JP2009238635A - Joining body, its manufacturing method, anisotropic conductive material and its manufacturing method - Google Patents
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Landscapes
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
本発明は、接合体及びその製造方法、並びに、異方性導電材料及びその製造方法に関する。 The present invention relates to a joined body and a manufacturing method thereof, and an anisotropic conductive material and a manufacturing method thereof.
従来より、回路部材を接続する手段として、図９Ａ（上面図）及び図９Ｂに示すような、導電性粒子が分散された熱硬化性樹脂を剥離フィルムに塗布したテープ状の接続材料（例えば、異方性導電フィルム（ＡＣＦ；Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ））が用いられている。
この異方性導電フィルムは、例えば、フレキシブルプリント基板（ＦＰＣ）やＩＣチップの端子と、ＬＣＤパネルのガラス基板上に形成されたＩＴＯ（Ｉｎｄｉｕｍ Ｔｉｎ Ｏｘｉｄｅ）電極とを接続する場合を始めとして、種々の端子同士を接着すると共に電気的に接続する場合に用いられている。
Conventionally, as a means for connecting circuit members, as shown in FIG. 9A (top view) and FIG. 9B, a tape-shaped connection material (for example, a thermosetting resin in which conductive particles are dispersed is applied to a release film (for example, An anisotropic conductive film (ACF; Anisotropic Conductive Film) is used.
This anisotropic conductive film can be used for various purposes including connecting a terminal of a flexible printed circuit board (FPC) or an IC chip to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. These terminals are used for bonding and electrically connecting the terminals.
この異方性導電フィルム（ＡＣＦ）等に代表される接着フィルムの被着体への貼り付け（転着）は、以下（１）〜（４）のように行われていた。
（１）まず、図１０Ａに示すように、ベースフィルム（剥離層）とＡＣＦ層（接着層）とで構成される接着フィルムのＡＣＦ層側からナイフを挿入し、ＡＣＦ層のみに任意の長さの切り込みを入れてハーフカットを行う。このハーフカットの際、ベースフィルムが切断されないように注意しながら、ＡＣＦ層にしっかりナイフを挿入する。
（２）次に、図１０Ｂ及び図１０Ｃに示すように、接着フィルムをベースフィルム側から仮圧着装置の加熱ヘッドにより押圧して、ＡＣＦ層を加熱しながらパネル（被着体）上に接触させて、ＡＣＦ層をパネルの数ｍｍ〜数ｍの接合部分に仮貼りする。
（３）次に、ベースフィルムを剥がす（ＡＣＦ層には、任意の長さの切り込みが入ってい
るので、パネル上には、パネルと接触した任意の長さのＡＣＦ層のみが残る）。
（４）さらに、ＩＣや配線等を接合させて、本圧着する。
しかしながら、上述した貼り付け（転着）方法によっては、異方性導電フィルム（ＡＣＦ）等の接着フィルムを被着体に貼り付けるために、ハーフカット及び加熱などを行う必要があるので、工程が複雑になると共に、仮貼り用の大型装置を用いる必要があるという問題があった。
Adhesion (transfer) of an adhesive film typified by this anisotropic conductive film (ACF) to an adherend has been performed as follows (1) to (4).
(1) First, as shown in FIG. 10A, a knife is inserted from the ACF layer side of an adhesive film composed of a base film (peeling layer) and an ACF layer (adhesive layer), and an arbitrary length only in the ACF layer. Make a half cut. Carefully insert the knife into the ACF layer, taking care not to cut the base film during this half-cut.
(2) Next, as shown in FIG. 10B and FIG. 10C, the adhesive film is pressed from the base film side by the heating head of the temporary pressure bonding device, and the ACF layer is heated and brought into contact with the panel (adhered body). Then, the ACF layer is temporarily attached to the joint portion of several mm to several m of the panel.
(3) Next, the base film is peeled off (since the ACF layer has notches of any length, only the ACF layer of any length in contact with the panel remains on the panel).
(4) Further, IC, wiring, etc., are joined and finally crimped.
However, depending on the affixing (transferring) method described above, it is necessary to perform half-cutting and heating in order to attach an adhesive film such as an anisotropic conductive film (ACF) to an adherend. In addition to being complicated, there is a problem that it is necessary to use a large apparatus for temporary attachment.
また、前記異方性導電フィルムとして、インクジェット方式により導電性粒子が配列されたもの（例えば、特許文献１）や、単層の導電性粒子を粘着層表面に配列させたもの（例えば、特許文献２）や、接着剤を塗布した面に、インクジェット方式を用いて導電性粒子を含んだ粘性領域を塗布したもの（例えば、特許文献３）が提案されている。 In addition, as the anisotropic conductive film, a film in which conductive particles are arranged by an ink jet method (for example, Patent Document 1) or a film in which single-layer conductive particles are arranged on the surface of an adhesive layer (for example, Patent Document) 2) and those in which a viscous region containing conductive particles is applied to the surface on which an adhesive is applied using an inkjet method (for example, Patent Document 3) have been proposed.
本発明は、従来における諸問題を解決し、以下の目的を達成することを課題とする。即ち、本発明は、接合特性を維持しつつ、配線間のショートを防ぐことができる接合体及びその製造方法、並びに、該接合体の製造方法に用いられる異方性導電材料及びその製造方法を提供することを目的とする。
また、本発明は、導電性粒子の使用量を低減すると共に、仮貼り用の大型装置を用いることなく、容易に仮貼りすることができる異方性導電材料及びその製造方法を提供することを目的とする。
An object of the present invention is to solve various problems in the prior art and achieve the following objects. That is, the present invention provides a bonded body that can prevent short-circuiting between wirings while maintaining bonding characteristics, a manufacturing method thereof, and an anisotropic conductive material used in the manufacturing method of the bonded body and a manufacturing method thereof. The purpose is to provide.
In addition, the present invention provides an anisotropic conductive material that can be temporarily attached without reducing the amount of conductive particles used, and without using a large apparatus for temporary attachment, and a method for manufacturing the same. Objective.
前記課題を解決する手段としては、以下の通りである。即ち、
＜１＞ 第１の回路部材と、前記第１の回路部材に電気的に接合された第２の回路部材とを備える接合体の製造方法であって、剥離層と、前記剥離層上に所定の間隔をもって形成され、導電性粒子を含有するドット形状の導電性粘着部とを有する異方性導電材料を、前記第１の回路部材上に所定の間隔をもって形成された第１の配線に貼り付ける貼付工程と、前記第１の配線に貼り付けられた異方性導電材料から前記剥離層を剥離して、前記第１の配線に前記導電性粘着部を転着させる転着工程と、前記転着された導電性粘着部を介して、前記第１の配線と、前記第２の回路部材上に形成された第２の配線とを電気的に接合する接合工程とを含み、前記異方性導電材料が前記第１の配線に貼り付けられる前において、隣接する導電性粘着部の中心間距離が、前記第１の配線の高さ位置における前記第１の配線の配線幅以下であり、且つ、前記導電性粘着部の高さが、前記導電性粒子の最大粒子径よりも大きいことを特徴とする接合体の製造方法である。
該接合体の製造方法では、貼付工程において、剥離層と、前記剥離層上に所定の間隔をもって形成され、導電性粒子を含有するドット形状の導電性粘着部とを有する異方性導電材料が、前記第１の回路部材上に所定の間隔をもって形成された第１の配線に貼り付けられ、転着工程において、前記第１の配線に貼り付けられた異方性導電材料から前記剥離層が剥離されて、前記第１の配線に前記導電性粘着部が転着され、接合工程において、前記転着された導電性粘着部を介して、前記第１の配線と、前記第２の回路部材上に形成された第２の配線とが電気的に接合される。前記異方性導電材料が前記第１の配線に貼り付けられる前において、隣接する導電性粘着部の中心間距離が、前記第１の配線の高さ位置における前記第１の配線の配線幅以下であり、且つ、前記導電性粘着部の高さが、前記導電性粒子の最大粒子径よりも大きい。その結果、接合特性を維持しつつ、配線間のショートを防ぐことができる。
＜２＞ 異方性導電材料が第１の配線に貼り付けられる前において、隣接する導電性粘着部間のスペース幅と、前記隣接する導電性粘着部の一方の最大直径と、前記隣接する導電性粘着部の他方の最大直径との合計が、前記第１の配線の高さ位置における前記第１の配線の配線幅以下である前記＜１＞に記載の接合体の製造方法である。
＜３＞ 異方性導電材料が第１の配線に貼り付けられる前において、導電性粘着部の最大直径が、隣接する導電性粘着部の中心間距離の１／２倍よりも小さい前記＜１＞から＜２＞のいずれかに記載の接合体の製造方法である。
＜４＞ 異方性導電材料が第１の配線に貼り付けられる前において、導電性粘着部の高さが、前記第１の配線の高さよりも低く、前記導電性粘着部の最大直径が、隣接する第１の配線間の高さ位置におけるスペース幅よりも小さい前記＜１＞から＜３＞のいずれかに記載の接合体の製造方法である。
＜５＞ 導電性粘着部が、導電性粒子を１ドットあたり５個以上含有する前記＜４＞に記載の接合体の製造方法である。
＜６＞ 導電性粘着部が、バインダー樹脂及び硬化剤をさらに含む前記＜１＞から＜５＞のいずれかに記載の接合体の製造方法である。
＜７＞ バインダー樹脂が、エポキシ樹脂及びアクリル樹脂の少なくともいずれかを含有する前記＜６＞に記載の接合体の製造方法である。
＜８＞ 硬化剤が、熱硬化剤及び光硬化剤の少なくともいずれかを含有する前記＜６＞から＜７＞のいずれかに記載の接合体の製造方法である。
＜９＞ 前記＜１＞から＜８＞のいずれかに記載の接合体の製造方法により製造されたことを特徴とする接合体である。
＜１０＞ 第１の回路部材と、前記第１の回路部材に電気的に接合された第２の回路部材とを備える接合体であって、前記第１の回路部材上に第１の配線が形成され、前記第２の回路部材上に第２の配線が形成され、前記第１の配線及び前記第２の配線間のみに導電性粒子が存在することを特徴とする接合体である。
該接合体は、前記第１の配線及び前記第２の配線間のみに導電性粒子が存在するので、接合特性を維持しつつ、配線間のショートを防ぐことができる。
＜１１＞ 前記＜１＞から＜８＞のいずれかに記載の接合体の製造方法に用いられる異方性導電材料であって、剥離層と、前記剥離層上に形成されたドット形状の導電性粘着部とを備えることを特徴とする異方性導電材料である。
該異方性導電材料は、前記剥離層上に前記導電性粘着部がドット形状に形成されているので、導電性粒子の使用量を低減すると共に、仮貼り用の大型装置を用いることなく、容易に仮貼りすることができる。
＜１２＞ 前記＜１１＞に記載の異方性導電材料の製造方法であって、バインダー樹脂、硬化剤、導電性粒子、及び溶媒を含む導電性ペーストを調製する調製工程と、前記調製された導電性ペーストを剥離層上にドット形成するドット形成工程とを含む異方性導電材料の製造方法である。
該接合体の製造方法では、調製工程において、バインダー樹脂、硬化剤、導電性粒子、及び溶媒を含む導電性ペーストが調製され、ドット形成工程において、前記調製された導電性ペーストが剥離層上にドット形成される。
Means for solving the above problems are as follows. That is,
<1> A manufacturing method of a joined body including a first circuit member and a second circuit member electrically joined to the first circuit member, the peeling layer and a predetermined layer on the peeling layer An anisotropic conductive material having a dot-shaped conductive adhesive portion containing conductive particles formed on the first circuit member is attached to the first wiring formed at a predetermined interval. An attaching step, a peeling step of peeling the release layer from the anisotropic conductive material attached to the first wiring, and transferring the conductive adhesive portion to the first wiring; A bonding step of electrically bonding the first wiring and the second wiring formed on the second circuit member via the transferred conductive adhesive portion, the anisotropic Before the conductive conductive material is attached to the first wiring, The inter-center distance is equal to or less than the wiring width of the first wiring at the height position of the first wiring, and the height of the conductive adhesive portion is larger than the maximum particle diameter of the conductive particles. This is a method for manufacturing a joined body.
In the manufacturing method of the joined body, in the attaching step, an anisotropic conductive material having a release layer and a dot-shaped conductive adhesive portion formed on the release layer at a predetermined interval and containing conductive particles is provided. The release layer is attached to the first wiring formed on the first circuit member at a predetermined interval, and the release layer is formed from the anisotropic conductive material attached to the first wiring in the transfer step. The conductive adhesive portion is peeled off and transferred to the first wiring. In the bonding step, the first wiring and the second circuit member are interposed via the transferred conductive adhesive portion. The second wiring formed above is electrically joined. Before the anisotropic conductive material is attached to the first wiring, the distance between the centers of adjacent conductive adhesive portions is equal to or smaller than the wiring width of the first wiring at the height position of the first wiring. And the height of the said electroconductive adhesion part is larger than the largest particle diameter of the said electroconductive particle. As a result, a short circuit between wirings can be prevented while maintaining the junction characteristics.
<2> Before the anisotropic conductive material is attached to the first wiring, the space width between the adjacent conductive adhesive portions, the maximum diameter of one of the adjacent conductive adhesive portions, and the adjacent conductive property The method for manufacturing a joined body according to <1>, wherein the total of the adhesive adhesive portion and the other maximum diameter is equal to or less than a wiring width of the first wiring at a height position of the first wiring.
<3> Before the anisotropic conductive material is attached to the first wiring, the maximum diameter of the conductive adhesive portion is smaller than ½ times the distance between the centers of the adjacent conductive adhesive portions. > To <2>.
<4> Before the anisotropic conductive material is attached to the first wiring, the height of the conductive adhesive portion is lower than the height of the first wiring, and the maximum diameter of the conductive adhesive portion is It is the manufacturing method of the joined body according to any one of <1> to <3>, which is smaller than a space width at a height position between adjacent first wirings.
<5> The method for producing a joined body according to <4>, wherein the conductive adhesive portion contains 5 or more conductive particles per dot.
<6> The method for producing a bonded body according to any one of <1> to <5>, wherein the conductive adhesive portion further includes a binder resin and a curing agent.
<7> The method for producing a joined body according to <6>, wherein the binder resin contains at least one of an epoxy resin and an acrylic resin.
<8> The method for producing a bonded body according to any one of <6> to <7>, wherein the curing agent contains at least one of a thermosetting agent and a photocuring agent.
<9> A joined body produced by the method for producing a joined body according to any one of <1> to <8>.
<10> A joined body including a first circuit member and a second circuit member electrically joined to the first circuit member, wherein the first wiring is provided on the first circuit member. The joined body is characterized in that a second wiring is formed on the second circuit member, and conductive particles exist only between the first wiring and the second wiring.
In the bonded body, since conductive particles exist only between the first wiring and the second wiring, it is possible to prevent a short circuit between the wirings while maintaining the bonding characteristics.
<11> An anisotropic conductive material used in the method for manufacturing a joined body according to any one of <1> to <8>, wherein the release layer and the dot-shaped conductivity formed on the release layer An anisotropic conductive material comprising a sticky adhesive portion.
In the anisotropic conductive material, since the conductive adhesive portion is formed in a dot shape on the release layer, while reducing the amount of conductive particles used, without using a large apparatus for temporary attachment, Can be temporarily pasted easily.
<12> The method for producing an anisotropic conductive material according to <11>, wherein a preparation step of preparing a conductive paste including a binder resin, a curing agent, conductive particles, and a solvent is prepared. And a dot forming step of forming dots on the release layer of the conductive paste.
In the manufacturing method of the joined body, in the preparation step, a conductive paste containing a binder resin, a curing agent, conductive particles, and a solvent is prepared. In the dot formation step, the prepared conductive paste is placed on the release layer. Dots are formed.
本発明の方法によれば、前記従来における諸問題を解決し、前記目的を達成することができ、接合特性を維持しつつ、配線間のショートを防ぐことができる接合体及びその製造方法、並びに、該接合体の製造方法に用いられる異方性導電材料及びその製造方法を提供することができる。また、導電性粒子の使用量を低減すると共に、仮貼り用の大型装置を用いることなく、容易に仮貼りすることができる異方性導電材料及びその製造方法を提供することができる。 According to the method of the present invention, it is possible to solve the above-described conventional problems, achieve the above-mentioned object, maintain a bonding characteristic, and prevent a short circuit between wirings, a manufacturing method thereof, An anisotropic conductive material used in the method for manufacturing the joined body and a method for manufacturing the anisotropic conductive material can be provided. Moreover, while reducing the usage-amount of electroconductive particle, the anisotropic conductive material which can be temporarily pasted easily, and its manufacturing method can be provided, without using the large apparatus for temporary pasting.
（接合体の製造方法）
本発明の接合体の製造方法は、貼付工程と、転着工程と、接合工程とを少なくとも含み、更に必要に応じて適宜選択した、その他の工程を含む。
(Method of manufacturing joined body)
The manufacturing method of the joined body of the present invention includes at least a pasting step, a transfer step, and a joining step, and further includes other steps appropriately selected as necessary.
＜貼付工程＞
前記貼付工程は、剥離層と、前記剥離層上に形成され、導電性粒子を含有するドット形状の導電性粘着部とを有する異方性導電材料を、前記第１の回路部材上に所定の間隔をもって形成された第１の配線に貼り付ける工程である。この貼付工程においては、例えば、図１Ａ及び図１Ｂに示すように、異方性導電材料１００を、第１の回路部材２００上に所定の間隔をもって形成された第１の配線２０に貼り付ける。
<Paste process>
The attaching step includes applying an anisotropic conductive material having a release layer and a dot-shaped conductive adhesive portion formed on the release layer and containing conductive particles on the first circuit member. This is a step of attaching to the first wiring formed with an interval. In this attaching step, for example, as shown in FIGS. 1A and 1B, the anisotropic conductive material 100 is attached to the first wiring 20 formed on the first circuit member 200 with a predetermined interval.
＜＜異方性導電材料＞＞
前記異方性導電材料としては、剥離層と導電性粘着部とを有してなるものであれば、特に制限はなく、目的に応じて適宜選択することができるが、例えば、幅が１ｍｍ〜２０ｍｍである接着テープなどが挙げられる。例えば、図２Ａ及び図２Ｂに示すように、異方性導電材料１００は、剥離層１０と導電性粘着部１１とを有する。
<< anisotropic conductive material >>
The anisotropic conductive material is not particularly limited as long as it has a release layer and a conductive adhesive portion, and can be appropriately selected according to the purpose. For example, an adhesive tape of 20 mm may be used. For example, as shown in FIGS. 2A and 2B, the anisotropic conductive material 100 includes a release layer 10 and a conductive adhesive portion 11.
−剥離層−
前記剥離層としては、その形状、構造、大きさ、厚み、材料（材質）などについては、特に制限はなく、目的に応じて適宜選択することができるが、剥離性の良好なものや耐熱性が高いものが好ましく、例えば、シリコーン等の剥離剤が塗布された透明な剥離ＰＥＴ（ポリエチレンテレフタレート）シートなどが好適に挙げられる。
-Release layer-
The shape, structure, size, thickness, material (material), etc. of the release layer are not particularly limited and can be appropriately selected according to the purpose. For example, a transparent release PET (polyethylene terephthalate) sheet coated with a release agent such as silicone is preferable.
−導電性粘着部−
前記導電性粘着部としては、前記剥離層上に所定の間隔をもって形成され、導電性粒子を含有するドット形状のものであれば、その形状、構造、大きさ、厚み、材料（材質）などについては、特に制限はなく、目的に応じて適宜選択することができ、例えば、バインダー樹脂及び硬化剤をさらに含有する導電性粘着部等が挙げられる。例えば、図３に示すように、導電性粘着部１１は、ドット形状であり、導電性粒子１２を複数個含有する。
隣接するドット形状の導電性粘着部は、お互いに接触しない程度に離れていればよい。
また、剥離層上における配列方法は、縦横一列（図４Ａ）、互い違い（図４Ｂ）のいずれであってもよく、他の配列であってもよい。
ドット形状としては、例えば、円形（図４Ａ及び図４Ｂ）が挙げられるが、これに限定されるものではなく、隣接するドット形状の導電性粘着部と交わらない形状であれば、例えば、図４Ｃに示す形状であってもよい。
-Conductive adhesive part-
The conductive adhesive part is formed on the release layer with a predetermined interval and has a dot shape containing conductive particles. The shape, structure, size, thickness, material (material), etc. There is no restriction | limiting in particular, According to the objective, it can select suitably, For example, the electroconductive adhesive part etc. which further contain binder resin and a hardening | curing agent are mentioned. For example, as shown in FIG. 3, the conductive adhesive portion 11 has a dot shape and contains a plurality of conductive particles 12.
Adjacent dot-shaped conductive adhesive portions need only be separated so as not to contact each other.
Further, the arrangement method on the release layer may be either a vertical and horizontal line (FIG. 4A) or a stagger (FIG. 4B), or may be another arrangement.
Examples of the dot shape include a circular shape (FIGS. 4A and 4B), but are not limited thereto. For example, as long as the shape does not intersect with the adjacent dot-shaped conductive adhesive portion, FIG. The shape shown in FIG.
−−バインダー樹脂−−
前記バインダー樹脂は、特に制限はなく、目的に応じて適宜選択することができるが、エポキシ樹脂及びアクリル樹脂の少なくともいずれかを含有するのが好ましい。
--Binder resin--
There is no restriction | limiting in particular in the said binder resin, Although it can select suitably according to the objective, It is preferable to contain at least any one of an epoxy resin and an acrylic resin.
前記エポキシ樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ノボラック型エポキシ樹脂などが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。 There is no restriction | limiting in particular as said epoxy resin, According to the objective, it can select suitably, For example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolak type epoxy resin etc. are mentioned. These may be used individually by 1 type and may use 2 or more types together.
前記アクリル樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、２−ヒドロキシ−１，３−ジアクリロキシプロパン、２，２−ビス[４−（アクリロキシメトキシ）フェニル]プロパン、２，２−ビス[４−（アクリロキシエトキシ）フェニル]プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロキシエチル）イソシアヌレート、ウレタンアクリレートなどが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。
また、前記アクリレートをメタクリレートにしたものが挙げられ、これらは、１種単独で使用してもよいし、２種以上を併用してもよい。
There is no restriction | limiting in particular as said acrylic resin, According to the objective, it can select suitably, For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol Propane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2, 2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) isocyanurate And urethane acrylate. These may be used individually by 1 type and may use 2 or more types together.
Moreover, what made the said acrylate into the methacrylate is mentioned, These may be used individually by 1 type and may use 2 or more types together.
−−硬化剤−−
前記硬化剤としては、バインダー樹脂を硬化するものであれば、特に制限はなく、目的に応じて適宜選択することができるが、熱硬化剤（熱によって活性化される硬化剤）及び光硬化剤（光によって活性化される硬化剤）の少なくともいずれかを含有するのが好ましい。前記熱硬化剤としては、バインダー樹脂がエポキシ樹脂であれば、例えば、アミン系硬化剤、スルホニウム塩が挙げられ、また、バインダー樹脂がアクリル樹脂であれば、例えば、有機過酸化物が挙げられる。また、前記光硬化剤としては、例えば、オニウム塩、スルホニウム塩が挙げられる。
--Curing agent--
The curing agent is not particularly limited as long as it cures the binder resin, and can be appropriately selected according to the purpose. A thermosetting agent (a curing agent activated by heat) and a photocuring agent. It preferably contains at least one of (a curing agent activated by light). Examples of the thermosetting agent include amine-based curing agents and sulfonium salts if the binder resin is an epoxy resin, and examples include organic peroxides if the binder resin is an acrylic resin. Examples of the photocuring agent include onium salts and sulfonium salts.
−−導電性粒子−−
前記導電性粒子としては、特に制限はなく、従来の異方性導電接着剤において用いられているものと同じ構成のものを使用することができる。例えば、半田、ニッケル等の金属粒子；金属（ニッケル、金、パラジウム、銅等）メッキで被覆された、樹脂粒子、ガラス粒子あるいはセラミック粒子；更にこれらを絶縁被覆した粒子；などが挙げられる。これらの導電性粒子を用いると、接合する端子及び基板配線の平滑性のばらつきを吸収し、製造時のプロセスマージンを確保することができるほか、応力により接続点が離れた場合でも、導通を確保することができ、高い信頼性が得られる。
前記導電性粒子の中でも、金属被覆樹脂粒子、例えば、ニッケル金メッキ被覆樹脂粒子が好ましく、端子間に前記導電性粒子が入り込むことにより生じるショートを防止可能な点で、前記金属被覆樹脂粒子が、絶縁樹脂により被覆されてなる絶縁粒子がより好ましい。
また、導電性粘着部が、導電性粒子を１ドットあたり１個以上含有することが好ましく、５個以上含有することがより好ましい。
また、粒子径１〜３０μｍのものを用いることが好ましい。ここで、粒子径とは、金属顕微鏡により測定された粒子径の平均値を意味する。
--Conductive particles--
There is no restriction | limiting in particular as said electroconductive particle, The thing of the same structure as what is used in the conventional anisotropic conductive adhesive can be used. For example, metal particles such as solder and nickel; resin particles, glass particles or ceramic particles coated with metal (nickel, gold, palladium, copper, etc.) plating; Use of these conductive particles absorbs variations in the smoothness of terminals and board wiring to be joined, ensuring a process margin during manufacturing, and ensuring conduction even when the connection point is separated due to stress. And high reliability can be obtained.
Among the conductive particles, metal-coated resin particles, for example, nickel gold-plated coated resin particles are preferable, and the metal-coated resin particles are insulated in that they can prevent a short circuit caused by the conductive particles entering between terminals. Insulating particles coated with a resin are more preferable.
Moreover, it is preferable that an electroconductive adhesion part contains 1 or more electroconductive particle per dot, and it is more preferable to contain 5 or more.
Moreover, it is preferable to use a thing with a particle diameter of 1-30 micrometers. Here, the particle diameter means an average value of the particle diameter measured by a metal microscope.
また、導電性粘着部にはその他の成分が含有されていてもよく、前記その他の成分としては、本発明の効果を害さない限り特に制限はなく、目的に応じて公知の添加剤の中から適宜選択することができ、例えば、充填剤、軟化剤、促進剤、老化防止剤、着色剤、難燃剤、シランカップリング剤などが挙げられる。
前記その他の成分の添加量としては、特に制限はなく、前記導電性粒子、前記バインダー樹脂、前記硬化剤などの添加量との関係で、適宜選択することができる。
The conductive adhesive portion may contain other components, and the other components are not particularly limited as long as they do not impair the effects of the present invention, and are selected from known additives depending on the purpose. For example, fillers, softeners, accelerators, anti-aging agents, colorants, flame retardants, silane coupling agents, and the like can be used.
There is no restriction | limiting in particular as addition amount of the said other component, According to the relationship with addition amounts, such as the said electroconductive particle, the said binder resin, and the said hardening | curing agent, it can select suitably.
＜＜第１の回路部材＞＞
前記第１の回路部材としては、第１の配線が所定の間隔をもって形成されたものであれば、特に制限はなく、目的に応じて適宜選択することができ、例えば、ＦＰＣ基板、ＰＷＢ基板が挙げられる。
<< first circuit member >>
The first circuit member is not particularly limited as long as the first wiring is formed with a predetermined interval, and can be appropriately selected according to the purpose. For example, an FPC board or a PWB board can be used. Can be mentioned.
＜＜導電性粘着部のピッチと第１の配線の配線幅との関係＞＞
前記導電性粘着部のピッチと第１の配線の配線幅との関係としては、図４に示すように、隣接する導電性粘着部１１ａ、１１ｂの中心間距離（ドット形状の導電性粘着部１１ａの中心線と、導電性粘着部１１ａに隣接するドット形状の導電性粘着部１１ｂの中心線との間の距離）Ｐが、第１の配線２０ａ、２０ｂの高さ位置における第１の配線２０ａ、２０ｂの配線幅Ｌ以下である（Ｐ≦Ｌを満たす）。このように、隣接する導電性粘着部１１ａ、１１ｂの中心間距離Ｐが、第１の配線２０ａ、２０ｂの高さ位置における第１の配線２０ａ、２０ｂの配線幅Ｌ以下である（Ｐ≦Ｌを満たす）と、第１の配線２０ａ、２０ｂ上にドット形状の導電性粘着部１１が捕捉される。なお、隣接する導電性粘着部１１ｃ、１１ｄ間のスペース幅Ｑ１と、隣接する導電性粘着部の一方１１ｃの最大直径Ｘと、隣接する導電性粘着部の他方１１ｄの最大直径Ｘとの合計Ｑが、第１の配線２０の高さ位置における第１の配線２０の配線幅Ｌ以下である（Ｑ≦Ｌを満たす）ことが好ましい。
<< Relationship Between Pitch of Conductive Adhesive Portion and Wiring Width of First Wiring >>
As shown in FIG. 4, the relationship between the pitch of the conductive adhesive portions and the wiring width of the first wiring is the distance between the centers of the adjacent conductive adhesive portions 11a and 11b (dot-shaped conductive adhesive portions 11a). The first wiring 20a at the height position of the first wirings 20a and 20b is a distance P between the center line of the first wirings 20a and 20b and the center line of the dot-shaped conductive adhesive part 11b adjacent to the conductive adhesive part 11a. , 20b or less (satisfying P ≦ L). Thus, the center-to-center distance P between the adjacent conductive adhesive portions 11a and 11b is equal to or smaller than the wiring width L of the first wirings 20a and 20b at the height position of the first wirings 20a and 20b (P ≦ L). When the condition is satisfied, the dot-shaped conductive adhesive portion 11 is captured on the first wirings 20a and 20b. The total of the space width Q1 between the adjacent conductive adhesive portions 11c and 11d, the maximum diameter X of one of the adjacent conductive adhesive portions 11c, and the maximum diameter X of the other 11d of the adjacent conductive adhesive portion. Q is preferably equal to or smaller than the wiring width L of the first wiring 20 at the height position of the first wiring 20 (satisfying Q ≦ L).
＜＜導電性粘着部の高さと導電性粒子の最大粒子径との関係＞＞
前記導電性粘着部の高さと導電性粒子の最大粒子径との関係としては、図５に示すように、導電性粘着部１１の高さＹが、導電性粘着部１１内の導電性粒子１２の最大粒子径よりも大きい（Ｙ＞導電性粒子の最大粒子径）。ここで、導電性粒子の最大粒子径とは、金属顕微鏡により測定された各導電性粒子の粒子径（導電性粒子が球径でない場合は最大径）の最大値を意味する。導電性粘着部１１の高さＹは、前記導電性粘着部１１における導電性粒子１２の最大粒子径より小さいと、粘着性が低下して異方性導電材料の貼り付け性が問題となる。導電性粘着部１１の高さＹが大きすぎると、リール製品にした場合、潰れて広がる可能性があるが、隣り合うドット形状の導電性粘着部１１と繋がらなければ特に制限を受けるものではない。
<< Relationship Between Height of Conductive Adhesive Portion and Maximum Particle Diameter of Conductive Particle >>
As shown in FIG. 5, the relationship between the height of the conductive adhesive portion and the maximum particle size of the conductive particles is that the height Y of the conductive adhesive portion 11 is the conductive particles 12 in the conductive adhesive portion 11. (Y> maximum particle diameter of conductive particles). Here, the maximum particle diameter of the conductive particles means the maximum value of the particle diameter of each conductive particle measured by a metal microscope (the maximum diameter when the conductive particles are not spherical). If the height Y of the conductive adhesive portion 11 is smaller than the maximum particle diameter of the conductive particles 12 in the conductive adhesive portion 11, the adhesiveness is lowered and the sticking property of the anisotropic conductive material becomes a problem. If the height Y of the conductive adhesive portion 11 is too large, there is a possibility that it will be crushed and spread when it is made into a reel product, but there is no particular limitation unless it is connected to the adjacent dot-shaped conductive adhesive portion 11. .
＜＜導電性粘着部の最大直径と導電性粘着部のピッチとの関係＞＞
前記導電性粘着部の最大直径と導電性粘着部のピッチとの関係としては、図５に示すように、導電性粘着部１１の最大直径Ｘが、隣接する導電性粘着部１１ａ、１１ｂの中心間距離Ｐの１／２倍よりも小さい（Ｘ＜Ｐ×１／２を満たす）ことが好ましい。このように、導電性粘着部１１の最大直径Ｘが、隣接する導電性粘着部１１ａ、１１ｂの中心間距離Ｐの１／２倍よりも小さい（Ｘ＜Ｐ×１／２を満たす）と、隣接するドット同士が接触しないので、ドット形状、ドット間距離が変わることがない。
<< Relationship Between Maximum Diameter of Conductive Adhesive Part and Pitch of Conductive Adhesive Part >>
As shown in FIG. 5, the maximum diameter X of the conductive adhesive portion 11 is the center of the adjacent conductive adhesive portions 11a and 11b as the relationship between the maximum diameter of the conductive adhesive portion and the pitch of the conductive adhesive portion. It is preferably smaller than ½ times the inter-distance P (satisfying X <P × ½). Thus, when the maximum diameter X of the conductive adhesive portion 11 is smaller than 1/2 the distance P between the centers of the adjacent conductive adhesive portions 11a and 11b (satisfying X <P × 1/2), Since adjacent dots do not contact each other, the dot shape and the inter-dot distance do not change.
＜＜導電性粘着部の高さと第１の配線の高さとの関係＞＞
前記導電性粘着部の高さと第１の配線の高さとの関係としては、図５に示すように、導電性粘着部１１の高さＹが、第１の配線２０の高さＨよりも低いことが好ましい。これにより、異方性導電材料が第１の配線に貼り付けられた際に、導電性粘着部１１が第１の回路部材２００の基板部２００ａに接触するのを防止することができ、もって第１の配線２０のみに導電性粘着部１１を転着することができる。
<< Relationship between height of conductive adhesive portion and height of first wiring >>
Regarding the relationship between the height of the conductive adhesive portion and the height of the first wiring, as shown in FIG. 5, the height Y of the conductive adhesive portion 11 is lower than the height H of the first wiring 20. It is preferable. Thus, when the anisotropic conductive material is attached to the first wiring, the conductive adhesive portion 11 can be prevented from coming into contact with the substrate portion 200a of the first circuit member 200. The conductive adhesive portion 11 can be transferred to only one wiring 20.
＜＜導電性粘着部の最大直径と第１の配線のピッチとの関係＞＞
前記導電性粘着部の最大直径と第１の配線のピッチとの関係としては、図５に示すように、導電性粘部１１の最大直径Ｘが、隣接する第１の配線２０ａ、２０ｂ間の高さ位置におけるスペース幅Ｓよりも小さいことが好ましい。これにより、１つの導電性粘着部１１が、隣接する第１の配線２０ａ、２０ｂにまたがって転着されるのを防止することができ、もって配線間のショートを防止することができる。
<< Relationship Between Maximum Diameter of Conductive Adhesive Portion and First Wiring Pitch >>
The relationship between the maximum diameter of the conductive adhesive portion and the pitch of the first wiring is that the maximum diameter X of the conductive viscous portion 11 is between the adjacent first wirings 20a and 20b, as shown in FIG. It is preferable to be smaller than the space width S at the height position. Thereby, it is possible to prevent one conductive adhesive portion 11 from being transferred across the adjacent first wirings 20a and 20b, thereby preventing a short circuit between the wirings.
＜転着工程＞
前記転着工程は、第１の配線に貼り付けられた異方性導電材料から剥離層を剥離して、前記第１の配線に前記導電性粘着部を転着させる工程である。例えば、図６Ａ及び図６Ｂに示すように、剥離層１０を剥がすと、ドット形状の導電性粘着部１１が、第１の回路部材２００上に形成された第１の配線２０上に転着される。ここで、ドット形状の導電性粘着部１１は、第１の配線２０上のみに転着され、第１の回路部材２００の基板部２００ａ上には転着されていない。
<Transfer process>
The transfer step is a step of peeling the release layer from the anisotropic conductive material attached to the first wiring and transferring the conductive adhesive portion to the first wiring. For example, as shown in FIGS. 6A and 6B, when the release layer 10 is peeled off, the dot-shaped conductive adhesive portion 11 is transferred onto the first wiring 20 formed on the first circuit member 200. The Here, the dot-shaped conductive adhesive portion 11 is transferred only on the first wiring 20, and is not transferred on the substrate portion 200 a of the first circuit member 200.
＜接合工程＞
前記接合工程は、転着された導電性粘着部を介して、第１の配線と、第２の回路部材上に形成された第２の配線とを電気的に接合する工程である。例えば、図７Ａ及び図７Ｂに示すように、転着された導電性粘着部１１を介して、第１の配線２０と第２の回路部材３００の第２の配線（端子）（不図示）とを接合する。ここで、充填材として、ＮＣＰ（Ｎｏｎ Ｃｏｎｄｕｃｔｉｖｅ Ｐａｓｔｅ）、ＮＣＦ（Ｎｏｎ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）を挟み込んでもよい。
<Joint process>
The joining step is a step of electrically joining the first wiring and the second wiring formed on the second circuit member through the transferred conductive adhesive portion. For example, as shown in FIGS. 7A and 7B, the first wiring 20 and the second wiring (terminal) (not shown) of the second circuit member 300 are connected via the transferred conductive adhesive portion 11. Join. Here, NCP (Non Conductive Paste) or NCF (Non Conductive Film) may be sandwiched as the filler.
＜＜第２の回路部材＞＞
前記第２の回路部材としては、第１の配線と対応する第２の配線を有し、前記第１及び第２の配線を介して、第１の回路部材と電気的に接合できるものであれば、特に制限はなく、目的に応じて適宜選択することができ、例えば、ＦＰＣ基板、ＣＯＦ基板、ＴＣＰ基板、ＰＷＢ基板、ＩＣ基板、パネル等が挙げられる。
<< second circuit member >>
The second circuit member has a second wiring corresponding to the first wiring, and can be electrically joined to the first circuit member via the first and second wirings. For example, there is no restriction | limiting, According to the objective, it can select suitably, For example, a FPC board | substrate, a COF board | substrate, a TCP board | substrate, a PWB board | substrate, an IC board | substrate, a panel etc. are mentioned.
＜その他の工程＞
前記その他の工程は、特に制限はなく、目的に応じて適宜選択することができる。
<Other processes>
The other steps are not particularly limited and can be appropriately selected depending on the purpose.
（接合体）
本発明の接合体は、本発明の接合体の製造方法により製造された接合体である。本発明の接合体の製造方法により製造された接合体は、第１の配線及び第２の配線間のみに導電性粒子が存在する。
(Joint)
The joined body of the present invention is a joined body produced by the method for producing a joined body of the present invention. In the bonded body manufactured by the bonded body manufacturing method of the present invention, conductive particles exist only between the first wiring and the second wiring.
（異方性導電材料）
本発明の異方性導電材料は、本発明の接合体の製造方法に用いられる異方性導電材料である。
(Anisotropic conductive material)
The anisotropic conductive material of the present invention is an anisotropic conductive material used in the method for producing a joined body of the present invention.
（異方性導電材料の製造方法）
本発明の異方性導電材料の製造方法は、調製工程と、ドット形成工程とを含み、更に必要に応じて適宜選択した、その他の工程を含む。
(Method for producing anisotropic conductive material)
The method for producing an anisotropic conductive material of the present invention includes a preparation step and a dot formation step, and further includes other steps appropriately selected as necessary.
＜調製工程＞
前記調製工程は、バインダー樹脂、硬化剤、導電性粒子、及び溶媒を含む導電性ペーストを調製する工程である。
前記バインダー樹脂、前記硬化剤、及び導電性粒子としては、上述したものが挙げられる。
前記溶媒としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、メチルエチルケトン（ＭＥＫ）、トルエン、酢酸エチル等が挙げられる。
前記調製の方法としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、攪拌装置を用いて調製する方法等が挙げられる。
<Preparation process>
The preparation step is a step of preparing a conductive paste containing a binder resin, a curing agent, conductive particles, and a solvent.
Examples of the binder resin, the curing agent, and the conductive particles include those described above.
There is no restriction | limiting in particular as said solvent, According to the objective, it can select suitably, For example, methyl ethyl ketone (MEK), toluene, ethyl acetate, etc. are mentioned.
There is no restriction | limiting in particular as said preparation method, According to the objective, it can select suitably, For example, the method etc. which are prepared using a stirring apparatus are mentioned.
＜ドット形成工程＞
前記ドット形成工程は、調製された導電性ペーストを剥離層上にドット形成する工程である。
前記ドット形成の方法としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、インクジェットプリンタ、レーザープリンタ等のドット形成装置を用いてドット形成する方法等が挙げられる。
<Dot formation process>
The dot forming step is a step of forming dots on the release layer with the prepared conductive paste.
The dot forming method is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a dot forming method using a dot forming apparatus such as an ink jet printer or a laser printer.
以下、本発明の実施例について説明するが、本発明は下記実施例に何ら限定されるものではない。 Examples of the present invention will be described below, but the present invention is not limited to the following examples.
（製造例１：熱硬化性接着剤Ａ）
フェノキシ樹脂（東都化成社製：ＹＰ５０）を４０部、ビスフェノールＡ型エポキアクリレート（ダイセルサイテック社製：ＥＢ６００）を３０部、シランカップリング剤（東レダウコーニング社製：Ｚ-６０３３）を１部、硬化剤（日本油脂社製：パーブチルＺ）を２部、導電性粒子（積水化学工業社製：ＡＵ２０５、５μｍφ）２７部からなる組成物をメチルエチルケトン（ＭＥＫ）で固形分３０％になるよう均一に溶解した熱硬化性接着剤Ａを作製した。
(Production Example 1: Thermosetting adhesive A)
40 parts of phenoxy resin (manufactured by Toto Kasei Co., Ltd .: YP50), 30 parts of bisphenol A type epoxy acrylate (manufactured by Daicel Cytec Co., Ltd .: EB600), 1 part of silane coupling agent (manufactured by Toray Dow Corning Co., Ltd .: Z-6033), A composition comprising 2 parts of a curing agent (manufactured by NOF Corporation: Perbutyl Z) and 27 parts of conductive particles (manufactured by Sekisui Chemical Co., Ltd .: AU205, 5 μmφ) is uniformly formed to a solid content of 30% with methyl ethyl ketone (MEK). A dissolved thermosetting adhesive A was prepared.
（製造例２：粒子密度の少ない熱硬化性接着剤Ｂ）
製造例１において、導電性粒子（積水化学工業社製：ＡＵ２０５、５μｍφ）の添加量を２７部から５部に変更した以外は、製造例１と同様にして熱硬化性接着剤Ｂを作製した。
(Production Example 2: Thermosetting adhesive B with low particle density)
In Production Example 1, a thermosetting adhesive B was produced in the same manner as in Production Example 1 except that the addition amount of conductive particles (manufactured by Sekisui Chemical Co., Ltd .: AU205, 5 μmφ) was changed from 27 parts to 5 parts. .
（製造例３：光硬化性接着剤Ｃ）
製造例１において、硬化剤を、硬化剤（日本油脂社製：パーブチルＺ）から光硬化剤（チバスペシャリティーケミカル社製：イルガキュア１８４）に代えた以外は、製造例１と同様にして光硬化性接着剤Ｃを作製した。
(Production Example 3: Photocurable Adhesive C)
Photocuring was performed in the same manner as in Production Example 1 except that the curing agent in Production Example 1 was changed from the curing agent (Nippon Yushi Co., Ltd .: Perbutyl Z) to the photocuring agent (Ciba Specialty Chemicals: Irgacure 184). Adhesive C was prepared.
（製造例４：熱可塑性粘着剤Ｄ）
スチレン−イソプレン−スチレンブロック共重合体（日本ゼオン社製：クインタック３４５０）５０部、タッキファイヤー（日本ゼオン社製：クイントンＢ１７０）７部、軟和剤（出光興産社製：ダイアナプロセスオイルＮＳ−９０Ｓ）１５部、及び老化防止剤（チバ・スペシャリティ・ケミカルズ社製：イルガノックス＃１０１０）１部、導電粒子（積水化学工業社製：ＡＵ２０５、５μｍφ）２７部からなる組成物を固形分３０％になるようにトルエンに均一に溶解し熱可塑性粘着剤Ｄを作製した。
(Production Example 4: Thermoplastic adhesive D)
50 parts of styrene-isoprene-styrene block copolymer (manufactured by Nippon Zeon: Quintaq 3450), 7 parts of tackfire (manufactured by Nippon Zeon: Quinton B170), softener (manufactured by Idemitsu Kosan Co., Ltd .: Diana Process Oil NS-) 90S) 15 parts of an anti-aging agent (Ciba Specialty Chemicals: Irganox # 1010) and 27 parts of conductive particles (Sekisui Chemical Co., Ltd .: AU205, 5 μmφ) 30% solid content A thermoplastic pressure-sensitive adhesive D was prepared by uniformly dissolving in toluene.
（製造例５：熱硬化性ペースト状接着剤Ｐ１）
ビスフェノールＡ型エポキシアクリレート（ダイセルＵＣＢ社製：ＥＢ６００）を９５部にリン酸アクリレート（東亞合成社製：ＰＭ-２）を１部、シランカップリング剤（東レダウコーニング社製：Ｚ-６０３３）を１部、硬化剤（日本油脂社製；パーブチルＺ）を３部含有させたペースト状接着剤Ｐ１を作製した。なお、ペースト状接着剤Ｐ１は、接合体を作製する際に、配線間を埋めるものとして使用される。
(Production Example 5: Thermosetting paste adhesive P1)
95 parts of bisphenol A type epoxy acrylate (manufactured by Daicel UCB: EB600), 1 part of phosphoric acid acrylate (manufactured by Toagosei: PM-2), silane coupling agent (manufactured by Toray Dow Corning: Z-6033) A paste adhesive P1 containing 1 part and 3 parts of a curing agent (manufactured by NOF Corporation; Perbutyl Z) was produced. Note that the paste adhesive P1 is used as a filler between the wirings when the joined body is manufactured.
（製造例６：光硬化性ペースト状接着剤Ｐ２）
製造例５において、硬化剤を、硬化剤（日本油脂社製：パーブチルＺ）から光硬化剤（チバスペシャリティーケミカル社製：イルガキュア１８４）に代えた以外は、製造例５と同様にして光硬化性ペースト状接着剤Ｐ２を作製した。なお、ペースト状接着剤Ｐ２は、接合体を作製する際に、配線間を埋めるものとして使用される。
(Production Example 6: Photocurable Paste Adhesive P2)
In Production Example 5, the curing agent was photocured in the same manner as in Production Example 5 except that the curing agent (Nippon Yushi Co., Ltd .: Perbutyl Z) was changed to a photocuring agent (Ciba Specialty Chemicals Ltd .: Irgacure 184). Paste-like adhesive P2 was produced. Note that the paste adhesive P2 is used as a filler between the wirings when the joined body is manufactured.
（製造例７：接着層がシート状の異方性導電材料Ａ）
製造例１で作製した熱硬化性接着剤Ａを乾燥後の厚みが２５μｍになるよう離形フィルム（帝人社製：Ａ-７０）上に塗布した後、１ｍｍ幅にスリットした異方性導電材料Ａを作製した。なお乾燥条件は１００℃／１０分で行った。
(Production Example 7: sheet-shaped anisotropic conductive material A with adhesive layer)
An anisotropic conductive material slit in a width of 1 mm after applying the thermosetting adhesive A prepared in Production Example 1 on a release film (Teijin Limited: A-70) to a thickness of 25 μm after drying. A was produced. The drying conditions were 100 ° C./10 minutes.
（製造例８：熱硬化ドット型の異方性導電材料Ｂ）
＜異方性導電材料の作製＞
インクジェットプリンタ（キーエンス社製：ＭＫ９１００、ノズル径３４μｍφ）に製造例１の熱硬化性接着剤Ａを注ぎ、離形フィルム（帝人社製：Ａ-７０）に、長辺ピッチ（図５における隣接する導電性粘着部１１ａ、１１ｂの中心間距離Ｐ）が８０μｍ、短辺ピッチ（長辺ピッチに対して垂直方向のピッチ）が１２０μｍの一定間隔でドット塗布した後に１ｍｍ幅にスリットした異方性導電材料Ｂを作製した。なお、異方性導電材料Ｂは、長辺が貼り付けられる配線のピッチ間隔に対応し、短辺が配線の長さに対応して貼り付けられた。
(Production Example 8: Thermosetting dot-type anisotropic conductive material B)
<Production of anisotropic conductive material>
The thermosetting adhesive A of Production Example 1 was poured into an inkjet printer (manufactured by Keyence Corporation: MK9100, nozzle diameter: 34 μmφ), and a long-side pitch (adjacent in FIG. 5) was placed on a release film (manufactured by Teijin Limited: A-70). Anisotropic conductivity in which the distance P between the centers of the conductive adhesive portions 11a and 11b is 80 μm and the short side pitch (pitch in the direction perpendicular to the long side pitch) is coated with dots at a constant interval of 120 μm and then slit to 1 mm width. Material B was produced. In addition, the anisotropic conductive material B was affixed corresponding to the pitch interval of the wiring to which a long side was affixed, and the short side corresponding to the length of the wiring.
＜単位ドット中の導電性粒子数測定＞
金属顕微鏡（オリンパス社製：ＭＸ-５０）の倍率５０倍を用いて、作製した異方性導電材料Ｂの単位ドット中に含有される導電性粒子の数（粒子密度）を測定した（Ｎ＝２０）。結果を表１に示す。
<Measurement of the number of conductive particles in a unit dot>
The number (particle density) of conductive particles contained in the unit dots of the produced anisotropic conductive material B was measured using a metal microscope (Olympus: MX-50) at a magnification of 50 (N = 20). The results are shown in Table 1.
＜ドット形状の導電性粘着部の最大直径測定＞
金属顕微鏡（オリンパス社製：ＭＸ-５０）の倍率５０倍を用いて、作製した異方性導電材料Ｂのドット形状の導電性粘着部の最大直径を測定した。結果を表１に示す。
<Measurement of maximum diameter of dot-shaped conductive adhesive part>
The maximum diameter of the dot-shaped conductive adhesive portion of the produced anisotropic conductive material B was measured using a metal microscope (manufactured by Olympus: MX-50) at a magnification of 50 times. The results are shown in Table 1.
＜ドット形状の導電性粘着部の高さ測定＞
マイクロメータ（ミツトヨ社製：ＭＤＣ-２５ＭＪ）を用いて、作製した異方性導電材料Ｂのドット形状の導電性粘着部の高さを測定した。結果を表１に示す。
<Measurement of height of dot-shaped conductive adhesive part>
Using a micrometer (Mitutoyo Co., Ltd .: MDC-25MJ), the height of the dot-shaped conductive adhesive portion of the produced anisotropic conductive material B was measured. The results are shown in Table 1.
（製造例９：熱硬化ドット型の異方性導電材料Ｃ）
製造例８において、製造例１で作製した熱硬化性接着剤Ａを製造例２で作製した熱硬化性接着剤Ｂに代えた以外は、製造例８と同様にして、異方性導電材料Ｃを作製し、単位ドット中の導電性粒子数測定、ドット形状の導電性粘着部の最大直径測定、及びドット形状の導電性粘着部の高さ測定を行った。結果を表１に示す。
(Production Example 9: Thermosetting dot-type anisotropic conductive material C)
In Production Example 8, the anisotropic conductive material C was prepared in the same manner as in Production Example 8, except that the thermosetting adhesive A produced in Production Example 1 was replaced with the thermosetting adhesive B produced in Production Example 2. The number of conductive particles in a unit dot was measured, the maximum diameter of the dot-shaped conductive adhesive portion was measured, and the height of the dot-shaped conductive adhesive portion was measured. The results are shown in Table 1.
（製造例１０：光硬化ドット型の異方性導電材料Ｄ）
製造例８において、製造例１で作製した熱硬化性接着剤Ａを製造例３で作製した光硬化性接着剤Ｃに代えた以外は、製造例８と同様にして、異方性導電材料Ｄを作製し、単位ドット中の導電性粒子数測定、ドット形状の導電性粘着部の最大直径測定、及びドット形状の導電性粘着部の高さ測定を行った。結果を表１に示す。
(Production Example 10: Photocurable dot-type anisotropic conductive material D)
In Production Example 8, the anisotropic conductive material D was prepared in the same manner as in Production Example 8, except that the thermosetting adhesive A produced in Production Example 1 was replaced with the photocurable adhesive C produced in Production Example 3. The number of conductive particles in a unit dot was measured, the maximum diameter of the dot-shaped conductive adhesive portion was measured, and the height of the dot-shaped conductive adhesive portion was measured. The results are shown in Table 1.
（製造例１１：熱可塑性ドット型の異方性導電材料Ｅ）
製造例８において、製造例１の熱硬化性接着剤Ａを製造例４の熱可塑性粘着剤Ｄに代えた以外は、製造例８と同様にして、異方性導電材料Ｅを作製し、単位ドット中の導電性粒子数測定、ドット形状の導電性粘着部の最大直径測定、及びドット形状の導電性粘着部の高さ測定を行った。結果を表１に示す。
(Production Example 11: Thermoplastic dot-type anisotropic conductive material E)
In Production Example 8, an anisotropic conductive material E was produced in the same manner as in Production Example 8 except that the thermosetting adhesive A of Production Example 1 was replaced with the thermoplastic adhesive D of Production Example 4, and the unit The number of conductive particles in the dot, the maximum diameter of the dot-shaped conductive adhesive portion, and the height of the dot-shaped conductive adhesive portion were measured. The results are shown in Table 1.
（製造例１２：長辺１２０μｍピッチの熱硬化ドット型の異方性導電材料Ｆ）
製造例８において、長辺ピッチを８０μｍから１２０μｍに変えた以外は、製造例８と同様にして、異方性導電材料Ｆを作製し、単位ドット中の導電性粒子数測定、ドット形状の導電性粘着部の最大直径測定、及びドット形状の導電性粘着部の高さ測定を行った。結果を表１に示す。
(Production Example 12: Thermosetting dot-type anisotropic conductive material F having a long side of 120 μm pitch)
In Production Example 8, except that the long-side pitch was changed from 80 μm to 120 μm, an anisotropic conductive material F was produced in the same manner as in Production Example 8, and the number of conductive particles in the unit dot was measured. The maximum diameter of the adhesive adhesive part and the height of the dot-shaped conductive adhesive part were measured. The results are shown in Table 1.
（製造例１３：長辺１６０μｍピッチの熱硬化ドット型の異方性導電材料Ｇ）
製造例８において、長辺ピッチを８０μｍから１６０μｍに変えた以外は、製造例８と同様にして、異方性導電材料Ｇを作製し、単位ドット中の導電性粒子数測定、ドット形状の導電性粘着部の最大直径測定、及びドット形状の導電性粘着部の高さ測定を行った。結果を表１に示す。
(Production Example 13: Thermosetting dot-type anisotropic conductive material G having a long side of 160 μm pitch)
In Production Example 8, except that the long-side pitch was changed from 80 μm to 160 μm, an anisotropic conductive material G was produced in the same manner as in Production Example 8, and the number of conductive particles in the unit dots was measured, and the conductive in the dot shape The maximum diameter of the adhesive adhesive part and the height of the dot-shaped conductive adhesive part were measured. The results are shown in Table 1.
（製造例１４：導電性粒子の粒子径よりも高さが低い熱硬化ドット型の異方性導電材料Ｈ）
製造例８において、固形分３０％から固形分１５％に変更した以外は、製造例８と同様にして、異方性導電材料Ｈを作製し、単位ドット中の導電性粒子数測定、ドット形状の導電性粘着部の最大直径測定、及びドット形状の導電性粘着部の高さ測定を行った。結果を表１に示す。
(Production Example 14: Thermosetting dot-type anisotropic conductive material H whose height is lower than the particle diameter of conductive particles)
In Production Example 8, except that the solid content was changed from 30% to 15%, the anisotropic conductive material H was produced in the same manner as in Production Example 8, and the number of conductive particles in the unit dots was measured. The maximum diameter of the conductive adhesive part and the height of the dot-shaped conductive adhesive part were measured. The results are shown in Table 1.
表１から、異方性導電材料Ｂ、Ｃ、Ｄ、Ｅ、Ｆ、Ｇにおいて、ドット形状の導電性粘着部の最大直径及び高さがほぼ同程度であることから、ドット形状の導電性粘着部の最大直径及び高さを制御することができることが判る。また、異方性導電材料Ｂ、Ｄ、Ｅ、Ｆ、Ｇについて、粒子密度がほぼ同等であり、導電性粒子の添加量を低減して意図的に粒子密度を低減させた異方性導電材料Ｃでは、異方性導電材料Ｂ、Ｄ、Ｅ、Ｆ、Ｇよりも粒子密度を低減していることが判る。また、異方性導電材料Ｈでは、接着剤組成物の固形分を１５％と低くすることで、ドット形状の導電性粘着部の高さを導電性粒子の粒子径５μｍよりも低い４μｍとした。 From Table 1, in anisotropic conductive materials B, C, D, E, F, and G, since the maximum diameter and height of the dot-shaped conductive adhesive portion are approximately the same, the dot-shaped conductive adhesive It can be seen that the maximum diameter and height of the part can be controlled. The anisotropic conductive materials B, D, E, F, and G have substantially the same particle density, and the amount of conductive particles added is reduced to intentionally reduce the particle density. In C, it can be seen that the particle density is reduced more than the anisotropic conductive materials B, D, E, F, and G. Further, in the anisotropic conductive material H, the height of the dot-shaped conductive adhesive portion is set to 4 μm, which is lower than the particle diameter of the conductive particles, by reducing the solid content of the adhesive composition to 15%. .
（実施例１：ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＢ）
ＦＰＣ基板（２００μｍピッチ、Ｌ／Ｓ＝１２０μｍ／８０μｍ、Ｃｕ厚１８μｍ、Ｓｎメッキ、ポリイミド膜厚３８μｍ）の端子部（第１の配線部）に異方性導電材料Ｂを載置し、ゴムローラーで押し付け、離形フィルムを剥離して、ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＢを作製した。
(Example 1: FPC board FB on which a dot-shaped conductive adhesive portion is transferred)
An anisotropic conductive material B is placed on a terminal part (first wiring part) of an FPC board (200 μm pitch, L / S = 120 μm / 80 μm, Cu thickness 18 μm, Sn plating, polyimide film thickness 38 μm), and a rubber roller Then, the release film was peeled off to prepare an FPC board FB on which the dot-shaped conductive adhesive portion was transferred.
＜転着性の確認＞
作製したＦＰＣ基板ＦＢについて、金属顕微鏡（オリンパス社製：ＭＸ-５０）の倍率１０倍で単位端子（単位配線）あたりのドット形状の導電性粘着部の転着個数を測定した。結果を表２に示す。
<Confirmation of transferability>
About the produced FPC board | substrate FB, the transfer number of the dot-shaped electroconductive adhesion part per unit terminal (unit wiring) was measured with the magnification of 10 times of the metal microscope (the Olympus company make: MX-50). The results are shown in Table 2.
（実施例２：ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＤ）
実施例１において、異方性導電材料Ｂを異方性導電材料Ｄに代えた以外は、実施例１と同様にして、ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＤを作製し、単位端子あたりのドット形状の導電性粘着部の転着個数を測定した。結果を表２に示す。
(Example 2: FPC board FD onto which a dot-shaped conductive adhesive portion was transferred)
In Example 1, except that the anisotropic conductive material B was replaced with the anisotropic conductive material D, an FPC board FD having a dot-shaped conductive adhesive portion transferred thereon was prepared in the same manner as in Example 1. The number of transfer of the dot-shaped conductive adhesive portion per unit terminal was measured. The results are shown in Table 2.
（実施例３：ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＥ）
実施例１において、異方性導電材料Ｂを異方性導電材料Ｅに代えた以外は、実施例１と同様にして、ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＥを作製し、単位端子あたりのドット形状の導電性粘着部の転着個数を測定した。結果を表２に示す。
(Example 3: FPC board FE on which a dot-shaped conductive adhesive portion was transferred)
In Example 1, except that the anisotropic conductive material B was replaced with the anisotropic conductive material E, an FPC substrate FE on which the dot-shaped conductive adhesive portion was transferred was prepared in the same manner as in Example 1. The number of transfer of the dot-shaped conductive adhesive portion per unit terminal was measured. The results are shown in Table 2.
（実施例４：ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＦ）
実施例１において、異方性導電材料Ｂを異方性導電材料Ｆに代えた以外は、実施例１と同様にして、ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＦを作製し、単位端子あたりのドット形状の導電性粘着部の転着個数を測定した。結果を表２に示す。
(Example 4: FPC board FF having a dot-shaped conductive adhesive portion transferred thereon)
In Example 1, except that the anisotropic conductive material B was replaced with the anisotropic conductive material F, an FPC board FF having a dot-shaped conductive adhesive portion transferred thereon was prepared in the same manner as in Example 1. The number of transfer of the dot-shaped conductive adhesive portion per unit terminal was measured. The results are shown in Table 2.
（比較例１：ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＧ）
実施例１において、異方性導電材料Ｂを異方性導電材料Ｇに代えた以外は、実施例１と同様にして、ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＧを作製し、単位端子あたりのドット形状の導電性粘着部の転着個数を測定した。結果を表２に示す。
(Comparative Example 1: FPC board FG on which a dot-shaped conductive adhesive portion is transferred)
In Example 1, except that the anisotropic conductive material B was replaced with the anisotropic conductive material G, an FPC board FG on which the dot-shaped conductive adhesive portion was transferred was prepared in the same manner as in Example 1. The number of transfer of the dot-shaped conductive adhesive portion per unit terminal was measured. The results are shown in Table 2.
（比較例２：ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＨ）
実施例１において、異方性導電材料Ｂを異方性導電材料Ｈに代えた以外は、実施例１と同様にして、ドット形状の導電性粘着部が転着されたＦＰＣ基板ＦＨを作製し、単位端子あたりのドット形状の導電性粘着部の転着個数を測定した。結果を表２に示す。
(Comparative example 2: FPC board | substrate FH in which the electroconductive adhesion part of the dot shape was transferred)
In Example 1, except that the anisotropic conductive material B was replaced with the anisotropic conductive material H, an FPC board FH on which the dot-shaped conductive adhesive portion was transferred was prepared in the same manner as in Example 1. The number of transfer of the dot-shaped conductive adhesive portion per unit terminal was measured. The results are shown in Table 2.
表２から、実施例１〜４のＦＰＣ基板ＦＢ、ＦＤ、ＦＥ、ＦＦでは、隣接する導電性粘着部の中心間距離Ｐ（８０〜１２０μｍ）が、第１の配線の高さ位置における第１の配線の配線幅Ｌ（１２０μｍ）以下であり、且つ、導電性粘着部の高さＨ（８μｍ）が、導電性粒子の粒子径（５μｍ）よりも大きいので、転着個数を８個以上にすることができることが判った。一方、比較例１のＦＰＣ基板ＦＧでは、隣接する導電性粘着部の中心間距離Ｐ（１６０μｍ）が、第１の配線の高さ位置における第１の配線の配線幅Ｌ（１２０μｍ）よりも大きい値であるために、転着個数が少なく、転着不良が発生した。また、比較例２のＦＰＣ基板ＦＨでは、導電性粘着部の高さＨ（４μｍ）が、導電性粒子の粒子径（５μｍ）よりも小さいために、転着個数が少なく、転着不良が発生した。 From Table 2, in the FPC boards FB, FD, FE, and FF of Examples 1 to 4, the center-to-center distance P (80 to 120 μm) of the adjacent conductive adhesive portions is the first at the height position of the first wiring. And the height H (8 μm) of the conductive adhesive portion is larger than the particle diameter (5 μm) of the conductive particles, so that the number of transfer is 8 or more. It turns out that you can. On the other hand, in the FPC board FG of Comparative Example 1, the center-to-center distance P (160 μm) between the adjacent conductive adhesive portions is larger than the wiring width L (120 μm) of the first wiring at the height position of the first wiring. Because of the value, the number of transfer was small and transfer failure occurred. Further, in the FPC board FH of Comparative Example 2, since the height H (4 μm) of the conductive adhesive portion is smaller than the particle diameter (5 μm) of the conductive particles, the number of transfer is small and transfer failure occurs. did.
（比較例３：接合体Ａ）
ＩＴＯパターンガラス（２００μｍピッチ、Ｌ／Ｓ＝１２０μｍ／８０μｍ、１０Ω／□）に製造例７で作製した異方性導電材料Ａを８０℃／１ＭＰａ／２ｓｅｃで貼り付けて、離形フィルムを剥離した後、ＦＰＣ基板（２００μｍピッチ、Ｌ／Ｓ＝１２０μｍ／８０μｍ、Ｃｕ厚１８μｍ、Ｓｎメッキ、ポリイミド膜厚３８μｍ）を位置合わせして、接続をおこなった。接続条件は２.０ｍｍ幅ヒートツールを用いて１９０℃／４ＭＰａ／１０ｓｅｃで行い、接合体Ａを作製した。作製した接合体Ａについて、４端子法を用いて電流１ｍＡを流したときの接続抵抗を測定した。結果を表３に示す。
(Comparative Example 3: Joint A)
The anisotropic conductive material A produced in Production Example 7 was attached to ITO pattern glass (200 μm pitch, L / S = 120 μm / 80 μm, 10Ω / □) at 80 ° C./1 MPa / 2 sec, and the release film was peeled off. Thereafter, the FPC substrate (200 μm pitch, L / S = 120 μm / 80 μm, Cu thickness 18 μm, Sn plating, polyimide film thickness 38 μm) was aligned and connected. The connection was performed at 190 ° C./4 MPa / 10 sec using a 2.0 mm width heat tool to produce a joined body A. With respect to the manufactured joined body A, the connection resistance when a current of 1 mA was passed was measured using a four-terminal method. The results are shown in Table 3.
（実施例５：接合体Ｂ）
ＩＴＯパターンガラス（２００μｍピッチ、Ｌ／Ｓ=１２０μｍ／８０μｍ、１０Ω／□）上に製造例５で作製したペースト状接着剤Ｐ１を塗布して、実施例１で作製したＦＰＣ基板ＦＢを位置合わせして、比較例３と同じ接続条件で接合体Ｂを作製した。作製した接合体Ｂについて、４端子法を用いて電流１ｍＡを流したときの接続抵抗を測定した。結果を表３に示す。
(Example 5: Conjugate B)
The paste-like adhesive P1 produced in Production Example 5 is applied onto ITO pattern glass (200 μm pitch, L / S = 120 μm / 80 μm, 10Ω / □), and the FPC board FB produced in Example 1 is aligned. Thus, a joined body B was produced under the same connection conditions as in Comparative Example 3. With respect to the manufactured joined body B, the connection resistance when a current of 1 mA was passed was measured using a four-terminal method. The results are shown in Table 3.
（実施例６：接合体Ｅ）
実施例５において、ＦＰＣ基板ＦＢを実施例３で作製したＦＰＣ基板ＦＥに代えた以外は、実施例５と同様にして、接合体Ｅを作製し、接続抵抗を測定した。結果を表３に示す。
(Example 6: Assembly E)
In Example 5, except that the FPC board FB was replaced with the FPC board FE produced in Example 3, a joined body E was produced and the connection resistance was measured in the same manner as in Example 5. The results are shown in Table 3.
（実施例７：接合体Ｆ）
実施例５において、ＦＰＣ基板ＦＢを実施例４で作製したＦＰＣ基板ＦＦに代えた以外は、実施例５と同様にして、接合体Ｆを作製し、接続抵抗を測定した。結果を表３に示す。
(Example 7: Conjugate F)
In Example 5, except that the FPC board FB was replaced with the FPC board FF produced in Example 4, a joined body F was produced and the connection resistance was measured in the same manner as in Example 5. The results are shown in Table 3.
（比較例４：接合体Ｇ）
実施例５において、ＦＰＣ基板ＦＢを比較例１で作製したＦＰＣ基板ＦＧに代えた以外は、実施例５と同様にして、接合体Ｇを作製し、接続抵抗を測定した。結果を表３に示す。
(Comparative Example 4: Joint G)
In Example 5, except that the FPC board FB was replaced with the FPC board FG produced in Comparative Example 1, a joined body G was produced and the connection resistance was measured in the same manner as in Example 5. The results are shown in Table 3.
（比較例５：接合体Ｈ）
実施例５において、ＦＰＣ基板ＦＢを比較例２で作製したＦＰＣ基板ＦＨに代えた以外は、実施例５と同様にして、接合体Ｈを作製し、接続抵抗を測定した。結果を表３に示す。
(Comparative Example 5: Conjugate H)
In Example 5, except that the FPC board FB was replaced with the FPC board FH produced in Comparative Example 2, a joined body H was produced and the connection resistance was measured in the same manner as in Example 5. The results are shown in Table 3.
（実施例８：接合体Ｉ）
比較例３で使用したＩＴＯパターンガラス上に、製造例６で作製したペースト状接着剤Ｐ２を塗布して、実施例２で作製したＦＤを位置合わせして、石英ガラスのステージの下から高圧水銀灯（東芝ライテック社製：Ｈ１０００Ｌ）を用いて照射度５００ｍＪ／ｃｍ２で１０ｓｅｃ照射した。圧力は１２０℃に加熱された２.０ｍｍ幅のヒートツールを用いて上から４ＭＰａでＦＰＣを押し込み接続を行い、接合体Ｉを作製した。作製した接合体Ｉについて、４端子法を用いて電流１ｍＡを流したときの接続抵抗を測定した。結果を表３に示す。
(Example 8: Conjugate I)
On the ITO pattern glass used in Comparative Example 3, the paste-like adhesive P2 produced in Production Example 6 was applied, the FD produced in Example 2 was aligned, and a high-pressure mercury lamp from under the quartz glass stage. (Toshiba Lighting & Technology Corp .: H1000L) was used for irradiation for 10 sec at an irradiation degree of 500 mJ / cm2. Using a 2.0 mm wide heat tool heated to 120 ° C., FPC was pushed in at 4 MPa from the top to make a connection. With respect to the manufactured joined body I, the connection resistance when a current of 1 mA was applied was measured using a four-terminal method. The results are shown in Table 3.
（実施例９：接合体Ｊ）
実施例８において、ＦＰＣ基板ＦＤを実施例３で作製したＦＰＣ基板ＦＥに代えた以外は、実施例８と同様にして、接合体Ｊを作製し、接続抵抗を測定した。結果を表３に示す。
(Example 9: Joint J)
In Example 8, except that the FPC board FD was replaced with the FPC board FE produced in Example 3, a joined body J was produced in the same manner as in Example 8, and the connection resistance was measured. The results are shown in Table 3.
表３から、実施例１〜４のＦＰＣ基板ＦＢ、ＦＤ、ＦＥ、ＦＦを用いた接合体Ｂ、Ｅ、Ｆ、Ｉ、Ｊ（実施例５〜９）については、導通信頼性が良好である（比較例３と同等である）のに対して、比較例１及び２のＦＰＣ基板ＦＧ、ＦＨを用いた接合体Ｇ、Ｈ（比較例４及び５）については、導通信頼性が不良であることが判った。 From Table 3, conduction | electrical_connection reliability is favorable about the joined bodies B, E, F, I, and J (Examples 5-9) using FPC board FB, FD, FE, and FF of Examples 1-4. On the other hand, for the joined bodies G and H (Comparative Examples 4 and 5) using the FPC boards FG and FH of Comparative Examples 1 and 2, the conduction reliability is poor. I found out.
＜粒子捕捉数と接続抵抗上昇値との関係＞
ＦＰＣ基板（２００μｍピッチ、Ｌ／Ｓ＝１２０μｍ／８０μｍ、Ｃｕ厚１８μｍ、Ｓｎメッキ、ポリイミド膜厚３８μｍ）の端子に、製造例９で作製した異方性導電材料Ｃのドット形状の導電性粘着部を単位端子あたりに１個転着させ、比較例３と同様に接続を行い、１個〜８個の導電性粒子が１個のドット形状の導電性粘着部内に含まれた接合体を８種作製した。１配線あたりの粒子捕捉数と環境試験８５℃／８５％／５００ｈｒ後の接続抵抗上昇値の関係を図８に示す。粒子捕捉数は金属顕微鏡を用いてカウントした。
図８では、１個のドット形状の導電性粘着部内に５個以上の導電性粒子が含有されていると（１配線あたりの粒子捕捉数が５個以上であると）、抵抗値が２Ω以下となっていることから、導電性粘着部が５個以上の導電性粒子を内部に含有すると、良好な導通信頼性が得られることが判った。
<Relationship between the number of trapped particles and the increase in connection resistance>
Dot-shaped conductive adhesive portions of anisotropic conductive material C produced in Production Example 9 on terminals of an FPC board (200 μm pitch, L / S = 120 μm / 80 μm, Cu thickness 18 μm, Sn plating, polyimide film thickness 38 μm) One piece per unit terminal is transferred and connected in the same manner as in Comparative Example 3, and 8 types of joined bodies in which 1 to 8 conductive particles are contained in one dot-shaped conductive adhesive portion. Produced. FIG. 8 shows the relationship between the number of particles trapped per wiring and the increase in connection resistance after an environmental test of 85 ° C./85%/500 hr. The number of captured particles was counted using a metal microscope.
In FIG. 8, when 5 or more conductive particles are contained in one dot-shaped conductive adhesive portion (when the number of particles captured per wiring is 5 or more), the resistance value is 2Ω or less. Therefore, it has been found that when the conductive adhesive portion contains five or more conductive particles inside, good conduction reliability can be obtained.
（比較例６及び実施例１０）
比較例３及び実施例５で接合体Ａ、Ｂを作製する際に、ＦＰＣ基板とＩＴＯガラスの間に１５μｍ厚のＰＥＴシートを０.２ｍｍの幅で異方性導電材料と一緒に挟み込んで接続おこなった。それぞれの接合体をＬ、Ｍとした。接合体Ｌは挟み込んだＰＥＴに流れ込んだ導電粒子が塞き止められた状態になっていたのに対して、接合体Ｍは端子間に粒子は存在せず、粒子も塞き止められていなかった。
＜絶縁性試験＞
作製した接合体Ｌ、Ｍについて端子間に電圧３０Ｖを印加したときのショート発生率を測定した。それぞれ１００ポイント測定した。結果を表４に示す。
(Comparative Example 6 and Example 10)
When manufacturing the joined bodies A and B in Comparative Example 3 and Example 5, a PET sheet having a thickness of 15 μm is sandwiched between the FPC substrate and the ITO glass together with an anisotropic conductive material with a width of 0.2 mm and connected. I did it. Each joined body was set to L and M. The joined body L was in a state in which the conductive particles flowing into the sandwiched PET were blocked, whereas the joined body M had no particles between the terminals, and the particles were not blocked. .
<Insulation test>
With respect to the manufactured joined bodies L and M, the short-circuit occurrence rate when a voltage of 30 V was applied between the terminals was measured. 100 points were measured for each. The results are shown in Table 4.
表４から、実施例１で作製したＦＰＣ基板ＦＢを用いた接合体Ｍ（実施例１０）については、全くショートが発生しなかった（端子間の絶縁性が保たれていた）のに対し、製造例７で作製した異方性導電材料Ａ（接着層がシート状であって、ドット型でない）を用いて導電性粘着部を転着させた接合体Ｌ（比較例６）については、特に、環境試験８５℃／８５％／５００ｈｒ後におけるショート発生率が高いことが判った。接合体Ｌでショートが発生した理由としては、配線（端子）間スペースに導電性粒子が存在するためと考えられる。 From Table 4, for the joined body M (Example 10) using the FPC board FB produced in Example 1, no short circuit occurred (insulation between terminals was maintained), whereas Regarding the bonded body L (Comparative Example 6) in which the conductive adhesive portion was transferred using the anisotropic conductive material A (the adhesive layer is sheet-like and not dot-shaped) manufactured in Production Example 7, It was found that the incidence of short-circuit after the environmental test 85 ° C./85%/500 hr was high. The reason why the short circuit occurred in the joined body L is considered to be that conductive particles exist in the space between the wirings (terminals).
本実施例では、ＦＰＣ基板等のＣＯＦ（チップ オン フィルム）基板にドット形状の導電性粘着部を転着させているが、ＩＴＯパターンガラスに転着させても同様の結果となる。
また、本発明の異方性導電材料は、ＣＯＦ基板／Ｇｌａｓｓ基板の接続に限らず、ＣＯＦ基板／ＰＷＢ基板、ＣＯＦ基板／ＣＯＦ基板、ＩＣ基板／Ｇｌａｓｓ基板、ＩＣ基板／ＰＷＢ基板などの接合に対応可能である。
In this embodiment, the dot-shaped conductive adhesive portion is transferred to a COF (chip on film) substrate such as an FPC substrate, but the same result is obtained even if transferred to ITO pattern glass.
In addition, the anisotropic conductive material of the present invention is not limited to the connection of the COF substrate / Glass substrate, but also for bonding of a COF substrate / PWB substrate, a COF substrate / COF substrate, an IC substrate / Glass substrate, an IC substrate / PWB substrate, and the like. It is possible.
１０ 剥離層
１１ 導電性粘着部
１１ａ 導電性粘着部
１１ｂ 導電性粘着部
１１ｃ 導電性粘着部
１１ｄ 導電性粘着部
１２ 導電性粒子
２０ 第１の配線
２０ａ 第１の配線
２０ｂ 第１の配線
１００ 異方性導電材料
２００ 第１の回路部材
２００ａ 基板部
３００ 第２の回路部材
DESCRIPTION OF SYMBOLS 10 Peeling layer 11 Conductive adhesion part 11a Conductive adhesion part 11b Conductive adhesion part 11c Conductive adhesion part 11d Conductive adhesion part 12 Conductive particle 20 1st wiring 20a 1st wiring 20b 1st wiring 100 Anisotropic Conductive material 200 first circuit member 200a substrate part 300 second circuit member
Claims (12)
剥離層と、前記剥離層上に所定の間隔をもって形成され、導電性粒子を含有するドット形状の導電性粘着部とを有する異方性導電材料を、前記第１の回路部材上に所定の間隔をもって形成された第１の配線に貼り付ける貼付工程と、
前記第１の配線に貼り付けられた異方性導電材料から前記剥離層を剥離して、前記第１の配線に前記導電性粘着部を転着させる転着工程と、
前記転着された導電性粘着部を介して、前記第１の配線と、前記第２の回路部材上に形成された第２の配線とを電気的に接合する接合工程とを含み、
前記異方性導電材料が前記第１の配線に貼り付けられる前において、隣接する導電性粘着部の中心間距離が、前記第１の配線の高さ位置における前記第１の配線の配線幅以下であり、且つ、前記導電性粘着部の高さが、前記導電性粒子の最大粒子径よりも大きいことを特徴とする接合体の製造方法。 A method of manufacturing a joined body comprising a first circuit member and a second circuit member electrically joined to the first circuit member,
An anisotropic conductive material having a release layer and a dot-shaped conductive adhesive portion formed on the release layer at a predetermined interval and containing conductive particles is formed on the first circuit member at a predetermined interval. A pasting step for pasting to the first wiring formed with,
A transfer step of peeling the release layer from the anisotropic conductive material affixed to the first wiring and transferring the conductive adhesive portion to the first wiring;
A bonding step of electrically bonding the first wiring and the second wiring formed on the second circuit member through the transferred conductive adhesive portion;
Before the anisotropic conductive material is attached to the first wiring, the distance between the centers of adjacent conductive adhesive portions is equal to or smaller than the wiring width of the first wiring at the height position of the first wiring. And the height of the said electroconductive adhesion part is larger than the largest particle diameter of the said electroconductive particle, The manufacturing method of the conjugate | zygote characterized by the above-mentioned.
バインダー樹脂、硬化剤、導電性粒子、及び溶媒を含む導電性ペーストを調製する調製工程と、
前記調製された導電性ペーストを剥離層上にドット形成するドット形成工程とを含む異方性導電材料の製造方法。 It is a manufacturing method of the anisotropic conductive material according to claim 11,
A preparation step of preparing a conductive paste containing a binder resin, a curing agent, conductive particles, and a solvent;
A method for producing an anisotropic conductive material, comprising: a dot forming step of forming dots on the release layer with the prepared conductive paste.
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| WO2016204136A1 (en) * | 2015-06-16 | 2016-12-22 | デクセリアルズ株式会社 | Connector, method for manufacturing connector, and testing method |
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| JP2017005225A (en) * | 2015-06-16 | 2017-01-05 | デクセリアルズ株式会社 | Connector, method of producing connector, inspection method |
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| CN114507488A (en) * | 2016-10-03 | 2022-05-17 | 昭和电工材料株式会社 | Conductive film, wound body, connection structure, and method for producing connection structure |
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