JP2009252857A - 実装装置、検査装置、検査方法及び実装方法 - Google Patents
実装装置、検査装置、検査方法及び実装方法 Download PDFInfo
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Abstract
【解決手段】ステップ104及び109において、表面実装部品Pに形成された全てのバンプP2それぞれについて取得された塗布剤Fの塗布前及び塗布後の平均輝度値が比較される。実装装置の制御部は、各バンプP2について、ステップ104及び109において取得された平均輝度値を比較し、これらの2値の差や割合を求める。これら2値の差や割合が、ユーザにより設定、あるいは自動的に算出された数値範囲内かどうかが判断され、当該バンプP2の塗布剤Fの塗布量が過少あるいは過多であるかが判定される。
【選択図】図6
Description
2 実装機構
3 塗布剤塗布ユニット
4 撮像機構
11 プレート
P 表面実装部品
P2 バンプ
Q プリント配線基板
Claims (10)
- 塗布対象部品の塗布対象領域である第1の領域に塗布剤を塗布する塗布ユニットと、
前記塗布ユニットで塗布される前の前記第1の領域の第1の輝度情報及び塗布された後の前記第1の領域の第2の輝度情報を取得する取得手段と、
前記第1の輝度情報及び前記第2の輝度情報を比較することで、前記第1の領域の前記塗布剤の塗布状態の良否を判定する判定手段と、
前記判定手段により前記塗布状態が良と判定された前記塗布対象部品を実装対象物に実装する実装機構と
を具備する実装装置。 - 請求項1に記載の実装装置であって、
前記取得手段は、前記塗布ユニットで塗布される前の前記塗布対象部品の前記第1の領域以外の塗布禁止領域である第2の領域の第3の輝度情報及び塗布された後の前記第2の領域の第4の輝度情報をさらに取得し、
前記判定手段は、前記第3の輝度情報及び前記第4の輝度情報を比較することで、前記第2の領域への誤塗布の有無をさらに判定し、
前記実装機構は、前記判定手段により前記第1の領域の前記塗布剤の前記塗布状態が良と判定され、かつ、前記第2の領域への誤塗布が無いと判定された前記塗布対象部品を実装する
実装装置。 - 請求項1に記載の実装装置であって、
前記塗布対象部品は回路素子であり、
前記第1の領域は前記回路素子に設けられた複数のバンプである
実装装置。 - 請求項3に記載の実装装置であって、
前記取得手段は、前記第1の輝度情報及び前記第2の輝度情報を前記バンプ毎に取得し、
前記判定手段は、前記第1の輝度情報及び前記第2の輝度情報を前記バンプ毎に比較することで、前記塗布状態の良否を前記バンプ毎に判定する
実装装置。 - 請求項1に記載の実装装置であって、
前記取得手段は、前記塗布対象部品の姿勢情報、または、前記塗布対象部品が適合性があるか否かの情報を取得する撮像機構である
実装装置。 - 請求項1に記載の実装装置であって、
前記塗布ユニットは、前記塗布剤が収容されるプレートを有し、
前記実装装置は、
前記判定手段の比較により、前記プレート上に収容されている前記塗布剤の量を検出する検出手段
をさらに具備する実装装置。 - 請求項6に記載の実装装置であって、
前記塗布ユニットは、前記検出手段により検出された前記塗布剤の量に基き、前記プレート上の前記塗布剤の量を調整する調整手段を有する
実装装置。 - 塗布対象部品の塗布対象領域の塗布剤の塗布状態を検査する検査装置であって、
前記塗布剤が塗布される前の前記塗布対象領域の第1の輝度情報及び塗布された後の前記塗布対象領域の第2の輝度情報を取得する取得手段と、
前記第1の輝度情報及び前記第2の輝度情報を比較することで、前記塗布対象領域の前記塗布剤の塗布状態の良否を判定する判定手段と
を具備する検査装置。 - 塗布対象部品の塗布対象領域の第1の輝度情報を取得し、
前記第1の輝度情報が取得された後、前記塗布対象領域に塗布剤を塗布し、
前記塗布剤が塗布された前記塗布対象領域の第2の輝度情報を取得し、
前記第1の輝度情報及び前記第2の輝度情報を比較することで、前記塗布対象領域の前記塗布剤の塗布状態の良否を判定し、
良と判定された前記塗布対象部品を実装対象物に実装する
実装方法。 - 塗布剤が塗布される前の、塗布対象部品の塗布対象領域の第1の輝度情報を取得し、
前記塗布剤が塗布された前記塗布対象領域の第2の輝度情報を取得し、
前記第1の輝度情報及び前記第2の輝度情報を比較することで、前記塗布対象領域の前記塗布剤の塗布状態の良否を判定する
検査方法。
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JP2008096777A JP4577395B2 (ja) | 2008-04-03 | 2008-04-03 | 実装装置及び実装方法 |
US12/379,728 US7817263B2 (en) | 2008-04-03 | 2009-02-27 | Mounting apparatus, inspecting apparatus, inspecting method, and mounting method |
CN2009101338387A CN101552191B (zh) | 2008-04-03 | 2009-04-03 | 安装设备、检测设备、检测方法以及安装方法 |
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Cited By (6)
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WO2014184855A1 (ja) * | 2013-05-13 | 2014-11-20 | 富士機械製造株式会社 | 部品実装機 |
JP2015079933A (ja) * | 2013-09-10 | 2015-04-23 | Juki株式会社 | 検査方法、実装方法、及び実装装置 |
JP2015088534A (ja) * | 2013-10-29 | 2015-05-07 | パナソニックIpマネジメント株式会社 | 電子部品実装方法 |
JPWO2014199439A1 (ja) * | 2013-06-11 | 2017-02-23 | 富士機械製造株式会社 | 部品実装機 |
JP2018056218A (ja) * | 2016-09-27 | 2018-04-05 | パナソニックIpマネジメント株式会社 | バンプ付電子部品搭載装置およびバンプ付電子部品搭載方法 |
KR20190090501A (ko) * | 2018-01-25 | 2019-08-02 | 한화정밀기계 주식회사 | 플립 칩의 플럭스 도포 상태 검사 방법 |
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CN102121934B (zh) * | 2010-12-23 | 2013-10-16 | 上海应用技术学院 | 一种检测涂抹效果的扫描机构 |
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JP2008216140A (ja) * | 2007-03-06 | 2008-09-18 | Fuji Mach Mfg Co Ltd | 電子部品装着装置における転写材転写検査方法 |
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WO2014184855A1 (ja) * | 2013-05-13 | 2014-11-20 | 富士機械製造株式会社 | 部品実装機 |
JP6037580B2 (ja) * | 2013-05-13 | 2016-12-07 | 富士機械製造株式会社 | 部品実装機 |
JPWO2014199439A1 (ja) * | 2013-06-11 | 2017-02-23 | 富士機械製造株式会社 | 部品実装機 |
JP2015079933A (ja) * | 2013-09-10 | 2015-04-23 | Juki株式会社 | 検査方法、実装方法、及び実装装置 |
JP2015088534A (ja) * | 2013-10-29 | 2015-05-07 | パナソニックIpマネジメント株式会社 | 電子部品実装方法 |
JP2018056218A (ja) * | 2016-09-27 | 2018-04-05 | パナソニックIpマネジメント株式会社 | バンプ付電子部品搭載装置およびバンプ付電子部品搭載方法 |
KR20190090501A (ko) * | 2018-01-25 | 2019-08-02 | 한화정밀기계 주식회사 | 플립 칩의 플럭스 도포 상태 검사 방법 |
KR102457527B1 (ko) | 2018-01-25 | 2022-10-21 | 한화정밀기계 주식회사 | 플립 칩의 플럭스 도포 상태 검사 방법 |
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CN101552191A (zh) | 2009-10-07 |
US7817263B2 (en) | 2010-10-19 |
CN101552191B (zh) | 2011-07-06 |
JP4577395B2 (ja) | 2010-11-10 |
US20090251701A1 (en) | 2009-10-08 |
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