JP2009267009A - Connection method between boards, interboard connection structure, and electronic component mounting body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection method between boards having an interboard connection with a high reliability even if a pitch between electrodes becomes narrow, and to provide an interboard connection structure, and an electronic component mounting body. <P>SOLUTION: The connection method between the boards includes the steps of: supplying a fluid medium 14 containing conductive particles 15 to a connection region A including plural first electrodes 11 formed on a first substrate 10; arranging a second substrate 12 having plural second electrodes 13 in opposition to the first substrate 10 in the state of contacting to the fluid medium 14; then heating the fluid medium 14 in the state that a facing distance between the first substrate 10 and the second substrate 12 is maintained to become broader than the connection region A in a site adjacent to at least the connection region A; and electrically connecting the first substrate 10 and the second substrate 12 by forming a connector consisting of the conductive particles 15 between the first electrodes 11 and the second electrodes 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connection method between substrates on which electrodes are formed, and more particularly to a connection method between substrates on which electrodes having a narrow pitch are formed, an inter-substrate connection structure, and an electronic component mounting body.

  There are various methods for electrically connecting substrates on which electronic components are mounted in an electronic device.

  For example, there is a method of connecting substrates using an electrical connector (for example, Patent Document 1). This method allows easy connection between boards and is easy to attach and detach as needed, but the volume occupied by the electrical connector must be secured in the electronic equipment, making it thinner and more dense There is a limit to the application to electronic devices that are increasingly being mounted.

On the other hand, there is a method of connecting substrates using an anisotropic conductive resin (for example, Patent Document 2). In this method, a resin containing conductive particles is disposed between substrates, and heating and pressurization are performed to achieve electrical connection between the substrates. Since this method can reduce the volume of the connection part between the substrates as compared with the use of an electrical connector, it is suitable for an electronic device that is becoming thinner and denser.
Japanese Patent No. 3984244 JP 2005-197001 A International Publication No. 2006/103948 Pamphlet

  However, since the connection between the substrates using the anisotropic conductive resin is performed by heating and pressurization, the anisotropic conductive resin may protrude to a region where electrical connection is not originally performed. For this reason, if the pitch between the electrodes formed on the substrate is narrowed, it may be a cause of occurrence of electrical short-circuiting or deterioration of reliability.

  Incidentally, the inventors of the present application have proposed a flip chip mounting method using a resin containing conductive particles and a bubble generating agent (Patent Document 3).

  1A to 1D are cross-sectional views showing the basic steps of the flip chip mounting method disclosed in Patent Document 3. FIG.

  As shown in FIG. 1A, conductive particles 15 and a bubble generating agent (not shown) are provided between a circuit board 10 having a plurality of connection terminals 11 and a semiconductor chip 12 having a plurality of electrode terminals 13. After supplying the contained resin (fluid medium) 14, as shown in FIG. 1B, the resin 14 is heated to generate bubbles 20 from the bubble generating agent in the resin 14. At this time, the resin 14 is self-assembled between the connection terminal 11 and the electrode terminal 13 as shown in FIG. Thereafter, as shown in FIG. 1 (d), by further heating the resin 14, the conductive particles 15 in the resin 14 self-assembled between the terminals 11 and 13 are melted and connected between the terminals 11 and 13. Form body 16. Thereby, a flip chip mounting body in which the terminals 11 and 13 are electrically connected is obtained.

  The method described above is suitable for connection between electrodes having a narrow pitch because the growth force of the bubbles generated from the bubble generating agent provides an accelerating force for moving the resin between the terminals 11 and 13. This method can also be applied to connections between substrates on which electronic components are mounted.

  2 to 4 are process diagrams showing an example of connecting the circuit board 10 on which the electronic component is mounted to the flexible wiring board 12. 2A is a plan view, FIG. 2B is a cross-sectional view along Ib-Ib in FIG. 2A, and FIG. 2C is Ic-Ic in FIG. 2A. It is sectional drawing which followed (it is the same also in FIG. 3 (a)-(c) and FIG. 4 (a)-(c)).

  2A to 2C, the connection terminal 11 formed on the circuit board 10 on which electronic components (not shown) are mounted and the wiring pattern 13 formed on the flexible wiring board 12 face each other. The circuit board 10 and the flexible wiring board 12 are arranged at the positions, and the resin 14 containing the conductive particles 15 and the bubble generating agent (not shown) is supplied to the connection region A between the connection terminals 11 and the wiring pattern 13. .

  Next, as shown in FIGS. 3A to 3C, by heating the resin 14, bubbles are generated from the bubble generating agent in the resin 14, and the resin 14 is connected to the connection terminals 11 and the wiring patterns 13. Self-assemble during.

  Thereafter, as shown in FIGS. 4A to 4C, the resin 14 is further heated to melt the conductive particles 15 in the resin 14 and connected between the connection terminal 11 and the wiring pattern 13. Form body 16.

  However, the inventors of the present application have examined the reliability of the connection between the connection terminal 11 and the wiring pattern 13 formed by such a method, and have caused a short circuit between the connection terminals 11 or between the wiring patterns 13. I found out there was something.

  The cause of this short circuit is as shown in FIG. 5 in the process of heating the resin 14 and self-assembling the resin 14 between the connection terminal 11 and the wiring pattern 13 (FIGS. 3A to 3C). This is because the conductive particles 15 in the resin 14a come into contact with each other when a part of the resin 14a protrudes from the connection region A to a region where electrical connection is not originally performed (for example, a region between the wiring patterns 13). It is thought to do.

  This is because the distance between the circuit board 10 and the flexible wiring board 12 becomes narrower as the pitch of the connection terminals 11 (wiring pattern 13) becomes narrower, and accordingly, the capillary phenomenon becomes prominent, and only the promotion force due to the growth of bubbles is generated. Then, it is considered that the movement of the resin cannot be controlled.

  Further, if the resin 14a remains in a region where electrical connection is not originally performed, there is a possibility that peeling or the like may occur due to material deterioration due to long-term use, which may be a problem in terms of guaranteeing long-term reliability.

  The flow of the resin based on the capillary phenomenon is considered to be a phenomenon that occurs also in the anisotropic conductive resin containing conductive particles.

  The present invention has been made in view of the above points, and its main purpose is to provide a method for connecting between substrates having a highly reliable connection between substrates even when the pitch between electrodes becomes narrow, an inter-substrate connection structure, and It is to provide an electronic component mounting body.

  The connection method between the substrates in the present invention realizes connection between the electrodes by heating a fluid medium containing conductive particles supplied between the substrates and forming a connection body made of conductive particles between the electrodes. The method is characterized in that a configuration is adopted in which means for suppressing the flow of the fluid medium at the time of heating is provided at a site near the connection region including the electrode. As a means for suppressing the flow of the fluid medium, a means for controlling the facing distance between the substrates, the heating temperature in the connection region, and other surrounding environments in consideration of the fluid characteristics of the fluid medium can be employed.

  That is, according to the method for connecting between substrates according to the present invention, a second substrate having a plurality of second electrodes is disposed opposite to a first substrate having a plurality of first electrodes, and the first electrodes are arranged. And a second electrode are electrically connected to each other through a connecting body, the method comprising: connecting conductive particles to a connection region on the first substrate and including a plurality of first electrodes (A) supplying a fluid medium containing a liquid, a step (b) for placing the second substrate in contact with the fluid medium, facing the first substrate, and heating the fluid medium And (c) forming a connection body made of conductive particles between the first electrode and the second electrode. In the step (b), the first substrate and the second electrode The distance between the substrate and the substrate is maintained to be wider than at least the portion of the connection region at a portion near the connection region. And wherein the door.

  In a preferred embodiment, the flow medium further contains a bubble generating agent, and the step (c) is performed by heating the flow medium to generate bubbles from the bubble generating agent, and the bubbles grow. A step (c1) of extruding the fluid medium out of the bubbles to cause the fluid medium to self-assemble between the first and second electrodes facing each other; and a fluid medium self-assembled between the first and second electrodes. And (c2) forming a connected body made of conductive particles melted between the first and second electrodes by heating and melting the conductive particles contained in the fluid medium.

  In a preferred embodiment, the fluid medium is made of a thermosetting resin, and step (c) further heats the thermosetting resin after step (c2) to cure the thermosetting resin. It further has a process (c3).

  In a preferred embodiment, the fluidized medium is made of an anisotropic conductive resin, and in step (c), the fluidized medium is heated and pressurized to form conductive particles between the first and second electrodes. A connection body consisting of is formed.

  In a preferred embodiment, at least one of the first substrate and the second substrate is a flexible substrate, and in step (b), the opposing distance between the first substrate and the second substrate is set to at least The flexible substrate is maintained in a curved or bent state so as to be wider than a portion of the connection region at a portion near the connection region.

  In the step (b), the flexible substrate is brought into contact with a heating member having a flat portion and a curved portion or a bent portion adjacent to the flat portion, and the portion of the connection region of the flexible substrate is brought into contact with the flat portion. The portion near the connection region of the flexible substrate is maintained in a state where the curved portion or the bent portion is in contact with each other, and in step (c), the fluid medium is heated by heating the heating member.

  In a preferred embodiment, the first board constitutes a circuit board on which electronic components are mounted, the second board constitutes a flexible wiring board, and the plurality of first electrodes are circuit boards. The plurality of second electrodes are composed of a wiring pattern extending to the end of the flexible wiring board.

  In another method for connecting between substrates according to the present invention, a second substrate having a plurality of second wiring patterns is disposed so as to face a first substrate having a plurality of first wiring patterns. The first wiring pattern at the portion extending to the end portion of the substrate and the second wiring pattern at the portion extending to the end portion of the second substrate are electrically connected via the connection body. A method for connecting between substrates, the step (a) of supplying a fluid medium containing conductive particles to a connection region on a first substrate and including a plurality of first wiring patterns; The step (b) of disposing the second substrate in contact with the fluid medium so as to oppose the first substrate, and heating the fluid medium so that the first wiring pattern and the second wiring pattern are A step (c) of forming a connection body made of conductive particles, and in the step (c), at least In sites near the connection area, while blowing a gas into the fluidized medium, characterized by heating the flowing medium.

  In another method for connecting between substrates according to the present invention, a second substrate having a plurality of second electrodes is disposed opposite to a first substrate having a plurality of first electrodes, and the first electrodes are arranged. And a second electrode are electrically connected to each other through a connecting body, the method comprising: connecting conductive particles to a connection region on the first substrate and including a plurality of first electrodes (A) supplying a fluid medium containing a liquid, a step (b) for placing the second substrate in contact with the fluid medium, facing the first substrate, and heating the fluid medium And (c) forming a connection body made of conductive particles between the first electrode and the second electrode, and in the step (c), the first substrate or the second electrode A heating member is brought into contact with at least one of the substrates, and the temperature of the heating member is connected at least in a region near the connection region. While lower than the site of frequency, characterized by heating the flowing medium.

  In another method for connecting between substrates according to the present invention, a second substrate having a plurality of second electrodes is disposed opposite to a first substrate having a plurality of first electrodes, and the first electrodes are arranged. And a second electrode are electrically connected to each other through a connecting body, the method comprising: connecting conductive particles to a connection region on the first substrate and including a plurality of first electrodes (A) supplying a fluid medium containing a liquid, a step (b) for placing the second substrate in contact with the fluid medium, facing the first substrate, and heating the fluid medium And (c) forming a connection body made of conductive particles between the first electrode and the second electrode. In the step (b), the second substrate is a holding member. The first substrate and the holding portion are disposed at least in the vicinity of the connection region. Facing distance between, characterized in that is narrower than the opposing distance between the first substrate and the second substrate.

  In the inter-substrate connection structure according to the present invention, a second substrate having a plurality of second electrodes is arranged to face a first substrate having a plurality of first electrodes, and the first electrode and the second electrode Between the first substrate and the second substrate, wherein the first electrode and the second electrode are between the first substrate and the second substrate. The conductive medium formed between the first electrode and the second electrode by heating the fluid medium containing the conductive particles supplied to the connection region including the plurality of first electrodes and the second electrode. And at least one of the first substrate and the second substrate is connected to the first substrate in the connection region and the first substrate in a region near the connection region. It is characterized in that it is curved or bent in a direction that is wider than the facing distance between the two substrates.

  An electronic component mounting body according to the present invention is formed by electrically connecting a first circuit board on which a first electronic component is mounted and a second circuit board on which a second electronic component is mounted. In the electronic component mounting body, between the first and second circuit boards, the connection terminals formed on the first and second circuit boards are connected to each other via the connection body by the method for connecting the boards according to the invention. And is electrically connected.

  An electronic component mounting body according to the present invention is an electronic component mounting body in which a circuit board on which an electronic component is mounted is electrically connected to a flexible wiring board. A connection terminal formed on a circuit board and a wiring pattern formed on a flexible wiring board are electrically connected through a connection body by the connection method between the boards concerned.

  In the method for connecting between substrates according to the present invention, a conductive particle is heated between electrodes by heating the fluidized medium by providing means for suppressing the flow of the fluidized medium at the time of heating in a region near the connection region including the electrodes. When forming the connection body which consists of, it can suppress that a fluid medium flows out of a connection area | region. As a result, even when the pitch between the electrodes is narrowed, it is possible to realize a reliable connection between the substrates without causing a short circuit.

  Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of simplicity. The present invention is not limited to the following embodiments.

(First embodiment)
FIG. 6 is a cross-sectional view showing a connection method between substrates in the first embodiment of the present invention. In addition, the basic process of the connection method between the substrates in the present embodiment is the same as the process shown in FIGS.

  That is, after supplying the fluid medium 14 containing the conductive particles 15 to the connection region including the first electrode 11 on the first substrate 10 having the plurality of first electrodes 11, The second substrate 12 having the second electrode 13 is disposed so as to face the first substrate 10 while being in contact with the fluid medium 14. Thereafter, the fluid medium 14 is heated to form a connection body made of conductive particles 15 between the first electrode 11 and the second electrode 13, whereby the first and second substrates 10, 12 are formed. Make a connection between.

  FIG. 6 is a cross-sectional view corresponding to the process shown in FIG. 2B, and a conductive region is connected to the connection region A (see FIG. 2A) between the first substrate 10 and the second substrate 12. The state where the fluid medium 14 containing the conductive particles 15 is supplied is shown. At this time, the facing distance between the first substrate 10 and the second substrate 12 is maintained so as to be wider than the region of the connection region A at least in the region near the connection region A. In this state, the fluid medium 14 is heated to form a connection body made of the conductive particles 15 between the first electrode 11 and the second electrode 13.

  Thus, by providing a region where capillary action does not occur at least in a region near the connection region A, the fluid medium 14 supplied to the connection region A does not protrude from the connection region A and the first electrode 11. A connection body made of conductive particles 15 can be formed between the second electrode 13 and the second electrode 13.

  It should be noted that even if there is a region where the facing distance between the first substrate 10 and the second substrate 12 is narrow at a part away from the connection region A, the fluid medium 14 flows at least at a part near the connection region A. The effect of the present invention can be exerted as long as the means for suppressing is provided.

  Here, the fluid medium 14 is not particularly limited as long as it is a material having fluidity at least when heated. As the fluid medium 14, for example, a thermosetting resin containing conductive particles 15 and a bubble generating agent can be used.

  In this case, in the state shown in FIG. 6, the thermosetting resin (fluid medium) 14 is heated to generate bubbles from the bubble generating agent (not shown), and the bubbles grow, so that the resin 14 becomes the bubbles. The resin 14 is self-assembled between the opposing electrodes 11 and 13 by pushing out. Thereafter, the resin 14 that is self-assembled between the electrodes 11 and 13 is further heated to melt the conductive particles 15 contained in the resin 14, and a connected body made of the conductive particles melted between the electrodes 11 and 13 is obtained. Form.

  In addition, after forming a connection body between the electrodes 11 and 13, the connection between the substrates 10 and 12 can be fixed by further heating the thermosetting resin 14 to cure the resin 14.

  In addition, an anisotropic conductive resin containing conductive particles 15 can be used for the fluid medium 14. In this case, in the state shown in FIG. 6, the anisotropic conductive resin (fluid medium) 14 is heated and pressurized to connect the first and second electrodes 11 and 13 with the conductive particles 15. Form the body.

  Further, when the second substrate 12 is a flexible substrate, as shown in FIG. 6, the opposing distance between the first substrate 10 and the second substrate 12 is connected at least at a portion near the connection region A. The fluid medium 14 can be heated in a state where the flexible substrate 12 is bent or bent so as to be longer than the region A.

  In this case, as shown in FIG. 6, the fluid medium 14 may be heated by bringing the heating member 31 into contact with the flexible substrate 12 and heating the heating member 31. At this time, if the contact surface of the heating member 31 with the flexible substrate 12 has a flat portion and a curved portion or a bent portion adjacent to the flat portion, the surface of the connection region A of the flexible substrate 12 is provided. The heating member 31 can be heated in a state where the flat portion is brought into contact and the curved portion or the bent portion is brought into contact with a portion near the connection region A of the flexible substrate 12.

  Here, the bending portion preferably has a curvature radius of 10 mm or less, and the bending portion preferably has a bending angle in the range of 10 to 30 °.

  In addition, it is preferable that the surface on which the heating member 31 is in contact with the flexible substrate 12 is closely attached at least in a region within 2 mm from the end of the connection region A. Thereby, it can prevent that the electroconductive particle 15 in the fluid medium 14 in the connection area | region A remains unmelted.

  Note that the heating member 30 may also be provided on the first substrate 10. Thereby, the electroconductive particle 15 in the fluidized medium 14 in the connection area | region A can be fuse | melted more reliably.

  In FIG. 6, the bent portion or the bent portion of the flexible substrate 12 is provided only on one side of the connection region A, but may be provided on both sides of the connection region A as shown in FIG. 7. By doing in this way, even when the connection area A is located at a position other than the substrate end, for example, at the center of the substrate, the same effect as in FIG.

  Note that when the second substrate 12 is not a flexible substrate, the second substrate 12 cannot be provided with a curved portion or a bent portion. In this case, as shown in FIG. 8, the second substrate (rigid substrate) 12 may be disposed with an inclination with respect to the first substrate 10. As a result, the facing distance between the first substrate 10 and the second substrate 12 can be made wider than the region of the connection region A in the region near the connection region A. Can be prevented from flowing. The inclination angle is preferably in the range of 10 to 30 °.

  In the present invention, the configurations of the first substrate 10 and the second substrate 12 are not limited. For example, a circuit board on which electronic components are mounted, a flexible wiring board on which a wiring pattern is formed, or the like is used. it can.

  For example, when the first substrate 10 constitutes a circuit board on which electronic components are mounted and the second substrate 12 constitutes a flexible wiring board, as shown in FIG. The first electrode 11 is composed of a connection terminal extending to the end of the circuit board 10, and the second electrode 13 is composed of a wiring pattern extending to the end of the flexible wiring board 12.

  In the above example, the connection region A is set at the ends of the circuit board 10 and the flexible wiring board 12, but the present invention is not limited to this, and can be set at any place on the boards 10 and 12.

(Second Embodiment)
FIG. 9 is a cross-sectional view showing a connection method between substrates in the second embodiment of the present invention. In addition, the basic process of the connection method between the substrates in the present embodiment is the same as the process shown in FIGS.

  FIG. 9 is a cross-sectional view corresponding to the step shown in FIG. 2B, in which a conductive region is connected to the connection region A (see FIG. 2A) between the first substrate 10 and the second substrate 12. The state where the fluid medium 14 containing the conductive particles 15 is supplied is shown. Here, heating members 30 and 31 are in contact with the first substrate 10 and the second substrate 12, respectively, and gas inlets 40 and 41 are provided in the heating members 30 and 31, respectively. ing. In this state, the fluid medium 14 is heated while blowing gas into the fluid medium 14 from the gas inlets 40 and 41. Thereby, it can suppress that the fluid medium 14 flows except the connection area | region A. FIG.

  However, since the gas at this time has a role of suppressing the movement of the fluid medium 14, the amount of inflow from the gas inlets 40 and 41 is balanced so that the fluid medium 14 does not move as a result. If possible, the inflow direction may be either suction or blowing. In the case of suction, bubbles generated during the connection process can also be removed.

(Third embodiment)
FIG. 10 is a cross-sectional view showing a method for connecting substrates in the third embodiment of the present invention. In addition, the basic process of the connection method between the substrates in the present embodiment is the same as the process shown in FIGS.

  FIG. 10 is a cross-sectional view corresponding to the process shown in FIG. 2B, and a conductive region is connected to the connection region A (see FIG. 2A) between the first substrate 10 and the second substrate 12. The state where the fluid medium 14 containing the conductive particles 15 is supplied is shown. Here, the heating member 31 is brought into contact with the second substrate 12 and the heating member 31 is heated, whereby the fluid medium 14 is heated. The heating member 31 is provided with a heating member 22 whose temperature can be set independently of the heating member 31, and the heating member 22 is in contact with a portion of the connection region A of the second substrate 12. . Then, the fluid medium 14 is heated in a state where the temperature of the heating member 22 is lower than the temperature of the heating member 31. That is, the fluid medium 14 is suppressed from flowing outside the connection region A by heating the fluid medium 14 in a state where the heating temperature of at least a portion near the connection region A is lower than the heating temperature of the connection region A. can do. This is because the fluid medium 14 surrounded by two substantially flat plates tends to move at a lower temperature and stably exist at a lower temperature when the temperature increases.

(Fourth embodiment)
FIG. 11 is a cross-sectional view showing a method for connecting substrates in the fourth embodiment of the present invention. In addition, the basic process of the connection method between the substrates in the present embodiment is the same as the process shown in FIGS.

  FIG. 11 is a cross-sectional view corresponding to the process shown in FIG. 2C, in which a conductive region is connected to the connection region A (see FIG. 2A) between the first substrate 10 and the second substrate 12. The state where the fluid medium 14 containing the conductive particles 15 is supplied is shown. Here, the second substrate 12 is disposed to face the first substrate 10 while being held by the holding member 31, and in the vicinity of the connection region A, the first substrate 10 and the holding member 31. Is smaller than the facing distance between the first substrate 10 and the second substrate 12.

  When the fluid medium 14 is heated in this state, the fluid medium 14 flows from the connection region A to the region B where the facing distance between the first substrate 10 and the holding member 31 is narrow due to capillary action. Since the action works, as a counteraction, the fluid medium 14 can be prevented from flowing out of the connection area A in the area where the first substrate 10 and the second substrate 12 face each other.

  Here, the facing distance between the first substrate 10 and the holding member 31 is preferably 100 μm or less. The holding member 31 may also serve as a heating member.

  As described above, the present invention has been described with reference to the preferred embodiments, but such description is not a limitation and various modifications can be made. For example, as the rigid substrate, for example, a semiconductor wafer, a semiconductor chip (including a bare chip and a mounting chip), and the like can be used in addition to a circuit board on which electronic components are mounted. Moreover, although there is no restriction | limiting in the structure of a flexible substrate, the board | substrate which consists of a material with a big elastic deformation so that a function is not impaired is preferable. In the second to fourth embodiments, a thermosetting resin containing conductive particles and a bubble generating agent, an anisotropic conductive resin containing conductive particles, or the like can be used as the fluid medium. .

  INDUSTRIAL APPLICABILITY The present invention is useful for an electronic component mounting body in an electronic device in which next-generation thinning and high-density mounting are progressing.

(A)-(d) is sectional drawing which showed the fundamental process of the flip-chip mounting method disclosed by patent document 3. FIG. It is the figure which showed the method of connecting the circuit board with which the electronic component was mounted to a flexible wiring board, (a) is a top view, (b) is sectional drawing along Ib-Ib of (a), (c) FIG. 4 is a cross-sectional view taken along line Ic-Ic in FIG. It is the figure which showed the method of connecting the circuit board with which the electronic component was mounted to a flexible wiring board, (a) is a top view, (b) is sectional drawing along Ib-Ib of (a), (c) FIG. 4 is a cross-sectional view taken along line Ic-Ic in FIG. It is the figure which showed the method of connecting the circuit board with which the electronic component was mounted to a flexible wiring board, (a) is a top view, (b) is sectional drawing along Ib-Ib of (a), (c) FIG. 4 is a cross-sectional view taken along line Ic-Ic in FIG. It is a top view explaining the subject of the present invention. It is sectional drawing which showed the connection method between the board | substrates in the 1st Embodiment of this invention. It is sectional drawing which showed the connection method between the board | substrates in the modification of 1st Embodiment. It is sectional drawing which showed the connection method between the board | substrates in the modification of 1st Embodiment. It is sectional drawing which showed the connection method between the board | substrates in the 2nd Embodiment of this invention. It is sectional drawing which showed the connection method between the board | substrates in the 3rd Embodiment of this invention. It is sectional drawing which showed the connection method between the board | substrates in the 4th Embodiment of this invention.

Explanation of symbols

10 First board (circuit board)
11 First electrode (connection terminal)
12 Second board (flexible wiring board)
13 Second electrode (wiring pattern)
14 Fluid medium (resin)
14a Some resins 15 Conductive particles 16 Connection body 20 Bubbles 22, 30, 31 Heating member (holding member)
40, 41 Gas inlet

Claims (13)

A second substrate having a plurality of second electrodes is arranged to face a first substrate having a plurality of first electrodes, and the first electrode and the second electrode are connected via a connector. A method of connecting between boards to be electrically connected,
Supplying a fluid medium containing conductive particles to the connection region on the first substrate and including the plurality of first electrodes;
A step (b) of disposing the second substrate so as to face the first substrate while being in contact with the fluid medium;
(C) forming the connection body made of the conductive particles between the first electrode and the second electrode by heating the fluid medium;
In the step (b), the facing distance between the first substrate and the second substrate is maintained so as to be wider than a portion of the connection region at least in a portion near the connection region. Connection method between boards. The fluid medium further contains a bubble generating agent,
The step (c)
The fluid medium is heated to generate bubbles from the bubble generating agent, and the bubbles grow to push the fluid medium out of the bubbles, thereby causing the fluid medium to be opposed to the first and second opposing surfaces. A step (c1) of self-assembly between the two electrodes;
The fluid medium self-assembled between the first and second electrodes is further heated to melt the conductive particles contained in the fluid medium, and is melted between the first and second electrodes. The connection method between the board | substrates of Claim 1 which has the process (c2) of forming the connection body which consists of the said electroconductive particle. The fluid medium is made of a thermosetting resin,
The step (c)
After the step (c2), the thermosetting resin is further heated to cure the thermosetting resin (c3).
The method for connecting between substrates according to claim 2, further comprising: The fluid medium is made of an anisotropic conductive resin,
2. The connection between the substrates according to claim 1, wherein in the step (c), a connection body made of the conductive particles is formed between the first and second electrodes by heating and pressurizing the fluid medium. Connection method. At least one of the first substrate or the second substrate is a flexible substrate,
In the step (b), the flexible substrate is formed so that the facing distance between the first substrate and the second substrate is wider at least in a portion near the connection region than in the connection region. The method for connecting between substrates according to claim 1, wherein the method is maintained in a curved or bent state. In the step (b), the flexible substrate is brought into contact with a heating member having a flat portion and a curved portion or a bent portion adjacent to the flat portion, and the portion of the connection region of the flexible substrate is contacted with the flat portion. The portion that is in contact with and is close to the connection region of the flexible substrate is maintained in a state in which the curved portion or the bent portion is in contact,
The method for connecting between substrates according to claim 5, wherein in the step (c), the fluid medium is heated by heating the heating member. The first board constitutes a circuit board on which electronic components are mounted, and the second board constitutes a flexible wiring board,
The plurality of first electrodes are formed of connection terminals extending to the end portions of the circuit board, and the plurality of second electrodes are formed of a wiring pattern extending to the end portions of the flexible wiring board. The method for connecting between substrates according to claim 1 or 5. A second substrate having a plurality of second wiring patterns is arranged opposite to a first substrate having a plurality of first wiring patterns, and a portion extended to an end of the first substrate is arranged. A method for connecting between substrates, wherein the first wiring pattern and the second wiring pattern at a portion extending to an end of the second substrate are electrically connected via a connecting body,
Supplying a fluid medium containing conductive particles to a connection region on the first substrate and including the plurality of first wiring patterns;
A step (b) of disposing the second substrate so as to face the first substrate while being in contact with the fluid medium;
(C) forming the connection body made of the conductive particles between the first wiring pattern and the second wiring pattern by heating the fluid medium;
In the step (c), the connection method between substrates, wherein the fluid medium is heated while blowing a gas into the fluid medium at least in a region near the connection region. A second substrate having a plurality of second electrodes is arranged to face a first substrate having a plurality of first electrodes, and the first electrode and the second electrode are connected via a connector. A method of connecting between boards to be electrically connected,
Supplying a fluid medium containing conductive particles to the connection region on the first substrate and including the plurality of first electrodes;
A step (b) of disposing the second substrate so as to face the first substrate while being in contact with the fluid medium;
(C) forming the connection body made of the conductive particles between the first electrode and the second electrode by heating the fluid medium;
In the step (c), a heating member is brought into contact with at least one of the first substrate and the second substrate, and the temperature of the heating member is set at least in the region near the connection region. A connection method between substrates, in which the fluid medium is heated in a state of being lower than a part. A second substrate having a plurality of second electrodes is arranged to face a first substrate having a plurality of first electrodes, and the first electrode and the second electrode are connected via a connector. A method of connecting between boards to be electrically connected,
Supplying a fluid medium containing conductive particles to the connection region on the first substrate and including the plurality of first electrodes;
A step (b) of disposing the second substrate so as to face the first substrate while being in contact with the fluid medium;
(C) forming the connection body made of the conductive particles between the first electrode and the second electrode by heating the fluid medium;
In the step (b), the second substrate is disposed so as to face the first substrate while being held by a holding member, and at least in the vicinity of the connection region, the first substrate And a holding member, the connecting distance between the substrates, wherein the facing distance between the first board and the second board is narrower than the facing distance between the first board and the second board. A second substrate having a plurality of second electrodes is arranged to face a first substrate having a plurality of first electrodes, and the first electrode and the second electrode are connected via a connection body. Board-to-board connection structure electrically connected to each other,
The first electrode and the second electrode are supplied to a connection region between the first substrate and the second substrate and including the plurality of first electrodes and the second electrode. The fluidized medium containing the conductive particles is heated and electrically connected via the connection body made of the conductive particles formed between the first electrode and the second electrode. And
A direction in which at least one of the first substrate and the second substrate is wider than a facing distance between the first substrate and the second substrate in the connection region in a portion near the connection region. A board-to-board connection structure that is curved or bent. An electronic component mounting body in which a first circuit board on which a first electronic component is mounted and a second circuit board on which a second electronic component is mounted are electrically connected,
The connection terminals formed on the first and second circuit boards are electrically connected to each other between the first and second circuit boards by a connection method between the boards according to claim 1. Electronic component mounting body connected to The circuit board on which the electronic component is mounted is an electronic component mounting body that is electrically connected to the flexible wiring board,
A connection terminal formed between the circuit board and the flexible board includes a connection terminal formed on the circuit board and a wiring pattern formed on the flexible wiring board according to the connection method between boards described in claim 1. Electronic component mounting body that is electrically connected via

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