JP2009244576A - Method of manufacturing patterned body by vacuum ultraviolet light - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a patterned body which has a functional layer accurately decomposed and removed like a precise and complicated pattern by vacuum ultraviolet light, with a high sensitivity. <P>SOLUTION: A method of manufacturing the patterned body uses a substrate 1 for pattern formation having a functional layer 1b consisting of a functional material capable of being decomposed by irradiation with vacuum ultraviolet light and includes a step of disposing a metal mask 10 on the functional layer and a step of irradiating a surface of the functional layer with vacuum ultraviolet light through the metal mask under the existence of a reactant gas to remove part of the functional layer like a pattern. The metal mask includes a metal thin plate and has a metal mask body 11 having openings 12 and bridges 13 formed so as to bridge the openings, and the bridges are formed so that spaces through which the reactant gas can pass may be formed between the functional layer and the bridges when the metal mask is disposed on the functional layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a pattern forming body using vacuum ultraviolet light.

  At present, various methods have been proposed as a method for manufacturing a pattern forming body for forming various patterns such as designs, images, characters, and circuits on a substrate. Typical examples of the method for producing such a pattern-formed body include lithographic printing, offset printing, and a printing method for producing a lithographic printing original plate using a heat mode recording material. It has been widely used because it has an advantage that a pattern-formed body can be easily produced.

  On the other hand, in recent years, a photolithography method has become the mainstream as a method to replace the printing method. Photolithographic methods include, for example, pattern exposure on a photoresist layer coated on a substrate, development of the photoresist after exposure, further etching, or using a substance having functionality in the photoresist, This is a method for producing a pattern forming body by directly forming a target pattern by exposure of a photoresist. Such a photolithography method can produce a pattern-formed body that has been subjected to high-definition patterning as compared with the conventional printing method. For example, it can produce a color filter used in a liquid crystal display device. Used in methods.

  However, in such a photolithography method, there is a problem that a waste liquid needs to be processed because it is necessary to use a photoresist and develop or etch with a liquid developer after exposure. The method for producing a pattern forming body using the photolithography method is not always highly productive. In addition, it has been pointed out that when a functional substance is used as a photoresist, there is a problem that the material is deteriorated by an alkaline solution or the like used during development, and the range of material selection is narrow.

  Under such circumstances, Patent Document 1 discloses a method for manufacturing a pattern forming body using vacuum ultraviolet light. In the method disclosed in Patent Document 1, a pattern forming substrate having a base material and an organic molecular film made of an organic substance formed on the base material is patterned in vacuum ultraviolet on the organic molecular film through a photomask. In this method, the organic molecular film is decomposed and removed by irradiating light to produce a pattern forming body. Such a method using vacuum ultraviolet light is a dry process that does not require the use of a developer, which was a drawback of the photolithography method, and is useful in that a pattern-formed body can be produced with high productivity. It is.

By the way, the pattern formation by vacuum ultraviolet light as disclosed in Patent Document 1 is performed by decomposing and removing the organic molecular film by the action of vacuum ultraviolet light. That is, when irradiation with vacuum ultraviolet light is performed, molecular bonds of organic substances in the organic molecular film are broken by the action of vacuum ultraviolet light, or oxygen atom radicals generated by oxygen excitation in the presence of oxygen are converted into organic substances. By acting on the organic matter, the organic matter of the organic molecular film becomes a decomposed product, and the decomposed product is volatilized and removed from the pattern forming substrate, whereby a pattern is formed.
For this reason, in the method for producing a pattern forming body using vacuum ultraviolet light, it is necessary that oxygen acting on the vacuum ultraviolet light always be present on the surface of the substrate on which the pattern is formed.

  However, in the method using a photomask as in Patent Document 1, since the organic molecular film and the photomask are close to each other, oxygen that acts on the vacuum ultraviolet light becomes insufficient when the vacuum ultraviolet light is continuously irradiated. As a problem, the sensitivity of pattern formation by vacuum ultraviolet light is reduced.

  In view of such problems, the present inventors have completed an invention that makes it possible to produce a pattern-formed body using vacuum ultraviolet light using a metal mask (Patent Document 2). A method using such a metal mask is described in Patent Document 1 in that a pattern formed body subjected to a high-definition pattern-shaped vacuum ultraviolet light irradiation treatment using vacuum ultraviolet light can be manufactured with high sensitivity. This is a significant advantage over the conventional methods.

However, since the metal mask has a tendency to decrease in thickness as the pattern becomes higher in definition, the method using the metal mask described in Patent Document 2, for example, also includes the metal mask. If a metal mask with openings in a high-definition pattern, such as a mask with a relatively large opening or a complicated opening, is used as a mask. The shape of the opening is deformed when manufacturing the film, which may make it difficult to perform the vacuum ultraviolet light irradiation treatment in the pattern shape originally planned.
Further, the method described in Patent Document 2 has room for improvement in that it is difficult to form a floating island pattern, which was possible in the method using the conventional photomask.

JP 2001-324816 A JP 2007-178783 A

  The present invention has been made in view of such problems, and a pattern formed body that has been subjected to a vacuum ultraviolet light irradiation treatment in a high-definition and complicated pattern shape using vacuum ultraviolet light has a high sensitivity. The main object of the present invention is to provide a method for producing a pattern forming body using vacuum ultraviolet light, which can be produced by the following method.

  In order to solve the above problems, the present invention provides a pattern formation comprising a substrate and a functional layer formed on the substrate and made of a functional material that can be decomposed by irradiation with vacuum ultraviolet light. A metal mask placement step of placing a metal mask on the functional layer of the pattern forming substrate using a working substrate, and a vacuum on the surface of the functional layer through the metal mask in the presence of a reactive gas. A vacuum ultraviolet light irradiation step of removing a part of the functional layer in a pattern by irradiating with ultraviolet light, wherein the metal mask comprises a metal The metal mask main body made of a thin plate and having an opening, and a bridge portion formed so as to bridge the opening, and when placed on the functional layer, the function A method for producing a pattern forming body using vacuum ultraviolet light, characterized in that the bridge portion is formed so that a void through which the reactive gas can flow is formed between the layer and the bridge portion. I will provide a.

According to the present invention, the metal mask used in the metal mask arranging step has a structure in which the opening formed in the metal mask main body is bridged by the bridge portion, thereby making the opening highly precise and complicated. Even if formed into a shape, it is possible to prevent the shape of the opening from being deformed when the metal mask is placed on the functional layer in the metal mask placement step.
In addition, when the bridge portion in the metal mask is disposed on the functional layer, a gap is formed so that the reactive gas can flow between the functional layer and the bridge portion. Therefore, when the functional layer is irradiated with vacuum ultraviolet light in the vacuum ultraviolet light irradiation step, the vacuum ultraviolet light is shielded by the bridge portion, and the functional layer located below the bridge portion is decomposed. It can prevent remaining without being removed, and the functional layer located below the bridge portion can be decomposed and removed.
For this reason, according to the method for manufacturing a pattern forming body using vacuum ultraviolet light according to the present invention, even if the metal mask having an opening formed in a high-definition and complicated pattern is used, the shape of the opening Similarly, a pattern formed body in which the functional layer is accurately decomposed and removed can be manufactured with high sensitivity.

  In the present invention, the metal mask has a floating island portion formed in the opening of the metal mask main body, and the bridge portion is formed to connect the metal mask main body and the floating island portion. It may be. This is because, by using a metal mask having such a structure, a pattern forming body in which the functional layer is decomposed and removed in a floating island pattern according to the present invention can be manufactured with high sensitivity.

  In the metal mask used in the present invention, the bridge portion is preferably thinner than the metal mask main body. The metal mask used in the present invention is preferably formed by half etching from at least one surface. Thereby, in the vacuum ultraviolet light irradiation step, sufficient reactive gas is allowed to flow between the bridge portion and the functional layer, and on the surface of the functional layer located below the bridge portion. This is because, as a result of being able to irradiate vacuum ultraviolet light, the surface of the functional layer located under the bridge portion can be easily decomposed and removed to a predetermined extent.

  Moreover, in this invention, it is preferable that the width | variety of the said bridge | bridging part of the metal mask used for the said metal mask arrangement | positioning process exists in the range of 5 micrometers-100 micrometers. As a result, in the vacuum ultraviolet light irradiation step, it becomes possible to sufficiently evacuate the vacuum ultraviolet light into the gap formed under the bridge portion, and the functional layer located under the bridge portion is not decomposed and removed. This is because this can be prevented more effectively.

  INDUSTRIAL APPLICABILITY The present invention has an effect that a pattern formed body in which a functional layer is decomposed and removed in a high-definition and complicated pattern using vacuum ultraviolet light can be manufactured with high sensitivity.

  Hereinafter, a method for producing a patterned body using vacuum ultraviolet light according to the present invention (hereinafter sometimes simply referred to as “a method for producing a patterned body of the present invention”) will be described.

  As described above, the method for producing a pattern formed body of the present invention includes a substrate, and a functional layer formed on the substrate and made of a functional material that can be decomposed by irradiation with vacuum ultraviolet light. A metal mask disposing step of disposing a metal mask on the functional layer of the pattern forming substrate, and in the presence of a reactive gas, the functional layer via the metal mask. A vacuum ultraviolet light irradiation step of removing a part of the functional layer in a pattern by irradiating the surface of the substrate with vacuum ultraviolet light, wherein the metal mask is made of a thin metal plate and has an opening. A metal mask main body having a portion and a bridge portion formed so as to bridge the opening, and the functional layer and the bridge portion when disposed on the functional layer. The reactive gases so Tsuryu possible gap is formed, is characterized in that said bridge portion is formed between the.

  Such a method for producing a pattern forming body of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing an example of a method for producing a pattern forming body of the present invention. As illustrated in FIG. 1, the pattern forming body manufacturing method of the present invention includes a substrate 1 a and a functional material that is formed on the substrate 1 a and can be decomposed by irradiation with vacuum ultraviolet light. A metal mask arranging step of arranging a metal mask 10 on the surface of the functional layer 1b of the pattern forming substrate 1 using the pattern forming substrate 1 having the functional layer 1b made of (FIG. 1A). (FIG. 1 (b)), in the presence of a reactive gas, the surface of the functional layer 1b is irradiated with vacuum ultraviolet light through the metal mask 10 so that a part of the functional layer 1b is formed. A vacuum ultraviolet light irradiation step for removing in a pattern (FIG. 1 (c)), and manufacturing a pattern forming body having a substrate 1a and a functional layer 1b formed in a pattern on the substrate 1a (Fig. 1 (d)) .

The manufacturing method of the pattern formation body of this invention has the characteristics in the metal mask used for the said metal mask arrangement | positioning process. FIG. 2 is a schematic view showing an example of a metal mask used in the metal mask arranging step. As illustrated in FIG. 2A, the metal mask 10 used in the present invention is made of a thin metal plate and bridges the metal mask body 11 having the opening 12 and the opening 12 of the metal mask body 11. And a bridge portion 13 formed on the surface.
FIG. 2B is a cross-sectional view taken along the line XX ′ in FIG. As illustrated in FIG. 2B, when the metal mask 10 used in the present invention is arranged on the functional layer 1b in the metal mask arranging step, the surface of the functional layer 1b and the bridge portion 13 are arranged. The bridge portion 13 is formed so that a gap through which a reactive gas can flow is formed.

According to the present invention, the metal mask used in the metal mask arranging step has a structure in which the opening formed in the metal mask main body is bridged by the bridge portion, thereby making the opening highly precise and complicated. Even if formed into a shape, it is possible to prevent the shape of the opening from being deformed when the metal mask is placed on the functional layer in the metal mask placement step.
In addition, when the bridge portion in the metal mask is disposed on the functional layer, a gap is formed so that the reactive gas can flow between the functional layer and the bridge portion. Therefore, when the functional layer is irradiated with vacuum ultraviolet light in the vacuum ultraviolet light irradiation step, the vacuum ultraviolet light is shielded by the bridge portion, and the functional layer located below the bridge portion is decomposed. It can prevent remaining without being removed, and the functional layer located below the bridge portion can be decomposed and removed.
For this reason, according to the method for manufacturing a pattern forming body using vacuum ultraviolet light according to the present invention, even if the metal mask having an opening formed in a high-definition and complicated pattern is used, the shape of the opening Similarly, a pattern formed body in which the functional layer is accurately decomposed and removed can be manufactured with high sensitivity.

  The manufacturing method of the pattern formation body of this invention has a metal mask arrangement | positioning process and a vacuum ultraviolet light irradiation process at least, and another process may be used as needed. Hereafter, each process used for this invention is demonstrated in order.

1. Metal Mask Arrangement Step First, the metal mask arrangement step used in the present invention will be described. This step uses a pattern formation substrate having a substrate and a functional layer formed on the substrate and made of a functional material that can be decomposed by irradiation with vacuum ultraviolet light. This is a step of disposing a metal mask on the surface of the functional layer of the forming substrate. This process is characterized in that a metal mask having a specific structure is used.
Hereinafter, such a metal mask arrangement process will be described in detail.

(1) Metal mask First, the metal mask used for this process is demonstrated. The metal mask used in this process is made of a thin metal plate, has a metal mask body having an opening, and a bridge portion formed so as to bridge the opening, and is disposed on the functional layer. The bridge portion is formed so that a gap through which the reactive gas can flow is formed between the functional layer and the bridge portion. It is.

(Bridge part)
The bridge portion is formed so as to bridge the opening formed in the metal mask main body, and has a function of preventing the shape of the opening from being deformed. Further, in the vacuum ultraviolet light irradiation step to be described later, a gap through which the reactive gas can flow between the functional layer and the bridge portion of the pattern forming substrate (hereinafter referred to as “vacuum for vacuum ultraviolet light irradiation treatment”). It may be referred to as “.”). The form in which such a bridge portion is formed is not particularly limited as long as the above-described vacuum ultraviolet light irradiation treatment gap can be formed in a desired size. As such an aspect, the aspect formed in the arch shape so that the opening part formed in the metal mask main body might be bridge | crosslinked may be sufficient, for example, and the aspect formed linearly may be sufficient.

  A mode in which a bridge portion is formed in the metal mask used in this step will be described with reference to the drawings. FIG. 3 is a schematic view showing an example of a mode in which a bridge portion is formed in the metal mask used in this step. As illustrated in FIG. 3, the aspect in which the bridge portion 13 is formed in the metal mask 10 used in this step is an aspect in which the bridge portion 13 is formed in an arch shape so as to bridge the opening 12 in the metal mask main body 11. (Figs. 3 (a) and 3 (b)), or a linearly formed mode (Figs. 3 (c) and 3 (d)).

  The bridge portion in the present invention may be formed in any of these modes, but it is preferable that the bridge portion is formed in a straight line so as to bridge the opening in the metal mask body. This is because such a bridge portion can be easily formed simultaneously with the opening by half-etching from at least one surface. That is, the metal mask used in this step can be manufactured by using a metal thin plate, half-etching the metal thin plate with a desired pattern from one surface, and then half-etching with the same pattern from the opposite surface. However, at this time, only the half etching from one surface is performed at the position corresponding to the bridge portion, or the etching condition is weakened at the position corresponding to the bridge portion, so that the bridge portion and the opening portion are Can be formed simultaneously. In consideration of such advantages in the manufacturing method, the bridge portion is particularly preferably formed by half etching from one surface.

  Further, the size of the vacuum ultraviolet light irradiation treatment gap formed by the bridge portion includes the wavelength of vacuum ultraviolet light used in the vacuum ultraviolet light irradiation step described later, the thickness of the bridge portion, the width of the bridge portion, etc. Accordingly, there is no particular limitation as long as a reactive gas such as oxygen can be present in the vacuum ultraviolet light irradiation processing gap and vacuum ultraviolet light can be circulated. Especially in this process, it is preferable that the height of the said vacuum ultraviolet irradiation process space | gap is 1 micrometer or more, It is more preferable that it is 10 micrometers or more, It is further more preferable that it is 30 micrometers or more. If the height of the vacuum ultraviolet light irradiation treatment gap is lower than the above range, it will be difficult to allow a reactive gas to flow into the vacuum ultraviolet light irradiation treatment gap or to circulate the vacuum ultraviolet light. Because there are cases.

  Moreover, it is preferable that the bridge | bridging part in this process is a thing thinner than the metal mask main body mentioned later. This is because it becomes easy to sufficiently circulate the vacuum ultraviolet light into the vacuum ultraviolet light irradiation processing gap formed by the bridge portion.

  Further, the bridge portion is formed so as to bridge an opening formed in the metal mask body described later, but the number of bridge portions formed for one opening is particularly limited. Instead, the number can be appropriately determined according to the shape of the opening. Accordingly, the number of bridge portions formed for one opening may be one or plural.

  FIG. 4 is a schematic view showing an example in which a bridge portion is formed in the metal mask used in this step. As illustrated in FIG. 4, as an aspect in which the bridge portion 13 is formed in the metal mask 10 used in this step, only one bridge portion 13 is formed with respect to one opening 12. There may be a mode in which a plurality of bridge portions 13 are formed with respect to one opening portion 12 (FIG. 4A) (FIGS. 4B and 4C).

  The aspect in which the bridge portion is formed may be any of the above-described aspects, but it is preferable that a plurality of bridge parts are formed with respect to one opening. Thereby, even if the opening area is small and a complicatedly bent opening is formed, it is possible to effectively prevent the opening from being deformed.

  The material used for the bridge portion is not particularly limited as long as the bridge portion can be formed in a desired form. Usually, the same metal material as that of the metal mask body described later is used.

(Metal mask body)
Next, the metal mask main body will be described. The metal mask main body used in this step is made of a thin metal plate and has an opening.

  The metal mask body used in this step is made of a thin metal plate, but the metal material constituting the thin metal plate is not particularly limited as long as it can shield vacuum ultraviolet light. Examples of such metal materials include Ni-Fe materials such as 42 alloy, 46 alloy, and Invar material, and SUS403 and other Fe materials such as steel plates. Any of these metal materials can be preferably used in this step, and 42 alloy is particularly preferably used.

  In addition, the said metal material may be only 1 type, or 2 or more types may be sufficient as it.

  Further, the thickness of the metal thin plate is not particularly limited as long as it is within a range in which an opening pattern having a desired shape can be formed, but in particular, it is preferably within a range of 5 μm to 500 μm. More preferably, it is in the range of 200 μm, more preferably in the range of 50 μm to 100 μm. This is because, in general, when the thickness is increased, it may be difficult to form a high-definition patterned opening. If the thickness is less than the above range, the metal mask used in this step is likely to be deformed, and the functional layer is decomposed and removed according to the pattern formed on the metal mask in the vacuum ultraviolet light irradiation step described later. This may be difficult.

  In addition, although the metal mask main body used for this process has an opening part, it can determine suitably according to the use etc. of a pattern formation body by this invention about the shape of the said opening part.

(Metal mask)
The metal mask used in the present invention has a floating island portion formed in the opening of the metal mask body, and the bridge portion is formed to connect the metal mask body and the floating island portion. It may be a thing.

  A metal mask having such a structure will be described with reference to the drawings. FIG. 5 is a schematic view showing another example of a metal mask used in this step. As illustrated in FIG. 5, the metal mask 10 used in this step has a floating island portion 14 disposed in the opening 12 of the metal mask main body 11, and the bridge portion 13 includes the floating island portion 14. It may be formed so as to be connected to the metal mask main body 11.

By using a metal mask having such a structure, a patterned body in which the functional layer is decomposed and removed in a floating island pattern according to the present invention can be manufactured with high sensitivity.
That is, the method for producing a patterned product of the present invention produces a patterned product from which the functional layer has been removed in a pattern by irradiating the surface of the functional layer with vacuum ultraviolet light in a pattern. is there. Such decomposition and removal by vacuum ultraviolet light is performed by cutting the functional material used for the functional layer by irradiation with vacuum ultraviolet light, or by vacuum ultraviolet light in the presence of a reactive gas typified by oxygen. The oxygen atom radical generated by the excitation of oxygen acts on the functional layer, whereby the functional material is decomposed, and the decomposition product is volatilized and removed from the functional layer to form a pattern. For this reason, in order to decompose and remove the functional layer with vacuum ultraviolet light in the present invention, a condition in which a reactive gas such as oxygen can come into contact with the surface of the functional layer is required. In this respect, the vacuum ultraviolet light lithography method using a metal mask is very useful because oxygen can always exist on the surface of the functional layer, and a pattern-formed body can be produced with high sensitivity. Is.
However, in the case of a metal mask, for example, in a pattern including a floating island portion as illustrated in FIG. 6A, the floating island portion is dropped (FIG. 6B), as shown in FIG. 6A. It is physically difficult to form a pattern including a floating island portion. To form such a pattern, a bridge portion that supports the floating island portion as illustrated in FIG. 6C is usually provided. It was mandatory. However, in the vacuum ultraviolet lithography method, it is necessary to irradiate vacuum ultraviolet light in a state where a reactive gas such as oxygen is in contact with the functional layer in order to form a pattern as described above. When the bridge portion is provided, there is a problem that the functional layer located on the lower surface of the bridge portion is not decomposed and removed. As a result, it has been impossible to perform vacuum ultraviolet light irradiation treatment in a pattern on only the floating island portion.
In this respect, the metal mask having the above structure (see FIG. 5) is formed such that the bridge portion forms a gap through which the reactive gas can flow between the functional layer and the bridge portion. Therefore, a reactive gas such as oxygen can be brought into contact with the functional layer located under the bridge portion. In addition, since vacuum ultraviolet light is non-directional dispersed light, a void is formed under the bridge part, so that the part can be irradiated with vacuum ultraviolet light using the wraparound of light. It becomes possible. For this reason, in this step, by using the metal mask having the above structure, a pattern formed body in which the functional layer is decomposed and removed in a floating island pattern shape can be manufactured.

  The floating island portion is formed in the opening of the metal mask main body described above. However, it is not essential that the floating island portion be formed in all the openings formed in the metal mask main body. It may be formed only at the opening of the part. In addition, the shape of the floating island portion can be appropriately determined according to the use of the pattern forming body produced according to the present invention, and is not particularly limited.

  Although the said floating island part will not be specifically limited if it can shield a vacuum ultraviolet light, Usually, it forms with the same metal thin plate as the said metal mask main body.

(2) Pattern Forming Substrate Next, the pattern forming substrate used in this step will be described. The substrate for pattern formation used in this step has a substrate and a functional layer formed on the substrate and made of a functional material that can be decomposed by irradiation with vacuum ultraviolet light. is there.
Hereinafter, such a pattern forming substrate will be described in detail.

(Functional layer)
The functional layer used in this step is made of a functional material that can be decomposed by irradiation with vacuum ultraviolet light.
The functional material used in this step can be appropriately determined according to the use of the pattern forming body formed by the present invention. As such a functional material, either an organic material or an inorganic material can be preferably used. Examples of the functional material used in the present invention include an organic semiconductor material, an organic EL material, a dye material, and a silicone material, a self-assembled monolayer as an inorganic material partially having an organic chain. .

  The thickness of the functional layer used in this step is a range in which the functional layer can be decomposed and removed when a predetermined amount of vacuum ultraviolet light is irradiated in the vacuum ultraviolet light irradiation step described later, depending on the type of the functional material. If it is in, it will not specifically limit. In particular, the thickness of the functional layer in this step is preferably in the range of 1 nm to 10 μm, more preferably in the range of 5 nm to 1 μm, and still more preferably in the range of 10 nm to 100 nm.

(substrate)
Next, the substrate used for the pattern forming substrate in this step will be described. The substrate used in this step is not particularly limited as long as it can support the functional layer, and is appropriately selected depending on the use of the pattern forming body produced by the present invention. Can be used. Examples of such a substrate include those made of an organic material or those made of an inorganic material, and more specifically, those made of a resin film, glass, ceramic, metal, etc. Can do.

(3) Method for Arranging Metal Mask Next, a method for arranging the metal mask on the functional layer of the pattern forming substrate in this step will be described.
In this step, the method for disposing the metal mask on the functional layer of the pattern forming substrate is not particularly limited as long as the metal mask can be disposed at a predetermined position on the functional layer. In particular, the method of arranging the metal mask in this step is preferably a method involving fixing the metal mask with a magnet from the side opposite to the functional layer of the pattern forming substrate. As a result, the metal mask is in close contact with the functional layer even when a high-definition and complicated pattern-shaped opening is formed and a thin thickness is used as the metal mask. This is because a pattern forming body in which the functional layer is decomposed and removed in a high-definition pattern can be manufactured.
That is, the pattern forming body manufacturing method of the present invention employs a method of irradiating the functional layer of the pattern forming substrate with vacuum ultraviolet light through a metal mask. As the pattern becomes higher in definition, the thickness tends to be reduced accordingly. Since a thin metal mask lacks flatness and tends to be deformed so that the surface undulates, simply placing it on the functional layer creates a gap between the functional layer and the metal mask. It will be unavoidable. In addition, since vacuum ultraviolet light is non-directional dispersed light, if there is such a gap, the part is also irradiated with vacuum ultraviolet light, and a metal mask with a high-definition opening is used. Even if it exists, the situation where the pattern corresponding to it cannot be formed may arise.
However, in this step, by fixing the metal mask with a magnet from the side opposite to the functional layer of the pattern forming substrate, even when a high-definition and thin metal mask is used, Since the metal mask can be fixed on the functional layer in close contact with no gap, it is possible to manufacture a pattern forming body in which the functional layer is decomposed and removed into a high-definition pattern. It is.

  The method for fixing the metal mask using a magnet in this step is not particularly limited as long as it can be fixed by the magnetic force of the magnet from the side opposite to the functional layer of the pattern forming substrate. As such a method, for example, after a metal mask is disposed on the functional layer of the pattern forming substrate, the magnet is disposed on the side opposite to the functional layer of the pattern forming substrate. And a method of fixing by arranging a metal mask on the functional layer of the pattern forming substrate disposed on the magnet after the pattern forming substrate is disposed on the magnet. . When an electromagnet is used as the magnet, after placing the pattern forming substrate on the electromagnet that is not energized, a metal mask is placed on the functional layer of the pattern forming substrate placed on the electromagnet, Next, a method of fixing by energizing the electromagnet can be mentioned.

  The magnet used in this step is not particularly limited as long as it can generate a magnetic force that can fix the metal mask from the back side of the functional layer side surface of the pattern forming substrate. Such a magnet may be either a permanent magnet or an electromagnet, and may have any magnetization form of anisotropic multipolar or isotropic multipolar. Among these, it is preferable to use an electromagnet in this step. Since the electromagnet can switch the magnetic force, for example, the pattern forming substrate is disposed on an electromagnet that is not energized, and a metal mask is disposed on the functional layer of the pattern forming substrate. This is because it is possible to adopt a method such as energizing the electromagnet to generate a magnetic force after the mask alignment, which has the advantage of improving the placement accuracy of the metal mask.

  Only one type of magnet may be used in this step, or two or more types may be used. When two or more types of magnets are used, a plurality of magnets having the same magnetic force may be used, or magnets having different magnetic forces may be used in combination.

Further, the size of the magnet used in this step is not particularly limited as long as it is within a range where the metal mask can be fixed in close contact with the functional layer of the pattern forming substrate, but at least from the area of the metal mask. It is preferable to have a large area. This is because if the area is smaller than the area of the metal mask, a portion where the metal mask is not fixed by a magnet is formed, and it may be difficult to disassemble and remove the functional layer in a high-definition pattern.
In addition, when using a several magnet in this process, it is not necessary for each magnet to have an area larger than the area of the said metal mask, The area at the time of combining several magnets is the said metal mask. It only needs to be larger than the area.

2. Vacuum ultraviolet light irradiation process Next, the vacuum ultraviolet light irradiation process in this invention is demonstrated. In this step, the functional layer is irradiated with vacuum ultraviolet light through the metal mask fixed on the functional layer of the pattern forming substrate in the metal mask placement step in the presence of a reactive gas. In this step, the functional layer is decomposed and removed in a pattern.

  The wavelength of the vacuum ultraviolet light irradiated in this step is particularly limited as long as the functional layer can be decomposed and removed according to the type of functional material used for the functional layer. However, it is usually preferably in the range of 100 nm to 260 nm, and more preferably in the range of 150 nm to 200 nm. This is because if the wavelength is longer than the above range, the generation efficiency of oxygen radicals is lowered, and the sensitivity may be lowered depending on the type of the functional material used for the functional layer. In addition, if the wavelength is shorter than the above range, stable irradiation with vacuum ultraviolet light may be difficult.

  In this step, examples of a light source that can be used for irradiation with vacuum ultraviolet light include an excimer lamp, a low-pressure mercury lamp, and various other light sources.

The irradiation amount of the vacuum ultraviolet light in this step is not particularly limited as long as it is within a range in which the functional layer can be decomposed and removed to a desired degree according to the type of functional material used for the functional layer.
Here, in this step, vacuum ultraviolet light may be irradiated until the functional layer at the site irradiated with vacuum ultraviolet light is completely removed, or only a part of the functional layer is decomposed and removed. Also good.

The method of irradiating the functional layer with vacuum ultraviolet light in this step is not particularly limited as long as the method can irradiate the functional layer with vacuum ultraviolet light with a uniform dose. Examples of such irradiation methods include a method of simultaneously irradiating the entire surface of the functional layer, and a method of sequentially irradiating the functional layer while moving at least one of the light source or the pattern forming substrate. Can be mentioned. Especially in this process, the method of irradiating the said functional layer sequentially is preferable. The reason is as follows.
That is, since vacuum ultraviolet light is non-directional dispersed light, in the method of irradiating the entire surface of the functional layer simultaneously, for example, when irradiating vacuum ultraviolet light to a large-area functional layer, There may be a difference in the irradiation amount of vacuum ultraviolet light between the ends. However, according to the method of sequentially irradiating the functional layer, it is easy to uniformly irradiate the entire surface even when the functional layer having a large area is irradiated with vacuum ultraviolet light. It is.

  In this step, among the methods of sequentially irradiating the functional layer, a method of irradiating while moving the light source while fixing the pattern forming substrate is preferable. This is because, according to such a method, it becomes easy to uniformly irradiate the functional layer having a large area with vacuum ultraviolet light.

  Note that the number of vacuum ultraviolet light sources used in this step may be one, or a plurality of light sources may be used. In the case of using a plurality of light sources, when using the method of irradiating while moving the light source as the vacuum ultraviolet light irradiation method in this step, the plurality of light sources may be moved simultaneously or individually. It may be moved.

  Moreover, although this process irradiates vacuum ultraviolet light in presence of reactive gas, as reactive gas used for this process, oxygen, a fluorine-containing gas, etc. can be mentioned, for example. Any of these reactive gases can be suitably used in this step, but at least oxygen as the reactive gas is the above-mentioned mechanism of action on the pattern forming substrate by vacuum ultraviolet light. It is preferable to be used.

3. Uses Examples of the use of the method for producing a patterned product of the present invention include the production of a pattern product used for a color filter for a liquid crystal display device, the formation of source / drain wiring of an organic transistor, and the hole injection layer of an organic EL And a light emitting layer, a microlens, and a biochip.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be specifically described with reference to examples.

[Example 1]
A metal mask having a pattern as shown in FIG. 2 (thickness: 50 μm, bridge width: 20 μm, vacuum ultraviolet light irradiation treatment gap height: 30 μm) was prepared.
Next, a methylene blue aqueous solution was applied to a glass substrate by spin coating, the water was evaporated, and a methylene blue film (thickness: about 500 nm) was formed.
The previous metal mask was brought into close contact with the magnet, and vacuum ultraviolet light (172 nm) was irradiated from the metal mask side with an illuminance of 10 mW / cm ² in the presence of oxygen to form a pattern. At this time, it was 20 seconds until the methylene blue at the lower part of the irradiated part and the bridge part was decomposed and removed.

[Comparative Example 1]
A metal mask (thickness: 50 μm, bridge width: 20 μm) with a vacuum ultraviolet light irradiation treatment gap height of 0 μm was prepared and the pattern was formed in the same manner as in Example 1, but the bottom of the bridge portion. The methylene blue was not decomposed and remained as a pattern.

[Example 2]
A metal mask having a pattern as shown in FIG. 2 (thickness: 100 μm, bridge width: 30 μm, vacuum ultraviolet light irradiation treatment gap height: 50 μm) was prepared.
Next, a liquid in which fluoroalkylsilane having 8 carbon chains was dissolved in methanol was prepared, and the glass substrate was immersed for 24 hours to form a self-assembled monolayer on the glass substrate.
The previous metal mask was brought into close contact with the magnet, and vacuum ultraviolet light (172 nm) was irradiated from the metal mask side in the presence of oxygen at an illuminance of 10 mW / cm ² to form a pattern. At this time, it was 30 seconds until the contact angle of water at the lower part of the irradiation part and the bridge part decreased from 104 degrees to 10 degrees or less.

[Comparative Example 2]
A metal mask (thickness 100 μm, bridge width 30 μm) with a vacuum ultraviolet light irradiation treatment gap height of 0 μm was prepared and the pattern was formed in the same manner as in Example 2, but the bottom of the bridge portion. The self-assembled monolayer was not decomposed and the water contact angle was 104 degrees.

[Example 3]
A metal mask having a pattern as shown in FIG. 2 (thickness 100 μm, bridge width 30 μm, vacuum ultraviolet light irradiation treatment gap height 50 μm) was prepared.
Next, poly (3-hexylthiophene), which is an organic semiconductor material, was formed on the SiO ₂ substrate with a thickness of 40 nm.
The previous metal mask was brought into close contact with the magnet, and vacuum ultraviolet light (172 nm) was irradiated from the metal mask side with an illuminance of 10 mW / cm ² in the presence of oxygen to form a pattern. At this time, it was 25 seconds until the poly (3-hexylthiophene) at the lower part of the irradiation part and the bridge part was decomposed and removed.

[Comparative Example 3]
A metal mask (thickness: 100 μm, bridge width: 30 μm) with a vacuum ultraviolet light irradiation treatment gap height of 0 μm was prepared, and a pattern was formed in the same manner as in Example 3. Poly (3-hexylthiophene) remained undegraded.

It is the schematic which shows an example of the manufacturing method of the pattern formation body by the vacuum ultraviolet light of this invention. It is the schematic which shows an example of the metal mask used for this invention. It is the schematic which shows the other example of the metal mask used for this invention. It is the schematic which shows the other example of the metal mask used for this invention. It is the schematic which shows the other example of the metal mask used for this invention. It is the schematic which shows an example of the metal mask for vacuum ultraviolet light.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Pattern formation board | substrate 1a ... Board | substrate 1b ... Functional layer 10 ... Metal mask 11 ... Metal mask main body 12 ... Opening part 13 ... Bridge part 14 ... Floating island part

Claims (5)

Using a substrate for pattern formation having a substrate and a functional layer formed on the substrate and made of a functional material that can be decomposed by irradiation with vacuum ultraviolet light,
A metal mask placement step of placing a metal mask on the functional layer of the pattern forming substrate;
In the presence of a reactive gas, by irradiating the surface of the functional layer with vacuum ultraviolet light through the metal mask, a vacuum ultraviolet light irradiation step of removing a part of the functional layer in a pattern, A method for producing a pattern formed body by vacuum ultraviolet light having:
When the metal mask is made of a thin metal plate, has a metal mask body having an opening, and a bridge portion formed so as to bridge the opening, and is disposed on the functional layer. The pattern formation by vacuum ultraviolet light is characterized in that the bridge portion is formed so that a void through which the reactive gas can flow is formed between the functional layer and the bridge portion. Body manufacturing method.   The metal mask has a floating island portion formed in an opening of the metal mask main body, and the bridge portion is formed to connect the metal mask main body and the floating island portion. The manufacturing method of the pattern formation body by the vacuum ultraviolet light of Claim 1.   The method of manufacturing a pattern forming body using vacuum ultraviolet light according to claim 1 or 2, wherein a thickness of the bridge portion of the metal mask is thinner than a thickness of the metal mask main body.   The vacuum ultraviolet light according to any one of claims 1 to 3, wherein the bridge portion of the metal mask is formed by half-etching from at least one surface. The manufacturing method of the pattern formation body by this.   The width | variety of the said bridge | bridging part of the said metal mask exists in the range of 5 micrometers-100 micrometers, The manufacture of the pattern formation body by the vacuum ultraviolet light in any one of Claim 1 to 4 characterized by the above-mentioned. Method.

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