JP2011122069A5 - - Google Patents
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- Publication number
- JP2011122069A5 JP2011122069A5 JP2009281168A JP2009281168A JP2011122069A5 JP 2011122069 A5 JP2011122069 A5 JP 2011122069A5 JP 2009281168 A JP2009281168 A JP 2009281168A JP 2009281168 A JP2009281168 A JP 2009281168A JP 2011122069 A5 JP2011122069 A5 JP 2011122069A5
- Authority
- JP
- Japan
- Prior art keywords
- fixing
- weight
- parts
- polishing pad
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 3
- 238000005498 polishing Methods 0.000 claims 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000003208 petroleum Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009281168A JP5520026B2 (ja) | 2009-12-11 | 2009-12-11 | 研磨パッド固定用両面テープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009281168A JP5520026B2 (ja) | 2009-12-11 | 2009-12-11 | 研磨パッド固定用両面テープ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011122069A JP2011122069A (ja) | 2011-06-23 |
| JP2011122069A5 true JP2011122069A5 (enrdf_load_stackoverflow) | 2012-11-01 |
| JP5520026B2 JP5520026B2 (ja) | 2014-06-11 |
Family
ID=44286268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009281168A Active JP5520026B2 (ja) | 2009-12-11 | 2009-12-11 | 研磨パッド固定用両面テープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5520026B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5858576B2 (ja) * | 2011-04-21 | 2016-02-10 | 東洋ゴム工業株式会社 | 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層 |
| US20140255638A1 (en) * | 2011-10-31 | 2014-09-11 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition for bonding a wafer and supporting body for said wafer, adhesive film, and laminate |
| JP6594606B2 (ja) * | 2013-01-31 | 2019-10-23 | 日東電工株式会社 | 粘着剤組成物および粘着シート |
| JP2015048430A (ja) * | 2013-09-03 | 2015-03-16 | 日東電工株式会社 | 両面粘着テープ |
| JP6202958B2 (ja) * | 2013-09-13 | 2017-09-27 | 日東電工株式会社 | 粘着シート |
| JP6513356B2 (ja) * | 2013-09-13 | 2019-05-15 | 日東電工株式会社 | 研磨パッド固定用粘着シート |
| JP7318510B2 (ja) * | 2019-12-02 | 2023-08-01 | 東洋インキＳｃホールディングス株式会社 | 研磨部材固定用粘着剤および粘着シート |
| KR102460711B1 (ko) * | 2020-08-21 | 2022-10-27 | 한국타이어앤테크놀로지 주식회사 | 흡음 타이어용 폼테이프 및 이를 포함하는 흡음 타이어 |
| JP7415888B2 (ja) * | 2020-11-17 | 2024-01-17 | 信越半導体株式会社 | 研磨パッド、両面研磨装置及びウェーハの両面研磨方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007245276A (ja) * | 2006-03-15 | 2007-09-27 | Sekisui Chem Co Ltd | 研磨パッド固定用両面テープ |
| JP5134533B2 (ja) * | 2006-05-17 | 2013-01-30 | 積水化学工業株式会社 | 研磨パッド固定用両面テープ |
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2009
- 2009-12-11 JP JP2009281168A patent/JP5520026B2/ja active Active