JP2009238841A - Heat conductive component and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat conductive component which has high heat conductivity, obtains sufficient heat dissipation effect, and sufficient strength, and electronic equipment having a heat dissipation structure with high heat dissipation effect using the same. <P>SOLUTION: The heat conductive components constituted by combining at least two members which is a first member and a second member made of the same material with the first member and differing in shape is constituted by combining the members such that characteristics of a fiber material which easily tears in a direction toward higher heat conductivity and characteristics of a fiber material which hardly tears in a direction toward lower heat conductivity cancel each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device having a heat dissipation structure for cooling a heating element such as an IC package, and a heat transfer component having excellent thermal conductivity for realizing the heat dissipation structure.

  Patent Document 1 describes an example in which a graphite film having a high thermal conductivity is used as a heat sink. FIG. 3 shows a heat sink described in Patent Document 1. A graphite film is used for the bottom member 102. A heat sink bottom member 102 is attached to the heating element directly or via another heat transfer member. Since the direction in which the graphite film has good thermal conductivity is directed to the surface direction of the bottom portion, the heat from the heating element spreads instantaneously at the bottom portion. However, when it is necessary to give the graphite material a thickness, there arises a problem that the thermal conductivity is inferior in the thickness direction, which is the direction of the radiating fin 101, as compared with the plane direction.

  Patent Document 2 describes an example in which short fiber graphite is used for an anisotropic heat transfer sheet. FIG. 4 is a longitudinal sectional view of the anisotropic heat transfer sheet described in Patent Document 2. FIG. 4 shows an anisotropic heat transfer sheet in which heat conductive fibers are oriented in the thickness direction of the sheet.

  However, the anisotropic heat transfer sheet using the graphite of Patent Document 2 has a problem that it is easy to tear in the thickness direction due to fiber characteristics and is brittle. As a countermeasure to this problem, a method of obtaining strength by combining with another material can be considered. However, there are problems such as a decrease in the thermal conductivity as a whole due to a decrease in the graphite content with high thermal conductivity and an increase in manufacturing costs.

JP 2006-100379 A JP 2003-174127 A

  Accordingly, the present invention provides a heat transfer component having high heat conductivity, sufficient heat dissipation effect, and sufficient strength, and an electronic device having a heat dissipation structure with high heat dissipation effect using the heat transfer component. Objective.

  The first heat transfer component of the present invention is a heat transfer component formed by combining at least two members of a second member having a different shape made of the same material as the first member and the first member. It is a fiber material having a characteristic that it is easy to tear along a direction with high thermal conductivity and difficult to tear along a direction with low thermal conductivity, and the first member and the second member are combined so as to cancel the characteristics. It is characterized by being.

  The second heat transfer component of the present invention is the first heat transfer component of the present invention, wherein the first member surrounds an outer edge portion of the second member and cancels the characteristics. The second member is combined with the second member substantially orthogonally, and heat from the heating element is conducted to the heat radiating member in a direction in which the second member has high thermal conductivity.

  A first electronic device according to the present invention includes an electronic component that generates heat, a heat dissipation component that dissipates heat of the heat generating electronic component, a first member that is disposed between the electronic component and the heat dissipation component, and the first In an electronic device comprising a heat transfer component formed by combining at least two members of a second member having a different shape made of the same material as the member, the heat transfer component is torn along a direction with high thermal conductivity. It is a fiber material that has a characteristic that it is easy to tear and is difficult to tear along a direction with low thermal conductivity, and the first member and the second member are combined substantially orthogonally so as to cancel the characteristics. The heat radiating component is arranged in a direction in which a member having a larger area in contact with the electronic component has higher thermal conductivity.

  According to a second electronic device of the present invention, in the first electronic device of the present invention, the heat dissipation component transmits the heat generated by the electronic component in a direction different from the direction in which the heat conductivity is high. Further, the heat transfer component is a heat transfer component in which an outer portion of a member different from the member having the larger area is relatively expanded in the extending direction of the heat pipe. It is characterized by that.

  According to the present invention, it is possible to provide a heat transfer component having high thermal conductivity, sufficient heat dissipation effect, and sufficient strength, and an electronic apparatus having a heat dissipation structure having high heat dissipation effect using the heat transfer component. it can.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a state before the combination of the heat transfer component and the heat dissipation component of the present embodiment. The heat transfer component 10 includes two members 10A and 10B. The heat dissipating component 20 has heat dissipating fins and is formed of a metal material such as an aluminum material. Both heat transfer members 10A and 10B are formed of a material in which fibers having high heat transfer properties are laminated. A typical example is a carbon fiber material formed by superposing graphite sheets. In order to integrate the members 10 </ b> A and 10 </ b> B into a heat transfer component, the members 10 </ b> A and 10 </ b> B may be bonded with an adhesive having thermal conductivity, or may be pressure bonded.

  Furthermore, with reference to FIG. 1, the detail about the intensity | strength and heat conductivity by the directionality which a carbon fiber material has is demonstrated. The heat transfer material 10A is formed by laminating graphite sheets in the AY direction. It is known that the carbon fiber material has extremely high thermal conductivity in the AX direction of the plane direction of the graphite sheet which is the fiber direction. However, the heat transfer material 10 </ b> A is easy to peel off in the form along the AX direction, so that the member is brittle and needs to be handled with care. In particular, in the case of the heat transfer material 10A having a small thickness, since the area of the laminated portion is smaller than the area in contact with the heat radiating component, there is a tendency that the layer is more easily peeled along the AX direction.

  The heat transfer material 10B is used by changing the direction by 90 degrees with respect to the carbon fiber material of 10A. That is, the thermal conductivity is high in the BY direction, and it is easy to peel off along the BY direction. However, the heat transfer material 10B is laminated in the thickness direction, and the adhesion portion of the laminated portion is larger than that of the heat transfer material 10A. Therefore, the heat transfer material 10B is superior to 10A in terms of brittleness of the member. ing.

  Since heat from a heating element such as an IC package is once conducted and dissipated in the AX direction of the heat transfer component, it is important to use a material having high thermal conductivity in this direction as the heat transfer component. is there. Therefore, it is necessary to arrange the heat transfer material 10A having a large contact area with the main heat generating portion of the heat generating body so that the direction of high heat transfer characteristics coincides with the AX direction. At that time, since the heat transfer member 10A is easily cracked in the thickness direction, the same material is combined as the heat transfer member 10B so as to surround the outer edge portion of the heat transfer member 10A by changing the direction by 90 degrees, thereby increasing the thickness direction. The heat transfer component 10 is formed without remarkably reducing the overall heat transfer characteristics.

  Once the heat from the heating element is conducted in the AX direction, the heat pipe (not shown) extending from the heat radiating component 20 in the BY direction is used to transmit the heat radiator (not shown) provided at a location away from the heat radiation component 20. In this case, the high heat transfer characteristic in the BY direction of the heat transfer member 10B is effective.

  In addition, when providing a heat pipe in the heat radiating component 20, if the heat transfer material 10B is configured to expand the area on the side where the heat pipe extends, the contact portion between the heat pipe portion and the heat transfer material 10 can be made larger. It becomes easier to transfer heat to the heat pipe direction. In this case, the heat radiating component 20 may not have a heat radiating plate such as a heat radiating fin.

  Next, with reference to FIG. 2, the heat dissipation structure of the electronic device of this embodiment will be described. FIG. 2 shows the relationship among the IC package 30, the heat transfer component 10, and the heat dissipation component 20 mounted on the printed circuit board 40. As described with reference to FIG. 1, the heat transfer members 10 </ b> A and 10 </ b> B are combined to form the heat transfer component 10, and heat generated from the IC package 30 is transmitted to the heat dissipation component 20 through the heat transfer component 10.

  As shown in FIG. 2, the heat transfer component 10 has a uniform thickness in a state where the members 10 </ b> A and 10 </ b> B are combined so that the degree of close contact with the IC package 30 that is in contact with the heat transfer component 10 is increased. In FIG. 2, the shapes and sizes of the contact surfaces of the IC package 30 and the heat transfer component 10 are shown to match, but it is not always necessary to match, and the heat transfer component 20 depends on the shape of the heat dissipation component 20. The shape and size of the ten contact surfaces may be appropriately changed. In the case of the heat radiating component 20 provided with the heat pipe as described above, it is possible to form the heat transfer component 10 so that the outer shape of the heat transfer component 10 protrudes to the side where the heat pipe extends with respect to the outer shape of the IC package 30.

  As described above, according to the heat transfer component of the present embodiment and the electronic apparatus using the heat transfer component, the heat transfer component has high thermal conductivity, sufficient heat dissipation effect, and sufficient strength. A heat dissipation structure with a high heat dissipation effect can be realized.

  Further, since the strength of the heat transfer component is improved, the handling cost for preventing breakage in each process can be reduced, which is effective in reducing the component cost.

It is a perspective view which shows the state before the combination of the heat-transfer component of this embodiment, and a thermal radiation component. It is a perspective view which shows the thermal radiation structure of the electronic device of this embodiment. It is a figure for demonstrating the conventional heat sink. It is a longitudinal cross-sectional view of the conventional anisotropic heat transfer sheet.

Explanation of symbols

10 heat transfer component 20 heat dissipation component 30 IC package 40 printed circuit board

Claims (5)

In a heat transfer component formed by combining at least two members of a second member having a different shape made of the same material as the first member and the first member, the material is easily torn along a direction with high thermal conductivity. A heat transfer component, characterized in that the first member and the second member are combined so as to cancel each other out of the fiber material having a characteristic that the thermal conductivity is difficult to tear along a low direction. The first member is combined with the second member so as to surround the outer edge of the second member and so as to cancel out the characteristics, and further the thermal conductivity of the second member. The heat transfer component according to claim 1, wherein heat from the heating element is conducted to the heat radiating member in a higher direction. Electronic components that generate heat,
A heat dissipating component that dissipates heat from the heat generating electronic component;
A heat transfer component formed by combining at least two members of a second member having a different shape made of the same material as the first member and the first member disposed between the electronic component and the heat dissipation component;
In an electronic device comprising
The heat transfer component is a fiber material having a characteristic that it is easy to tear along a direction with high thermal conductivity and difficult to tear along a direction with low thermal conductivity, and the first member and the second member cancel the characteristics. It is combined almost orthogonally to meet,
Furthermore, the said heat radiating component is arrange | positioned in the direction where the thermal conductivity of the member with the larger area which contacts the said electronic component among the said members is high, The electronic device characterized by the above-mentioned.   The heat transfer component or electronic device according to claim 1, wherein the fiber material is a material in which carbon fibers are laminated. The heat dissipating component is a heat pipe for transferring the heat generated by the electronic component in a direction different from the direction having high thermal conductivity,
Furthermore, the heat transfer component is a heat transfer component in which an outer portion of a member different from the member having the larger area is relatively expanded in the extending direction of the heat pipe. The electronic device according to 3 or 4.

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