JP2009262485A5 - - Google Patents

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Publication number
JP2009262485A5
JP2009262485A5 JP2008117098A JP2008117098A JP2009262485A5 JP 2009262485 A5 JP2009262485 A5 JP 2009262485A5 JP 2008117098 A JP2008117098 A JP 2008117098A JP 2008117098 A JP2008117098 A JP 2008117098A JP 2009262485 A5 JP2009262485 A5 JP 2009262485A5
Authority
JP
Japan
Prior art keywords
wiring layer
circuit board
layer
pair
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008117098A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009262485A (ja
JP5171377B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008117098A priority Critical patent/JP5171377B2/ja
Priority claimed from JP2008117098A external-priority patent/JP5171377B2/ja
Priority to US12/429,517 priority patent/US8157357B2/en
Publication of JP2009262485A publication Critical patent/JP2009262485A/ja
Publication of JP2009262485A5 publication Critical patent/JP2009262485A5/ja
Application granted granted Critical
Publication of JP5171377B2 publication Critical patent/JP5171377B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008117098A 2008-04-28 2008-04-28 回路基板及び液体吐出装置 Expired - Fee Related JP5171377B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008117098A JP5171377B2 (ja) 2008-04-28 2008-04-28 回路基板及び液体吐出装置
US12/429,517 US8157357B2 (en) 2008-04-28 2009-04-24 Circuit substrate and liquid discharging apparatus with a first wiring layer directly connected to the substrate and a second wiring layer connected to the first wiring layer through a metal film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008117098A JP5171377B2 (ja) 2008-04-28 2008-04-28 回路基板及び液体吐出装置

Publications (3)

Publication Number Publication Date
JP2009262485A JP2009262485A (ja) 2009-11-12
JP2009262485A5 true JP2009262485A5 (https=) 2011-06-16
JP5171377B2 JP5171377B2 (ja) 2013-03-27

Family

ID=41214571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008117098A Expired - Fee Related JP5171377B2 (ja) 2008-04-28 2008-04-28 回路基板及び液体吐出装置

Country Status (2)

Country Link
US (1) US8157357B2 (https=)
JP (1) JP5171377B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6422318B2 (ja) * 2014-12-02 2018-11-14 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04155867A (ja) * 1990-10-18 1992-05-28 Mitsubishi Electric Corp 半導体装置
US5479197A (en) * 1991-07-11 1995-12-26 Canon Kabushiki Kaisha Head for recording apparatus
JP2002052725A (ja) * 2000-08-07 2002-02-19 Sony Corp プリンタ、プリンタヘッド及びプリンタヘッドの製造方法
JP2002313942A (ja) 2000-12-28 2002-10-25 Canon Inc 半導体装置およびその製造方法とそれを用いた液体吐出装置
US6825543B2 (en) 2000-12-28 2004-11-30 Canon Kabushiki Kaisha Semiconductor device, method for manufacturing the same, and liquid jet apparatus
JP2004167822A (ja) * 2002-11-20 2004-06-17 Sony Corp 液体吐出ヘッドの製造方法、液体吐出ヘッド及び液体吐出装置
TWI228269B (en) * 2003-11-14 2005-02-21 Ind Tech Res Inst Structure of inkjet-head chip and method for making the same
KR100553914B1 (ko) * 2004-01-29 2006-02-24 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
JP2005254755A (ja) * 2004-03-15 2005-09-22 Fuji Xerox Co Ltd インクジェット記録ヘッドおよびインクジェット記録装置

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