JP2009262107A - Dielectrophoretic electrode, dielectrophoretic cell and collector for dielectric fine particle using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dielectrophoretic electrode hardly causing breakage of an electrode substrate, easy to handle, and inexpensively manufactured so as to be disposable, and to provide a dielectrophoretic cell and a collector for the dielectric fine particles using the same. <P>SOLUTION: The dielectrophoretic electrode 5 is provided which serves as the electrode for collecting the dielectric fine particles in a liquid sample by dielectrophoresis, and the dielectrophoretic electrode 5 includes an electrode pattern 2 including a conductive thin film or an electrode pattern 4 with a plating layer laminated on the conductive thin film, formed on one face of a flexible base material 1. The dielectrophoretic cell and the collector for the dielectric fine particles each use the dielectrophoretic electrode 5. The conductive thin film is preferably a thin film of development silver formed by a photograph manufacturing method. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a dielectrophoresis electrode that collects dielectric fine particles in a liquid by using a phenomenon of dielectrophoresis, and a dielectrophoresis cell and a dielectric fine particle collecting apparatus using the same.
More specifically, the present invention provides a dielectrophoresis electrode manufactured at low cost so that the electrode substrate is not easily damaged and can be easily handled and used, and a dielectrophoresis cell and a dielectric particulate collection device using the same. About doing.

The dielectric fine particles in the present invention are solid particles made of a dielectric that can be collected by dielectrophoresis, and microorganisms such as animal cells, plant cells, bacteria, protozoa, yeasts, molds, and spores. .
In the following description, in order to make it easy to understand the connection with related applications, the name of microorganisms is mainly used as a representative of dielectric fine particles, but the present invention collects all fine particles having dielectric properties. Applies to

It is important in various industrial fields such as food manufacturing, pharmaceutical manufacturing, and semiconductor manufacturing to quickly confirm and measure the presence or absence of microorganisms contained in a liquid sample. For example, in the food manufacturing industry, sterilization treatment and sterilization treatment are performed so that harmful microorganisms and other microorganisms are not contained in liquids such as washing water, dilution water, and drinking water. If there is a defect and harmful microorganisms such as bacteria are mixed in the final product, the product cannot be shipped.
Consumers' interest in safe products has been extremely high in recent years, and the impact on corporate activities when products that are contaminated with pathogens are accidentally shipped inadvertently is enormous. In some cases, it may be directly linked to the existence of a company, so it is increasingly important for industries to maintain hygienic manufacturing processes.

Conventionally, a colony counting method using a selective medium is used for the separation of target microorganisms for examining the presence or absence of bacteria, but it takes a long time of about 1 to several days to obtain a result, In addition, there is a problem that it cannot be applied to microorganisms that cannot be cultured.
For this reason, it is required to carry out inspection before product shipment to confirm whether or not bacteria are contained in the product more quickly and to take necessary countermeasures based on the result of the confirmation inspection. .

As a method for collecting fine particles in a liquid, a method has been proposed in which a voltage is applied between opposing electrodes to collect and remove the fine particles on the electrodes (for example, Patent Document 1).
This method is a so-called electrophoresis method, in which the particles are charged in a uniform and equal electric field, and the fine particles are collected by the electrodes and removed. In order to move the fine particles, it is necessary to apply a high voltage, There is a problem that fine particles that are not charged cannot be collected.

On the other hand, the collection of microparticles such as microorganisms in liquids by induction electrophoresis, which has been attracting attention recently, is different from electrophoresis in that it does not depend on the charge of microparticles and collects microbes with a small amount of charge at a low voltage. If possible, a chip for the purpose of separating microorganisms by induction electrophoresis has been disclosed (for example, Non-Patent Document 1).
In the dielectrophoresis, when an electric field is generated by an alternating frequency by a microelectrode, polarization characteristics between particles such as microorganisms to be handled and a surrounding liquid depend on the frequency.
In the case of particles such as microorganisms, a lower voltage can be used by using microelectrodes than in the past. For this reason, it has the characteristic which can avoid that the cell membrane of the microorganisms collected by the dielectrophoresis breaks.

  In addition, as an apparatus for measuring microorganisms contained in the liquid, between the electrodes of the dielectrophoresis electrode provided in the cell into which the liquid is introduced, an alternating voltage is applied to collect the microorganisms on the electrodes, There is known a microorganism count measuring device that calculates the number of microorganisms by measuring impedance (Patent Documents 2, 3, and 4).

Various types of dielectrophoretic electrodes used in a microorganism measuring apparatus by dielectrophoresis have been disclosed (Patent Documents 4, 5, and 6). In addition, a molecular patterning device that fixes molecules such as proteins in an arbitrary shape on a substrate using dielectrophoresis is disclosed (Patent Document 7). Furthermore, an apparatus for removing fine particles in water by dielectrophoresis for removing fine particles and microorganisms in ultrapure water used in a semiconductor production process, a medical material production process, and the like is disclosed (Patent Document 8).
JP 61-188798 A Japanese Patent Laid-Open No. 2000-125846 JP 2003-000223 A JP 2005-233920 A JP 2001-165906 A JP 2007-006858 A JP-A-5-098484 JP 2000-061472 A Suzuki Masato et al., “Biological and Life Separation of Microorganisms in Microfluids by Dielectrophoresis”, BUNSEKI KAGAKA, 2005, Vol. 54, No. 12, p. 1189-1195

  Non-Patent Document 1 discloses a chip for performing life-and-death separation of microorganisms using a dielectrophoresis method. In this chip, an ITO vapor deposition film formed on a glass substrate is patterned by a photolithographic method to form an electrode plate, and an acrylic plate provided with a liquid inlet / outlet via a silicon plate spacer (thickness 300 μm) is provided thereon. Laminated. Since this chip uses a glass substrate, it must be handled with care so as not to be damaged, and the operation is inconvenient. In addition, there is a problem that the metal oxide vapor deposition film formed on the glass substrate is etched by a photolithography method to form a pattern, so that it is inferior in mass productivity and cannot be manufactured at low cost.

  Patent Document 2 discloses a device for measuring the number of microorganisms by a dielectrophoresis method, which includes a cell having a plurality of electrodes, an electrophoresis power supply circuit that applies an alternating voltage between the electrodes, and an impedance between the electrodes to which the voltage is applied. Thus, a microorganism count measuring device for calculating the number of microorganisms is disclosed. The comb-shaped electrode formed on the substrate is a very thin film having a thickness of 5 to 50 nm. This comb-shaped electrode is disclosed in which a platinum thin film with chromium as a base is attached to one side of a substrate made of borate glass by sputtering or vapor deposition, and an electrode pattern is formed by photolithography. As with Non-Patent Document 1, since a glass substrate is used, it is inconvenient to handle with care so as not to be damaged. In addition, there is a problem that the metal sputtering film or vapor deposition film formed on the glass substrate is etched by a photolithography method to form a pattern, so that it is inferior in mass productivity and cannot be manufactured at low cost.

  Patent Document 3 is an apparatus for measuring the number of microorganisms by a dielectrophoresis method similar to that of Patent Document 2, in which an AC voltage is applied between a pair of electrodes to concentrate a plurality of types of microorganisms by dielectrophoresis, and a solid is fixed between the electrodes. Disclosed are a microbe measurement apparatus and a microbe measurement electrode chip for calculating the number of microbes of only a specific microbe by measuring the impedance between electrodes after the phased antibody specifically reacts with the specific microbe and is separated. ing. An electrode is formed by forming a thin film such as chromium or platinum on a glass substrate or plastic substrate by sputtering, vapor deposition, plating, or the like, and etching by photolithography or the like. In the comb electrode, for example, electrodes having a line width of 30 to 100 μm are opposed to each other with a groove interval of 5 to 10 μm. The film thickness of the electrode is about 50 to 200 nm. Similar to Non-Patent Document 1, when a glass substrate is used, there is a problem in that it is necessary to handle it carefully so as not to damage it, and the operation is inconvenient.

In Patent Document 4, a solution channel formed by carving one groove on another glass substrate is superposed on a comb electrode (microarray electrode) formed on a glass substrate or a silicon wafer substrate, and the comb electrode A device is disclosed in which a high-frequency voltage is applied to the particle, a fine particle solution is introduced from the solution passage inlet, and the fine particles are collected on the electrode according to the electrode pattern.
As in Non-Patent Document 1, when a glass substrate is used, it is necessary to handle it with care so as not to damage it, which is inconvenient.

Patent Document 5 discloses a method of separating two or more types of molecules from each other using dielectrophoretic force. In paragraph 0091 of Patent Document 5, the electrodes are usually formed on a substrate made of a non-conductive material such as glass, quartz, silicon, or the like, using a microfabrication technique known per se, to form a pair of the above-described shapes. This electrode is prepared by providing a comb-like electrode.
Further, in the embodiment, since the electrode pattern is formed by vapor-depositing aluminum on a glass substrate and etching by photolithography or the like, it is necessary to handle it carefully so as not to damage it, and the operation is inconvenient.

  Patent Document 6 discloses a microorganism testing chip (dielectrophoresis sensor) used in a device for measuring the number of microorganisms by a dielectrophoresis method. The measuring device for the number of microorganisms comprises a microorganism testing chip provided with a dielectrophoresis electrode, and a measurement main body for measuring an impedance change by applying an alternating voltage to the induction electrophoresis electrode. In paragraph 0028 of Patent Document 6, an inexpensive microorganism testing chip can be realized by forming the substrate from a resin material and forming the dielectrophoresis electrode from a conductive paste. However, it is unclear whether the substrate is flexible and no suggestion is made.

Patent Document 7 discloses a dielectrophoresis electrode that attracts (or repels) molecules such as proteins in a solution by using a dielectrophoresis method and adsorbs the molecules to a substrate.
According to the embodiment, an electrode having a wave shape provided on a glass substrate is formed. However, similarly to Non-Patent Document 1, when a glass substrate is used, it is necessary to handle it with care so as not to damage it, which is inconvenient.

  Patent Document 8 discloses an apparatus for removing fine particles in water by dielectrophoresis. In this device, a constricted portion of an electric field formed between opposing electrodes is formed, water to be treated is passed between the electrodes, a high voltage pulse is applied between the electrodes, and fine particles in water are captured by dielectrophoresis. is there. According to the examples, the dielectrophoretic electrodes are aluminum parallel plate electrodes separated by 3 mm, but it is unclear whether the electrodes are flexible, and no suggestion is given.

Thus, in the prior art, a dielectrophoretic electrode is produced by etching a metal thin film formed by sputtering or vapor deposition on a non-flexible glass substrate by a photolithographic method to obtain an electrode pattern. It was.
Since a glass substrate is used, it is necessary to handle it with care so as not to damage it, and the operation is inconvenient. In addition, there is a problem that the metal sputtering film or vapor deposition film formed on the glass substrate is etched by a photolithography method to form a pattern, so that it is inferior in mass production and cannot be manufactured at low cost.

  The present invention provides a dielectrophoretic electrode manufactured at low cost so that the electrode substrate is not easily damaged and can be easily handled and used, and a dielectrophoretic cell and a dielectric fine particle collecting apparatus using the same. This is the issue.

  In order to solve the above problems, the present invention is an electrode for collecting dielectric fine particles in a liquid sample by a dielectrophoresis method, and is formed on one side of a flexible substrate by a photographic method. In addition, the present invention provides a dielectrophoretic electrode characterized in that an electrode pattern comprising a developed silver thin film is formed.

  The present invention also provides an electrode for collecting dielectric fine particles in a liquid sample by a dielectrophoresis method, wherein an electrode pattern is formed on one side of a flexible substrate, and the electrode pattern However, gold, platinum, ruthenium, palladium, rhodium, silver, aluminum, nickel, chromium, copper, zinc, and tin are electrolessly plated and / or electroplated on a developed silver thin film formed by a photographic process. There is provided a dielectrophoretic electrode characterized by being an electrode pattern formed by laminating metal plating layers made of one or more metals selected from a metal group such as

  The present invention is also an electrode for collecting dielectric fine particles in a liquid sample by a dielectrophoresis method, wherein an electrode pattern made of a conductive thin film is formed on one side of a flexible substrate. A dielectrophoretic electrode is provided.

  The conductive thin film is formed by printing a conductive paste containing one or more selected from metal particles, carbon nanoparticles or carbon fibers, and a paste containing an electroless plating catalyst. After conducting sputtering or vacuum deposition of metal or metal oxide using either a conductive thin film, a photoresist pattern or a pattern printed with a solvent-soluble printing material as a shielding mask, the shielding mask is formed. Conductive thin film formed by stripping (lift-off) method performed by removing, thin film formed by sputtering or vacuum deposition of metal or metal oxide, etched thin film formed by photolithography method, metal foil is formed by photolithography Any one of conductive thin films formed by etching by a method is preferable.

  Further, the electrode pattern is formed on the conductive thin film by electroless plating and / or electrolytic plating, such as gold, platinum, ruthenium, palladium, rhodium, silver, aluminum, nickel, chromium, copper, zinc, tin, etc. It is preferable that the electrode pattern is formed by laminating metal plating layers made of one or more metals selected from these metal groups.

  Moreover, it is preferable that at least a pair of the electrode patterns is formed on one side of the flexible substrate.

  Moreover, it is preferable that the said electrode pattern consists of a comb-shaped electrode.

  The comb-shaped electrode preferably has a line width of 1 to 200 μm, a groove interval of 0.1 to 1000 μm, and a line thickness of 0.05 to 30 μm.

  Moreover, it is preferable that a dielectric film for electrical insulation from the liquid sample is formed on the connection wiring pattern for connecting to the electrode pattern and an external power source.

  The present invention also provides a dielectrophoresis cell using the dielectrophoresis electrode described above.

  The present invention also provides an apparatus for collecting dielectric fine particles by dielectrophoresis, comprising the above-described dielectrophoretic electrode.

  The dielectrophoretic electrode is an electrode film in which the flexible base material is a film base material, and the dielectrophoretic cell includes the electrode film and a transparent lower portion on which the electrode film is placed. A support plate, a spacer laminated on the electrode film so as to form a gap through which the liquid sample passes, and an upper transparent cover plate having a liquid sample inlet / outlet; and the upper transparent cover plate includes the spacer It is preferable to be laminated on the electrode film via a gap and bonded so that it cannot be easily peeled off.

  The dielectrophoretic electrode is an electrode film in which the flexible base material is a film base material, and the dielectrophoretic cell includes the electrode film and a transparent lower portion on which the electrode film is placed. A support plate, a spacer laminated on the electrode film so as to form a gap through which the liquid sample passes, and an upper transparent cover plate having a liquid sample inlet / outlet; and the upper transparent cover plate includes the spacer It is preferable that it is laminated | stacked on the said electrode film via, and it adhere | attaches so that it can peel again.

  According to the present invention, since the dielectrophoretic electrode is laminated on the flexible base material, it is not broken and broken during handling of the expensive electrode substrate, and the waste of cost can be saved. In addition, since the dielectrophoretic electrode is laminated on a flexible base material, there are few restrictions on the production method. For example, it is possible to form an electrode on a base film with a roll-to-roll with excellent productivity. It can be manufactured at low cost so that it can be used up. Furthermore, it is possible to provide a dielectrophoresis cell and a dielectric fine particle collecting apparatus using the inexpensively manufactured dielectrophoresis electrode.

The present invention will be described below with reference to the drawings based on the best mode.
1 to 4 are drawings showing embodiments of the dielectrophoretic electrode of the present invention, FIG. 1 is a plan view of the dielectrophoretic electrode, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 3 is a partially enlarged plan view of a portion B in FIG. 1, and FIG. 4 is a cross-sectional view taken along the line CC in FIG. FIG. 3A shows a dielectrophoresis electrode having an electrode pattern made of a conductive thin film. FIG. 3B shows a dielectrophoretic electrode having an electrode pattern in which a plating layer is laminated on a conductive thin film.
5 to 7 are diagrams showing embodiments of the dielectrophoresis cell using the dielectrophoresis electrode of the present invention, FIG. 5 is a plan view of the dielectrophoresis cell, and FIG. A cross-sectional view taken along line D, FIG. 7 is a plan view of the spacer.
5 shows that the upper transparent cover plate 14 has transparency, the electrode pattern 2 (or 4) composed of a pair of comb-shaped electrodes is a solid line, and the spacer 16 has a diagonal line ( Hatched). Moreover, in order to show the boundary line of the electrode film 5, the dotted line was attached | subjected.
FIG. 8 is a plan view showing an example of a long electrode film in which a plurality of electrode patterns are formed. FIG. 9 is a schematic manufacturing process diagram in which electrolytic plating is performed on a conductive thin film having an electrode pattern formed on one surface of a flexible substrate.

As shown in FIGS. 1 to 4, the electrode pattern 2 (or 4) of the dielectrophoretic electrode 5 is an electrode pattern 2 in which a conductive thin film 2 is formed on a flexible substrate 1, or An electrode pattern 4 in which a conductive thin film 2 is formed on a base material 1 and a metal plating layer 3 is further laminated. The electrode pattern 5 is configured together with the base material 1 having flexibility. .
In the case of the comb-shaped electrode shown in FIG. 1, the groove width dimension Wb of the comb-shaped electrode is usually narrower than the width dimension Wa of the comb-shaped electrode as shown in the partial enlarged view of FIG.
As shown in FIG. 1, connection wirings 6 and 6 for connecting to an electrode pattern and an external power supply extend. A dielectric film for electrical insulation from the liquid sample is formed on the connection wirings 6 and 6. The dielectric film is not particularly limited, and a known film such as a deposited film of a silicon dioxide film can be used.

In the prior art, since a thin film formed by sputtering or vapor deposition on an inflexible glass substrate was mainly etched by a photolithographic method to obtain an electrode pattern, a dielectrophoretic electrode was produced. There was a problem of being low.
In order to solve this problem, a flexible base material is used in the present invention. As shown in FIG. 8, a plurality of electrode patterns are continuously provided on one side of a long flexible base material. It is possible to increase productivity.
For example, when forming an electrode pattern with a metal thin film made of developed silver produced by a photographic method, a roll-shaped film in which a photosensitive agent is applied to one side of a long flexible substrate is prepared in advance. And after exposing using the exposure mask for copying the shape of a required electrode pattern, it develops and the electrode pattern formed with the metal thin film which consists of developed silver is obtained.
It cuts from the elongate flexible base material in which the electrode pattern which consists of a some metal thin film shown in FIG. 8 is arrange | positioned, and each electrode film 5 as shown in FIG. 1 can be produced.
The number of electrode patterns produced per unit time is determined according to the width dimension of the roll film to be used and the exposure / development process speed.

FIG. 9 is a schematic manufacturing process diagram in which electrolytic plating is performed on the conductive thin film of the electrode pattern using the long electrode film 30 on which the plurality of electrode patterns shown in FIG. 8 are formed.
In FIG. 9, a long electrode film 30 unwound from a roll body 21 of an electrode film made of a conductive thin film such as developed silver by a photographic manufacturing method is transferred from left to right by transfer rolls 22 and 22. .
First, dust adhering to the electrode film 30 is washed away by the water washing device 23, and then a metal plating layer is laminated on the conductive thin film by the electrolytic plating device 24. The electrode film that has passed through the electroplating device 24 is washed away with the electrolytic solution by the water washing device 25, then drained and dried by the drying device 26, and finally the electrode film in which the plating layer is laminated on the conductive thin film. The roll body 27 is wound up.
The equipment such as the transfer roll 22, the water washing devices 23 and 25, the electrolytic plating device 24, and the drying device 26 shown in FIG. 9 can be equipment manufactured based on a known technique.

The base material 1 having flexibility is a base material that supports the electrode pattern 2 (or 4), and the material is not particularly limited. However, the handling property of the electrode film for dielectrophoresis 5 is excellent. A resin film having flexibility is preferably used.
In order to observe the dielectric fine particles adhering to the electrode pattern 2 (or 4) with an optical microscope, illumination light is irradiated from behind the electrode film 5 so that the transmitted light can be received. Preferably there is. Those having transparency in the visible region and generally having a total light transmittance of 90% or more are preferred.
Specific examples of the transparent resin film used for the substrate 1 having flexibility include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic resins, epoxy resins, fluororesins, silicone resins, Single layer of 50 to 300 μm thickness made of polycarbonate resin, diacetate resin, triacetate resin, polyarylate resin, polyvinyl chloride, polysulfone resin, polyether sulfone resin, polyimide resin, polyamide resin, polyolefin resin, cyclic polyolefin resin, etc. A multi-layer composite film made of a film or the transparent resin may be mentioned.

The upper transparent cover plate 14 covers the upper part of the electrode pattern 2 (or 4) and forms a sealed dielectrophoresis cell 10 as shown in FIG. 6, and has a corrosion resistance to the liquid sample. There is no particular limitation on the material if it exists. In order to observe the transmitted light by irradiating illumination light from behind the dielectrophoresis electrode in order to observe the dielectric fine particles attached to the electrode pattern 2 (or 4) with an optical microscope, it is a transparent substrate. It is preferable.
Specific examples of the resin film used for the upper transparent cover plate 14 include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic resins, epoxy resins, fluorine resins, silicone resins, polycarbonate resins, Single-layer film having a thickness of 50 to 300 μm made of acetate resin, triacetate resin, polyarylate resin, polyvinyl chloride, polysulfone resin, polyether sulfone resin, polyimide resin, polyamide resin, polyolefin resin, cyclic polyolefin resin, or the like A composite film having a plurality of layers made of a resin is exemplified.

The spacer 16 is laminated on the electrode film 5 to form a gap through which the liquid sample passes between the upper transparent cover plate 14 having the liquid inlet 11 and the liquid outlet 12. The material is not particularly limited. The spacer 16 may be opaque or transparent.
Specific examples of the resin film used for the spacer 16 include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic resins, epoxy resins, fluorine resins, silicone resins, polycarbonate resins, diacetate resins, Single-layer film or multi-layer composite film having a thickness of 50 to 300 μm made of triacetate resin, polyarylate resin, polyvinyl chloride, polysulfone resin, polyether sulfone resin, polyimide resin, polyamide resin, polyolefin resin, cyclic polyolefin resin, etc. Is mentioned.

  The electrode pattern 2 (or 4) shown in FIG. 1, FIG. 3, and FIG. 5 is composed of a comb-shaped electrode, and is provided on one surface of a flexible substrate 1. This comb-shaped electrode is a conductive thin film 2 nested in a pair or a plurality of pairs of opposing comb-shaped shapes, or an electrode pattern 4 in which a plating layer 3 is laminated on the conductive thin film 2. is there.

  Formation of electrode pattern 2 made of a conductive thin film of dielectrophoretic electrode contains an electrode pattern made of developed silver produced by a photographic method, or one or more selected from metal particles, carbon nanotubes, and carbon nanofibers Electrode pattern formed by printing conductive paste, electrode pattern formed by printing paste containing electroless plating catalyst, metal or metal oxide deposited thin film on the surface of substrate, photolithography Any one of the electrode patterns formed by the method is preferred.

  The electrode pattern 4 formed by laminating the plating layer 3 on the electroconductive thin film 2 of the dielectrophoretic electrode is formed by an electrode pattern made of developed silver produced by a photographic method, or metal particles, carbon nanotubes, carbon nanofibers. Electrode pattern formed by printing a conductive paste containing one or more selected from the above, electrode pattern formed by printing a paste containing an electroless plating catalyst, photoresist pattern or solvent-soluble printing material On the electrode pattern formed by the peeling (lift-off) method, which is performed by removing the shielding mask after vacuum deposition of metal or metal oxide using any of the patterns printed as a shielding mask. Preferably, the electrode pattern is formed by laminating metal plating by electrolytic plating and / or electrolytic plating. Arbitrariness.

  As described above, in the present invention, as a method for producing an electrode pattern, a method of generating from a developed silver layer generated by a photographic method, a method of laminating plating on a developed silver layer generated by a photographic method, a conductive paste A method of generating by printing, a method of laminating plating on a metal layer generated by printing a conductive paste, a method of depositing metal by a lift-off method, a metal generated by deposition or a metal oxide For example, a method of laminating plating on a vapor deposition layer of an object can be used. In the following, the electrode pattern manufacturing method by each method and the metal plating layer will be described in order.

(Metal thin film composed of developed silver produced by photographic method)
In the exposure development method based on the photographic method for forming a developed silver layer, (a) developed silver appears in an exposed portion that is not covered with an exposure mask, that is, developed in a shape opposite to the exposure mask. A so-called negative exposure and development method in which silver appears; and (b) a so-called positive type in which developed silver appears in a portion that is covered with an exposure mask and is not exposed, that is, developed silver appears in the same shape as the exposure mask. There are two exposure development methods.
In the present invention, any of the above-described two photographic production methods (a) negative exposure / development method and (b) positive exposure / development method can be applied.

(Photo production method)
Hereinafter, a method for producing a developed silver mesh pattern by a positive exposure / development method (DTR method) will be described. In the case of the DTR method, a physical development nucleus layer is preferably provided in advance on the surface of a flexible substrate. As the physical development nuclei, fine particles (having a particle size of about 1 to several tens of nm) made of heavy metals or sulfides thereof are used. Examples thereof include colloids such as gold and silver, metal sulfides obtained by mixing water-soluble salts such as palladium and zinc and sulfides, and the like. The fine particle layer of these physical development nuclei can be provided on the transparent substrate by a vacuum deposition method, a cathode sputtering method, a coating method or the like. From the viewpoint of production efficiency, a coating method is preferably used. The content of physical development nuclei in the physical development nuclei layer is suitably about 0.1 to 10 mg per square meter in solid content.

1, 2, 4 and 6 can be provided with an adhesive layer of a polymer latex layer such as vinylidene chloride or polyurethane, and between the adhesive layer and the physical development nucleus layer. Can also be provided with an intermediate layer made of a hydrophilic binder such as gelatin.
The physical development nucleus layer preferably contains a hydrophilic binder. The amount of the hydrophilic binder is preferably about 10 to 300% by mass with respect to the physical development nucleus. As the hydrophilic binder, gelatin, gum arabic, cellulose, albumin, casein, sodium alginate, various starches, polyvinyl alcohol, polyvinyl pyrrolidone, polyacrylamide, a copolymer of acrylamide and vinyl imidazole, and the like can be used. The physical development nucleus layer may also contain a hydrophilic binder crosslinking agent.

The physical development nucleus layer and the intermediate layer can be applied by an application method such as dip coating, slide coating, curtain coating, bar coating, air knife coating, roll coating, gravure coating, spray coating, and the like. In the present invention, the physical development nucleus layer is preferably provided as a continuous and uniform layer by the above-described coating method.
The supply of silver halide for precipitating metallic silver on the physical development nucleus layer is performed by a method in which the physical development nucleus layer and the silver halide emulsion layer are integrally provided in this order on the substrate, or another paper or plastic resin film. There is a method of supplying a soluble silver complex salt from a silver halide emulsion layer provided on a substrate such as the above. From the viewpoint of cost and production efficiency, the former physical development nucleus layer and the silver halide emulsion layer are preferably provided integrally.

The silver halide emulsion can be produced according to a general method for producing a silver halide emulsion of a silver halide photographic light-sensitive material. The silver halide emulsion is usually prepared by mixing and ripening an aqueous silver nitrate solution, an aqueous halogen solution of sodium chloride or sodium bromide in the presence of gelatin.
The silver halide composition of the silver halide emulsion layer preferably contains 80 mol% or more of silver chloride, and more preferably 90 mol% or more is silver chloride. The conductivity of the physically developed silver formed by increasing the silver chloride content is improved.
The silver halide emulsion layer is sensitive to various light sources. When the electrode pattern is formed by physical development silver in the present invention, the exposure method of the silver halide emulsion layer is a method in which the transparent original of the electrode pattern and the silver halide emulsion layer are exposed in close contact, or various laser beams are used. There are scanning exposure methods and the like. The former contact exposure is possible even if the silver halide has relatively low photosensitivity, but in the case of scanning exposure using laser light, relatively high photosensitivity is required. Therefore, when the latter exposure method is used, the silver halide may be subjected to chemical sensitization or spectral sensitization with a sensitizing dye in order to increase the sensitivity of the silver halide.

Chemical sensitization includes metal sensitization using a gold compound or silver compound, sulfur sensitization using a sulfur compound, or a combination thereof. Gold-sulfur sensitization using a gold compound and a sulfur compound in combination is preferable. In the above-described method of exposing with laser light, a laser beam having an oscillation wavelength of 450 nm or less, for example, a blue semiconductor laser (also referred to as a violet laser diode) having an oscillation wavelength of 400 to 430 nm is used. It can be handled even under a yellow fluorescent lamp.
Any position on the substrate on which the physical development nucleus layer is provided, for example, an adhesive layer, an intermediate layer, a physical development nucleus layer or a silver halide emulsion layer, a protective layer, or a backing layer provided with a support interposed therebetween. A dye or pigment for preventing irradiation may be contained.
When developing silver using a photosensitive material in which a silver halide emulsion layer is coated directly on the physical development nucleus layer or via an intermediate layer, the transparent original of the electrode pattern and the photosensitive material are adhered to each other. Or after exposing the above photosensitive material to scanning exposure of a digital image of an electrode pattern with various laser beam output machines, and then processing in an alkaline solution in the presence of a soluble silver complex salt forming agent and a reducing agent. Transfer development (DTR development) occurs, the silver halide in the unexposed area is dissolved to form a silver complex salt, which is reduced on the physical development nuclei to deposit metal silver to obtain a physically developed silver thin film having an electrode pattern. . The exposed portion is chemically developed in the silver halide emulsion layer to become blackened silver. After the development, the silver halide emulsion layer and the intermediate layer, or the protective layer provided if necessary, are removed by washing with water, and the physically developed silver thin film of the electrode pattern is exposed on the surface.

After DTR development, the silver halide emulsion layer or the like provided on the physical development nucleus layer may be removed by washing with water or transferring and peeling to a release paper or the like. There are two methods for removing the water washing: a method of removing hot water using a scrubbing roller or the like while jetting it with a nozzle or the like, and a method of removing hot water by jetting with a nozzle or the like.
On the other hand, when supplying a soluble silver complex salt from a silver halide emulsion layer provided on a substrate different from the substrate on which the physical development nucleus layer was coated, the silver halide emulsion layer was exposed in the same manner as described above. After that, the substrate coated with the physical development nucleus layer and another photosensitive material coated with the silver halide emulsion layer are superposed and adhered in an alkaline solution in the presence of a soluble silver complex salt forming agent and a reducing agent. Then, after taking out from the alkaline solution, after several tens of seconds to several minutes, the both are removed to obtain a physically developed silver thin film having an electrode pattern deposited on the physical development nuclei.

Next, a soluble silver complex salt forming agent, a reducing agent, and an alkali solution necessary for silver complex diffusion transfer development will be described. The soluble silver complex salt forming agent is a compound that dissolves silver halide to form a soluble silver complex salt, and the reducing agent is a compound that reduces this soluble silver complex salt to precipitate metallic silver on physical development nuclei. These actions are performed in an alkaline solution.
Examples of the soluble silver complex forming agent used in the present invention include sodium thiosulfate, thiosulfate such as ammonium thiosulfate, thiocyanate such as sodium thiocyanate and ammonium thiocyanate, alkanolamine, sodium sulfite, and potassium bisulfite. Sulfites such as T. H. Examples include the compounds described in 474-475 (1977) of James The Theory of the Photographic Process 4th edition.
As the reducing agent, a developing agent known in the field of photographic development can be used. For example, hydroquinone, catechol, pyrogallol, methylhydroquinone, polyhydroxybenzenes such as chlorohydroquinone, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1-phenyl-3-pyrazolidone, 1-phenyl-4-methyl- Examples include 3-pyrazolidones such as 4-hydroxymethyl-3-pyrazolidone, paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, paraphenylenediamine, and the like.

The above-described soluble silver complex salt forming agent and reducing agent may be applied to the substrate together with the physical development nucleus layer, added to the silver halide emulsion layer, or contained in an alkaline solution. Further, it may be contained in a plurality of positions, but it is preferably contained in at least the alkaline liquid.
The content of the soluble silver complex salt forming agent in the alkaline solution is suitably used in the range of 0.1 to 5 mol per liter of the developer, and the reducing agent is 0.05 to 1 per liter of the developer. It is suitable to use in the molar range.
The pH of the alkaline solution is preferably 10 or more, and more preferably in the range of 11-14. Application of the alkaline solution for silver complex diffusion transfer development may be an immersion method or a coating method. The immersion method is, for example, a method in which a substrate provided with a physical development nucleus layer and a silver halide emulsion layer is transported while being immersed in an alkaline liquid stored in a large amount in a tank. About 40 to 120 ml of alkali solution per square meter is applied on the silver halide emulsion layer.

The pattern of the dielectrophoresis electrode for collecting the dielectric fine particles is selected according to the particle diameter of the dielectric fine particles to be collected. In the case of a comb electrode generally used as a dielectrophoresis electrode, the line width is 1 to 200 μm, the groove interval (interval between a pair of electrodes) is 0.1 to 1000 μm, and the line thickness is 0.05 to 30 μm. Is preferred. Also in the case of other electrode shapes, the line width, the spacing between the electrodes, and the line thickness can be set to the same level as that of the comb electrode.
Compared to the particle size of the dielectric fine particles to be collected, if the line width or the groove spacing of the comb-shaped electrode is too narrow, the grooves are filled, and an electric field that causes dielectrophoresis cannot be formed properly. Collection of fine particles becomes incomplete. Further, the line thickness of the comb-shaped electrode needs to be appropriately selected according to the particle diameter of the dielectric fine particles to be collected.

The developed silver layer by physical development of an arbitrary electrode pattern formed on a flexible base material according to the present invention has a very thin film thickness but is highly conductive, so that it can be made thin and fine. It is possible to increase the collection efficiency of various dielectric fine particles.
In addition, the developed silver layer itself by this physical development, the metal silver particles forming the developed silver layer obtained after the development process is very small, and the amount of the hydrophilic binder present in the developed silver layer is extremely small, Since the developed silver layer is formed in the state where the developed silver layer is close to the close-packed state and has electric conductivity, it can be plated with a metal such as copper or nickel. If necessary, a metal plating layer can be laminated on the developed silver layer.

(Exposure equipment)
As the exposure apparatus for exposing the silver halide emulsion layer, there are a single wafer processing type exposure apparatus using a single wafer type exposure mask (photomask) and a continuous exposure apparatus capable of forming a continuous pattern. A single wafer processing type exposure apparatus uses a single wafer type exposure mask (photomask) on which a predetermined mask pattern is formed to feed a flexible base material to the exposure apparatus by intermittent feeding, and passes through the inside of the apparatus. Evacuation is performed and the exposure mask and the substrate are brought into close contact with each other to eliminate a gap, and then, for example, exposure is performed with ultraviolet rays. In a single wafer processing type exposure apparatus, since vacuum evacuation, exposure, and release to the atmosphere are intermittently performed, continuous production cannot be performed, and the processing speed becomes slow.
On the other hand, if a continuous exposure apparatus that can continuously expose a flexible substrate is used, the processing speed is higher than that of a single wafer processing type exposure apparatus, and continuous production is possible. There are advantages.
As an example of the continuous exposure apparatus, a cylindrical drum made of a material that transmits light used for exposure in a photographic method, an exposure mask film formed with a mesh pattern provided on the outer peripheral wall of the cylindrical drum, and the inside of the cylindrical drum And an exposure light source disposed on the surface of the cylindrical drum, and exposes a substrate wound around the cylindrical drum with light emitted from a light source inside the cylindrical drum.

(Generation of conductive thin film by printing)
The conductive paste used in the present invention is an electrode pattern made of a conductive thin film. Usually, a conductive paste in which conductive particles such as metal particles, carbon nanoparticles, and carbon fibers are mixed with a resin component as a binder is used. The conductive thin film may be formed by printing a conductive paste containing one or more selected from metal particles, carbon nanoparticles, and carbon fibers. Alternatively, a conductive metal thin film may be formed by printing a paste containing an electroless catalyst.
As said metal particle, metal powder, such as copper, silver, nickel, aluminum, is used, However, It is preferable to use the fine powder of copper or silver from the point of electroconductivity and a price.
Since the line width of the electrode pattern to be printed is about 1 to 100 μm, the particle diameter of the conductive particles used for the conductive paste may be about 0.05 to 5 μm.

As the resin component used for the conductive paste, a thermoplastic resin such as a polyester resin, a (meth) acrylic resin, a thermoplastic resin, a polystyrene resin, or a polyamide resin is preferably used. Further, it may be a thermosetting resin such as an epoxy resin, an amino resin, a polyimide resin, or a (meth) acrylic resin.
In the conductive paste, the metal powder or carbon powder is mixed with these resin components, and then the viscosity is adjusted by adding an organic solvent such as alcohol or ether.
The electrode pattern 2 is printed on one side of the flexible substrate 1 shown in FIGS. 1, 4 and 6 using a conductive paste, and the solvent is removed by drying to cure the electrode pattern.
The method for applying the conductive paste to form the electrode pattern is not particularly limited, but it is preferably printed by a method such as screen printing, gravure printing, or ink jet method.

(Generation of conductive thin film by vapor deposition)
The electrode pattern of the metal or metal oxide vapor deposition layer used in the present invention is preferably formed using a peeling (lift-off) method. After conducting vacuum deposition of metal or metal oxide using either a photoresist pattern or a pattern printed with solvent-soluble printing material as a shielding mask, the shielding mask is removed to form a conductive thin film of electrode pattern Is done. The metal oxide used as the conductive thin film has conductivity such as a semiconductor, and examples thereof include ITO (indium-added tin oxide) and zinc oxide.

A method for forming a fine line mesh pattern by a peeling (lift-off) method performed using a photoresist pattern as a shielding mask is as follows.
First, after applying a resist on a flexible substrate, heat treatment (pre-baking) is performed to remove the solvent from the resist. Next, after exposing a desired electrode pattern to the resist using a photomask, the resist pattern is developed to form a resist pattern to be a shielding mask. Next, on the shielding mask composed of the base material and the resist pattern, after forming the vapor deposition film over the entire surface, using the resist remover, the shielding mask and the vapor deposition film on the mask are simultaneously removed, A metal thin film layer having an electrode pattern made of a deposited film left on a flexible substrate is obtained.

A method of forming an electrode pattern by a peeling (lift-off) method performed using an electrode pattern printed with a solvent-soluble printing material as a shielding mask is as follows.
First, a portion serving as a shielding mask is printed on a flexible substrate with a printing material mainly composed of a solvent-soluble resin. Next, after forming a vapor deposition film over the entire surface of the flexible base material and the shielding mask made of the printing material, using the solvent, the shielding mask and the vapor deposition film on the mask Are removed at the same time to obtain a conductive thin film having an electrode pattern made of a deposited film left on the substrate.

(Metal plating layer)
The plating method used when laminating a metal plating layer on a developed silver layer, which is a conductive metal thin film forming an electrode pattern, or other conductive thin film layer is an electroless plating method or an electrolytic plating method. Or any of the plating methods which combined both is possible.
Select from metal group such as gold, platinum, ruthenium, palladium, rhodium, silver, aluminum, nickel, chromium, copper, zinc, tin by electroless plating and / or electrolytic plating on conductive thin film of electrode pattern It is preferable that the metal plating layer which consists of 1 type or 2 types or more of formed metal is laminated | stacked.
In the present invention, the metal plating method can be performed by a known method. For example, the electroless plating method is conventionally known, such as copper, nickel, silver, gold, tin, solder, or a multilayer or composite system of copper / nickel. These methods can be used, and for these, reference can be made to documents such as “Basics and Applications of Electroless Plating; Nikkan Kogyo Shimbun, May 30, 1994, First Edition”.

The metal used for plating is chromium (Cr) and / or nickel (Ni) because it is easy to plate and the plating layer is excellent in conductivity and corrosion resistance, and can be plated on a thick film at low cost. Is preferred. It is also preferable that the metal plating layer is formed by laminating a plurality of layers of the same kind of metal or different kinds of metals by performing plating a plurality of times. For example, when a first plating layer is laminated on a developed silver layer and a second plating layer is further laminated thereon, one plating layer is an electroless nickel plating layer, and the other plating layer is electrolytic chromium ( Combinations that are Cr) layers are preferred.
The type of the plating tank used for plating may be either a vertical type or a horizontal type, but the length is determined so as to ensure a predetermined plating residence time.

(Dielectrophoresis cell)
As shown in FIGS. 5 to 7, the dielectrophoresis cell 10 using the electrode film 5 having the electrode pattern 2 (or 4) of FIG. 1 according to the present invention was placed on the lower support plate 13. An upper transparent cover plate 14 having a liquid inlet 11 and a liquid outlet 12 on an electrode film 5 in which an electrode pattern 2 (or 4) is formed on a substrate 1 having flexibility is a liquid sample. Are stacked via spacers 16 in which voids are formed.
The liquid inlet 11 and the liquid outlet 12 provided in the upper transparent cover plate 14 are preferably provided with either an opening hole for pipe connection or a short pipe.
A dielectrophoresis cell 10 shown in FIG. 5 includes lead wires 6 and 6 from a pair of comb electrodes (electrode patterns) 2 (or 4).

6, the electrode pattern 2 (or 4) and the transparent upper transparent cover plate 14 are adjusted by adjusting the thickness (about 50 to 300 μm) of the spacer 16 in the sectional view taken along the line D-D in FIG. 5. The height of the gap through which the liquid sample can pass can be set.
The lower support plate 13 and the lower portion of the flexible base material 1 of the electrode film 5 are bonded together with an adhesive layer 20. Further, the upper transparent cover plate 14 is bonded to the upper part of the flexible base material 1 of the electrode film 5 with the adhesive layers 19 and 18 through the spacer 16.

A general purpose dielectrophoresis cell 10 includes an electrode film 5 in which an electrode pattern 2 (or 4) is laminated on a flexible substrate 1, and a transparent film on which the electrode film 5 is placed. A lower support plate 13, a spacer 16 laminated on the electrode film 5 so as to form a gap 15 through which the liquid sample passes, and an upper transparent cover plate 14 having a liquid sample entrance and exit. The upper transparent cover plate 14 is laminated on the electrode film 5 via the spacers 16 and bonded so that it cannot be easily peeled off.
In this case, the dielectrophoresis cell 10 in which a certain amount of dielectric fine particles are collected in the electrode pattern 2 (or 4) can be cleaned and reused, but it is inexpensive based on the present invention. The produced dielectrophoresis cell 10 can be used as it is without being reused, which is convenient because it eliminates the need for cleaning.

  On the other hand, the special purpose dielectrophoresis cell 10 is transparent on the upper part of the dielectrophoresis cell 10 in order to collect and use the dielectric fine particles (such as useful microorganisms) collected in the electrode pattern 2 (or 4). The cover plate 14 and the upper part of the electrode film 5 can be peeled again from the adhesive layer 18 bonding. In this case, it is preferable to use an ultraviolet curable removable adhesive that provides stable removability for the adhesive layer 18.

  As shown in FIGS. 5 and 6, the dielectric fine particles 17 contained in the liquid sample transferred to the inside of the dielectrophoresis cell 10 are basically comb-shaped in which an electric field is formed by the electrode pattern 2 (or 4). It is captured in the groove 7 between the electrodes.

  In the case of a comb-shaped electrode as shown in FIG. 3, the electrode pattern 2 (or 4) consists of very fine fine lines (line width 1 to 200 μm), and the groove interval of the electrode pattern 2 (or 4) is also captured. It is set to a predetermined size (0.1 to 1000 μm) according to the size of the microorganisms to be collected. The thickness of the electrode pattern 2 (or 4) is also set to a preferable thickness dimension (0.05 to 30 μm) in accordance with the size of the dielectric fine particles to be collected.

As shown in FIG. 5, the dielectrophoresis cell 10 is provided with a pair of comb electrodes as the electrode pattern 2 (or 4). The flow direction of the liquid sample of the comb electrodes (left in FIG. 5) The liquid sample flows in the right direction from the direction), or may be parallel or orthogonal (not shown).
The dielectrophoresis cell 10 may be provided with a plurality of pairs of comb electrodes.

  In addition, the dielectrophoresis cell of the present invention uses two electrode films in which one or more electrode patterns are formed on a flexible substrate so that the electrode patterns of the electrode films face each other. Further, they may be arranged via spacers at regular intervals (not shown). In this case, if the liquid inlet and the liquid outlet are provided in one of the two electrode films, the lower support plate 13 and the upper transparent cover plate 14 in FIG. 5 can be omitted.

(Dielectric fine particle collector)
A collection device for collecting dielectric fine particles by a general dielectrophoresis method includes a transfer means for transferring a liquid sample such as a pump, a dielectrophoretic electrode for collecting dielectric fine particles, and an alternating current to the dielectrophoretic electrode. A power supply unit that applies a voltage, and further includes a measuring unit that measures a change in impedance due to an AC voltage applied to the dielectrophoresis electrode, if necessary.
The dielectrophoretic electrode 5 according to the present invention shown in FIGS. 1 to 4 and the dielectrophoretic cell 10 according to the present invention shown in FIGS. 5 to 7 are generally in a liquid sample having a conventionally known configuration. The present invention can be applied to a collection device (for example, Patent Documents 2, 3, and 4) that collect dielectric fine particles by a dielectrophoresis method.

  The present invention collects dielectric fine particles contained in liquid samples such as washing water, dilution water, and drinking water used in various industrial fields such as food manufacturing, pharmaceutical manufacturing, and semiconductor manufacturing by dielectrophoresis. It can apply to the electrode for doing. The dielectrophoretic electrode of the present invention can be applied to a dielectrophoresis cell and a dielectric fine particle collecting device.

It is a top view which shows the embodiment example of the dielectrophoresis electrode of this invention. It is arrow sectional drawing which follows the AA line of FIG. FIG. 2 is a partially enlarged plan view of a portion B in FIG. 1. FIG. 4 is a cross-sectional view taken along line CC in FIG. 3, where (a) is a dielectrophoresis electrode made of a conductive thin film, and (b) is a dielectrophoresis electrode in which a plating layer is laminated on the electroconductive thin film. . It is a top view which shows the embodiment example of a dielectrophoresis cell using the dielectrophoresis electrode of this invention. It is arrow sectional drawing which follows the DD line | wire of FIG. It is a top view of a spacer. It is a top view which shows the example of the elongate electrode film in which the several electrode pattern was formed. It is an outline manufacturing process figure which performs electroplating on the electroconductive thin film of the electrode pattern formed in the single side | surface of the base material which has flexibility.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base material which has flexibility, 2 ... Conductive thin film (electrode pattern), 3 ... Metal plating layer, 4 ... Electrode pattern which laminated | stacked the plating layer on the conductive thin film, 5 ... Dielectrophoresis electrode (electrode film), 6 ... Lead-out wiring, 7 ... Groove between comb electrodes, 10 ... Dielectrophoresis cell, 11 ... Liquid inlet, 12 ... Liquid outlet, 13 ... Lower support plate, 14 ... Upper transparent cover plate, 15 ... Liquid passage 16 ... spacer, 17 ... dielectric fine particles, 18, 19, 20 ... adhesive layer, 21 ... roll of electrode film made of conductive thin film, 22 ... transfer roll, 23 ... water washing device, 24 ... electrolysis Plating apparatus, 25 ... water washing apparatus, 26 ... drying apparatus, 27 ... roll body of electrode film in which a plating layer is laminated on a conductive thin film, 30 ... length in which an electrode pattern composed of a plurality of conductive thin films is formed Scale electrode film.

Claims (13)

  Electrodes for collecting dielectric fine particles in a liquid sample by dielectrophoresis, and forming an electrode pattern consisting of a thin film of developed silver formed by photolithography on one side of a flexible substrate A dielectrophoresis electrode characterized by being made.   An electrode for collecting dielectric fine particles in a liquid sample by a dielectrophoresis method, wherein an electrode pattern is formed on one side of a flexible substrate, and the electrode pattern is formed by a photographic process. Selected from the group of metals such as gold, platinum, ruthenium, palladium, rhodium, silver, aluminum, nickel, chromium, copper, zinc, tin by electroless plating and / or electrolytic plating on the developed silver thin film A dielectrophoretic electrode, characterized in that it is an electrode pattern formed by laminating metal plating layers made of one or more kinds of the formed metals.   An electrode for collecting dielectric fine particles in a liquid sample by a dielectrophoresis method, characterized in that an electrode pattern made of a conductive thin film is formed on one side of a flexible substrate. Dielectrophoresis electrode.   The conductive thin film is formed by printing a conductive paste containing one or more selected from metal particles, carbon nanoparticles or carbon fibers, and a paste containing an electroless plating catalyst. The shielding mask is removed after sputtering or vacuum evaporation of metal or metal oxide using the conductive thin film, photoresist pattern or pattern printed with solvent-soluble printing material formed as a shielding mask. Conductive thin film formed by peeling (lift-off) method, thin film formed by sputtering or vacuum deposition of metal or metal oxide, etched thin film formed by photolithographic method, metal foil by photolithographic method 4. The conductive thin film formed by etching, wherein Dielectrophoresis electrode.   The electrode pattern is a metal such as gold, platinum, ruthenium, palladium, rhodium, silver, aluminum, nickel, chromium, copper, zinc, tin, etc. by electroless plating and / or electrolytic plating on the conductive thin film. The dielectrophoretic electrode according to claim 4, wherein the electrode pattern is an electrode pattern formed by laminating metal plating layers made of one or more metals selected from a group.   The dielectrophoretic electrode according to claim 1, wherein at least a pair of the electrode patterns are formed on one surface of the flexible base material.   The dielectrophoretic electrode according to claim 1, wherein the electrode pattern is a comb-shaped electrode.   8. The dielectrophoresis electrode according to claim 7, wherein the comb-shaped electrode has a line width of 1 to 200 [mu] m, a groove interval of 0.1 to 1000 [mu] m, and a line thickness of 0.05 to 30 [mu] m.   9. The dielectrophoretic electrode according to claim 8, wherein a dielectric film for electrical insulation from a liquid sample is formed on the connection wiring pattern for connecting to the electrode pattern and an external power source.   A dielectrophoresis cell comprising the dielectrophoresis electrode according to claim 1.   An apparatus for collecting dielectric fine particles by dielectrophoresis, comprising the dielectrophoretic electrode according to claim 1.   The dielectrophoresis electrode is an electrode film in which the flexible base material is a film base material, and the dielectrophoresis cell has the electrode film and a transparent lower support plate on which the electrode film is placed. And a spacer laminated on the electrode film so as to form a gap through which the liquid sample passes, and an upper transparent cover plate having an inlet / outlet for the liquid sample, the upper transparent cover plate being interposed via the spacer 11. The dielectrophoresis cell according to claim 10, wherein the dielectrophoresis cell is laminated on the electrode film and adhered so as not to be easily peeled off.   The dielectrophoresis electrode is an electrode film in which the flexible base material is a film base material, and the dielectrophoresis cell has the electrode film and a transparent lower support plate on which the electrode film is placed. And a spacer laminated on the electrode film so as to form a gap through which the liquid sample passes, and an upper transparent cover plate having an inlet / outlet for the liquid sample, the upper transparent cover plate being interposed via the spacer 11. The dielectrophoresis cell according to claim 10, wherein the dielectrophoresis cell is laminated on the electrode film and adhered so as to be peeled off again.

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