JP2009255271A5 - - Google Patents

Download PDF

Info

Publication number
JP2009255271A5
JP2009255271A5 JP2008199426A JP2008199426A JP2009255271A5 JP 2009255271 A5 JP2009255271 A5 JP 2009255271A5 JP 2008199426 A JP2008199426 A JP 2008199426A JP 2008199426 A JP2008199426 A JP 2008199426A JP 2009255271 A5 JP2009255271 A5 JP 2009255271A5
Authority
JP
Japan
Prior art keywords
polishing pad
cushion layer
polishing
mpa
pad according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008199426A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009255271A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008199426A priority Critical patent/JP2009255271A/ja
Priority claimed from JP2008199426A external-priority patent/JP2009255271A/ja
Publication of JP2009255271A publication Critical patent/JP2009255271A/ja
Publication of JP2009255271A5 publication Critical patent/JP2009255271A5/ja
Pending legal-status Critical Current

Links

JP2008199426A 2007-08-01 2008-08-01 研磨パッド、およびその製造方法 Pending JP2009255271A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008199426A JP2009255271A (ja) 2007-08-01 2008-08-01 研磨パッド、およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007200440 2007-08-01
JP2008068926 2008-03-18
JP2008199426A JP2009255271A (ja) 2007-08-01 2008-08-01 研磨パッド、およびその製造方法

Publications (2)

Publication Number Publication Date
JP2009255271A JP2009255271A (ja) 2009-11-05
JP2009255271A5 true JP2009255271A5 (enrdf_load_stackoverflow) 2011-09-01

Family

ID=41383359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008199426A Pending JP2009255271A (ja) 2007-08-01 2008-08-01 研磨パッド、およびその製造方法

Country Status (1)

Country Link
JP (1) JP2009255271A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011115935A (ja) * 2009-10-30 2011-06-16 Toray Ind Inc 研磨パッドおよび研磨パッドの製造方法
JP7295624B2 (ja) * 2018-09-28 2023-06-21 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP7198395B2 (ja) * 2019-02-05 2023-01-04 東レコーテックス株式会社 研磨シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0963995A (ja) * 1995-08-28 1997-03-07 Hitachi Ltd 研磨装置およびそれを用いた研磨方法
JPH10125681A (ja) * 1996-08-27 1998-05-15 Toshiba Corp 半導体装置の製造方法
JP3668046B2 (ja) * 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3890786B2 (ja) * 1998-11-09 2007-03-07 東レ株式会社 研磨装置および研磨パッド
JP2002192455A (ja) * 2000-12-25 2002-07-10 Toyobo Co Ltd 研磨パッド
JP2004022886A (ja) * 2002-06-18 2004-01-22 Nikon Corp 研磨部材、この研磨部材を用いた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP4709530B2 (ja) * 2004-11-04 2011-06-22 リケンテクノス株式会社 難燃性樹脂組成物
JP2006339573A (ja) * 2005-06-06 2006-12-14 Toray Ind Inc 研磨パッドおよび研磨装置
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法

Similar Documents

Publication Publication Date Title
MX2010010430A (es) Ensamble de compuesto biolaminado y metodos relacionados.
JP2014205915A5 (enrdf_load_stackoverflow)
JP2011176038A5 (enrdf_load_stackoverflow)
JP2016029161A5 (enrdf_load_stackoverflow)
NO20093090L (no) Flerlags polymersjikt med en smeltebruddflate
JP2015120876A5 (enrdf_load_stackoverflow)
DE602008003537D1 (de) Dämpfer mit eingeschlossener schicht für fahrzeug
AR058894A1 (es) Azulejo para piso
JP2011500359A5 (enrdf_load_stackoverflow)
JP2011507736A5 (enrdf_load_stackoverflow)
EP1988575A3 (en) Semiconductor device
JP2010518649A5 (enrdf_load_stackoverflow)
JP2009529442A5 (enrdf_load_stackoverflow)
IN2012DN01193A (enrdf_load_stackoverflow)
MX384409B (es) Película de capa intermedia para vidrio laminado, método para fabricar película de capa intermedia para vidrio laminado y vidrio laminado.
JP2011122069A5 (enrdf_load_stackoverflow)
WO2009028897A8 (en) Bonded steel plate having excellent sound-absorbing, virbration-damping and processability
JP2010047979A5 (enrdf_load_stackoverflow)
DE112006001483A5 (de) Siegelbares Laminat für wiederverschließbare Verpackung
WO2011065714A3 (ko) 무늬목 강화 원목마루 및 그 제조 방법
CL2014001210A1 (es) Compuesto de elementos conformado de materiales de madera en que una superficie del elemento comprende primera capa de adhesivo de fusion reticulado curado por radiacion, y cubierta por segunda capa de adhesivo fundido y esto unido adhesivamente a un sustrato en forma de pelicula; metodo para fabricar dicho compuesto, adhesivo de fusion; y uso de dicho adhesivo.
JP2011507720A5 (enrdf_load_stackoverflow)
JP2011079297A5 (enrdf_load_stackoverflow)
TW201129473A (en) Laminated film
JP2014110390A5 (enrdf_load_stackoverflow)