JP2011122069A - Double-sided adhesive tape for fixing polishing pad - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a both-sided adhesive tape for fixing a polishing pad, that can be bonded even to a conventional polishing plate made of a hardly bondable material and can be released with no remaining adhesive. <P>SOLUTION: A double-sided adhesive tape 1 for fixing a polishing pad includes a resin film base 2, a polishing plate-fixing self-adhesive layer 3 stacked integrally on one surface of the base 2, and a polishing pad-fixing adhesive layer 4 stacked integrally on the other surface of the base 2. The self-adhesive constituting the polishing plate-fixing self-adhesive layer 3 includes a base resin containing a styrene-isoprene-styrene-based elastomer, and 50-200 pts.wt. of a petroleum-based tackifying resin and 10-60 pts.wt. of a coumarone-based tackifying resin, each based on 100 pts.wt. of the base resin. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a double-sided tape for fixing a polishing pad used for fixing a polishing pad to a polishing surface plate of a polishing apparatus for polishing a semiconductor wafer or the like.

  With the progress of miniaturization of wiring for the purpose of increasing the density of semiconductor integrated circuits, it is necessary to make the surface irregularities of semiconductor wafers and glass substrates for liquid crystals as flat as possible. Therefore, chemical mechanical polishing (CMP) is adopted.

That is, in the CMP method, a polishing pad is fixed on a polishing surface plate of a polishing apparatus using a double-sided tape, and a polishing surface is dropped onto the polishing pad while the polishing slurry is dropped on the polishing pad. It is made to polish by moving relatively.
The double-sided tape is provided with a polishing pad adhesive layer that adheres a polishing pad along one surface of the substrate, and a polishing surface plate adhesive layer that adheres to the polishing surface plate along the other surface of the substrate. Is provided.
The polishing surface plate adhesive layer is formed of an adhesive having removability so as to facilitate replacement of the polishing pad (Patent Document 1).

JP-A-6-172722

However, in the case of a conventional double-sided tape, depending on the material of the polishing surface plate, there are some that cannot be adhered well to the polishing surface plate.
In other words, the polishing surface plate of the polishing apparatus includes various materials such as resin materials such as stainless steel, cast iron, aluminum, and polycarbonate, and in particular, those made of cast iron and polycarbonate are bonded with a conventional adhesive. It is often difficult.

  In view of the above circumstances, the present invention provides both surfaces for fixing a polishing pad that can be bonded to a polishing platen even if it is a conventional polishing platen that is difficult to bond, and can be peeled off after use without any adhesive residue. The purpose is to provide tape.

  In order to achieve the above object, the double-sided tape for fixing a polishing pad according to the present invention (hereinafter referred to only as “the double-sided tape of the present invention”) is a pressure-sensitive adhesive for fixing a platen on one surface of a substrate made of a resin film. A double-sided pressure-sensitive adhesive tape for fixing a polishing pad in which an adhesive layer is laminated and integrated, and an adhesive layer for fixing a polishing pad is laminated and integrated on the other surface of the base material, and constitutes a pressure-sensitive adhesive layer for fixing a platen A base resin containing a styrene-isoprene-styrene elastomer, 50 to 200 parts by weight of a petroleum-based tackifier resin, and 10 to 60 parts by weight of a coumarone-based tackifier resin with respect to 100 parts by weight of the base resin. It is characterized by including.

The double-sided tape of the present invention uses a resin film as a base material. By using a resin film as a base material, while strengthening the adhesive strength of the pressure-sensitive adhesive layer for fixing the surface plate and the adhesive layer for fixing the polishing pad, on the other hand, when peeling the polishing pad from the surface plate after use The polishing pad can be easily peeled off without any adhesive residue on the surface plate. In particular, the pressure-sensitive adhesive layer for fixing the platen has a high adhesive force during polishing and has excellent removability when peeled after use.
In the present invention, the substrate is not particularly limited, and examples thereof include synthetic resin films such as polyester resins and polypropylene resins. Among them, they are flat, have little thickness fluctuation, and have a certain strength. Since it has, a polyester-type resin film is suitable.
Moreover, in order to improve adhesiveness with an adhesive agent, it is preferable to perform surface treatments, such as a corona treatment and a plasma treatment, or easy adhesion processes, such as a rubber system and a polyurethane resin system, to a base material.

Moreover, although the thickness of the synthetic resin film used as a base material is not specifically limited, 12-300 micrometers is preferable, 20-250 micrometers is more preferable, 23-250 micrometers is still more preferable.
That is, when the thickness of the synthetic resin film as the base material is less than 12 μm, the base material breaks and peels cleanly when the obtained double-sided pressure-sensitive adhesive tape for fixing the polishing pad is peeled off from the polishing surface plate of the polishing machine. May not be possible. On the other hand, when the thickness exceeds 300 μm, it is difficult to adjust the pressure when the polishing pad and the resulting double-sided pressure-sensitive adhesive tape for fixing the polishing pad are pressure-bonded, and the adhesive strength between the polishing pad and the double-sided pressure-sensitive adhesive tape for fixing the polishing pad decreases. There are things to do.

In the double-sided tape of the present invention, the pressure-sensitive adhesive layer for fixing the platen is laminated and integrated on one surface of the substrate.
In the present invention, the adhesive base resin constituting the surface plate fixing adhesive layer is not particularly limited as long as it contains a styrene-isoprene-styrene elastomer.
The content of the styrene-isoprene-styrene elastomer in the base resin is not particularly limited, but is preferably 30 to 70% by weight of the entire base resin.
That is, if the content of the styrene-isoprene-styrene elastomer in the base resin is less than 30% by weight, the required adhesive strength may not be exhibited. If it exceeds 70% by weight, the amount of tackifying resin is relatively large. It may decrease and the adhesive strength may decrease.

The amount of styrene of the styrene-isoprene-styrene elastomer in the base resin is not particularly limited, but is preferably 14 to 24%, and more preferably 15 to 18%.
If the amount of styrene of the styrene-isoprene-styrene elastomer in the base resin is less than 14%, it may become an adhesive with weak cohesiveness and may not be able to withstand polishing stress. If it exceeds 24%, the cohesive force is high. In some cases, the adhesive strength may not be exhibited.

  The diblock ratio of the styrene-isoprene-styrene elastomer in the base resin is not particularly limited, but is preferably 25 to 70%, and more preferably 45 to 60%. Here, the diblock refers to a diblock composed of styrene and isoprene.

  If the diblock ratio of the styrene-isoprene-styrene elastomer is less than 25%, the cohesiveness may be too high and the adhesive force may not be exhibited. May not be able to withstand.

  The molecular weight of the styrene-isoprene-styrene elastomer in the base resin is not particularly limited, but is preferably 150,000 to 250,000 in terms of weight average molecular weight. That is, if the weight average molecular weight is less than 150,000, the heat resistance may decrease, and if the weight average molecular weight exceeds 250,000, the compatibility with the resin or solvent may be deteriorated. Here, the weight average molecular weight refers to that measured as a polystyrene-converted molecular weight by a GPC (gel permeation chromatography) method.

In the present invention, the pressure-sensitive adhesive constituting the surface plate fixing pressure-sensitive adhesive layer is 50 to 200 parts by weight (preferably 60 to 150 parts by weight, more preferably 80 to 150 parts by weight) with respect to 100 parts by weight of the base resin. 150 parts by weight of petroleum resin-based tackifier resin and 10-60 parts by weight (preferably 10-50 parts by weight, more preferably 10-30 parts by weight) of coumarone resin-based tackifier resin.
That is, when the blending amount of the petroleum resin-based tackifying resin is less than 50 parts by weight or more than 200 parts by weight with respect to 100 parts by weight of the base resin, there is a problem that the adhesive force cannot be exhibited.

  When the blending amount of the coumarone resin-based tackifying resin is less than 10 parts by weight with respect to 100 parts by weight of the base resin, the cohesive force becomes too low to withstand the polishing stress during polishing, that is, the adhesive strength is reduced. . On the other hand, when the blending amount of the coumarone resin-based tackifying resin exceeds 60 parts by weight, there is a problem that the cohesiveness becomes too high and the adhesive strength is lowered.

The petroleum resin-based tackifying resin is not particularly limited, and examples thereof include aliphatic petroleum resins, alicyclic petroleum resins, aromatic petroleum resins, and the like, and a phase with a styrene-isoprene-styrene resin. From the viewpoint of solubility, an aliphatic petroleum resin is preferred.
Further, the coumarone resin-based tackifier resin is not particularly limited, but preferably has a softening point near 120 ° C. in order to ensure cohesive strength.

  Further, in the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer for fixing the platen, if necessary, tackifying other than the antioxidant (anti-aging agent), the above petroleum resin-based tackifying resin and the coumarone resin-based tackifying resin. Various additives such as resins, organic peroxides, heat stabilizers, light stabilizers, ultraviolet absorbers can be blended, and antioxidants can be blended to prevent deterioration of the styrene-isoprene-styrene elastomer. preferable.

Although it does not specifically limit as said antioxidant, For example, phenolic antioxidants, such as 2, 2- methylenebis (4-methyl-6-t- butylphenol), N-phenyl-N- (1, 3- dimethyl). Amine-based antioxidants such as butyl) -p-phenylenediamine) and benzimidazole-based antioxidants such as 2-mercaptobenzimidazole.
The antioxidant exhibits an effect in a small amount and does not need to be too much. The amount of the antioxidant may be 2 parts by weight or less with respect to 100 parts by weight of the base resin.

  Examples of the tackifying resin other than the petroleum resin tackifying resin and the coumarone resin tackifying resin include natural products such as rosin resin and terpene resin and derivatives thereof, styrene resin, phenol resin, xylene resin and the like. Examples include synthetic resins.

The thickness of the pressure-sensitive adhesive layer for fixing the platen is not particularly limited, but is preferably 10 to 50 μm.
That is, if the thickness of the pressure-sensitive adhesive layer for fixing the surface plate is less than 10 μm, peeling may occur from the surface plate during polishing. If the thickness of the pressure-sensitive adhesive layer exceeds 50 μm, the thickness will be constant when peeling after use. There may be a residue of glue on the board side.

On the other hand, in the double-sided pressure-sensitive adhesive tape for fixing the polishing pad of the present invention, the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer for polishing pad fixing is not particularly limited as long as the pressure-sensitive adhesive can achieve the object of the present invention. A heat sensitive adhesive and a hot-melt adhesive are mentioned.
In the present invention, the heat-sensitive pressure-sensitive adhesive means a material that exhibits high adhesive force after thermocompression bonding.
Although it does not specifically limit as said heat-sensitive adhesive, The (meth) acrylic-acid alkylester type | system | group obtained by copolymerizing the polymerizable monomer in the polymerizable monomer mixture containing 90 weight% or more of (meth) acrylic acid butyl is used. Thermosensitive containing 20 to 70 parts by weight (more preferably 30 to 60 parts by weight) of a terpene phenol resin with respect to 100 parts by weight of the solid content of the copolymer and the (meth) acrylic acid alkyl ester copolymer. Mold adhesives are preferred.
In the above heat-sensitive adhesive, if the blending amount of the terpene phenol resin is less than 20 parts by weight, it may not function as a heat-sensitive adhesive or the adhesive strength may be insufficient. If it exceeds 70 parts by weight, the adhesive A layer may become hard and initial tackiness may be inferior.

  The terpene phenol resin is not particularly limited as long as the object of the present invention can be achieved. For example, a commercially available terpene phenol resin such as YS series trade name T115 of Yashara Chemical Co., Ltd. or YS series trade name T130 of Yashara Chemical Co. is used. be able to.

Moreover, you may mix | blend other tackifying resin with the said thermosensitive adhesive in the range which does not inhibit the objective of this invention other than a terpene phenol resin.
Other tackifying resins are not particularly limited, and examples thereof include phenol resins, rosin resins, and terpene resins, and these can be used alone or in combination.

[Adhesive strength of polishing pad fixing adhesive layer]
If the 180 ° peel force of the polishing pad fixing pressure-sensitive adhesive layer in the double-sided pressure-sensitive adhesive tape for polishing pad fixing is low, the polishing pad fixing pressure-sensitive adhesive layer is altered by the acid or alkali contained in the slurry during the polishing process. Since the polishing pad may be peeled off from the double-sided pressure-sensitive adhesive tape for fixing the polishing pad when the adhesive force is reduced, it is preferably 20 N / 25 mm or more, more preferably 25 N / 25 mm or more.
Here, the 180 ° peel force of the pressure-sensitive adhesive layer for fixing the polishing pad in the double-sided pressure-sensitive adhesive tape for fixing the polishing pad is measured according to JIS Z0237. In the above 180 ° peel force measurement method, a temperature of 25 ° C. is required from when a test piece made of a double-sided adhesive tape for fixing a polishing pad is attached to a test plate (stainless steel plate) until 180 ° peel force is measured. Let it stand for 30 minutes in an atmosphere with a relative humidity of 50%.

  The thickness of the pressure-sensitive adhesive layer for fixing the polishing pad is not particularly limited, but is preferably 50 to 100 μm, and more preferably 60 to 80 μm. That is, if the thickness of the pressure-sensitive adhesive layer for fixing the polishing pad is too thin, the polishing pad may be peeled off from the pressure-sensitive adhesive layer for fixing the polishing pad during the polishing step, or the polishing accuracy of the polishing pad may be deteriorated. During the polishing process, cohesive failure may occur in the pressure-sensitive adhesive layer for fixing the polishing pad.

  You may add a crosslinking agent to the adhesive used for the said adhesive pad for polishing pad fixation. The crosslinking agent is not particularly limited and includes, for example, an isocyanate crosslinking agent, an aziridine crosslinking agent, an epoxy crosslinking agent, a metal chelate crosslinking agent, etc. Among them, performance such as heat resistance and durability is expressed. Since it is easy, an isocyanate type crosslinking agent is preferable.

  In the double-sided tape for fixing the polishing pad of the present invention, it is preferable that a release material is stuck on the adhesive layer. The release material to be attached is not particularly limited, and for example, a release treatment on at least one surface of paper, plastic film, or the like with a silicone resin release agent or a long-chain alkyl group pendant graft polymer release agent. Release paper, release film and the like obtained by applying the above.

  The material of the polishing pad fixed using the double-sided tape of the present invention is not particularly limited, for example, a hard polyurethane foam, various rubber foams, foams of olefin resins such as polyethylene and polypropylene, Further, sliced products of these foams having an average foamed particle size of 0.5 mm or more, and those obtained by adding abrasive grains such as cerium and silica, fillers, abrasives, etc. to these foams.

  The double-sided tape of the present invention uses a resin film as a base material to enhance the adhesive force of the adhesive layer for fixing the surface plate and the adhesive layer for fixing the polishing pad, while polishing from the surface plate after use. When the pad is peeled off, the polishing pad can be easily peeled off without any adhesive residue on the surface plate. The pressure-sensitive adhesive constituting the platen-fixing pressure-sensitive adhesive layer is a base resin mainly composed of a styrene-isoprene-styrene elastomer and 50 to 200 parts by weight of a petroleum-based adhesive with respect to 100 parts by weight of the base resin. Since it includes 10 to 60 parts by weight of coumarone-based tackifying resin, the surface plate is used when the polishing pad is peeled off after use while ensuring a sufficient adhesive force when polishing against the polishing surface plate. The polishing pad can be easily peeled off without causing adhesive residue. Furthermore, even if it is a polishing surface plate that is difficult to adhere to the conventional surface, it can be adhered to the polishing surface plate while ensuring sufficient adhesive force, and when removing the polishing pad after use, it should be peeled off without any adhesive residue. Can do.

It is sectional drawing showing one embodiment of the double-sided tape of this invention.

Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof.
FIG. 1 shows one embodiment of the double-sided tape of the present invention.

As shown in FIG. 1, this double-sided tape 1 has a base plate fixing pressure-sensitive adhesive layer 3 laminated on one surface of a substrate 2 made of a resin film, and a polishing pad fixing adhesive layer 4 on the other surface. Are stacked. A release sheet 5 is laminated on the surface of the pressure-sensitive adhesive layer 3 for fixing the platen and the adhesive layer 4 for fixing the polishing pad.
The base material 2 made of a resin film is formed of a polyethylene terephthalate film having a thickness of 12 to 300 μm whose both surfaces are subjected to easy adhesion treatment by corona discharge treatment or the like.

The pressure-sensitive adhesive layer 3 for fixing the platen is composed of a base resin mainly composed of styrene-isoprene-styrene elastomer, 50 to 200 parts by weight of a petroleum-based tackifying resin with respect to 100 parts by weight of the base resin, It is formed with an adhesive containing 60 parts by weight of coumarone-based tackifying resin.
The polishing pad fixing adhesive layer 4 is formed of an acrylic solvent adhesive.
The release sheet 5 is formed of a polyethylene terephthalate film having both sides treated with silicone.
Then, the double-faced tape 1 removes the release sheet 5, the surface plate fixing adhesive layer 3 side is a surface plate (not shown), and the polishing pad fixing adhesive layer 4 side is a polishing pad (not shown). ) Are pressed and bonded to each other.

Moreover, this double-sided tape 1 can be manufactured as follows, for example.
That is, a base resin containing a styrene-isoprene-styrene elastomer on the surface having a releasability of one release sheet 5, and 50 to 200 parts by weight of a petroleum-based tackifying resin with respect to 100 parts by weight of the base resin Then, a pressure-sensitive adhesive layer containing 10 to 60 parts by weight of a coumarone-based tackifying resin is applied to the thickness of the pressure-sensitive adhesive layer 3 for fixing the platen, and dried to form a sheet for forming the pressure-sensitive adhesive layer 3 for fixing the platen. The adhesive layer for polishing pad fixing is prepared by applying and drying an acrylic solvent-type pressure-sensitive adhesive on the surface having the releasability of another release sheet 5 so as to have the thickness of the adhesive layer 4 for fixing the polishing pad. 4 A sheet for forming is prepared.
Next, the pressure-sensitive adhesive layer side of the platen fixing pressure-sensitive adhesive layer 3 forming sheet is pressed against one surface of the base material 2 made of a resin film, and the polishing pad fixing adhesive layer is pressed against the other surface of the base material 2. 4. Press the adhesive layer side of the 4 forming sheet, transfer the surface plate fixing adhesive layer 3 and the polishing pad fixing adhesive layer 4 to each surface of the substrate 2 made of a resin film, and laminate and integrate them. Can be obtained.

  Examples of the present invention and comparative examples will be described in detail below, but the present invention is not limited to the following examples.

Example 1
The release sheet (Fujimori Kogyo Co., Ltd. release paper 75S-518LA) 5 was coated with an adhesive A having the following composition to be the pressure-sensitive adhesive layer 3 for fixing the platen so that the thickness after drying was 40 μm. It heated for 3 minutes in 100 degreeC oven, the solvent was dried, and the 1st laminated body provided with the adhesive layer 3 for surface plate fixing on the one side of the release paper 5 was obtained.
Both sides of a 25 μm thick polyethylene terephthalate film (manufactured by Teijin) were subjected to corona discharge treatment to obtain a substrate 2.
Acrylic resin system in which 1.5 parts by weight of an isocyanate cross-linking agent (Coronate L-55E manufactured by Nippon Polyurethane Co., Ltd.) is mixed with 100 parts by weight of an acrylic ester copolymer (WHD manufactured by Sekisui Chemical Co., Ltd.) on one surface of the substrate 2 The pressure-sensitive adhesive was applied so that the thickness after drying was 80 μm, heated in an oven at 100 ° C. for 3 minutes to dry the solvent, and the adhesive layer 4 for fixing the polishing pad on one surface of the substrate 2. The 2nd laminated body provided with was obtained.
Next, a release sheet (release paper 75S-518LA, manufactured by Fujimori Kogyo Co., Ltd.) 5 is laminated on the surface of the adhesive layer 4 for fixing the polishing pad, and then the first laminate obtained above is used for fixing the surface plate. The double-sided tape 1 was obtained by laminating the agent layer 3 side to the base material 2 side of the second laminate.
[Adhesive A]
(A) Base resin: 100 parts by weight [styrene-isoprene-styrene elastomer (trade name Quintac 3433N, manufactured by Nippon Zeon Co., Ltd., 16% styrene, 56% diblock, average molecular weight 170,000) 100 parts by weight]
(B) Petroleum-based tackifying resin: 90 parts by weight [trade name M100 manufactured by Nippon Zeon Co., Ltd., softening point 100 ° C.]
(C) Coumarone tackifying resin: 30 parts by weight [trade name Escron V-120, softening point 120 ° C., manufactured by Nikko Chemical Co., Ltd.]

(Example 2)
A pressure-sensitive adhesive B having the same composition as pressure-sensitive adhesive A was obtained except that the amount of petroleum-based tackifying resin was 140 parts by weight and the amount of coumarone-based tackifying resin was 10 parts by weight with respect to 100 parts by weight of the base resin. . A double-sided tape 1 was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer 3 was formed using the pressure-sensitive adhesive B instead of the pressure-sensitive adhesive A.

(Example 3)
A double-sided tape 1 was obtained in the same manner as in Example 1 except that OPP (biaxially oriented polypropylene film) having a thickness of 60 μm was used as the substrate 1.

(Comparative Example 1)
A double-sided tape 1 was obtained in the same manner as in Example 1 except that a rayon nonwoven fabric (trade name SPC manufactured by Nippon Paper Industries Co., Ltd.) was used as the substrate 1.

(Comparative Example 2)
A pressure-sensitive adhesive C having the same composition as that of pressure-sensitive adhesive A was obtained except that the amount of the petroleum-based tackifying resin was 40 parts by weight with respect to 100 parts by weight of the base resin. A double-sided tape 1 was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer 3 was formed using the pressure-sensitive adhesive C instead of the pressure-sensitive adhesive A.

(Comparative Example 3)
An adhesive D having the same composition as that of the adhesive A was obtained except that the blending amount of the petroleum-based tackifying resin with respect to 100 parts by weight of the base resin was 250 parts by weight. Then, a double-sided tape 1 was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer 3 was formed using the pressure-sensitive adhesive D instead of the pressure-sensitive adhesive A.

(Comparative Example 4)
Adhesive E having the same composition as that of Adhesive A was obtained except that the blending amount of the coumarone-based tackifying resin with respect to 100 parts by weight of the base resin was changed to 5 parts by weight. A double-sided tape 1 was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer 3 was formed using the pressure-sensitive adhesive E instead of the pressure-sensitive adhesive A.

(Comparative Example 5)
A pressure-sensitive adhesive F having the same composition as that of pressure-sensitive adhesive A was obtained except that the amount of coumarone-based tackifying resin was 80 parts by weight with respect to 100 parts by weight of the base resin. Then, a double-sided tape 1 was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer 3 was formed using the pressure-sensitive adhesive F instead of the pressure-sensitive adhesive A.

  About the double-sided tape 1 obtained in Examples 1 to 3 and Comparative Examples 1 to 5, the pressure-sensitive adhesive layer 3 for fixing the platen to each polishing platen made of stainless steel (SP), polycarbonate (PC), or anodized. The adhesive performance and re-peelability were evaluated as follows, and the results are shown in Table 1.

[Adhesion performance]
A 90 ° peel test according to JISZ0237 was carried out for evaluation.

[Removability]
A polishing pad is fixed to a polycarbonate surface plate of a polishing apparatus via a double-sided tape, and after polishing a glass plate as a specimen to be polished for 15 hours, the double-sided tape is peeled off from the surface plate together with the polishing pad. Visually inspect whether there is any adhesive residue on the board side, ○ if there is no adhesive residue, × if there is adhesive residue, XX if it is peeled off from the surface plate during polishing, XX if the substrate is destroyed X was evaluated.

DESCRIPTION OF SYMBOLS 1 Double-stick tape 2 Base material 3 Adhesive layer 4 for fixing a surface plate Adhesive layer 5 for fixing a polishing pad Release sheet

Claims (4)

A polishing pad fixing double-sided surface in which a pressure-sensitive adhesive layer for fixing a surface plate is laminated and integrated on one surface of a base material made of a resin film, and an adhesive layer for fixing a polishing pad is stacked and integrated on the other surface of the base material A base resin containing a styrene-isoprene-styrene elastomer, wherein the pressure-sensitive adhesive is a pressure-sensitive adhesive tape and the pressure-sensitive adhesive layer constituting the surface plate fixing pressure-sensitive adhesive layer;
A double-sided tape for fixing a polishing pad comprising 50 to 200 parts by weight of a petroleum-based tackifying resin and 10 to 60 parts by weight of a coumarone-based tackifying resin with respect to 100 parts by weight of the base resin.   2. The double-sided tape for fixing a polishing pad according to claim 1, wherein the styrene content of the styrene-isoprene-styrene elastomer in the base resin of the adhesive constituting the surface plate fixing adhesive layer is 14 to 24%.   3. The polishing pad fixing device according to claim 1, wherein a diblock ratio of the styrene-isoprene-styrene elastomer in the base resin of the pressure-sensitive adhesive constituting the surface plate fixing adhesive layer is 25 to 70%. Double-sided tape.   The double-sided tape for fixing a polishing pad according to any one of claims 1 to 3, wherein the adhesive constituting the adhesive layer for fixing the platen contains an antioxidant.

Images