JP2009255271A5 - - Google Patents

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Publication number
JP2009255271A5
JP2009255271A5 JP2008199426A JP2008199426A JP2009255271A5 JP 2009255271 A5 JP2009255271 A5 JP 2009255271A5 JP 2008199426 A JP2008199426 A JP 2008199426A JP 2008199426 A JP2008199426 A JP 2008199426A JP 2009255271 A5 JP2009255271 A5 JP 2009255271A5
Authority
JP
Japan
Prior art keywords
polishing pad
cushion layer
polishing
mpa
pad according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008199426A
Other languages
Japanese (ja)
Other versions
JP2009255271A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008199426A priority Critical patent/JP2009255271A/en
Priority claimed from JP2008199426A external-priority patent/JP2009255271A/en
Publication of JP2009255271A publication Critical patent/JP2009255271A/en
Publication of JP2009255271A5 publication Critical patent/JP2009255271A5/ja
Pending legal-status Critical Current

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Claims (5)

圧縮弾性率が３ＭＰａ以上１０ＭＰａ以下の研磨層と、圧縮弾性率が２ＭＰａ以上１０ＭＰａ以下のクッション層との積層体からなり、最大厚みと最小厚みの差が５０μｍ以下でかつ、積層体の厚みバラツキをクッション層の厚みで除した値が０．１５以下であることを特徴とする研磨パッド。 It consists of a laminate of a polishing layer having a compression modulus of 3 MPa to 10 MPa and a cushion layer having a compression modulus of 2 MPa to 10 MPa, and the difference between the maximum thickness and the minimum thickness is 50 μm or less, and the thickness variation of the laminate A polishing pad, wherein the value divided by the thickness of the cushion layer is 0.15 or less. クッション層が無発泡構造である請求項１記載の研磨パッド。 The polishing pad according to claim 1, wherein the cushion layer has a non-foamed structure. クッション層がポリウレタンゴムである請求項１または２記載の研磨パッド。 The polishing pad according to claim 1 or 2, wherein the cushion layer is polyurethane rubber. 研磨層とクッション層が接着剤で積層されている請求項１〜３のいずれかに記載の研磨パッド。 The polishing pad according to claim 1, wherein the polishing layer and the cushion layer are laminated with an adhesive. 半導体基板の研磨用である請求項１〜４のいずれかに記載の研磨パッド。 The polishing pad according to claim 1, which is used for polishing a semiconductor substrate.
JP2008199426A 2007-08-01 2008-08-01 Polishing pad and its manufacturing method Pending JP2009255271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008199426A JP2009255271A (en) 2007-08-01 2008-08-01 Polishing pad and its manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007200440 2007-08-01
JP2008068926 2008-03-18
JP2008199426A JP2009255271A (en) 2007-08-01 2008-08-01 Polishing pad and its manufacturing method

Publications (2)

Publication Number Publication Date
JP2009255271A JP2009255271A (en) 2009-11-05
JP2009255271A5 true JP2009255271A5 (en) 2011-09-01

Family

ID=41383359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008199426A Pending JP2009255271A (en) 2007-08-01 2008-08-01 Polishing pad and its manufacturing method

Country Status (1)

Country Link
JP (1) JP2009255271A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011115935A (en) * 2009-10-30 2011-06-16 Toray Ind Inc Polishing pad and method for manufacturing polishing pad
JP7295624B2 (en) * 2018-09-28 2023-06-21 富士紡ホールディングス株式会社 Polishing pad, method for producing same, and method for producing abrasive product
JP7198395B2 (en) * 2019-02-05 2023-01-04 東レコーテックス株式会社 polishing sheet

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0963995A (en) * 1995-08-28 1997-03-07 Hitachi Ltd Polishing device and polishing method using thereof
JPH10125681A (en) * 1996-08-27 1998-05-15 Toshiba Corp Manufacture of semiconductor device
JP3668046B2 (en) * 1998-05-11 2005-07-06 株式会社東芝 Polishing cloth and method for manufacturing semiconductor device using the polishing cloth
JP3890786B2 (en) * 1998-11-09 2007-03-07 東レ株式会社 Polishing apparatus and polishing pad
JP2002192455A (en) * 2000-12-25 2002-07-10 Toyobo Co Ltd Abrasive pad
JP2004022886A (en) * 2002-06-18 2004-01-22 Nikon Corp Polishing member, polishing device using the same, semiconductor device manufacturing method using it, and semiconductor device manufactured through the method
JP4709530B2 (en) * 2004-11-04 2011-06-22 リケンテクノス株式会社 Flame retardant resin composition
JP2006339573A (en) * 2005-06-06 2006-12-14 Toray Ind Inc Polishing pad and polishing unit
JP4884726B2 (en) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 Manufacturing method of laminated polishing pad

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