JP2009246346A5 - - Google Patents

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Publication number
JP2009246346A5
JP2009246346A5 JP2009049196A JP2009049196A JP2009246346A5 JP 2009246346 A5 JP2009246346 A5 JP 2009246346A5 JP 2009049196 A JP2009049196 A JP 2009049196A JP 2009049196 A JP2009049196 A JP 2009049196A JP 2009246346 A5 JP2009246346 A5 JP 2009246346A5
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JP
Japan
Prior art keywords
semiconductor
substrate
base substrate
layer
manufacturing
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Application number
JP2009049196A
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English (en)
Japanese (ja)
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JP2009246346A (ja
JP5478916B2 (ja
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Priority to JP2009049196A priority Critical patent/JP5478916B2/ja
Priority claimed from JP2009049196A external-priority patent/JP5478916B2/ja
Publication of JP2009246346A publication Critical patent/JP2009246346A/ja
Publication of JP2009246346A5 publication Critical patent/JP2009246346A5/ja
Application granted granted Critical
Publication of JP5478916B2 publication Critical patent/JP5478916B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009049196A 2008-03-14 2009-03-03 Ｓｏｉ基板の作製方法 Expired - Fee Related JP5478916B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009049196A JP5478916B2 (ja) 2008-03-14 2009-03-03 Ｓｏｉ基板の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008066165 2008-03-14
JP2008066165 2008-03-14
JP2009049196A JP5478916B2 (ja) 2008-03-14 2009-03-03 Ｓｏｉ基板の作製方法

Publications (3)

Publication Number Publication Date
JP2009246346A JP2009246346A (ja) 2009-10-22
JP2009246346A5 true JP2009246346A5 (https=) 2012-04-19
JP5478916B2 JP5478916B2 (ja) 2014-04-23

Family

ID=41307875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009049196A Expired - Fee Related JP5478916B2 (ja) 2008-03-14 2009-03-03 Ｓｏｉ基板の作製方法

Country Status (1)

Country Link
JP (1) JP5478916B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013002227A1 (ja) 2011-06-30 2013-01-03 シャープ株式会社 半導体基板の製造方法、半導体基板作成用基板、積層基板、半導体基板、及び電子デバイス
US9614021B2 (en) * 2013-07-24 2017-04-04 Samsung Display Co., Ltd. Organic light-emitting display apparatus and manufacturing method thereof

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