JP2011122069A5 - - Google Patents

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Publication number
JP2011122069A5
JP2011122069A5 JP2009281168A JP2009281168A JP2011122069A5 JP 2011122069 A5 JP2011122069 A5 JP 2011122069A5 JP 2009281168 A JP2009281168 A JP 2009281168A JP 2009281168 A JP2009281168 A JP 2009281168A JP 2011122069 A5 JP2011122069 A5 JP 2011122069A5
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JP
Japan
Prior art keywords
fixing
weight
parts
polishing pad
pressure
Prior art date
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Application number
JP2009281168A
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Japanese (ja)
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JP5520026B2 (en
JP2011122069A (en
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Priority to JP2009281168A priority Critical patent/JP5520026B2/en
Priority claimed from JP2009281168A external-priority patent/JP5520026B2/en
Publication of JP2011122069A publication Critical patent/JP2011122069A/en
Publication of JP2011122069A5 publication Critical patent/JP2011122069A5/ja
Application granted granted Critical
Publication of JP5520026B2 publication Critical patent/JP5520026B2/en
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Claims (1)

樹脂フィルムからなる基材の一方の面に定盤固定用粘着剤層が積層一体化され、前記基材の他方の面に研磨パッド固定用接着剤層が積層一体化された研磨パッド固定用両面粘着テープであって、定盤固定用粘着剤層を構成する粘着剤が、スチレン−イソプレン−スチレン系エラストマーを含むベース樹脂と、
このベース樹脂１００重量部に対し、５０〜２００重量部の石油系粘着付与樹脂と、１０〜６０重量部のクマロン系粘着付与樹脂とを含むことを特徴とする研磨パッド固定用両面テープ A polishing pad fixing double-sided surface in which a pressure-sensitive adhesive layer for fixing a surface plate is laminated and integrated on one surface of a base material made of a resin film, and an adhesive layer for fixing a polishing pad is stacked and integrated on the other surface of the base material A base resin containing a styrene-isoprene-styrene elastomer, wherein the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer for fixing the platen is an adhesive tape;
A double-sided tape for fixing a polishing pad comprising 50 to 200 parts by weight of a petroleum-based tackifying resin and 10 to 60 parts by weight of a coumarone-based tackifying resin with respect to 100 parts by weight of the base resin.
JP2009281168A 2009-12-11 2009-12-11 Double-sided tape for fixing polishing pad Active JP5520026B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009281168A JP5520026B2 (en) 2009-12-11 2009-12-11 Double-sided tape for fixing polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009281168A JP5520026B2 (en) 2009-12-11 2009-12-11 Double-sided tape for fixing polishing pad

Publications (3)

Publication Number Publication Date
JP2011122069A JP2011122069A (en) 2011-06-23
JP2011122069A5 true JP2011122069A5 (en) 2012-11-01
JP5520026B2 JP5520026B2 (en) 2014-06-11

Family

ID=44286268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009281168A Active JP5520026B2 (en) 2009-12-11 2009-12-11 Double-sided tape for fixing polishing pad

Country Status (1)

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JP (1) JP5520026B2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858576B2 (en) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 Hot melt adhesive sheet for laminated polishing pad and support layer with adhesive layer for laminated polishing pad
JP6034796B2 (en) * 2011-10-31 2016-11-30 東京応化工業株式会社 Adhesive composition for bonding wafer and support of wafer and use thereof
JP6594606B2 (en) * 2013-01-31 2019-10-23 日東電工株式会社 Adhesive composition and adhesive sheet
JP2015048430A (en) * 2013-09-03 2015-03-16 日東電工株式会社 Double-sided adhesive tape
JP6202958B2 (en) * 2013-09-13 2017-09-27 日東電工株式会社 Adhesive sheet
JP6513356B2 (en) * 2013-09-13 2019-05-15 日東電工株式会社 Adhesive sheet for fixing polishing pad
JP7318510B2 (en) * 2019-12-02 2023-08-01 東洋インキＳｃホールディングス株式会社 Adhesive and Adhesive Sheet for Fixing Abrasive Member
KR102460711B1 (en) * 2020-08-21 2022-10-27 한국타이어앤테크놀로지 주식회사 Foam tape for sound-absorbing tire and sound-absorbing tire comprising the same
JP7415888B2 (en) 2020-11-17 2024-01-17 信越半導体株式会社 Polishing pad, double-sided polishing device, and wafer double-sided polishing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245276A (en) * 2006-03-15 2007-09-27 Sekisui Chem Co Ltd Double-side tape for fixing polishing pad
WO2007132881A1 (en) * 2006-05-17 2007-11-22 Sekisui Chemical Co., Ltd. Double sided adhesive tape for fixing polishing pad

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