 includes a moving part 34 a that slides and moves with the guide rail 32 and a moving part 34 b that slides and moves with the guide rail 33. And the support part 34c and the support part 34d are standingly arranged by the moving part 34a and the moving part 34b, respectively. A bridging portion 34e is constructed over the support portion 34c and the support portion 34d. Since the fourth stage 34 is formed in a portal shape by the support portion 34c, the support portion 34d, and the bridging portion 34e, the fourth stage 34 does not collide with the first stage 17, the second stage 18, and the third stage 24. It is movable in the Y direction. The linear motion mechanism of the fourth stage 34 includes, for example, a mechanism similar to the first Y stage 13 and a fourth Y-axis motor (not shown), and moves forward or backward along the Y direction at a predetermined speed. ing.

  The fourth stage 34 includes a heater elevating device 35 at the bridging portion 34e, and a suction heating device 36 on the base 11 side of the heater elevating device 35. The heater elevating device 35 includes an air cylinder that moves up and down, and the suction heating device 36 can be moved up and down by driving the air cylinder. The suction heating device 36 is provided with a suction-type substrate chuck mechanism so that the flexible substrate 6 and the flexible substrate 7 can be adsorbed. Furthermore, the suction heating device 36 includes a heating mechanism inside and can generate heat.

  Gate-shaped support portions 37 are disposed in the vicinity of the first stage 17 on both sides in the X direction of the base 11. The support part 37 includes a pair of support pillars 37a and support pillars 37b erected on the side surface of the base 11, and a bridging part 37c bridged between the support pillars 37a and the support pillars 37b. A first imaging device 38 and a second imaging device 39 are disposed in the bridging portion 37c. The first imaging device 38 includes a first illumination device 38a and an imaging lens 38b, and light emitted from the first illumination device 38a is applied to the flexible substrate 6 and the flexible substrate 7 through the imaging lens 38b. . The first imaging device 38 can image the flexible substrate 6 and the flexible substrate 7 irradiated with light. Similarly, the second imaging device 39 includes a second illumination device 39a and an imaging lens 39b, and can image the flexible substrate 6 and the flexible substrate 7 irradiated with light.

  Gate-shaped support portions 40 are disposed in the vicinity of the third stage 24 on both sides in the X direction of the base 11. The support portion 40 includes a pair of support columns 40a and 40b that are erected on the side surface of the base 11, and a bridging portion 40c that is bridged between the support columns 40a and 40b. A third imaging device 41 and a fourth imaging device 42 are disposed in the bridging portion 40c. The 3rd imaging device 41 is provided with the 3rd illumination device 41a and the imaging lens 41b, and can image the board | substrate 2 irradiated with light. Similarly, the fourth imaging device 42 includes a fourth illumination device 42a and an imaging lens 42b, and can image the substrate 2 irradiated with light.

  FIG. 3 is an electric control block diagram of the mounting apparatus. In FIG. 3, the control device 45 of the mounting apparatus 10 includes a CPU (arithmetic processing device) 46 that performs various arithmetic processes as a processor and a memory 47 that stores various information.

  The first X stage driving device 48, the first X stage position detecting device 49, the first Y stage driving device 50, the first Y stage position detecting device 51, the first rotating stage driving device 52, and the first rotating stage angle detecting device 53 are input / output. It is connected to the CPU 46 via the interface 54 and the data bus 55. Further, the second X stage driving device 56, the second X stage position detecting device 57, the second Y stage driving device 58, the second Y stage position detecting device 59, the second rotating stage driving device 60, and the second rotating stage angle detecting device 61 are: The CPU 46 is connected via an input / output interface 54 and a data bus 55. Further, the third X stage driving device 62, the third X stage position detecting device 63, the third Y stage driving device 64, the third Y stage position detecting device 65, the third rotating stage driving device 66, and the third rotating stage angle detecting device 67 are: The CPU 46 is connected via an input / output interface 54 and a data bus 55. Further, the fourth stage driving device 68 and the fourth stage position detecting device 69 are connected to the CPU 46 via the input / output interface 54 and the data bus 55.

  Further, the first imaging device 38, the second imaging device 39, the third imaging device 41, and the fourth imaging device 42 are connected to the CPU 46 via the input / output interface 54 and the data bus 55. Further, the first illumination device 38 a, the second illumination device 39 a, the third illumination device 41 a, and the fourth illumination device 42 a are connected to the CPU 46 via the input / output interface 54 and the data bus 55. Further, the heater elevating device 35, the suction heating device 36, the input device 72, and the display device 73 are also connected to the CPU 46 via the input / output interface 54 and the data bus 55.

  The first X stage driving device 48 is a device that controls the movement of the first X stage 14 by driving the first X axis motor 14a, and the first X stage position detecting device 49 is a device that detects the position of the first X stage 14. is there. Similarly, the first Y stage driving device 50 is a device that controls the movement of the first Y stage 13 by driving the first Y axis motor 13a, and the first Y stage position detecting device 51 detects the position of the first Y stage 13. It is a device to do. The first rotary stage driving device 52 is a device that controls the rotation of the first rotary stage 15 by driving the first rotary motor 15a, and the first rotary stage angle detecting device 53 is the rotation of the first rotary stage 15. It is a device that detects the angle. The first X stage position detection device 49, the first Y stage position detection device 51, and the first rotation stage angle detection device 53 detect the position and rotation angle of the first stage 17. Then, the first X stage driving device 48, the first Y stage driving device 50, and the first rotary stage driving device 52 move the first stage 17, whereby the flexible substrate 6 can be moved and stopped to a desired position. It has become.

  Similarly, the second X stage driving device 56 controls the movement of the second X stage 21 by driving the second X axis motor 21a, and the second X stage position detecting device 57 detects the position of the second X stage 21. It is a device to do. Similarly, the second Y stage driving device 58 is a device that controls the movement of the second Y stage 20 by driving the second Y axis motor 20a, and the second Y stage position detecting device 59 detects the position of the second Y stage 20. It is a device to do. The second rotary stage driving device 60 is a device that controls the rotation of the second rotary stage 22 by driving the second rotary motor 22a, and the second rotary stage angle detecting device 61 is the rotation of the second rotary stage 22. It is a device that detects the angle. The second X stage position detection device 57, the second Y stage position detection device 59, and the second rotation stage angle detection device 61 detect the position and rotation angle of the second stage 18. The second X stage driving device 56, the second Y stage driving device 58, and the second rotary stage driving device 60 can move and stop the flexible substrate 7 to a desired position by moving the second stage 18. It has become.

  Similarly, the third X stage driving device 62 is a device that controls the movement of the third X stage 27 by driving the third X axis motor 27a, and the third X stage position detecting device 63 detects the position of the third X stage 27. It is a device to do. Similarly, the third Y stage driving device 64 is a device that controls the movement of the third Y stage 26 by driving the third Y axis motor 26a, and the third Y stage position detecting device 65 detects the position of the third Y stage 26. It is a device to do. The third rotary stage driving device 66 is a device that controls the rotation of the third rotary stage 28 by driving the third rotary motor 28a, and the third rotary stage angle detecting device 67 is the rotation of the third rotary stage 28. It is a device that detects the angle. The third X stage position detection device 63, the third Y stage position detection device 65, and the third rotation stage angle detection device 67 detect the position and rotation angle of the third stage 24. Then, the third X stage driving device 62, the third Y stage driving device 64, and the third rotating stage driving device 66 move the third stage 24, so that the substrate 2 can be moved and stopped to a desired position. ing.

  The fourth stage driving device 68 is a device that controls the movement of the fourth stage 34 by driving the fourth Y-axis motor 34f, and the fourth stage position detecting device 69 is a device that detects the position of the fourth stage 34. is there. The fourth stage position detection device 69 detects the position of the fourth stage 34, and the fourth stage drive device 68 moves the fourth stage 34, thereby moving and stopping the suction heating device 36 to a desired position. Is possible.

  The first imaging device 38 and the second imaging device 39 are devices that image the flexible substrate 6 and the flexible substrate 7, and can output the captured image data to the CPU 46. Similarly, the third imaging device 41 and the fourth imaging device 42 are devices that image the substrate 2, and can output the captured image data to the CPU 46. The first illumination device 38a and the second illumination device 39a are devices that irradiate light to the flexible substrate 6 and the flexible substrate 7, and the third illumination device 41a and the fourth illumination device 42a are devices that irradiate the substrate 2 with light. . The first illumination device 38 a, the second illumination device 39 a, the third illumination device 41 a, and the fourth illumination device 42 a can start and stop the light irradiation and change the intensity of the light to be irradiated by an instruction signal from the CPU 46.

  The heater elevating device 35 is a device that raises and lowers the suction heating device 36 in accordance with an instruction signal from the CPU 46. The suction heating device 36 is a device that starts and stops the suction of the flexible substrate 6 and the flexible substrate 7 according to an instruction signal from the CPU 46, and further starts and stops heating the flexible substrate 6 and the flexible substrate 7 according to an instruction signal from the CPU 46. It is a device which performs. The input device 72 is a device for inputting various processing conditions to be mounted. For example, the input device 72 receives coordinates such as the alignment mark 2a, the alignment mark 6d, and the alignment mark 7d from an external device (not shown) and inputs them. It is a device to do. The display device 73 is a device that displays processing conditions and work status, and an operator performs an operation using the input device 72 based on information displayed on the display device 73.

  The memory 47 is a concept including a semiconductor memory such as a RAM and a ROM, and an external storage device such as a hard disk and a CD-ROM. Functionally, a storage area for storing program software 74 in which a procedure for controlling operations in the mounting apparatus 10 is described is set. Further, a storage area for storing mark position data 75, which is coordinate data of the mark position, such as the alignment mark 2a, the alignment mark 6d, and the alignment mark 7d, is also set. In addition, a storage area for storing illumination condition data 76 that is illumination condition data when the first illumination device 38a to the fourth illumination device 42a illuminate the substrate 2 and the like, and the first imaging device 38 to the first imaging device 38 A storage area for storing imaging data 77 that is image data captured by the four imaging devices 42 is set. In addition, pressure condition data 78 that is data such as heating conditions when the suction heating device 36 heats and pressure conditions when the suction heating device 36 is pressed against the substrate 2, a work area and a temporary file for the CPU 46. And other various storage areas are set.

  The CPU 46 performs control for arranging the flexible substrate 6 and the flexible substrate 7 on the substrate 2 in accordance with the program software 74 stored in the memory 47. As specific function implementation units, there are a stage control calculation unit 79, an illumination control calculation unit 80, an imaging control calculation unit 81, a mark position calculation unit 82, a crimp control calculation unit 83, and the like. The stage control calculation unit 79 performs a calculation for moving and stopping the first stage 17 to the fourth stage 34 to a predetermined place. The illumination control calculation unit 80 calculates the light intensity so that the first imaging device 38 to the fourth imaging device 42 capture an appropriate image. The imaging control calculation unit 81 issues an instruction to the first imaging device 38 to the fourth imaging device 42 to capture an image such as the alignment mark 2a. The mark position calculation unit 82 calculates the mark position using the captured image. The mark position calculation unit 82 calculates the coordinate of the mark position using the mark position data calculated by the imaging control calculation unit 81 and the position data of the first imaging device 38 to the fourth imaging device 42. The pressure bonding control calculation unit 83 performs a calculation for the suction heating device 36 to realize pressure bonding between the substrate 2, the flexible substrate 6, and the flexible substrate 7.

(Manufacturing method of mounting structure)
Next, the manufacturing method which arrange | positions the flexible substrate 6 and the flexible substrate 7 to the board | substrate 2 using the mounting apparatus 10 mentioned above is demonstrated in FIGS. FIG. 4 is a flowchart showing a manufacturing process of a mounting structure in which two substrates are arranged on the substrate. FIGS. 5 to 7 show a manufacturing method of the mounting structure in which two substrates are arranged on the substrate. It is a figure explaining.

  Step S1 corresponds to a first mark measurement step, and is a step of measuring the positions of alignment marks formed on the two flexible substrates after placing the two flexible substrates on the stage. Next, the process proceeds to step S2. Step S2 corresponds to a substrate moving step, and is a step of moving the two flexible substrates to set the relative position of the alignment mark to a predetermined position. Next, the process proceeds to step S3. Step S3 corresponds to a second mark measurement step, and is a step of measuring the position of the alignment mark formed on the substrate after placing the substrate on the stage. Next, the process proceeds to step S4. Step S4 corresponds to a substrate aligning process, and is a process of aligning the positions by stacking two flexible substrates on the substrate. Next, the process proceeds to step S5. Step S5 corresponds to a mounting process and is a process of bonding the substrate and the two flexible substrates. Thus, the manufacturing process for manufacturing the mounting structure in which the two substrates are arranged on the substrate is completed.

  Next, a manufacturing method of a mounting structure in which two substrates are arranged on a substrate will be described in detail with reference to FIGS. FIG. 5A to FIG. 5C are diagrams corresponding to the first mark measurement process of step S1. As shown in FIG. 5A, after the flexible substrate 6 is placed on the first placement table 16 of the first stage 17, the flexible substrate 6 is attracted to the first placement table 16. A plurality of positioning pins are arranged on the first mounting table 16, and the flexible substrate 6 can be arranged at a substantially predetermined position by placing the flexible substrate 6 in contact with the side surface of the positioning pin. It is like that. Similarly, after mounting the flexible substrate 7 on the second mounting table 23 of the second stage 18, the flexible substrate 7 is attracted to the second mounting table 23. A plurality of positioning pins are also arranged on the second mounting table 23. By placing the flexible substrate 7 so as to be in contact with the side surface of the positioning pin, the flexible substrate 7 can be disposed at a substantially predetermined position. It is like that.

  Next, the convex part 6b and the convex part 7b are irradiated by turning on the first illumination device 38a. And the 1st imaging device 38 images the convex part 6b and the convex part 7b. Similarly, the projection 6c and the projection 7c are irradiated by turning on the second illumination device 39a. And the 2nd imaging device 39 images the convex part 6c and the convex part 7c. At this time, focus adjustment of the imaging lens 38b and the imaging lens 39b is performed in advance so that an image to be captured becomes clear.

  FIG. 5B shows an image 84 captured by the first imaging device 38. In the image 84, an alignment mark 6d and an alignment mark 7d are captured. Therefore, the position of the alignment mark 6d and the alignment mark 7d can be measured using one image 84.

  The imaging device can measure the positions of the alignment mark 6d and the alignment mark 7d with higher accuracy when the number of effective pixels that can be imaged is larger. On the other hand, as the number of effective pixels increases, it is difficult to manufacture an image pickup device free from pixel defects, and thus it is difficult to prepare an image pickup device free from pixel defects and having a large number of effective pixels. In the present embodiment, for example, an imaging apparatus including 1000 pixels in both the vertical direction and the horizontal direction is employed. Then, the measurement resolution is set to 0.6 μm by setting the magnification of the imaging lens so that the imaging range is 0.6 mm both vertically and horizontally. Therefore, the imaging range is set by multiplying the desired measurement resolution by the number of pixels. Then, after the alignment mark is formed so that the two alignment marks are in the imaging range, the two alignment marks are arranged at the desired measurement resolution by arranging them so as to be in the imaging range. Can be measured. In the present embodiment, the first imaging device 38, the second imaging device 39, the third imaging device 41, and the fourth imaging device 42 employ an imaging device having the above-described number of pixels. Then, by setting the magnification of the imaging lens described above, the measurement resolution when using each imaging device is set to 0.6 μm, for example.

  Next, the mark position calculation unit 82 calculates the positions of the center 6f of the alignment mark 6d and the center 7f of the alignment mark 7d. The calculation of the positions of the center 6f and the center 7f is performed by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the first reference position 84a at the lower left of the image 84 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the first reference position 84 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the first reference position 84a and the coordinate data of the center 6f and the center 7f with the first reference position 84a as the origin, the mark position calculation unit 82 uses the center 6f on the coordinate axis of the mounting apparatus 10 and The coordinates of the center 7f are calculated.

  FIG. 5C shows an image 85 captured by the second imaging device 39. Similar to the image 84, the image 85 includes the alignment mark 6e and the alignment mark 7e. Accordingly, the position of the alignment mark 6e and the alignment mark 7e can be measured using one image 85.

  Next, the mark position calculation unit 82 calculates the positions of the center 6g of the alignment mark 6e and the center 7g of the alignment mark 7e. The calculation of the positions of the center 6g and the center 7g is calculated by multiplying the number of pixels in the X direction and the Y direction by the second reference position 85a at the lower left of the image 85 and the measurement resolution. Next, the mark position calculation unit 82 inputs the coordinate data of the second reference position 85 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the second reference position 85a and the coordinate data of the center 6g and the center 7g with the second reference position 85a as the origin, the mark position calculation unit 82 uses the center 6g on the coordinate axis of the mounting apparatus 10 and The coordinates of the center 7g are calculated.

  FIG. 5D is a diagram corresponding to the substrate moving process in step S2. As shown in FIG. 5 (d), the flexible substrate 6 is placed on the first placement table 16, and the flexible substrate 7 is placed on the second placement table 23. The stage control calculation unit 79 calculates a difference between data obtained by measuring the center 6f, the center 6g, the center 7f, and the center 7g and a target location where each center is arranged.

  Specifically, first, the midpoint between the center 6f and the center 6g is calculated, and the difference between the midpoint and the target location where the midpoint is placed is calculated. Next, the angle formed by the line connecting the center 6f and the center 6g and the X axis is calculated. Then, the difference between this line segment and the target angle for arranging the line segment is calculated. Subsequently, by driving the first stage 17 based on the calculated difference, the flexible substrate 6 is moved in the XY direction and rotated around the Z direction of the middle point. Then, the stage control calculation unit 79 moves to substantially the same location as the target location for the center 6f and the center 6g. Next, by the same method, the stage control calculation unit 79 moves to the substantially same place as the target place with the center 7f and the center 7g.

  FIG. 6A to FIG. 6C are diagrams corresponding to the second mark measurement process in step S3. As shown in FIG. 6A, after the substrate 2 is placed on the third placement table 29 of the third stage 24, the substrate 2 is attracted to the third placement table 29. A plurality of positioning pins are arranged on the third mounting table 29, and the substrate 2 can be placed at a substantially predetermined position by placing the substrate 2 in contact with the side surface of the positioning pins. It has become.

  Next, the alignment mark 2a and the alignment mark 2b are irradiated by turning on the third illumination device 41a and the fourth illumination device 42a. Then, the third imaging device 41 images the alignment mark 2a, and the fourth imaging device 42 images the alignment mark 2b. At this time, focus adjustment of the imaging lens 41b and the imaging lens 42b is performed in advance so that an image to be captured becomes clear.

  FIG. 6B shows an image 86 captured by the third imaging device 41. In the image 86, the alignment mark 2a is captured. Next, the mark position calculation unit 82 calculates the position of the center 2c of the alignment mark 2a. The calculation of the position of the center 2c is performed by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the third reference position 86a at the lower left of the image 86 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the third reference position 86 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the third reference position 86a and the coordinate data of the center 2c with the third reference position 86a as the origin, the mark position calculation unit 82 calculates the coordinates of the center 2c on the coordinate axis of the mounting apparatus 10. To do.

  FIG. 6C shows an image 87 captured by the fourth imaging device 42. Similar to the image 86, the alignment mark 2 b is captured in the image 87. Next, the mark position calculation unit 82 calculates the position of the center 2d of the alignment mark 2b. The calculation of the position of the center 2d is performed by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the fourth reference position 87a at the lower left of the image 87 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the fourth reference position 87 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the fourth reference position 87a and the coordinate data of the center 2d with the fourth reference position 87a as the origin, the mark position calculation unit 82 calculates the coordinates of the center 2d on the coordinate axis of the mounting apparatus 10. To do.

  FIG. 6D to FIG. 7C are diagrams corresponding to the substrate alignment process in step S4. As shown in FIG. 6D, the substrate 2 is placed on the third placement table 29. The stage control calculation unit 79 calculates the difference between the data obtained by measuring the centers 2c and 2d and the target location where each center is arranged.

  Specifically, first, the midpoint between the center 2c and the center 2d is calculated, and the difference between this midpoint and the target location where the midpoint is placed is calculated. Next, the angle formed by the line connecting the center 2c and the center 2d and the X axis is calculated. Then, the difference between this line segment and the target angle for arranging the line segment is calculated. Subsequently, by driving the third stage 24 based on the calculated difference, the substrate 2 is moved in the XY directions and rotated around the Z direction of the middle point. Then, the stage control calculation unit 79 moves to substantially the same location as the target location for the centers 2c and 2d.

  Next, as shown in FIG. 7A, the stage control calculation unit 79 moves the fourth stage 34 so that the suction heating device 36 faces the place between the flexible substrate 6 and the flexible substrate 7. Move to. Subsequently, the stage control calculation unit 79 drives the heater lifting device 35 to lower the suction heating device 36. Then, the stage control calculation unit 79 brings the suction heating device 36 into contact with the flexible substrate 6 and the flexible substrate 7. Next, the stage control calculation unit 79 drives the substrate chuck mechanism of the suction heating device 36 to attract the flexible substrate 6 and the flexible substrate 7 to the suction heating device 36. Then, the stage control calculation unit 79 drives the heater elevating device 35 to raise the suction heating device 36.

  Next, as illustrated in FIG. 7B, the stage control calculation unit 79 moves the fourth stage 34 to move the suction heating device 36 to a place facing the substrate 2. Subsequently, as illustrated in FIG. 7C, the stage control calculation unit 79 drives the heater lifting device 35 to lower the suction heating device 36. At this time, the flexible substrate 6 and the flexible substrate 7 are aligned with the suction heating device 36, and the suction heating device 36 moves to a preset position. And since the board | substrate 2 is also aligned to the preset position, the flexible substrate 6, the flexible substrate 7, and the board | substrate 2 are arrange | positioned in the preset relative position.

  FIG. 7C and FIG. 7D are diagrams corresponding to the mounting process of step S5. As shown in FIG. 7C, the crimping control calculation unit 83 presses the flexible substrate 6 and the flexible substrate 7 against the substrate 2 with a predetermined pressure. An anisotropic conductive paste is applied in advance to a place in contact with the substrate 2 in the vicinity of the concave portion 6a of the flexible substrate 6 and in the vicinity of the concave portion 7a of the flexible substrate 7, and then the anisotropic conductive paste is dried. . Subsequently, the crimping control calculation unit 83 causes the suction heating device 36 to generate heat, thereby heating the flexible substrate 6 and the flexible substrate 7 to a predetermined temperature. Then, after a predetermined time has elapsed, the crimping control calculation unit 83 cools the suction heating device 36.

  As a result, as shown in FIG. 7D, the substrate 2, the flexible substrate 6, and the flexible substrate 7 are fixed. Conductive particles are mixed in the anisotropic conductive paste, and the terminals formed on the flexible substrate 6 and the terminals formed on the substrate 2 are electrically connected by the conductive particles. Similarly, the terminals formed on the flexible substrate 7 and the terminals formed on the substrate 2 are electrically connected. Since the board | substrate 2, the flexible board | substrate 6, and the flexible board | substrate 7 are each arrange | positioned after adjusting a position, each corresponding terminal can be electrically connected with sufficient quality. Through the above steps, the manufacturing process for manufacturing the mounting structure in which two substrates are arranged on the substrate is completed.

As described above, the present embodiment has the following effects.
(1) According to the present embodiment, in the first mark measurement process of step S1, the alignment marks 6d, 6e, 7d, and 7e are imaged and the positions of the alignment marks are measured. At this time, the alignment mark 6d and the alignment mark 7d are imaged on one image 84 and measured. Similarly, the positioning mark 6e and the positioning mark 7e are imaged on one image 85 and measured. Therefore, the position of the alignment marks in a predetermined number can be measured with a small number of times of imaging as compared with the method of imaging one alignment mark in one image. As a result, the position of the alignment mark can be measured with high productivity.

  (2) According to the present embodiment, the relative positions of the flexible substrate 6 and the flexible substrate 7 are adjusted to a predetermined position in the substrate moving process of step S2. And the relative position of the flexible substrate 6 and the flexible substrate 7, and the board | substrate 2 is match | combined at the board | substrate matching process of step S4. In the mounting process in step S5, the flexible substrate 6 and the flexible substrate 7 are simultaneously fixed to the substrate 2. Therefore, after the flexible substrate 6 and the substrate 2 are fixed in the mounting process, the flexible substrate 6 and the flexible substrate 7 are mounted on the substrate 2 with higher productivity than the method of fixing the flexible substrate 7 and the substrate 2 together. Can do.

  (3) According to this embodiment, in the flexible substrate 6, the alignment mark 6d is formed on the convex portion 6b, and the alignment mark 6e is formed on the convex portion 6c. Similarly, in the flexible substrate 7, an alignment mark 7d is formed on the convex portion 7b, and an alignment mark 7e is formed on the convex portion 7c. Accordingly, even when the second semiconductor element 4 is present on the substrate 2, a plurality of alignment marks can be obtained by arranging the convex portions 6b, the convex portions 6c, the convex portions 7b, and the convex portions 7c while avoiding the second semiconductor element 4. Can be placed close together.

(Second Embodiment)
Next, an embodiment of a droplet discharge head and a manufacturing method thereof will be described with reference to FIGS. This embodiment is different from the first embodiment in that a droplet discharge head is manufactured by using a mounting structure manufacturing method. Note that description of the same points as in the first embodiment is omitted.

(Droplet ejection head)
First, the droplet discharge head will be described. FIG. 8 is a schematic perspective view showing the configuration of the droplet discharge head. FIG. 8A is a view as seen from the liquid supply side, and FIG. 8B is a view as seen from the droplet discharge side. As shown in FIG. 8, the droplet discharge head 91 is formed in a substantially rectangular parallelepiped. The longitudinal direction of the droplet discharge head 91 is defined as the X direction, and the direction orthogonal to the longitudinal direction is defined as the Y direction. The direction in which the droplet discharge head 91 discharges droplets is the direction opposite to the Z direction.

  The droplet discharge head 91 includes a nozzle plate 93 on which nozzles 92 for discharging droplets are formed. The nozzle plate 93 only needs to be a plate material that is resistant to droplets and is resistant to corrosion, and a metal plate, a silicon plate, a glass plate, or the like can be used. In the present embodiment, for example, a stainless plate is employed. The nozzle plate 93 is formed with two rows of nozzles 92, and nine nozzles 92 are formed in each row. The number of nozzles in each row is not limited to nine and can be set according to the required specifications of the droplet discharge head 91.

  A substantially rectangular parallelepiped flow path forming substrate 94 is disposed so as to overlap with the nozzle plate 93, and a vibration plate 95 is disposed so as to overlap with the flow path forming substrate 94. The flow path forming substrate 94 only needs to be a plate material having corrosion resistance and rigidity against droplets, and a metal plate, a silicon plate, a glass plate, or the like can be used. In the present embodiment, for example, a plate made of a silicon single crystal is employed. The vibration plate 95 may be a plate material that has corrosion resistance against droplets, vibration that can vibrate, and strength, and may be a metal plate, a silicon plate, a glass plate, a reinforced resin, or the like. In the present embodiment, for example, a stainless plate is employed.

  A pair of reinforcing members 96 and 97 having a substantially rectangular parallelepiped shape are arranged on the diaphragm 95 so as to overlap each other. The reinforcing member 96 and the reinforcing member 97 are arranged apart from each other, and a space is formed between the reinforcing member 96 and the reinforcing member 97. The reinforcing member 96 and the reinforcing member 97 may be any plate material that is resistant to liquid droplets and has rigidity, and may be a metal plate, a silicon plate, a glass plate, or the like. In the present embodiment, for example, a plate made of a silicon single crystal is employed. An introduction port 96a and an introduction port 97a are formed in the reinforcing member 96 and the reinforcing member 97, respectively, so that the liquid material constituting the liquid droplets to be discharged can be supplied.

  A flexible board 98 as a wiring board is disposed so as to overlap with the reinforcing member 96, and a flexible board 99 as a wiring board is disposed so as to overlap with the reinforcing member 97. A part of the flexible substrate 98 and the flexible substrate 99 is fixed to the diaphragm 95 between the reinforcing member 96 and the reinforcing member 97. The flexible substrate 98 and the flexible substrate 99 are flexible substrates, and wirings for supplying electric signals to the droplet discharge head 91 are formed on the surfaces of the flexible substrate 98 and the flexible substrate 99 facing the vibration plate 95. Yes. The drive circuit unit 100 is disposed on the surface of the flexible substrate 98 and the flexible substrate 99 where the wiring is formed. The drive circuit unit 100 has a function of forming a drive signal for discharging a droplet from an electric signal input to the droplet discharge head 91.

  FIG. 9 is a schematic exploded perspective view showing the structure of the droplet discharge head. As shown in FIG. 9, a pressure chamber 101 is formed at a location facing the nozzle 92 in the flow path forming substrate 94, and the nozzle 92 and the pressure chamber 101 are arranged to communicate with each other. Therefore, the same number of pressure chambers 101 as the nozzles 92 are arranged on the flow path forming substrate 94 in two rows like the nozzles 92. A channel hole 102 is formed in the channel forming substrate 94, and the channel hole 102 is connected to each pressure chamber 101 by a channel (not shown).

  A driving element 103 serving as a driving unit is disposed at a location facing the pressure chamber 101 on the vibration plate 95 disposed so as to overlap the flow path forming substrate 94. Therefore, the same number of drive elements 103 as the nozzles 92 are arranged in the diaphragm 95 in two rows like the nozzles 92. A lower electrode film 104 and an upper electrode film 105 are disposed on the drive element 103, and the lower electrode film 104 and the upper electrode film 105 are disposed between the two rows of drive elements 103. The lower electrode film 104 is connected to the wiring 104 a extending in the X direction between the two rows of driving elements 103. The lower electrode film 104 of each drive element 103 is electrically connected. A flow path hole 106 is disposed at a position facing the flow path hole 102 in the vibration plate 95, and the flow path hole 102 and the flow path hole 106 are connected to each other.

  A pair of reinforcing member 96 and reinforcing member 97 are disposed on the diaphragm 95 on which the drive element 103 is disposed. The introduction port 96a formed in the reinforcing member 96, the flow path hole 106, and the flow path hole 102 are connected and arranged so that the liquid can pass through each hole. Similarly, the introduction port 97a formed in the reinforcing member 97, the flow path hole 106, and the flow path hole 102 are connected to each other so that the liquid can pass through each hole.

  FIG. 10A is a schematic plan view showing a droplet discharge head. As shown in FIG. 10A, the flexible substrate 98 includes a convex portion 98a on the lower left side and a convex portion 98b on the lower right side. A terminal portion 98g in which terminals are arranged is arranged between the convex portion 98a and the convex portion 98b on the surface of the flexible substrate 98 on the diaphragm 95 side. Similarly, the flexible substrate 99 includes a convex portion 99a on the upper left side and a convex portion 99b on the upper right side. And, on the surface of the flexible substrate 99 on the vibration plate 95 side, a terminal portion 99g in which terminals are arranged is arranged between the convex portion 99a and the convex portion 99b. The convex portion 98a and the convex portion 99a are arranged to face each other, and the convex portion 98b and the convex portion 99b are arranged to face each other.

  FIG.10 (b) and FIG.10 (c) are principal part schematic plan views which show a flexible substrate. As shown in FIG. 10B, an alignment mark 98c is formed on the convex portion 98a, and an alignment mark 99c is formed on the convex portion 99a. An alignment mark 95a is formed on the diaphragm 95 at a location between the convex portion 98a and the convex portion 99a. Similarly, as shown in FIG. 10C, an alignment mark 98d is formed on the convex portion 98b, and an alignment mark 99d is formed on the convex portion 99b. An alignment mark 95b is formed on the diaphragm 95 at a location between the convex portion 98b and the convex portion 99b. The alignment mark 95a and the alignment mark 95b can be manufactured in the same process using the same material as the lower electrode film 104 or the upper electrode film 105.

  FIG. 10D is a schematic cross-sectional view showing the structure of the droplet discharge head. As shown in FIG. 10D, the droplet discharge head 91 includes a nozzle plate 93, and the nozzle 92 is formed on the nozzle plate 93. A pressure chamber 101 communicating with the nozzle 92 is formed at a location above the nozzle plate 93 and facing the nozzle 92. Then, the liquid material 111 stored in a supply device (not shown) is supplied to the pressure chamber 101 through a flow channel 101a and a pressure chamber inlet 101b such as a flow channel and an introduction port 97a and a flow channel hole 102 (not shown).

  Above the pressure chamber 101, a vibration plate 95 that vibrates in the vertical direction (Z direction) and expands and contracts the volume in the pressure chamber 101, and a drive unit that expands and contracts in the left-right direction to vibrate the vibration plate 95. A drive element 103 is provided. In the drive element 103, a lower electrode film 104, a piezoelectric element 107, and an upper electrode film 105 are arranged on the upper surface of the diaphragm 95 in this order. An insulating film (not shown) is formed on the surface of the diaphragm 95 on which the driving element 103 is disposed, and even when a current flows through the lower electrode film 104 and the upper electrode film 105, a current flows through the diaphragm 95. It is supposed not to. The piezoelectric element 107 can be expanded and contracted by applying a voltage between the lower electrode film 104 and the upper electrode film 105.

  A reinforcing member 97 is arranged above the drive element 103 (Z direction). A recess 97 b is formed on the drive element 103 side of the reinforcing member 97, and the recess 97 b is disposed so as to cover the drive element 103. And since the reinforcement member 97 is arrange | positioned so that the drive element 103 may be sealed, the reinforcement member 97 can prevent that the dust adheres to the drive element 103. FIG.

  A flexible substrate 99 is disposed on the vibration plate 95 and the reinforcing member 97. A plurality of wirings (not shown) are arranged on the surface of the flexible substrate 99 on the vibration plate 95 side. The wiring is electrically connected to the upper electrode film 105 and the lower electrode film 104. A resist 108 made of a resin material or the like is applied between the reinforcing member 96 and the flexible substrate 98 to prevent dust and moisture from adhering to the electric circuit formed on the flexible substrate 98. Similarly, a resist 108 made of a resin material or the like is applied between the reinforcing member 97 and the flexible substrate 99. Further, a resist 108 is also applied between the flexible substrate 98 and the flexible substrate 99 of the vibration plate 95.

  When the droplet discharge head 91 receives a nozzle drive signal for controlling and driving the drive element 103, the drive element 103 expands and contracts, and the diaphragm 95 expands and contracts the volume in the pressure chamber 101. Pressurize. As a result, a reduced volume of the liquid material 111 is discharged as a droplet 112 from the nozzle 92 of the droplet discharge head 91. The nozzle 92, the pressure chamber 101, the vibration plate 95, the drive element 103, and the like constitute a droplet discharge element 113, and a plurality of droplet discharge elements 113 are arranged in one droplet discharge head 91.

(Method for manufacturing droplet discharge head)
Next, a manufacturing method for manufacturing a droplet discharge head using the method for manufacturing a mounting structure according to the first embodiment will be described with reference to FIGS. FIG. 11 is a flowchart showing a manufacturing process for manufacturing a droplet discharge head, and FIGS. 12 to 14 are diagrams for explaining a method for manufacturing the droplet discharge head.

  Step S11 corresponds to a wiring board mark measurement step, and is a step of measuring the position of the alignment mark formed on the two flexible substrates after placing the two flexible substrates on the stage. Next, the process proceeds to step S12. Step S12 corresponds to a substrate moving step, and is a step of moving the relative position of the two flexible substrates to set the relative position of the alignment mark to a predetermined position. Next, the process proceeds to step S13. Step S13 corresponds to a vibration plate mark measurement step, and is a step of measuring the position of the alignment mark formed on the vibration plate after placing the substrate on the stage. Next, the process proceeds to step S14. Step S <b> 14 corresponds to a substrate alignment process, and is a process of aligning the positions by overlapping two flexible substrates on the diaphragm. Next, the process proceeds to step S15. Step S15 corresponds to a mounting process and is a process of joining the diaphragm and the two flexible boards. Next, the process proceeds to step S16. Step S16 corresponds to a resist coating process and is a process of coating a resist on the diaphragm and between the diaphragm and the flexible substrate. This completes the manufacturing process for manufacturing the droplet discharge head.

  Next, a manufacturing method of the droplet discharge head 91 will be described in detail with reference to FIGS. 12 to 14 in association with the steps shown in FIG. FIG. 12A to FIG. 12C are diagrams corresponding to the wiring board mark measuring step in step S11. As shown in FIG. 12A, after the flexible substrate 98 is placed on the first placement table 16 of the first stage 17, the flexible substrate 98 is attracted to the first placement table 16. Similarly, after the flexible substrate 99 is placed on the second placement table 23 of the second stage 18, the flexible substrate 99 is attracted to the second placement table 23. The manufacturing method of the flexible substrate 98 and the flexible substrate 99 on which the drive circuit unit 100 is mounted is well known, and the description thereof is omitted. The first mounting table 16 and the second mounting table 23 are formed with recesses in the shape of the drive circuit unit 100, and the drive circuit unit 100 is disposed in the recesses so that the flexible substrate 98 and the flexible substrate 99 are attached to the first mounting table 16 and It mounts on the 2nd mounting base 23, respectively. Therefore, the first mounting table 16 and the second mounting table 23 can suck the flexible substrate 98 and the flexible substrate 99, respectively.

  Next, the first illumination device 38a is turned on to irradiate the convex portion 98a and the convex portion 99a. And the 1st imaging device 38 images the convex part 98a and the convex part 99a. Similarly, the projection 98b and the projection 99b are irradiated by turning on the second illumination device 39a. And the 2nd imaging device 39 images the convex part 98b and the convex part 99b.

  FIG. 12B shows an image 114 captured by the first imaging device 38. In the image 114, an alignment mark 98c and an alignment mark 99c are captured. Therefore, the position of the alignment mark 98c and the alignment mark 99c can be measured using one image 114.

  Next, the mark position calculation unit 82 calculates the positions of the center 98e of the alignment mark 98c and the center 99e of the alignment mark 99c. The calculation of the positions of the center 98e and the center 99e is performed by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the first reference position 114a at the lower left of the image 114 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the first reference position 114 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the first reference position 114a and the coordinate data of the center 98e and the center 99e with the first reference position 114a as the origin, the mark position calculation unit 82 uses the center 98e on the coordinate axis of the mounting apparatus 10 and The coordinates of the center 99e are calculated.

  FIG. 12C shows an image 115 captured by the second imaging device 39. Similar to the image 114, an alignment mark 98d and an alignment mark 99d are captured in the image 115. Therefore, the position of the alignment mark 98d and the alignment mark 99d can be measured using one image 115.

  Next, the mark position calculation unit 82 calculates the positions of the center 98f of the alignment mark 98d and the center 99f of the alignment mark 99d. The calculation of the positions of the center 98f and the center 99f is performed by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the second reference position 115a at the lower left of the image 115 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the second reference position 115 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the second reference position 115a and the coordinate data of the center 98f and the center 99f with the second reference position 115a as the origin, the mark position calculation unit 82 uses the center 98f on the coordinate axis of the mounting apparatus 10 and The coordinates of the center 99f are calculated.

  FIG. 12D is a diagram corresponding to the substrate moving process in step S12. As shown in FIG. 12 (d), the flexible substrate 98 is placed on the first placement table 16, and the flexible substrate 99 is placed on the second placement table 23. The stage control calculation unit 79 calculates a difference between data obtained by measuring the center 98e, the center 98f, the center 99e, and the center 99f and a target location where each center is arranged.

  Specifically, first, the midpoint between the center 98e and the center 98f is calculated, and the difference between the midpoint and the target location where the midpoint is placed is calculated. Next, the angle formed by the line connecting the center 98e and the center 98f and the X axis is calculated. Then, the difference between this line segment and the target angle for arranging the line segment is calculated. Subsequently, by driving the first stage 17 based on the calculated difference, the flexible substrate 98 is moved in the XY directions and rotated around the Z direction of the middle point. Then, the stage control calculation unit 79 moves to the substantially same place as the target place with the center 98e and the center 98f. Next, in the same manner, the stage control calculation unit 79 moves the center 99e and the center 99f to substantially the same place as the target place.

  FIG. 13A to FIG. 13C are diagrams corresponding to the diaphragm mark measuring step in step S13. As shown in FIG. 13A, after the ejection head main body 116 is placed on the third mounting base 29 of the third stage 24, the ejection head main body 116 is adsorbed to the third mounting base 29. The discharge head main body 116 is an assembly of the nozzle plate 93, the flow path forming substrate 94, the vibration plate 95, the reinforcing member 96, and the reinforcing member 97, and is formed by forming a portion of the droplet discharge head 91. . The manufacturing method of the discharge head main body 116 is well-known, and description thereof is omitted.

  Next, the alignment mark 95a and the alignment mark 95b are irradiated by turning on the third illumination device 41a and the fourth illumination device 42a. Then, the third imaging device 41 images the alignment mark 95a, and the fourth imaging device 42 images the alignment mark 95b. At this time, focus adjustment of the imaging lens 41b and the imaging lens 42b is performed in advance so that an image to be captured becomes clear.

  FIG. 13B shows an image 117 captured by the third imaging device 41. An alignment mark 95a is captured in the image 117. Next, the mark position calculation unit 82 calculates the position of the center 95c of the alignment mark 95a. The calculation of the position of the center 95c is calculated by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the third reference position 117a at the lower left of the image 117 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the third reference position 117 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the third reference position 117a and the coordinate data of the center 95c with the third reference position 117a as the origin, the mark position calculation unit 82 calculates the coordinates of the center 95c on the coordinate axis in the mounting apparatus 10. To do.

  FIG. 13C shows an image 118 captured by the fourth imaging device 42. Similar to the image 117, the alignment mark 95 b is captured in the image 118. Next, the mark position calculation unit 82 calculates the position of the center 95d of the alignment mark 95b. The calculation of the position of the center 95d is performed by multiplying the number of pixels in the X direction and the Y direction by the measurement resolution with the fourth reference position 118a at the lower left of the image 118 as the origin. Next, the mark position calculation unit 82 inputs the coordinate data of the fourth reference position 118 a on the coordinate axis in the mounting apparatus 10 from the memory 47. Subsequently, using the coordinate data of the fourth reference position 118a and the coordinate data of the center 95d with the fourth reference position 118a as the origin, the mark position calculation unit 82 calculates the coordinates of the center 95d on the coordinate axis in the mounting apparatus 10. To do.

  FIGS. 13D to 14C are diagrams corresponding to the substrate alignment process of step S14. As shown in FIG. 13 (d), the ejection head main body 116 is placed on the third placement table 29. The stage control calculation unit 79 calculates the difference between the data obtained by measuring the centers 95c and 95d and the target location where each center is arranged.

  Specifically, first, the midpoint between the center 95c and the center 95d is calculated, and the difference between the midpoint and the target location where the midpoint is placed is calculated. Next, the angle formed by the line connecting the center 95c and the center 95d and the X axis is calculated. Then, the difference between this line segment and the target angle for arranging the line segment is calculated. Subsequently, by driving the third stage 24 based on the calculated difference, the ejection head main body 116 is moved in the XY direction and rotated around the Z direction of the middle point. Then, the stage control calculation unit 79 moves to substantially the same place as the target place with the centers 95c and 95d.

  Next, as shown in FIG. 14A, the stage control calculation unit 79 moves the fourth stage 34 to place the suction heating device 36 opposite to the place between the flexible board 98 and the flexible board 99. Move to. Subsequently, the stage control calculation unit 79 drives the heater lifting device 35 to lower the suction heating device 36. Then, the stage control calculation unit 79 brings the suction heating device 36 into contact with the flexible substrate 98 and the flexible substrate 99. Next, the stage control calculation unit 79 drives the substrate chuck mechanism of the suction heating device 36 to attract the flexible substrate 98 and the flexible substrate 99 to the suction heating device 36. Then, the stage control calculation unit 79 drives the heater elevating device 35 to raise the suction heating device 36.

  Next, as illustrated in FIG. 14B, the stage control calculation unit 79 moves the fourth stage 34, thereby moving the suction heating device 36 to a location facing the discharge head main body 116. Subsequently, as illustrated in FIG. 14C, the stage control calculation unit 79 drives the heater lifting device 35 to lower the suction heating device 36. At this time, the flexible substrate 98 and the flexible substrate 99 are aligned with the suction heating device 36, and the suction heating device 36 moves to a preset position. Since the discharge head main body 116 is also aligned at a preset position, the flexible substrate 98, the flexible substrate 99, and the discharge head main body 116 are disposed at a preset relative position.

  FIG. 14C is a diagram corresponding to the mounting process of step S15. As illustrated in FIG. 14C, the crimping control calculation unit 83 presses the flexible substrate 98 and the flexible substrate 99 against the diaphragm 95 with a predetermined pressure. An anisotropic conductive paste is applied in advance to a place in contact with the diaphragm 95 in the vicinity of the terminal portion 98g of the flexible substrate 98 and in the vicinity of the terminal portion 99g of the flexible substrate 99, and then the anisotropic conductive paste is dried. Has been. Subsequently, the pressure bonding control calculation unit 83 causes the suction heating device 36 to generate heat, thereby heating the flexible substrate 98 and the flexible substrate 99 to a predetermined temperature. Then, after a predetermined time has elapsed, the crimping control calculation unit 83 cools the suction heating device 36. As a result, the diaphragm 95, the flexible substrate 98, and the flexible substrate 99 are fixed. The terminals formed on the flexible substrate 98 and the terminals formed on the diaphragm 95 are electrically connected by the anisotropic conductive paste. Similarly, the terminals formed on the flexible substrate 99 and the terminals formed on the diaphragm 95 are electrically connected. Since the diaphragm 95, the flexible substrate 98, and the flexible substrate 99 of the discharge head main body 116 are arranged after adjusting their positions, the corresponding terminals can be electrically connected with high quality.

  FIG. 14D is a diagram corresponding to the resist coating process in step S16. As shown in FIG. 14D, a resist 108 material is applied between the reinforcing member 96 and the flexible substrate 98. Similarly, the material of the resist 108 is applied between the reinforcing member 97 and the flexible substrate 99. Further, the material of the resist 108 is applied to the vibration plate 95, the flexible substrate 98, the terminal portion 98g on the flexible substrate 99, and the vicinity of the terminal portion 99g. Thereafter, the resist 108 is solidified by drying the discharge head body 116. With the above steps, the manufacturing process for manufacturing the droplet discharge head 91 is completed.

As described above, the present embodiment has the following effects.
(1) According to the present embodiment, in the wiring board mark measuring step in step S11, the alignment marks 98c, 98d, 99c, and 99d on the flexible substrate 98 and the flexible substrate 99 are imaged, and the alignment marks 98c, The positions 98d, 99c, and 99d are measured. At this time, two alignment marks are captured in one image and measured. Therefore, the positions of the alignment marks 98c, 98d, 99c, and 99d can be measured with a small number of imaging compared to a method of capturing one alignment mark in one image. As a result, since the positions of the alignment marks 98c, 98d, 99c, and 99d can be measured with high productivity, the droplet discharge head 91 can be manufactured with high productivity.

  (2) According to the present embodiment, the relative positions of the flexible substrate 98 and the flexible substrate 99 are adjusted to a predetermined position in the substrate moving process of step S12. Then, the relative positions of the flexible substrate 98 and the flexible substrate 99 and the diaphragm 95 are aligned in the substrate alignment step of step S14. In the mounting process in step S15, the flexible substrate 98, the flexible substrate 99, and the diaphragm 95 are fixed. Therefore, the flexible substrate 98 and the flexible substrate 99 can be mounted on the vibration plate 95 with higher productivity than the method of fixing the flexible substrate 98 and the flexible substrate 99 to the vibration plate 95 one by one in the mounting process of step S15. .

The present embodiment is not limited to the above-described embodiment, and various changes and improvements can be added. A modification will be described below.
(Modification 1)
In the first embodiment, the convex portions 6b and the convex portions 6c are formed at the corners of the flexible substrate 6 and the convex portions 7b and the convex portions 7c are formed at the corners of the flexible substrate 7, but the convex portions are arranged. The location is not limited to the corner. For example, as shown in FIG. 15A, the convex part 121 may be arranged at a place other than the corner, and the alignment mark 122 may be arranged on the convex part 121. Also in this case, the position of the alignment mark 122 can be measured with high productivity by capturing a plurality of alignment marks 122 in one image 123. Furthermore, the freedom degree of the place which arrange | positions the convex part 121 can be enlarged. This content can also be applied to the second embodiment.

(Modification 2)
In the first embodiment, the convex portion 6b and the convex portion 6c are formed at the corners of the flexible substrate 6, and the alignment mark 6d and the alignment mark 6e are arranged on the convex portion 6b and the convex portion 6c, respectively. The place where the alignment mark is arranged is not limited to the convex portion. Further, the position where the alignment mark is arranged is not limited to the corner of the substrate. As shown in FIG. 15B, by arranging the alignment marks near the side 124a of the substrate 124, a plurality of alignment marks 125 can be arranged close to each other. Also in this case, the position of the alignment mark 125 can be measured with high productivity by capturing a plurality of alignment marks in one image 126. Since no convex portion is formed on the substrate 124, the outer shape can be made difficult to deform. This content can also be applied to the second embodiment.

(Modification 3)
In the first embodiment, two alignment marks are captured in one image, but three or more may be used. As shown in FIG. 15B, three or more alignment marks can be imaged in one image 126 by bringing three or more alignment marks close to each other. The substrate 124 is formed with a right angle, and the alignment mark 125 is arranged at a location near the corner, so that the four alignment marks 125 can be imaged in one image 126. Furthermore, by setting the angle to less than 90 degrees, five or more alignment marks 125 can be captured in one image 126. Compared with the case where the number of alignment marks 125 to be captured in one image 126 is larger, the position of many alignment marks 125 can be measured with one image. Therefore, the position of the alignment mark 125 can be measured with high productivity. This content can also be applied to the second embodiment.

(Modification 4)
In the first embodiment, two substrates are arranged to face each other, but the number of substrates is not limited to two. As shown in FIGS. 15C and 15D, three or more substrates 127 may be connected and arranged. Also in this case, the position of the alignment mark 129 can be measured with high productivity by capturing a plurality of alignment marks 129 in one image 128. Further, since the degree of freedom of the arrangement pattern of the substrate 127 is increased, the substrate 127 can be easily arranged. This content can also be applied to the second embodiment.

(Modification 5)
In the first embodiment, an imaging apparatus having 1000 pixels in both the vertical and horizontal directions is employed. Then, the measurement resolution is set to 0.6 μm by setting the magnification of the imaging lens so that the imaging range is 0.6 mm both vertically and horizontally. The combination of the number of pixels and the magnification of the imaging lens is not limited to this, and other combinations may be used. The number of pixels of the imaging device may exceed 1000 pixels in both the vertical and horizontal directions and may be 2000 pixels. Since the measurement resolution is as small as 0.3 μm, it is possible to measure with higher accuracy. Further, the imaging range may be widened to 1.2 mm both vertically and horizontally. The measurement resolution may be set to 0.6 μm by adopting an imaging device having 1000 pixels in both the vertical and horizontal directions. Since the fineness is not required when the convex portions and the marks are formed, the convex portions and the marks can be easily formed. Further, the magnification of the imaging lens may be increased. In this case as well, the measurement resolution becomes small, so that the measurement can be performed with higher accuracy. This content can also be applied to the second embodiment.

(Modification 6)
In the first embodiment, the alignment marks 6d, 6e, 7d, and 7e are formed in a circular shape, but are not limited to a circular shape. For example, any figure can be used as long as it can extract one point from a figure such as a rectangle or a cross. A quadrangle is a figure that can easily calculate a central point using a diagonal. Also, the cross shape is a figure that is easy to calculate a specific point because it is easy to extract a point where two straight lines intersect. By using such a figure, a specific point can be easily extracted. This content can also be applied to the second embodiment.

(Modification 7)
In the first embodiment, the terminal formed on the substrate 2, the alignment mark 2a, and the alignment mark 2b may be formed in the same process using the same material. Since the alignment mark 2a and the alignment mark 2b may be marks that can be imaged by the imaging apparatus, the terminals may be formed of the same material. Then, by forming simultaneously in the step of forming the terminal, the process of forming the terminal and the step of forming the alignment mark 2a and the alignment mark 2b are produced compared to the case of forming in two steps. The alignment mark 2a and the alignment mark 2b can be formed with good performance. This content can also be applied to the second embodiment.

(Modification 8)
In the first embodiment, after the first mark measurement process in step S1 and the substrate movement process in step S2, the second mark measurement process in step S3 is performed. However, the order of the steps may be changed. For example, step S3 may be performed in parallel while step S1 and step S2 are being performed. Since the steps S1 to S3 are performed in a short time, the position of the alignment mark can be measured with high productivity. Moreover, after implementing step S3, you may perform step S1 and step S2. Also in this case, the position of the alignment mark can be measured with high productivity.

  Further, step S3 may be performed after step S1, and step S2 may be performed after step S3. Furthermore, step S1 and step S3 may be performed simultaneously, and then step S2 may be performed. By performing step S1 and step S3 simultaneously, the position of the alignment mark can be measured with high productivity. This content can also be applied to the second embodiment.

(Modification 9)
In the first embodiment, after adjusting the relative positions of the flexible substrate 6 and the flexible substrate 7 in the substrate moving process in step S2, the flexible substrate 6 and the flexible substrate 7 are arranged on the substrate 2 in the substrate alignment process in step S4. did. After step S2, the first mark measurement process of step S1 may be performed again to measure and inspect the relative position of the alignment mark. Then, it may be inspected that the relative position of the alignment mark is at a predetermined position, and the process may proceed to step S4. Furthermore, the relative position of the flexible substrate 6 and the flexible substrate 7 can be adjusted with high accuracy.

(Modification 10)
In the first embodiment, after the first mark measurement process in step S1, the relative position between the flexible substrate 6 and the flexible substrate 7 is adjusted in the substrate moving process in step S2, and then the flexible in the substrate alignment process in step S4. The substrate 6 and the flexible substrate 7 are arranged on the substrate 2. Not limited to this, a method of omitting step S2 may be adopted. In this case, the suction heating device 36 can adsorb the flexible substrate 6 and the flexible substrate 7 separately. In step S1, the positions of the alignment marks 6d, 6e, 7d, 7e are measured. In step S4, first, the flexible substrate 6 is placed on the substrate 2. At this time, the relative position of the flexible substrate 6 and the substrate 2 is adjusted to a predetermined position by driving the third stage 24. Next, the flexible substrate 7 is disposed on the substrate 2. At this time, the relative position between the flexible substrate 7 and the substrate 2 is adjusted to a predetermined position by driving the third stage 24. And it mounts in the mounting process of step S5. In the case of this method, since the first stage 17 and the second stage 18 are not moved, the mechanism for moving the first stage 17 and the second stage 18 of the mounting apparatus 10 can be omitted. Therefore, the mounting apparatus 10 can be a simple apparatus.

(Modification 11)
In the first embodiment, the flexible substrate 6 and the flexible substrate 7 have flexibility. When there is no object forming a step on the substrate 2 as in the first semiconductor element 3 and the third semiconductor element 5, the flexible substrate 6 and the flexible substrate 7 may be non-flexible substrates. Therefore, it is possible to use a substrate such as a substrate obtained by molding glass fiber with an epoxy resin or a substrate using silicon.

(Modification 12)
In the first embodiment, the convex portions 6b, 6c, 7b, and 7c are formed in a rectangular shape, but the shape is not limited to a rectangular shape and may be other shapes. For example, an ellipse or a polygon may be used. You may set according to the shape of the element arrange | positioned on the board | substrate 2. FIG. It is possible to easily design elements to be arranged on the substrate 2. This content can also be applied to the second embodiment.

(Modification 13)
In the first embodiment, the alignment mark 6 d is disposed on the flexible substrate 6, and the alignment mark 7 d is disposed on the flexible substrate 7. Then, the alignment mark 2a is arranged at a location on the substrate 2 opposite to a substantially central location between the alignment mark 6d and the alignment mark 7d. The alignment mark to be arranged on the substrate 2 may be arranged at a position facing the alignment mark 6d and the alignment mark 7d after the flexible substrate 6 and the flexible substrate 7 are assembled. The third imaging device 41 captures an alignment mark placed on the substrate 2 and the CPU 46 stores it in the memory 47. Then, after the assembly, the third imaging device 41 images the alignment mark 6d and the alignment mark 7d, and the CPU 46 compares the position of the overlapping alignment mark, whereby the flexible substrate 6 and the substrate 2 are compared. The position of the flexible substrate 7 can be measured. At this time, by comparing the alignment mark of the substrate 2 with the alignment marks of the flexible substrate 6 and the flexible substrate 7, the difference in the alignment mark position can be measured with high accuracy.

(A) is a schematic perspective view which shows the structure of a mounting structure in connection with 1st Embodiment, (b) is a schematic plan view of a mounting structure. (A) is a schematic plan view of a mounting apparatus, (b) A schematic side view of a mounting apparatus. The electrical control block diagram of a mounting apparatus. The flowchart which shows the manufacturing process of the mounting structure by which two board | substrates are arrange | positioned on the board | substrate. The figure explaining the manufacturing method of the mounting structure by which two board | substrates are arrange | positioned on the board | substrate. The figure explaining the manufacturing method of the mounting structure by which two board | substrates are arrange | positioned on the board | substrate. The figure explaining the manufacturing method of the mounting structure by which two board | substrates are arrange | positioned on the board | substrate. FIG. 6 is a schematic perspective view illustrating a configuration of a droplet discharge head according to a second embodiment. FIG. 3 is a schematic exploded perspective view showing a structure of a droplet discharge head. (A) is a schematic plan view showing a droplet discharge head, (b) and (c) are main part schematic plan views showing a flexible substrate, (c) is a main part schematic plan view showing a flexible substrate, and (d) is a main part schematic plan view. FIG. 3 is a schematic cross-sectional view showing the structure of a droplet discharge head. 6 is a flowchart showing a manufacturing process for manufacturing a droplet discharge head. The figure explaining the manufacturing method of a droplet discharge head. The figure explaining the manufacturing method of a droplet discharge head. The figure explaining the manufacturing method of a droplet discharge head. The figure which shows the example of arrangement | positioning of the board | substrate in connection with a modification.

Explanation of symbols

  2a, 2b, 6d, 6e, 7d, 7e, 95a, 95b, 98c, 98d, 99c, 99d, 122, 125, 129... Alignment marks, 2. 1 flexible substrate as a wiring substrate, 6b, 6c, 7b, 7c, 98a, 98b, 99a, 99b, 121 ... convex portion, 95 ... vibration plate, 98, 99 ... flexible substrate as wiring substrate, 103 ... as drive unit Drive element.

Claims (8)

A first mark measuring step of imaging the alignment marks of a plurality of first wiring boards on which wiring and alignment marks are arranged, and measuring the positions of the alignment marks;
A second mark measurement step of imaging the alignment mark on the second wiring board on which the wiring and the alignment mark are arranged, and measuring the position of the alignment mark;
Using the measurement result of the first mark measurement process and the measurement result of the second mark measurement process, the first wiring board is placed at a location where the wiring of the first wiring board and the wiring of the second wiring board face each other. And a substrate alignment step of relatively moving the second wiring substrate;
A mounting step of connecting and fixing the wiring of the first wiring board and the wiring of the second wiring board;
In the first mark measuring step, a plurality of the alignment marks are picked up in one image, and the position of the alignment mark is measured. It is a manufacturing method of the mounting structure according to claim 1,
A method for manufacturing a mounting structure, further comprising a substrate moving step of moving a relative position of the plurality of first wiring substrates to a predetermined position using a measurement result of the first mark measuring step. A method for manufacturing a droplet discharge head in which a driving unit for discharging droplets vibrates the diaphragm,
A diaphragm mark measurement step of imaging the alignment mark of the diaphragm in which wiring and a plurality of alignment marks are arranged, and measuring the position of the alignment mark;
A wiring board mark measuring step of imaging the positioning marks of a plurality of wiring boards on which wiring and positioning marks are arranged, and measuring the positions of the positioning marks;
Using the measurement result of the vibration plate mark measurement step and the measurement result of the wiring substrate mark measurement step, the vibration plate and the wiring substrate are placed at locations where the wiring of the vibration plate and the wiring of the wiring substrate face each other. A relatively moving substrate alignment process;
A mounting step of connecting and fixing the wiring of the diaphragm and the wiring of the wiring board;
In the wiring board mark measurement step, a method of manufacturing a droplet discharge head, wherein a plurality of the alignment marks are captured in one image and the positions of the alignment marks are measured. A method of manufacturing a droplet discharge head according to claim 3,
A method of manufacturing a droplet discharge head, further comprising: a substrate moving step of moving a relative position of the plurality of wiring substrates to a predetermined position using a measurement result of the wiring substrate mark measuring step. A plurality of first wiring boards on which wiring and alignment marks are arranged;
A second wiring board on which wiring and alignment marks are arranged,
The wiring of the first wiring board and the wiring of the second wiring board are connected and mounted,
At least two of the alignment marks in the plurality of first wiring boards pick up an image of the alignment marks when the first wiring board and the second wiring board are mounted. A mounting structure which is disposed in an imaging range of an imaging device. The mounting structure according to claim 5,
At least one of the first wiring substrates has a convex portion in a planar direction of the first wiring substrate, and the alignment mark is formed on the convex portion. A driving unit for discharging liquid droplets is a liquid droplet discharging head that vibrates the diaphragm,
Wiring and alignment marks are arranged on the diaphragm,
Provided with a plurality of wiring boards on which wiring and alignment marks are arranged,
The wiring of the diaphragm and the wiring of the wiring board are connected and mounted,
Among the alignment marks on the plurality of wiring boards, at least two of the alignment marks are within an imaging range of an imaging device that images the alignment marks when the diaphragm and the wiring board are mounted. A droplet discharge head, which is arranged. The droplet discharge head according to claim 7,
At least one of the wiring substrates has a convex portion in a plane direction of the wiring substrate, and the alignment mark is formed on the convex portion.

Images