JP2009244581A - Mask for vacuum-ultraviolet light, and method and apparatus for manufacturing pattern-formed body using vacuum-ultraviolet light - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal mask for vacuum-ultraviolet light, by which a pattern-formed body can be manufactured with high sensitivity, wherein the pattern-formed body is accurately subjected to vacuum-ultraviolet light radiation by using the vacuum-ultraviolet light in a high-definition and complex pattern. <P>SOLUTION: The metal mask 10 for vacuum-ultraviolet light is used for the method of manufacturing the pattern-formed body whose pattern-forming surface is subjected to the vacuum-ultraviolet light radiation in a pattern by: using a substrate for forming the pattern; arranging the metal mask on the pattern-forming surface of the substrate for forming the pattern; and irradiating the pattern-forming surface with the vacuum-ultraviolet light through the metal mask in the presence of a reactant gas. The metal mask includes: a metal mask body 1 consisting of a metal thin plate and having an opening 2; and a bridge portion 3 formed to form a bridge across the opening, wherein the bridge portion is formed so that an air gap through which the reactant gas can be passed is formed between the pattern-forming surface and the bridge portion when the bridge portion is arranged on the substrate 101 for forming the pattern. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a pattern forming body using vacuum ultraviolet light, and more specifically, a method for producing a pattern forming body that performs vacuum ultraviolet light irradiation processing in a pattern using a metal mask, and the manufacturing method. The present invention relates to a vacuum ultraviolet light mask used for the above-mentioned and a pattern forming body manufacturing apparatus for carrying out the manufacturing method.

  At present, various methods have been proposed as a method for manufacturing a pattern forming body for forming various patterns such as designs, images, characters, and circuits on a substrate. Typical examples of the method for producing such a pattern-formed body include lithographic printing, offset printing, and a printing method for producing a lithographic printing original plate using a heat mode recording material. It has been widely used because it has an advantage that a pattern-formed body can be easily produced.

  On the other hand, in recent years, a photolithography method has become the mainstream as a method to replace the printing method. Photolithographic methods include, for example, pattern exposure on a photoresist layer coated on a substrate, development of the photoresist after exposure, further etching, or using a substance having functionality in the photoresist, This is a method for producing a pattern forming body by directly forming a target pattern by exposure of a photoresist. Such a photolithography method can produce a pattern-formed body that has been subjected to high-definition patterning as compared with the conventional printing method. For example, it can produce a color filter used in a liquid crystal display device. Used in methods.

  However, in such a photolithography method, there is a problem that a waste liquid needs to be processed because it is necessary to use a photoresist and develop or etch with a liquid developer after exposure. A method for producing a pattern-formed body using a photolithography method has not always been highly productive. In addition, it has been pointed out that when a functional substance is used as a photoresist, there is a problem that the material is deteriorated by an alkaline solution or the like used during development, and the range of material selection is narrow.

  Under such circumstances, Patent Document 1 discloses a method for manufacturing a pattern forming body using vacuum ultraviolet light. In the method disclosed in Patent Document 1, a pattern forming substrate having a base material and an organic molecular film made of an organic substance formed on the base material is patterned in vacuum ultraviolet on the organic molecular film through a photomask. In this method, the organic molecular film is decomposed and removed by irradiating light to produce a pattern forming body. Such a method using vacuum ultraviolet light is a dry process that does not require the use of a developer, which was a drawback of the photolithography method, and is useful in that a pattern-formed body can be produced with high productivity. It is.

By the way, the pattern formation by vacuum ultraviolet light as disclosed in Patent Document 1 is performed by decomposing and removing the organic molecular film by the action of vacuum ultraviolet light. That is, when irradiation with vacuum ultraviolet light is performed, molecular bonds of organic substances in the organic molecular film are broken by the action of vacuum ultraviolet light, or oxygen atom radicals generated by oxygen excitation in the presence of oxygen are converted into organic substances. By acting on the organic matter, the organic matter of the organic molecular film becomes a decomposed product, and the decomposed product is volatilized and removed from the pattern forming substrate, whereby a pattern is formed.
For this reason, in the method for producing a pattern forming body using vacuum ultraviolet light, it is necessary that oxygen acting on the vacuum ultraviolet light always be present on the surface of the substrate on which the pattern is formed.

  However, in the method using a photomask as in Patent Document 1, since the organic molecular film and the photomask are close to each other, oxygen that acts on the vacuum ultraviolet light becomes insufficient when the vacuum ultraviolet light is continuously irradiated. As a problem, the sensitivity of pattern formation by vacuum ultraviolet light is reduced.

  In view of such problems, the present inventors have completed an invention that makes it possible to produce a pattern-formed body using vacuum ultraviolet light using a metal mask (Patent Document 2). A method using such a metal mask is described in Patent Document 1 in that a pattern formed body subjected to a high-definition pattern-shaped vacuum ultraviolet light irradiation treatment using vacuum ultraviolet light can be manufactured with high sensitivity. This is a significant advantage over the conventional methods.

  However, since the metal mask has a tendency to decrease in thickness as the pattern becomes higher in definition, the method using the metal mask described in Patent Document 2, for example, also includes the metal mask. If a metal mask with openings in a high-definition pattern, such as a mask with a relatively large opening or a complicated opening, is used as a mask. The shape of the opening is deformed when manufacturing the film, which may make it difficult to perform the vacuum ultraviolet light irradiation treatment in the pattern shape originally planned.

JP 2001-324816 A JP 2007-178783 A

  The present invention has been made in view of such problems, and a pattern formed body that has been subjected to a vacuum ultraviolet light irradiation treatment in a high-definition and complicated pattern shape using vacuum ultraviolet light has a high sensitivity. The object of the present invention is to provide a vacuum ultraviolet light metal mask that can be manufactured by the method, a method for manufacturing a pattern forming body using vacuum ultraviolet light using the metal mask, and a device for manufacturing a pattern forming body using vacuum ultraviolet light that can perform the manufacturing method. It is what.

  In order to solve the above problems, the present invention uses a pattern forming substrate, disposes a metal mask on the pattern forming surface of the pattern forming substrate, and the pattern is formed through the metal mask in the presence of a reactive gas. A vacuum ultraviolet light metal mask for use in a method of manufacturing a pattern forming body in which the pattern forming surface is subjected to vacuum ultraviolet light irradiation treatment in a pattern by irradiating the forming surface with vacuum ultraviolet light, comprising: And having a metal mask body having an opening and a bridge portion formed so as to bridge the opening, and when arranged on the pattern forming substrate, the pattern forming surface and the bridge For the vacuum ultraviolet light, wherein the bridge portion is formed so that a gap through which the reactive gas can flow is formed between the portion and the portion. To provide a Tarumasuku.

According to the vacuum ultraviolet light metal mask of the present invention, since the opening is bridged by the bridge portion, the shape of the opening is deformed even if the opening is formed in a high-definition and complicated shape. Can be prevented. Further, when the vacuum ultraviolet light metal mask of the present invention is disposed on the pattern forming substrate, a gap through which the reactive gas can flow is formed between the pattern forming surface and the bridge portion. As described above, when the bridge portion is formed, the vacuum ultraviolet light is shielded by the bridge portion when the pattern forming body is manufactured using the metal mask for vacuum ultraviolet light according to the present invention. It is possible to prevent the pattern formation surface located on the side from being subjected to the vacuum ultraviolet light irradiation treatment.
For this reason, according to the metal mask for vacuum ultraviolet light of the present invention, a pattern formed body that has been subjected to vacuum ultraviolet light irradiation treatment in a high-definition and complicated pattern shape using vacuum ultraviolet light has high sensitivity. Can be manufactured.

  In the vacuum ultraviolet light metal mask of the present invention, it is preferable that the bridge portion is thinner than the metal mask main body. Moreover, it is preferable that the bridge portion is formed by half etching from at least one surface. This is because it becomes easy to form the bridge portion so that a void through which the reactive gas can flow is formed.

  Moreover, in the metal mask for vacuum ultraviolet light of this invention, it is preferable that the width | variety of the said bridge | bridging part exists in the range of 5 micrometers-100 micrometers. As a result, when the pattern forming body is manufactured using the vacuum ultraviolet light metal mask of the present invention, it becomes possible to sufficiently circulate the vacuum ultraviolet light into the gap formed in the lower portion of the bridge portion. It is because it can prevent more effectively that the pattern formation surface located in the lower part of a part is no longer subjected to a vacuum ultraviolet light irradiation process.

  In order to solve the above problems, the present invention provides a metal mask arranging step of using a pattern forming substrate and arranging the vacuum ultraviolet light metal mask according to the present invention on the pattern forming surface of the pattern forming substrate. Vacuum ultraviolet light irradiation step of irradiating the pattern formation surface with vacuum ultraviolet light through the vacuum ultraviolet light metal mask in the presence of a reactive gas. A method for manufacturing a body is provided.

  According to the present invention, since the metal mask for vacuum ultraviolet light according to the present invention is used as a metal mask used for performing the vacuum ultraviolet light irradiation treatment in a pattern, the vacuum ultraviolet light is used for high definition and It is possible to manufacture with high sensitivity a pattern forming body in which a vacuum ultraviolet light irradiation treatment is accurately performed in a complicated pattern.

  In this invention, it is preferable that the said metal mask arrangement | positioning process fixes the said metal mask for vacuum ultraviolet light with a magnet from the surface opposite to the said pattern formation surface of the said pattern formation board | substrate. As a result, even if a high-definition and complicated pattern is formed as a metal mask for vacuum ultraviolet light according to the present invention and a thin mask is used, the metal mask for vacuum ultraviolet light is used as the pattern. This is because it can be fixed in close contact with the forming surface, so that a pattern forming body in which the pattern forming surface is subjected to a vacuum ultraviolet light irradiation treatment accurately in a high-definition and complicated pattern can be manufactured.

  Furthermore, the present invention provides a pattern-forming substrate support portion that supports the pattern-forming substrate, and a vacuum placed so as to be disposed on the pattern-forming surface of the pattern-forming substrate supported by the pattern-forming substrate support portion. An ultraviolet light metal mask, and a vacuum ultraviolet light irradiation unit that irradiates the pattern formation surface of the pattern formation substrate supported by the pattern formation substrate support part with vacuum ultraviolet light through the vacuum ultraviolet light metal mask, A pattern forming body using vacuum ultraviolet light, characterized in that the vacuum ultraviolet light metal mask is the vacuum ultraviolet light metal mask according to the present invention. Providing manufacturing equipment.

  According to the present invention, since the vacuum ultraviolet light metal mask is the vacuum ultraviolet light metal mask according to the present invention, accurate vacuum ultraviolet light is obtained in a high-definition and complicated pattern using vacuum ultraviolet light. A pattern formed body that has been subjected to irradiation treatment can be produced with high sensitivity. Moreover, the pattern formation body manufacturing apparatus by the vacuum ultraviolet light of this invention can implement suitably the manufacturing method of the pattern formation body by the vacuum ultraviolet light which concerns on the said invention.

  The apparatus for producing a pattern forming body using vacuum ultraviolet light according to the present invention is such that the vacuum ultraviolet light metal mask is opposite to the pattern forming surface of the pattern forming substrate supported by the pattern forming substrate support. It is preferable to have a magnetic force generator fixed by magnetic force. As a result, even if a high-definition and complicated pattern is formed and a thin mask is used as the vacuum ultraviolet light metal mask supported by the metal mask support, the vacuum ultraviolet light is used. This is because the metal mask can be fixed in close contact with the pattern forming surface, so that a pattern forming body in which the pattern forming surface is accurately subjected to the vacuum ultraviolet light irradiation processing according to the pattern can be manufactured.

  INDUSTRIAL APPLICABILITY The present invention has an effect that it is possible to manufacture with high sensitivity a pattern forming body that has been subjected to a vacuum ultraviolet light irradiation process accurately in a high-definition and complicated pattern using vacuum ultraviolet light.

The present invention relates to a metal mask for vacuum ultraviolet light, a pattern forming body manufacturing method using vacuum ultraviolet light, and a pattern forming body manufacturing apparatus using vacuum ultraviolet light.
Hereinafter, each of these inventions will be described in order.

A. First, the metal mask for vacuum ultraviolet light of the present invention will be described. As described above, the metal mask for vacuum ultraviolet light of the present invention uses a pattern forming substrate, disposes the metal mask on the pattern forming surface of the pattern forming substrate, and the metal mask in the presence of a reactive gas. The pattern forming surface is used for a method of manufacturing a pattern forming body in which the pattern forming surface is subjected to vacuum ultraviolet light irradiation processing in a pattern by irradiating the pattern forming surface with a vacuum ultraviolet light. The pattern forming surface and the bridge portion when the metal mask main body having an opening and a bridge portion formed so as to bridge the opening are disposed on the pattern forming substrate. The bridge portion is formed so as to form a gap through which the reactive gas can flow.

  In order to describe the vacuum ultraviolet light metal mask of the present invention, a method for producing a pattern forming body using vacuum ultraviolet light, which is an application of the vacuum ultraviolet light metal mask of the present invention, will be described first. The vacuum ultraviolet light metal mask of the present invention uses a pattern forming substrate, disposes a metal mask on the pattern forming surface of the pattern forming substrate, and passes the pattern through the metal mask in the presence of a reactive gas. By irradiating the formation surface with vacuum ultraviolet light, the pattern formation surface is used in a so-called vacuum ultraviolet light lithography method for producing a pattern-formed body in which the pattern formation surface is subjected to vacuum ultraviolet light irradiation treatment in a pattern.

  A specific example of such a vacuum ultraviolet light lithography method will be described with reference to the drawings. FIG. 1 is a schematic view showing an example of a method for producing a pattern forming body using vacuum ultraviolet light, which is an application of the vacuum ultraviolet light metal mask of the present invention. As illustrated in FIG. 1, the metal mask for vacuum ultraviolet light of the present invention has a pattern forming substrate 101 having a pattern forming surface P that can be subjected to vacuum ultraviolet light irradiation treatment by being irradiated with vacuum ultraviolet light. (FIG. 1A), a metal mask placement step of placing the metal mask 102 on the pattern formation surface P of the pattern formation substrate 101 (FIG. 1B), in the presence of a reactive gas. And a vacuum ultraviolet light irradiation step (FIG. 1C) for irradiating the pattern forming surface P with vacuum ultraviolet light (VUV) through the metal mask 102, whereby the pattern forming surface P is vacuum-patterned. The pattern forming body 100 subjected to the ultraviolet light irradiation treatment is manufactured (FIG. 1 (d)), which is used in a method for manufacturing a pattern forming body using vacuum ultraviolet light. That is, the metal mask for vacuum ultraviolet light of the present invention is used as the metal mask 102 in FIG.

Next, the metal mask for vacuum ultraviolet light of this invention is demonstrated, referring a figure. FIG. 2 is a schematic view showing an example of a metal mask for vacuum ultraviolet light according to the present invention. As illustrated in FIG. 2A, the vacuum ultraviolet light metal mask 10 of the present invention is made of a thin metal plate and bridges the metal mask body 1 having the opening 2 and the opening 2 of the metal mask body 1. And a bridge portion 3 formed in such a manner.
FIG. 2B is a cross-sectional view taken along line XX ′ in FIG. As illustrated in FIG. 2B, when the vacuum ultraviolet light metal mask 10 of the present invention is actually disposed on the pattern forming substrate 101 in the vacuum ultraviolet light lithography method, the pattern forming metal mask 10 is used. The bridge portion 3 is formed so that a gap through which a reactive gas can flow is formed between the pattern forming surface of the substrate 101 and the bridge portion 3.

According to the vacuum ultraviolet light metal mask of the present invention, since the opening is bridged by the bridge portion, the shape of the opening is deformed even if the opening is formed in a high-definition and complicated shape. Can be prevented. Further, when the vacuum ultraviolet light metal mask of the present invention is disposed on the pattern forming substrate, a gap through which the reactive gas can flow is formed between the pattern forming surface and the bridge portion. As described above, when the bridge portion is formed, the vacuum ultraviolet light is shielded by the bridge portion when the pattern forming body is manufactured using the metal mask for vacuum ultraviolet light according to the present invention. It is possible to prevent the pattern formation surface located on the side from being subjected to the vacuum ultraviolet light irradiation treatment.
For this reason, according to the metal mask for vacuum ultraviolet light of the present invention, a pattern formed body that has been subjected to vacuum ultraviolet light irradiation treatment in a high-definition and complicated pattern shape using vacuum ultraviolet light has high sensitivity. Can be manufactured.

The metal mask for vacuum ultraviolet light of this invention has a metal mask main body and a bridge part.
Hereafter, each structure used for the metal mask of this invention is demonstrated in order.

1. Bridge part First, the bridge part used for the metal mask for vacuum ultraviolet light of this invention is demonstrated. The bridge portion used in the present invention is formed so as to bridge the opening formed in the metal mask body, and has a function of preventing the shape of the opening from being deformed. The bridge portion used in the present invention allows the reactive gas to flow between the pattern formation surface and the bridge portion when the vacuum ultraviolet light metal mask of the present invention is disposed on the pattern formation substrate. It is characterized by being formed so that possible voids are formed.
Hereinafter, such a bridge portion will be described in detail.

  As described above, when the vacuum ultraviolet light metal mask of the present invention is used in the vacuum ultraviolet light lithography method and disposed on the pattern forming substrate, the bridge portion used in the present invention is the pattern forming surface and the bridge portion. It is formed so that the space | gap which the said reactive gas can flow between (it is hereafter called the space | gap for a vacuum ultraviolet light irradiation process) may be formed between these. Is. Therefore, the aspect in which the bridge part is formed is not particularly limited as long as the vacuum ultraviolet light irradiation processing gap can be formed in a desired size. As such an aspect, the aspect formed in the arch shape so that the opening part formed in the metal mask main body might be bridge | crosslinked may be sufficient, for example, and the aspect formed linearly may be sufficient.

  The aspect in which the bridge part in this invention is formed is demonstrated referring a figure. FIG. 3 is a schematic view showing an example of an aspect in which a bridge portion in the present invention is formed. As illustrated in FIG. 3, the bridge portion 3 in the present invention may be formed in an arch shape so as to bridge the opening 2 in the metal mask main body 1 (FIGS. 3A and 3B). )), Or a linearly formed mode (FIGS. 3C and 3D).

  The bridge portion in the present invention may be formed in any of these modes, but it is preferable that the bridge portion is formed in a straight line so as to bridge the opening in the metal mask body. This is because such a bridge portion can be easily formed simultaneously with the opening by half-etching from at least one surface. That is, as will be described later, the vacuum ultraviolet light metal mask of the present invention uses a metal thin plate, and after half-etching the metal thin plate with a desired pattern from one surface, half-etching with the same pattern from the opposite surface However, at this time, only the half etching from one surface is performed on the position corresponding to the bridge portion, or the etching condition is weakened on the position corresponding to the bridge portion. The bridge portion and the opening can be formed at the same time. Considering such advantages in the manufacturing method, it is particularly preferable that the bridge portion in the present invention is formed by half etching from one surface.

  In addition, the size of the vacuum ultraviolet light irradiation treatment gap formed by the bridge portion in the present invention is the vacuum ultraviolet light used in the vacuum ultraviolet light lithography method performed using the vacuum ultraviolet light metal mask of the present invention. Depending on the wavelength, the thickness of the bridge portion, the width of the bridge portion, etc., a reactive gas such as oxygen can be present in the vacuum ultraviolet light irradiation treatment gap, and vacuum ultraviolet light can be circulated. There is no particular limitation as long as it is within a possible range. Among them, the vacuum ultraviolet light irradiation treatment gap formed by the bridge portion in the present invention has a height of preferably 1 μm or more, more preferably 10 μm or more, and further preferably 30 μm or more. If the height of the vacuum ultraviolet light irradiation treatment gap is lower than the above range, it will be difficult to allow a reactive gas to flow into the vacuum ultraviolet light irradiation treatment gap or to circulate the vacuum ultraviolet light. Because there are cases.

  Moreover, it is preferable that the bridge | bridging part used for this invention is a thing thinner than the metal mask main body mentioned later. This is because it becomes easy to sufficiently circulate the vacuum ultraviolet light into the vacuum ultraviolet light irradiation processing gap formed by the bridge portion in the present invention.

  The bridge portion in the present invention is formed so as to bridge an opening formed in the metal mask main body to be described later, but the number of bridge portions formed for one opening is particularly limited. It is not a thing, but the number can be determined suitably according to the shape of an opening part, etc. Therefore, in the present invention, the number of bridge portions formed for one opening may be one or plural.

  FIG. 4 is a schematic view showing an example in which a bridge portion is formed in the vacuum ultraviolet light metal mask of the present invention. As illustrated in FIG. 4, the aspect in which the bridge portion is formed in the vacuum ultraviolet light metal mask of the present invention is an aspect in which only one bridge portion 3 is formed for one opening 2. There may be a mode in which a plurality of bridge portions 3 are formed for one opening 2 (FIG. 4A) (FIGS. 4B and 4C).

  The bridge portion in the present invention may be formed in any of these modes, but it is preferable that a plurality of bridge portions are formed with respect to one opening. Thereby, even if the opening area is small and a complicatedly bent opening is formed, it is possible to effectively prevent the opening from being deformed.

  The material used for the bridge portion in the present invention is not particularly limited as long as the bridge portion can be formed in a desired form. Usually, the same metal material as that of the metal mask body described later is used. Since such a metal material will be described later in the section “2. Metal Mask Body”, description thereof is omitted here.

2. Metal Mask Body Next, the metal mask body used in the present invention will be described. The metal mask main body used in the present invention is made of a thin metal plate and has an opening.

  The metal mask body used in the present invention is made of a metal thin plate, but the metal material constituting the metal thin plate used in the present invention is not particularly limited as long as it can shield vacuum ultraviolet light. . Examples of such metal materials include Ni-Fe materials such as 42 alloy, 46 alloy, and Invar material, and SUS403 and other Fe materials such as steel plates. In the present invention, any of these metal materials can be preferably used, and among these, 42 alloy is preferably used.

  In addition, the metal material used for this invention may be only one type, or may be two or more types.

  Further, the thickness of the metal thin plate is not particularly limited as long as it is within a range in which an opening pattern having a desired shape can be formed, but in particular, it is preferably within a range of 5 μm to 500 μm. More preferably, it is in the range of 200 μm, more preferably in the range of 50 μm to 100 μm. This is because, in general, when the thickness is increased, it may be difficult to form a high-definition patterned opening. If the thickness is less than the above range, the vacuum ultraviolet light metal mask of the present invention is likely to be deformed, and it may be difficult to perform the vacuum ultraviolet light irradiation treatment according to the pattern formed on the mask. Because.

  Although the metal mask body used in the present invention has an opening, the shape of the opening and the like are used for a pattern forming body formed using the vacuum ultraviolet light metal mask of the present invention. It can be determined accordingly.

3. Manufacturing method of metal mask for vacuum ultraviolet light Next, the manufacturing method of the metal mask for vacuum ultraviolet light of this invention is demonstrated. The metal mask for vacuum ultraviolet light of this invention can be manufactured by etching a metal thin plate. Here, the method for etching the metal thin plate in order to produce the vacuum ultraviolet light metal mask of the present invention is not particularly limited as long as it is a method capable of etching the metal thin plate into a desired pattern to form an opening. It is not a thing. As such an etching method, generally known etching methods can be used. Among them, as an etching method suitably used for producing the vacuum ultraviolet light metal mask of the present invention, the following method can be exemplified.

(First method)
First, examples of the first method include a method of sequentially performing the following steps.
(1) A photosensitive resist is applied to both sides of a thin metal plate, and a predetermined pattern plate is used. The part to be a cut-out part has openings on both sides and the part to be a bridge part is opened only on the other side. A step of attaching a re-peelable film to the other surface having no opening corresponding to the bridge portion after forming a resist pattern of a predetermined shape having a portion.
(2) A resist pattern having a predetermined shape was formed on both surfaces, and the first etching process using a corrosive solution was performed on a metal thin plate formed by attaching a film to the other surface until reaching a thickness that left a bridge portion. Then, the process of peeling the film in the other side.
(3) A step of covering one surface side having an opening corresponding to the bridge portion with an etching resistance layer from above the resist patterning.
(4) A step of performing a second etching process using a corrosive liquid on the metal thin plate provided with the etching resistance layer and penetrating the punched portion.
(5) A step of peeling the etching resistance layer and the resist pattern.

(Second method)
Next, as a 2nd method, the method of performing the following processes in order can be mentioned.
(1) A photosensitive resist is applied to both sides of a thin metal plate, and a predetermined pattern plate is used. The part to be a cut-out part has openings on both sides and the part to be a bridge part is opened only on the other side. Forming a resist pattern of a predetermined shape having a portion.
(2) A step of performing the first etching process with the corrosive liquid from both surfaces of the thin metal plate on which the resist pattern having a predetermined shape is formed until the portion is penetrated and the bridge portion is formed on the other surface side. .
(3) A step of covering one surface side having an opening corresponding to the bridge portion with an etching resistance layer from above the resist patterning.
(4) A step of performing a second etching process using a corrosive liquid on the metal thin plate provided with the etching resistance layer and penetrating the punched portion.
(5) A step of peeling the etching resistance layer and the resist pattern.

(Third method)
Next, as the third method, a method of sequentially performing the following steps can be exemplified.
(1) A photosensitive resist is applied to both sides of a thin metal plate, and a predetermined pattern plate is used. The part to be a cut-out part has openings on both sides and the part to be a bridge part is opened only on the other side. A step of applying a re-peelable film to one surface having an opening corresponding to the bridge portion after forming a resist pattern of a predetermined shape having a portion.
(2) Depth in the thickness direction of the first etching process with a corrosive solution on a thin metal plate formed with a resist pattern of a predetermined shape on both sides and a film that can be removed again on one side The process which peels the film which can be re-peeled after performing until it becomes predetermined amount.
(3) A step of covering the other surface side having no opening corresponding to the bridge portion with an etching resistance layer from above the resist patterning.
(4) A step of performing a second etching process using a corrosive liquid on the metal thin plate provided with the etching resistance layer, penetrating the punched portion and forming a bridge portion on the other surface side.
(5) A step of peeling the etching resistance layer and the resist pattern.

(Fourth method)
Next, as a 4th method, the method of performing the following processes in order can be mentioned.
(1) A photosensitive resist is applied to both surfaces of a thin metal plate, and a resist pattern having a predetermined shape having openings on both surfaces is formed in both the portion to be a punched portion and the portion to be a bridge portion using a predetermined pattern plate. Process.
(2) A step of performing a first etching process using a corrosive solution from both surfaces of a thin metal plate on which a resist pattern having a predetermined shape is formed to a thickness that remains as a bridge portion.
(3) A step of covering both surfaces with an etching resistance layer while leaving only one of the openings corresponding to the extracted portion.
(4) A step of performing a second etching process using a corrosive liquid on the metal thin plate provided with the etching resistance layer, penetrating the punched portion and forming a bridge portion leaving the middle in the thickness direction.
(5) A step of peeling the etching resistance layer and the resist pattern.

B. Method for Producing Pattern Formed Body Using Vacuum Ultraviolet Light Next, a method for producing a pattern formed body using vacuum ultraviolet light according to the present invention (hereinafter sometimes simply referred to as “method for producing pattern formed body according to the present invention”). explain. As described above, the pattern forming body manufacturing method of the present invention uses a pattern forming substrate, and the metal mask for vacuum ultraviolet light according to the present invention is disposed on the pattern forming surface of the pattern forming substrate. And a vacuum ultraviolet light irradiation step of irradiating the pattern formation surface with vacuum ultraviolet light through the vacuum ultraviolet light metal mask in the presence of a reactive gas. .

  Such a method for producing a pattern forming body of the present invention will be described with reference to the drawings. FIG. 5 is a schematic view showing an example of a method for producing a pattern forming body of the present invention. As illustrated in FIG. 5, the pattern forming body manufacturing method of the present invention uses the pattern forming substrate 20 ′ (FIG. 5A), and on the pattern forming surface P of the pattern forming substrate 20 ′, The metal mask placement step of placing the vacuum ultraviolet light metal mask 10 according to the present invention (FIG. 5B), and the pattern formation through the vacuum ultraviolet light metal mask 10 in the presence of a reactive gas. A vacuum ultraviolet light irradiation process for irradiating the surface P with vacuum ultraviolet light (FIG. 5C), and the pattern forming surface P of the pattern forming substrate 20 ′ is subjected to vacuum ultraviolet light irradiation processing in a pattern shape The formed body 20 is manufactured (FIG. 5D).

  According to the present invention, since the metal mask for vacuum ultraviolet light according to the present invention is used as a metal mask used for performing the vacuum ultraviolet light irradiation treatment in a pattern, the vacuum ultraviolet light is used for high definition and It is possible to manufacture with high sensitivity a pattern forming body in which a vacuum ultraviolet light irradiation treatment is accurately performed in a complicated pattern.

The manufacturing method of the pattern formation body of this invention has a metal mask arrangement | positioning process and a vacuum ultraviolet light irradiation process at least, and may have another process as needed.
Hereafter, each process used for this invention is demonstrated in order.

1. Metal Mask Arrangement Step First, the metal mask arrangement step used in the present invention will be described. This step is a step of using a pattern forming substrate and placing a metal mask on the pattern forming surface of the pattern forming substrate, and the metal mask for vacuum ultraviolet light according to the present invention is used as the metal mask. It is characterized by.
Hereinafter, such a metal mask arrangement process will be described.

(1) Pattern Forming Substrate First, the pattern forming substrate used in this step will be described. The pattern forming substrate used in this step is subjected to vacuum ultraviolet light irradiation treatment in a pattern shape by irradiating the pattern forming surface with vacuum ultraviolet light in a pattern shape in a vacuum ultraviolet light irradiation step described later. A pattern forming body can be formed.
Here, the “pattern forming surface” refers to a surface of the pattern forming substrate on which a vacuum ultraviolet light metal mask is disposed in this step and subjected to a vacuum ultraviolet light irradiation treatment.

As the pattern forming substrate used in this step, a substrate whose pattern forming surface is subjected to a desired vacuum ultraviolet light irradiation treatment by vacuum ultraviolet light irradiation is generally used. Such a pattern formation substrate may be a property change substrate having a single-layer structure made of a property change material that causes a desired property change by vacuum ultraviolet light irradiation treatment, and may be formed on an arbitrary support substrate. It may be a characteristic change type laminate having a structure in which a characteristic change layer whose desired characteristic is changed by vacuum ultraviolet light irradiation treatment is laminated.
The pattern forming substrate may be a decomposition / removal type laminate having a structure in which a decomposition / removal layer made of a decomposition / removal material that is oxidatively decomposed by vacuum ultraviolet light irradiation treatment is laminated on any support substrate Good.
Here, the decomposition and removal layer and the property change layer are those in which the former is completely removed by irradiation with vacuum ultraviolet light, whereas the latter changes the surface characteristics by irradiation with vacuum ultraviolet light, The characteristic change layer itself is different in that it remains.
Hereinafter, the characteristic change substrate, the characteristic change type laminate, and the decomposition / removal type laminate will be described.

(Characteristic change board)
First, the characteristic change substrate will be described. As the property change material constituting the property change substrate, a material capable of expressing desired self-supporting property and causing desired property change depending on the use of the pattern forming body produced by the present invention. If it is, it will not specifically limit. Examples of the characteristics that change due to the vacuum ultraviolet light irradiation of the characteristic change material include wettability, adhesion to a specific substance, surface roughness, chemical bondability, and the like. In particular, in this step, it is preferable to use a material whose surface wettability is changed by the action of vacuum ultraviolet light as the property changing material. By using such a characteristic changing material, for example, the pattern forming body manufactured according to the present invention can be made suitable for applying the functional coating liquid in a pattern on the pattern forming surface. It is.

  Examples of the property changing material whose surface wettability is changed by the action of vacuum ultraviolet light include polymers such as polycarbonate, polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, and cellulose triacetate. Can do.

  In addition, the thickness of the characteristic change substrate may be arbitrarily determined according to the use of the pattern forming body produced according to the present invention, but is preferably within a range of 0.01 mm to 5 mm. It is preferably within a range of 0.1 mm to 1 mm, and particularly preferably within a range of 0.2 mm to 0.4 mm.

(Characteristic change type laminate)
Next, the characteristic change type laminate will be described. The property change layer constituting the property change type laminate is not particularly limited as long as the surface property is changed by irradiation with vacuum ultraviolet light. Examples of the characteristics that change due to the action with vacuum ultraviolet light include wettability, adhesion to a specific substance, surface roughness, chemical bonding, and the like. In particular, in this step, it is preferable to use a layer whose surface wettability is changed by the action of vacuum ultraviolet light as the property change layer. This is because by using such a characteristic change layer, the pattern formed body produced according to the present invention can be made suitable for applying a functional coating liquid in a pattern on the pattern forming surface. .

  As such a characteristic change layer whose wettability is changed by the action of vacuum ultraviolet light, for example, a layer containing organopolysiloxane can be used. More specifically, a layer containing an organopolysiloxane or the like as described in JP-A-2001-074928 can be used. In addition to such organopolysiloxanes, surfactants, additives and the like can be used. Examples of such additives include those described in JP-A-2001-074928.

  The film thickness of the characteristic change layer is appropriately selected according to the type of the characteristic change layer, the use of the pattern-formed body formed according to the present invention, etc., but is usually within a range of 0.01 μm to 1 mm. It is preferable that it is in the range of 0.1 micrometer-0.1 mm especially.

  The support substrate used in the property change type laminate is not particularly limited as long as it can support the property change layer, and the use of the pattern forming body produced by the present invention is not limited. It can be appropriately selected and used according to the above. Examples of such a support substrate include those made of an organic material or those made of an inorganic material, and more specifically, those made of a resin film, glass, ceramic, metal or the like. be able to.

(Decomposition removal type laminate)
Next, the decomposition removal type laminate will be described. The decomposition / removal layer of the decomposition / removal type laminate is not particularly limited as long as it is a layer that can be decomposed and removed by irradiation with vacuum ultraviolet light. Examples of such a decomposition removal layer include thin films such as LB films and alternating adsorption films.

  The thickness of the decomposition / removal layer is not particularly limited as long as it is within a range in which the decomposition / removal layer can be decomposed and removed when a desired amount of vacuum ultraviolet light is irradiated according to the material constituting the decomposition / removal layer. In particular, in this step, the thickness is preferably in the range of 0.01 mm to 5 mm, particularly preferably in the range of 0.1 mm to 1 mm, and more preferably in the range of 0.2 mm to 0.4 mm. It is preferable that

  The support substrate used in the decomposition / removal type laminate is not particularly limited as long as it can support the decomposition / removal layer, and the use of the pattern forming body produced by the present invention is not limited. It can be appropriately selected and used according to the above. Since it is the same as that of the support substrate used for the characteristic changeable laminate, description thereof is omitted here.

  In this step, any one of the characteristic change substrate, the characteristic change laminate, and the decomposition / removal laminate can be suitably used as a pattern forming substrate. When the decomposition / removal-type laminate is used as the pattern forming substrate, the pattern forming body manufactured according to the present invention is a material in which a portion irradiated with vacuum ultraviolet light is different from a portion not irradiated with vacuum ultraviolet light. It will consist of

(2) Vacuum ultraviolet light metal mask The vacuum ultraviolet light metal mask used in this step is the vacuum ultraviolet light metal mask according to the present invention. Therefore, the vacuum ultraviolet light metal mask used in this step is the same as that described in the section “A. Vacuum ultraviolet light metal mask”, and the description thereof is omitted here.

(3) Method for Arranging Vacuum Ultraviolet Light Metal Mask Next, a method for arranging the vacuum ultraviolet light metal mask on the pattern forming surface of the pattern forming substrate in this step will be described. In this step, the vacuum ultraviolet light metal mask can be arranged on the pattern forming surface of the pattern forming substrate as long as the vacuum ultraviolet light metal mask can be arranged at a predetermined position on the pattern forming surface. It is not particularly limited. In particular, the method of arranging the vacuum ultraviolet light metal mask in this step involves fixing the vacuum ultraviolet light metal mask with a magnet from the side opposite to the pattern forming surface of the pattern forming substrate. Preferably there is. As a result, even if the vacuum ultraviolet light metal mask according to the present invention has a high-definition and complicated pattern-shaped opening and is thin, the vacuum ultraviolet light metal mask is used. This is because, since the mask can be fixed in close contact with the pattern forming surface, it is possible to manufacture a pattern forming body in which the pattern forming surface is precisely subjected to vacuum ultraviolet light irradiation processing in a high-definition pattern.
That is, the pattern forming body manufacturing method of the present invention employs a method in which vacuum ultraviolet light is irradiated onto the pattern forming surface of the pattern forming substrate through a vacuum ultraviolet light metal mask. Due to its nature, when the pattern is made high-definition, the thickness tends to decrease accordingly. Since a thin metal mask lacks flatness and tends to deform so that the surface undulates, simply placing it on the pattern formation surface will leave a gap between the pattern formation surface and the metal mask. It will be unavoidable. Also, since vacuum ultraviolet light is a non-directed dispersed light, if there is such a gap, that part is also irradiated with vacuum ultraviolet light, and even if a high-definition metal mask is used, it corresponds to it. There is a possibility that a pattern cannot be formed.
However, by fixing the metal mask for vacuum ultraviolet light with a magnet from the side opposite to the pattern forming surface in this step, the metal mask is removed even when a high-definition and thin metal mask is used. Since it can be fixed in close contact with the pattern forming surface without any gaps, the pattern forming surface can be manufactured in a pattern with a high-definition pattern and subjected to vacuum ultraviolet light irradiation treatment. is there.

  As a method for fixing the vacuum ultraviolet light metal mask in this step using a magnet as described above, any method can be used as long as it can be fixed by the magnetic force of the magnet from the side opposite to the pattern forming surface of the pattern forming substrate. There is no particular limitation. As such a method, for example, after a metal mask is disposed on the pattern formation surface of the pattern formation substrate, the magnet is disposed on the surface opposite to the pattern formation surface of the pattern formation substrate. And a method of fixing by placing a metal mask on the surface (pattern forming surface) of the pattern forming substrate arranged on the magnet after arranging the pattern forming substrate on the magnet. Can do. When an electromagnet is used as the magnet, a pattern forming substrate is disposed on an electromagnet that is not energized, and then a metal mask is disposed on the surface (pattern forming surface) of the pattern forming substrate disposed on the electromagnet. Then, a method of fixing by energizing the electromagnet can be mentioned.

  The magnet used in this step is not particularly limited as long as it can generate a magnetic force that can fix the metal mask from the back side of the pattern forming surface of the pattern forming substrate. Such a magnet may be either a permanent magnet or an electromagnet, and may have any magnetization form of anisotropic multipolar or isotropic multipolar. Among these, it is preferable to use an electromagnet in this step. Since the electromagnet can switch the magnetic force, for example, the pattern forming substrate is disposed on an electromagnet that is not energized, and a metal mask is disposed on the pattern forming surface of the pattern forming substrate. This is because it is possible to adopt a method such as energizing the electromagnet to generate a magnetic force after the alignment is performed, and there is an advantage that the arrangement accuracy of the metal mask can be improved.

  Only one type of magnet may be used in this step, or two or more types may be used. When two or more types of magnets are used, a plurality of magnets having the same magnetic force may be used, or magnets having different magnetic forces may be used in combination.

The size of the magnet used in this step is not particularly limited as long as it is within a range where the metal mask can be fixed in close contact with the pattern forming surface of the pattern forming substrate, but at least from the area of the metal mask. It is preferable to have a large area. If the area is smaller than the area of the metal mask, a portion where the metal mask is not fixed by a magnet is formed, and it may be difficult to perform the vacuum ultraviolet light irradiation process in a high-definition pattern.
In addition, when using a several magnet in this process, it is not necessary for each magnet to have an area larger than the area of the said metal mask, The area at the time of combining several magnets is the said metal mask. It only needs to be larger than the area.

2. Vacuum ultraviolet light irradiation process Next, the vacuum ultraviolet light irradiation process in this invention is demonstrated. In this step, the pattern forming surface is patterned by irradiating the pattern forming surface with vacuum ultraviolet light through the vacuum ultraviolet light metal mask fixed on the pattern forming surface in the metal mask arranging step. Is a step of performing a vacuum ultraviolet light irradiation treatment.

  The wavelength of the vacuum ultraviolet light irradiated in this step is not particularly limited as long as it is within a range where oxygen radicals can be generated by acting with oxygen, but it is usually preferably within a range of 100 nm to 260 nm. Especially, it is preferable that it exists in the range of 150 nm-200 nm. This is because if the wavelength is longer than the above range, the generation efficiency of oxygen radicals is lowered, and the sensitivity may be lowered depending on the mode of vacuum ultraviolet light irradiation treatment. In addition, if the wavelength is shorter than the above range, stable irradiation with vacuum ultraviolet light may be difficult.

  In this step, examples of a light source that can be used for irradiation with vacuum ultraviolet light include an excimer lamp, a low-pressure mercury lamp, and various other light sources.

  The irradiation amount of vacuum ultraviolet light in this step is particularly limited as long as it is within a range where a desired degree of vacuum ultraviolet light irradiation treatment can be performed according to the type of vacuum ultraviolet light irradiation treatment applied to the pattern forming surface in this step. Not.

The method of irradiating the pattern forming surface with vacuum ultraviolet light in this step is not particularly limited as long as the method can irradiate the pattern forming surface with vacuum ultraviolet light with a uniform dose. Examples of such an irradiation method include a method of simultaneously irradiating the entire surface of the pattern forming surface and a method of sequentially irradiating the pattern forming surface while moving at least one of the light source or the pattern forming substrate. Can be mentioned. In particular, in this step, a method of sequentially irradiating the pattern forming surface is preferable. The reason is as follows.
That is, since vacuum ultraviolet light is non-directional dispersed light, the method of simultaneously irradiating the entire pattern formation surface, for example, when irradiating vacuum ultraviolet light to a large area pattern formation surface, There may be a difference in the irradiation amount of vacuum ultraviolet light between the ends. However, according to the method of sequentially irradiating the pattern forming surface, it is easy to uniformly irradiate the entire surface even if the pattern forming surface having a large area is irradiated with vacuum ultraviolet light. It is.

  In this step, among the methods of sequentially irradiating the pattern forming surface, a method of irradiating while moving the light source while fixing the pattern forming substrate is preferable. This is because such a method makes it easy to uniformly irradiate a large area pattern forming surface with vacuum ultraviolet light.

  Note that the number of vacuum ultraviolet light sources used in this step may be one, or a plurality of light sources may be used. In the case of using a plurality of light sources, when using the method of irradiating while moving the light source as the vacuum ultraviolet light irradiation method in this step, the plurality of light sources may be moved simultaneously or individually. It may be moved.

  The type of vacuum ultraviolet light irradiation treatment applied to the pattern formation surface in this step varies depending on the type of the pattern formation substrate. For example, when the characteristic change substrate or the characteristic change type laminate is used as the pattern formation substrate, the vacuum ultraviolet light irradiation process changes the characteristic, while the decomposition removal type laminate is used as the pattern formation surface substrate. In the case of using a body, the vacuum ultraviolet light irradiation treatment decomposes and removes the decomposition removal layer.

  Moreover, although this process irradiates vacuum ultraviolet light in presence of reactive gas, as reactive gas used for this process, oxygen, a fluorine-containing gas, etc. can be mentioned, for example. Any of these reactive gases can be suitably used in this step, but at least oxygen as the reactive gas is the above-mentioned mechanism of action on the pattern forming substrate by vacuum ultraviolet light. It is preferable to be used.

3. Uses Examples of the use of the method for producing a patterned product of the present invention include the production of a pattern product used for a color filter for a liquid crystal display device, the formation of source / drain wiring of an organic transistor, and the hole injection layer of an organic EL And a light emitting layer, a microlens, and a biochip.

C. Next, a pattern forming body manufacturing apparatus for vacuum ultraviolet light according to the present invention (hereinafter may be simply referred to as “pattern forming body manufacturing apparatus according to the present invention”) will be described. As described above, the pattern forming body manufacturing apparatus according to the present invention includes a pattern forming substrate support part for supporting a pattern forming substrate and a pattern forming surface of the pattern forming substrate supported by the pattern forming substrate support part. A vacuum ultraviolet light metal mask disposed so as to be disposed, and a vacuum ultraviolet light through the vacuum ultraviolet light metal mask on the pattern formation surface of the pattern formation substrate supported by the pattern formation substrate support. A vacuum ultraviolet light irradiating portion for irradiation, wherein the vacuum ultraviolet light metal mask is the vacuum ultraviolet light metal mask according to the present invention.

Such a pattern forming body manufacturing apparatus of the present invention will be described with reference to the drawings. FIG. 6 is a schematic view showing an example of a pattern forming body manufacturing apparatus of the present invention. As illustrated in FIG. 6, the pattern forming body manufacturing apparatus 30 according to the present invention supports a pattern forming substrate 101 and a pattern supported by the pattern forming substrate support 31. The vacuum ultraviolet light metal mask 10 disposed on the pattern formation surface P of the formation substrate 101 and the pattern formation surface P of the pattern formation substrate 101 supported by the pattern formation substrate support 31 are used for the vacuum ultraviolet light. A vacuum ultraviolet light irradiation unit 32 that irradiates vacuum ultraviolet light through the metal mask 10.
In such an example, the pattern forming body manufacturing apparatus 30 of the present invention is characterized in that the vacuum ultraviolet light metal mask 10 is the vacuum ultraviolet light metal mask according to the present invention.

  According to the present invention, since the vacuum ultraviolet light metal mask is the vacuum ultraviolet light metal mask according to the present invention, accurate vacuum ultraviolet light is obtained in a high-definition and complicated pattern using vacuum ultraviolet light. A pattern formed body that has been subjected to irradiation treatment can be produced with high sensitivity. Moreover, the pattern formation body manufacturing apparatus by the vacuum ultraviolet light of this invention can implement suitably the manufacturing method of the pattern formation body by the vacuum ultraviolet light which concerns on the said invention.

The pattern forming body manufacturing apparatus of the present invention has at least the above-mentioned pattern forming substrate support section, a vacuum ultraviolet light metal mask, and a vacuum ultraviolet light irradiation section, and has other configurations as necessary. It may be.
Hereafter, each structure used for this invention is demonstrated in order.

1. First, the metal mask for vacuum ultraviolet light used in the present invention will be described. The metal mask for vacuum ultraviolet light used in the present invention is placed so as to be disposed on the pattern formation surface of the pattern formation substrate supported by the pattern formation substrate support portion described later.

In the pattern forming body manufacturing apparatus of the present invention, the vacuum ultraviolet metal mask can be placed on the pattern forming surface of the pattern forming substrate supported by the pattern forming substrate support section described later. And if it is a position which can irradiate the said pattern formation surface with a vacuum ultraviolet light through the vacuum ultraviolet light metal mask by the vacuum ultraviolet light irradiation part mentioned later, it will not specifically limit.
Moreover, as an aspect in which the vacuum ultraviolet light metal mask is installed in the present invention, the metal mask is formed on the metal mask support portion formed so that the metal mask can be disposed on the pattern forming surface of the pattern forming substrate. It may be a supported mode.

  The metal mask for vacuum ultraviolet light used in the present invention is the same as that described in the above section “A. Metal mask for vacuum ultraviolet light”, and the description thereof is omitted here.

2. Next, the pattern forming substrate support in the pattern forming body manufacturing apparatus of the present invention will be described. The pattern forming substrate support part in the pattern forming body manufacturing apparatus of the present invention is not particularly limited as long as it can stably support the pattern forming substrate. The shape and the like of the pattern forming substrate support unit is the shape of the pattern forming substrate irradiated with vacuum ultraviolet light using the pattern forming body manufacturing apparatus of the present invention and the pattern forming body manufacturing apparatus of the present invention. May be selected as appropriate in accordance with the use of the pattern forming body to be formed, for example, may be a structure that supports the entire surface of the pattern forming substrate, or may support a part of the pattern forming substrate. It may be a structure.

  The constituent material of such a pattern-forming substrate support is not particularly limited as long as it has strength capable of supporting the pattern-forming substrate. For example, an inorganic material such as a metal or ceramic, Organic materials such as plastic can also be used. The pattern forming substrate supported by the pattern forming substrate support section is the same as the pattern forming substrate described in the above-mentioned “B. Method for producing pattern forming body”. Omitted.

  The pattern forming substrate support used in the present invention may have a moving device for moving the pattern forming substrate and sequentially irradiating the pattern forming surface with vacuum ultraviolet light.

3. Vacuum ultraviolet light irradiation part Next, the vacuum ultraviolet light irradiation part used for this invention is demonstrated. The vacuum ultraviolet light irradiation part used for this invention will not be specifically limited if it has a light source which can irradiate the said pattern formation board | substrate with the vacuum ultraviolet light which has a desired wavelength. As a wavelength of the vacuum ultraviolet light irradiated from the vacuum ultraviolet light irradiation part in this invention, it is usually preferable to be in the range of 100 nm to 260 nm, and it is particularly preferable to be in the range of 150 nm to 200 nm.

Examples of a light source that can irradiate vacuum ultraviolet light having such a wavelength include an excimer lamp and a low-pressure mercury lamp.

  In the pattern forming body manufacturing apparatus of the present invention, only one such light source may be used, or a plurality of such light sources may be used.

  Further, the vacuum ultraviolet light irradiation unit has a moving device for sequentially irradiating the pattern forming surface of the pattern forming substrate supported by the pattern forming substrate support unit by moving the light source to the vacuum ultraviolet light. It may be.

4). Other Configurations The pattern forming body manufacturing apparatus of the present invention may have a configuration other than the above. Other configurations used in the present invention can be appropriately selected and used according to the type and application of the pattern forming body manufactured by the pattern forming body manufacturing apparatus of the present invention. In particular, in the present invention, as such another configuration, the vacuum ultraviolet light metal mask is magnetically applied from the side opposite to the pattern formation surface of the pattern formation substrate supported by the pattern formation substrate support. It is preferable to have a magnetic force generating part that is fixed by. As a result, even if a high-definition and complicated pattern is formed as a metal mask for vacuum ultraviolet light supported by the metal mask support part and a thin mask is used, the vacuum ultraviolet light is used. Since the metal mask for light can be fixed in close contact with the pattern forming surface, a pattern forming body in which the pattern forming surface is precisely subjected to vacuum ultraviolet light irradiation processing into a high-definition pattern can be manufactured. It is.

  The case where the pattern forming body manufacturing apparatus of the present invention has the magnetic force generation unit will be described with reference to the drawings. FIG. 7 is a schematic view showing another example of the pattern forming body manufacturing apparatus of the present invention. As illustrated in FIG. 7, the pattern forming body manufacturing apparatus 30 according to the present invention includes the pattern forming surface P of the pattern forming substrate 101 that is supported by the pattern forming substrate support 31 on the vacuum ultraviolet light metal mask 10. It may have a magnetic force generator 33 that is fixed by a magnetic force from the opposite side.

  As the magnetic force generating portion used in the present invention, a vacuum ultraviolet light metal mask disposed on the pattern forming surface of the pattern forming substrate supported by the pattern forming substrate supporting portion described above is used. There is no particular limitation as long as it can generate a magnetic force that can be fixed by a magnetic force from the side opposite to the pattern forming surface. As such a magnetic force generation part, a magnet is usually used.

  The magnet used for the magnetic force generator may be either a permanent magnet or an electromagnet, and may have any magnetization form of anisotropic multipolar or isotropic multipolar. Among these, it is preferable to use an electromagnet in this step.

  Moreover, the magnet used for the said magnetic force generation | occurrence | production part may be only one type, or may use two or more types. When two or more types of magnets are used, a plurality of magnets having the same magnetic force may be used, or magnets having different magnetic forces may be used in combination.

  The size of the magnet used for the magnetic force generation unit is the same as the content described in the above-mentioned section “B. Method for producing pattern-formed body”, and thus the description thereof is omitted here.

  In the pattern forming body manufacturing apparatus of the present invention, the pattern forming substrate support portion and the magnetic force generation portion may be configured integrally. By having such a structure, the structure of the pattern formation body manufacturing apparatus of this invention can be simplified, without impairing a function.

  Moreover, the pattern formation body manufacturing apparatus of this invention may have other structures other than the above. Such other configurations include, for example, a temperature control unit for controlling the temperature in the pattern forming body manufacturing apparatus, a humidity control unit for controlling the humidity in the pattern forming body manufacturing apparatus, and the pattern Examples include a magnetic force generator-pattern forming substrate distance controller that adjusts the distance between the surface opposite to the pattern forming surface of the pattern forming substrate supported by the forming substrate support and the magnetic force generator. it can.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be specifically described with reference to examples.

[Example]
A metal mask for vacuum ultraviolet light having a pattern as shown in FIG. 2 (thickness 50 μm, bridge width 20 μm, height of vacuum ultraviolet light irradiation treatment gap 30 μm) was prepared.
Next, a vacuum ultraviolet light metal mask is placed on a PET substrate having a thickness of 100 μm (Mylar (registered trademark) manufactured by DuPont, USA) in close contact with a magnet, and in the presence of oxygen, a metal for vacuum ultraviolet light. Vacuum ultraviolet light (172 nm) was irradiated from the mask side with an illuminance of 10 mW / cm ² to form a pattern. At this time, it was 20 seconds until the contact angle of water at the lower part of the irradiation part and the bridge part became 66 degrees to 20 degrees or less.
At this time, a pattern forming body manufacturing apparatus using vacuum ultraviolet light as shown in FIG. 8 was used.

[Comparative example]
A vacuum ultraviolet light metal mask (thickness 50 μm, bridge width 20 μm) with a vacuum ultraviolet light irradiation treatment gap height of 0 μm was prepared and the pattern was formed in the same manner as in the example. The PET under the bridge part was not decomposed, and the contact angle of water was the same as that of the unexposed part.

It is the schematic which shows an example of the manufacturing method of the pattern formation body by a vacuum ultraviolet light. It is the schematic which shows an example of the metal mask for vacuum ultraviolet light of this invention. It is the schematic which shows the other example of the metal mask for vacuum ultraviolet light of this invention. It is the schematic which shows the other example of the metal mask for vacuum ultraviolet light of this invention. It is the schematic which shows an example of the manufacturing method of the pattern formation body by the vacuum ultraviolet light of this invention. It is the schematic which shows an example of the pattern formation body manufacturing apparatus by the vacuum ultraviolet light of this invention. It is the schematic which shows an example of the pattern formation body manufacturing apparatus by the vacuum ultraviolet light of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Metal mask main body 2 ... Opening part 3 ... Bridge part 10 ... Vacuum ultraviolet light metal mask 20 ... Pattern formation body 20 '... Pattern formation body substrate 30 ... Pattern formation body manufacturing apparatus 31 ... Pattern formation board | substrate support part 32 ... Vacuum ultraviolet light irradiation part 33 ... Magnetic force generation part 100 ... Pattern formation body 101 ... Substrate for pattern formation body 102 ... Metal mask P ... Pattern formation surface

Claims (8)

Using a pattern formation substrate, placing a metal mask on the pattern formation surface of the pattern formation substrate, and irradiating the pattern formation surface with vacuum ultraviolet light through the metal mask in the presence of a reactive gas Thus, the pattern forming surface is a vacuum ultraviolet light metal mask used in a method of manufacturing a pattern forming body in which the pattern is subjected to vacuum ultraviolet light irradiation treatment,
When the metal mask main body made of a thin metal plate and having an opening and a bridge portion formed so as to bridge the opening is disposed on the pattern forming substrate, the pattern is formed. The metal mask for vacuum ultraviolet light, wherein the bridge portion is formed so that a gap through which the reactive gas can flow is formed between the surface and the bridge portion.   The metal mask for vacuum ultraviolet light according to claim 1, wherein the bridge portion has a thickness smaller than that of the metal mask main body.   3. The vacuum ultraviolet light metal mask according to claim 1, wherein the bridge portion is formed by half etching from at least one surface.   The metal mask for vacuum ultraviolet light according to any one of claims 1 to 3, wherein a width of the bridge portion is in a range of 5 µm to 100 µm. A metal mask placement step of placing a vacuum ultraviolet light metal mask according to any one of claims 1 to 4 on a pattern formation surface of the pattern formation substrate using a pattern formation substrate,
A vacuum ultraviolet light irradiation step of irradiating the pattern formation surface with vacuum ultraviolet light through the vacuum ultraviolet light metal mask in the presence of a reactive gas. Manufacturing method.   The said metal mask arrangement | positioning process fixes the said metal mask for vacuum ultraviolet light with a magnet from the surface opposite to the said pattern formation surface of the said pattern formation board | substrate, The Claim 5 characterized by the above-mentioned. A method for producing a pattern-formed body using vacuum ultraviolet light. A pattern forming substrate support part for supporting the pattern forming substrate;
A vacuum ultraviolet light metal mask installed so as to be disposed on the pattern formation surface of the pattern formation substrate supported by the pattern formation substrate support;
A vacuum ultraviolet light pattern comprising: a vacuum ultraviolet light irradiating unit configured to irradiate a vacuum ultraviolet light through the vacuum ultraviolet light metal mask on a pattern forming surface of the pattern forming substrate supported by the pattern forming substrate support part. Forming body manufacturing apparatus,
The vacuum ultraviolet light metal mask according to any one of claims 1 to 4, wherein the vacuum ultraviolet light metal mask is the vacuum ultraviolet light metal mask.   The vacuum ultraviolet light metal mask has a magnetic force generation part for fixing by a magnetic force from a surface opposite to the pattern forming surface of the pattern forming substrate supported by the pattern forming substrate support part. Item 8. A pattern forming body manufacturing apparatus using vacuum ultraviolet light according to Item 7.

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