JP2009231817A - Device for mounting electronic parts and method of mounting electronic parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform mounting of electronic parts efficiently when a receiving pressure in a step of a mounting tool receiving semiconductor chips from a wafer stage and a mounting pressure in a step of mounting are varied. <P>SOLUTION: The device for mounting electronic parts is provided with a means 27 for applying a pressure adapted to selectively applying a receiving pressure and a mounting pressure, in which the receiving pressure is applied to a semiconductor chip when a mounting tool 17 receives the semiconductor chip from a wafer stage and the mounting pressure is applied when mounting is made on a substrate. The means for applying a pressure has: a cylinder 12 including a driving shaft 16 that is driven by a fluid pressure and to which the mounting tool is fixed; a first electro-pneumatic regulator 33 for setting a fluid to a pressure corresponding to the receiving pressure to supply the fluid to the cylinder; a second electro-pneumatic regulator 35 for setting a fluid to a pressure corresponding to the mounting pressure to supply the fluid to the cylinder; and a first and a second changeover valves 34, 36 for selectively supplying, to the cylinder, the fluid having a pressure respectively controlled by the first and the second electro-pneumatic regulator. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting a semiconductor chip as an electronic component received from a supply unit by a mounting tool on a substrate.

  In a mounting apparatus for mounting a semiconductor chip as an electronic component on a substrate, when the semiconductor chip is received from a wafer stage serving as a supply unit by a mounting tool, the semiconductor chip is mounted on the substrate.

  A wafer sheet is stretched over the wafer stage, and a semiconductor wafer that is divided into a number of ridge-like semiconductor chips is attached to the wafer sheet. Then, by pushing up one semiconductor chip with the push-up pin, the semiconductor chip is supplied to the mounting tool.

  In a flip chip type mounting apparatus, a semiconductor chip pushed up by a push-up pin from a wafer stage is adsorbed by a reversing tool constituting a supply unit with the wafer stage.

  The reversing tool rotates the semiconductor chip 180 degrees so that the upper and lower surfaces are reversed, and the surface of the semiconductor chip provided with the terminals is directed downward. In this state, the mounting tool receives the semiconductor chip from the reversing tool and mounts it on the substrate.

  The pressure when the mounting tool receives the semiconductor chip from a supply unit such as a wafer stage or a reversing tool is set lower than the pressure when the semiconductor chip is mounted on the substrate. Accordingly, when the mounting tool receives the semiconductor chip from the supply unit, it is possible to prevent the semiconductor chip from being excessively damaged and to be damaged, and when mounting, the semiconductor chip can be reliably mounted on the substrate.

  Therefore, the pressure applied to the mounting tool is controlled to be different between when the mounting tool receives the semiconductor chip from the supply unit and when it is mounted on the substrate.

  Cited Document 1 discloses a mounting load control device. This control device has a collet holder (mounting tool), and an urging force in the load direction is applied to the collet holder (mounting tool) by a spring. The collet holder is applied with an urging force opposite to the spring by the air cylinder.

The urging force generated in the air cylinder is set by controlling the air pressure with an electropneumatic regulator. The load generated in the collet chuck is measured with a load sensor, and the electropneumatic regulator is controlled by the controller based on the measurement. It comes to be controlled by.
JP 2006-324533 A

  That is, according to the configuration shown in the cited document 1, the throttle opening of the electropneumatic regulator is changed in accordance with an electrical signal from the controller, and the air pressure supplied from the supply source to the electropneumatic regulator is controlled. And supplied to the air cylinder.

  As a result, the urging force generated by the air cylinder can be controlled so that the required pressure is obtained when the semiconductor chip is received from the supply unit and when the received semiconductor chip is mounted on the substrate. It is.

  By the way, if the pressure of the air from the supply source is controlled by a single electropneumatic regulator to a pressure corresponding to the pressure received and the mounting pressure, each time the electric pressure supplied to the cylinder is changed, the electric pressure is changed. The throttle opening of the empty regulator must be changed by an electrical signal from the controller.

  However, changing the aperture of the electropneumatic regulator cannot be performed instantaneously, and it may take a relatively long time. Therefore, since it takes a long time to change the air pressure supplied to the cylinder by the electropneumatic regulator, the tact time required for receiving the semiconductor chip from the supply unit and mounting it on the substrate also increases, leading to a decrease in productivity. That happened.

  The present invention provides an electronic component mounting in which when the mounting tool receives the electronic component from the supply unit and mounts the electronic component on the substrate, the pressure applied to the electronic component can be changed in a short time to improve productivity. It is to provide an apparatus and mounting method.

The present invention is a mounting apparatus for receiving an electronic component from a supply unit by a mounting tool and mounting the electronic component on a substrate,
A pressure applying means that selectively applies a receiving pressure applied to the electronic component when the mounting tool receives the electronic component from the supply unit and a mounting pressure applied to the electronic component when mounted on the substrate;
The pressure applying means is
A cylinder having a drive shaft driven by fluid pressure, and the mounting tool mounted on the drive shaft;
First pressure setting means for supplying fluid to the cylinder by setting the fluid to a pressure corresponding to the received pressure;
Second pressure setting means for supplying the cylinder with a fluid set to a pressure corresponding to the mounting pressure;
An electronic component mounting apparatus comprising: selection means for selectively supplying a fluid whose pressure is controlled by the first pressure setting means and the second pressure setting means to the cylinder.

  The selection means includes a first control valve that controls supply of the fluid whose pressure is set by the first pressure setting means to the cylinder, and the fluid whose pressure is set by the second pressure setting means. It is preferable that the second control valve is configured to control supply to the cylinder.

  The mounting pressure is set higher than the receiving pressure, and when the pressure applied to the mounting tool is changed from the mounting pressure to the receiving pressure, the fluid supplied to the cylinder is discharged from the first pressure setting means. Then, it is preferable to supply a fluid set to the receiving pressure to the cylinder.

  When changing from the receiving pressure to the mounting pressure, it is preferable to supply a fluid having a pressure set by the second pressure setting means to the cylinder without discharging the fluid from the cylinder.

  A pressure detection sensor for detecting the pressure of the fluid supplied to the cylinder, and the first pressure setting means and the second pressure setting means are controlled based on the detection of the pressure detection sensor and supplied to the cylinder. And a control device for setting the pressure of the fluid.

The present invention is a mounting method in which a mounting tool is driven by a cylinder operated by fluid pressure, and an electronic component is received from a supply unit by the mounting tool and mounted on a substrate.
Presetting the pressure of the fluid applied to the cylinder to a pressure corresponding to a receiving pressure when the electronic component is received from the supply unit and a mounting pressure when the electronic component is mounted on the substrate;
When the mounting tool receives the electronic component from the supply unit or when the electronic component is mounted on the substrate, either a fluid set to a pressure corresponding to the received pressure or a fluid set to a pressure corresponding to the mounting pressure is used. And a method of selectively supplying the cylinder to the cylinder.

Detecting the pressure of the fluid supplied to the cylinder;
It is preferable to provide a step of controlling the pressure of the fluid supplied to the cylinder based on this detection.

  According to the present invention, the pressure of the fluid applied to the cylinder that drives the mounting tool is set in advance to the receiving pressure when receiving the electronic component from the supply unit and the mounting pressure when mounting the electronic component on the substrate. In addition, the pressure of the fluid supplied to the cylinder is selected in order to select and supply the cylinder with a predetermined pressure of fluid depending on whether the mounting tool receives the electronic component from the supply unit or mounts it on the substrate. Can be switched instantaneously.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 6 show a first embodiment of the present invention. FIG. 1 shows a mounting head 1 of a mounting apparatus. The mounting head 1 is an X / Y movable body whose lateral shape driven in the X and Y directions is horizontal by an X / Y drive source 2a and has an inverted L shape. 2 is provided. Similar to the X / Y movable body 2, the X / Y movable body 2 is connected and fixed to the upper part of the support body 3 having an inverted L shape.

  As shown in FIG. 2, a pair of Z rails 4 that are spaced apart at a predetermined interval in the horizontal direction are provided along the vertical direction (Z direction) on the inner surface of the vertical side of the support 3. This Z rail 4 is provided with a Z movable body 5 on one side, which is slidably engaged with a slider 6 provided on the back side. A female screw body 8 is provided in the middle of the back surface of the Z movable body 5 in the vertical direction.

  A screw shaft 9 having an axial line along the vertical direction is screwed onto the female screw body 8. The screw shaft 9 is rotationally driven by a Z drive source 11 provided on the upper surface of the horizontal side of the support 3. Thereby, the Z movable body 5 can be driven along the Z direction indicated by an arrow in FIG.

  A cylinder 12 that constitutes a pressure applying means, which will be described later, is provided in the lower front portion of the Z movable body 5 with the axis line vertical. A piston 13 is provided inside the cylinder 12 so as to be movable along the Z direction. A spring 14 that urges the piston 13 in the upward direction is accommodated in the cylinder 12. When the piston 13 is urged in the downward direction by air pressure, which will be described later, against the urging force of the spring 14, the piston 13 is engaged with a stopper portion 15 formed of a step portion formed inside the cylinder 12. The lowered position is restricted.

  A drive shaft 16 is provided on the lower surface of the piston 13. The drive shaft 16 protrudes outward from the lower end surface of the cylinder 12, and a mounting tool 17 is attached to the tip thereof. The mounting tool 17 is formed with a suction hole 18 having one end opened on the lower end surface and the other end opened on the side surface. The suction hole 18 is connected to the other end of a suction tube 19 whose one end is connected to a suction pump (not shown). Therefore, when the suction pump is operated, a suction force is generated at the tip of the suction hole 18.

  The mounting tool 17 of the mounting head 1 is driven in the Z direction indicated by the arrow in FIG. 3 to receive the semiconductor chip 21 as the electronic component from the wafer stage 22 as the supply unit, and then in the horizontal direction indicated by the arrow X. It is driven and positioned above the mounting portion 23. Next, the semiconductor chip 21 is mounted on the upper surface of the substrate 24 that is driven in the downward direction indicated by the arrow Z and is positioned on the mounting portion 23.

  The receiving pressure when the mounting tool 17 receives the semiconductor chip 21 from the wafer stage 22 and the mounting pressure when mounting the semiconductor chip 21 on the substrate 24 are the pressures of compressed air as fluid supplied to the cylinder 12 in FIG. It is controlled and changed by the pressure applying means 27 shown. The pressure applying means 27 includes the cylinder 12 as described above.

  The pressure applying means 27 has a compressed air supply source 28. One end of a supply pipe 29 is connected to the supply source 28. The other end of the supply pipe 29 is connected to a supply port 12a (shown in FIG. 1) formed in the cylinder 12. The supply port 12a is located at the end of the piston 13 opposite to the end from which the drive shaft 16 protrudes. When compressed air is supplied into the cylinder 12 from the supply port 12a, the piston 13 is connected to the spring 14 by a pressure. It is biased in the downward direction against the restoring force.

  The middle portion of the supply pipe 29 is branched into a first branch pipe 31 and a second branch pipe 32 arranged in parallel. The first branch pipe 31 includes a first electropneumatic regulator 33 as a first pressure setting means and a three-port two-position type first switching valve 34 as a first control valve constituting a selection means. It is provided in series. The second branch pipe 32 has a second electropneumatic regulator 35 as a second pressure setting means and a three-port two-position type second switching valve 36 as a second control valve constituting the selection means. It is provided in series.

  The first electropneumatic regulator 33 and the second electropneumatic regulator 35 are configured so that the pressure of the compressed air supplied from the supply source 28 is set to a pressure set in advance by a control signal from the control device 38. , 36.

  In other words, the first electropneumatic regulator 33 uses compressed air supplied from the supply source 28 at a pressure that does not damage the semiconductor chip 21 when the mounting tool 17 receives the semiconductor chip 21 from the wafer stage 22. A certain receiving pressure P1 is set.

  When the mounting tool 17 mounts the semiconductor chip 21 received from the wafer stage 22 on the substrate 24 by the compressed air supplied from the supply source 28, the second electropneumatic regulator 35 attaches the semiconductor chip 21 to the substrate 24. Is set to a mounting pressure P2, which is a pressure that can be reliably mounted. Note that P1 <P2 and P1 is set larger than the restoring force F of the spring 14.

  In the mounting apparatus having the above configuration, when mounting the semiconductor chip 21 on the substrate 24, first, the mounting head 1 is driven in the X and Y directions, and the mounting tool 17 is pushed up by the push-up pins (not shown) of the wafer stage 22. 21 is positioned above 21.

  Next, the mounting tool 17 is driven in the downward direction by the Z drive source 11. At the same time, the first switching valve 34 is switched to a state in which compressed air whose pressure is set by the first electropneumatic regulator 33 is supplied to the cylinder 12 as shown in FIG.

  As a result, the piston 13 is urged in the downward direction by the compressed air set at the receiving pressure P 1 by the first electropneumatic regulator 33, so that the mounting tool 17 descends and contacts the semiconductor chip 21 received from the wafer stage 22. Touch. The semiconductor chip 21 is attracted to the lower end surface of the mounting tool 17 by the suction force generated in the suction hole 18.

  The mounting tool 17 is urged by the first electropneumatic regulator 33 in the downward direction by the compressed air set at the receiving pressure P1. When the mounting tool 17 descends and presses the semiconductor chip 21, the piston 13 rises relative to the cylinder 12 while the pressing force applied to the semiconductor chip 21 is maintained at the receiving pressure P <b> 1. Accordingly, the pressing force applied to the semiconductor chip 21 by the mounting tool 17 is maintained at the receiving pressure P1 if the reaction force of the spring 14 is ignored.

  When the lower end surface of the mounting tool 17 contacts the semiconductor chip 21, this is detected by a gap sensor (not shown) provided in the mounting tool 17, and a detection signal is output to the control device 38.

  Based on the detection signal from the gap sensor, the control device 38 drives the cylinder 12 slightly in the downward direction by the Z drive source 11 and then drives it in the upward direction. As a result, the semiconductor chip 21 is received from the wafer stage 22 by the mounting tool 17, that is, the pickup is completed.

  As described above, when the semiconductor chip 21 is received from the wafer stage 22 by the mounting tool 17, the semiconductor chip 21 is not applied with a pressure higher than the receiving pressure P <b> 1 set by the first electropneumatic regulator 33. Can be received without being damaged by the mounting tool 17.

  When the semiconductor chip 21 is received by the mounting tool 17, the mounting head 1 is driven in the X direction shown in FIG. 3 to position the mounting tool 17 above the substrate 24. Next, the mounting tool 17 is driven in the downward direction by the Z drive source 11.

  While the mounting tool 17 moves from above the wafer stage 22 to above the substrate 24 of the mounting unit 23, the first switching valve 34 is adjusted to a pressure P1 by the first electropneumatic regulator 33 as shown in FIG. The second switching valve 36 is switched to a state in which the compressed air set to the mounting pressure P2 is supplied to the cylinder 12 by the second electropneumatic regulator 35.

  As a result, the piston 13 is urged in the downward direction by the compressed air set at the mounting pressure P2 by the second electropneumatic regulator 35, so that the mounting tool 17 is lowered and the semiconductor chip 21 held by suction at its lower end. Is pressed against the substrate 24, the pressing force applied to the semiconductor chip 21 is maintained at the mounting pressure P2.

  That is, when the mounting tool 17 descends and presses the semiconductor chip 21, the pressing force applied to the semiconductor chip 21 is maintained at the mounting pressure P <b> 2 and the piston 13 rises relative to the cylinder 12. The pressing force applied to the semiconductor chip 21 is maintained at the mounting pressure P2 if the reaction force of the spring 14 is ignored.

  When the compressed air set at the mounting pressure P2 is supplied to the piston 13, the first switching valve 34 cuts off the compressed air set at the receiving pressure P1. For this reason, when compressed air at the mounting pressure P2 is supplied to the cylinder 12, the pressure in the cylinder 12 is received in advance and maintained at the pressure P1, so that the pressure to the mounting pressure P2 is quickly performed. Can do.

  When a gap sensor (not shown) provided on the mounting tool 17 detects that the semiconductor chip 21 attracted to the mounting tool 17 has hit the substrate 24, the cylinder 12 is lowered by the Z drive source 11 after the detection. The semiconductor chip 21 that is slightly driven in the direction and held by the mounting tool 17 is mounted on the substrate 24. Therefore, the semiconductor chip 21 can be reliably mounted by the pressure of P2 set by the second electropneumatic regulator 35.

  The pressures P1 and P2 applied to the mounting tool 17 are preset by the first electropneumatic regulator 33 and the second electropneumatic regulator 35. Therefore, when the pressure of the compressed air supplied to the cylinder 12 is changed from P1 to P2 or vice versa, the first and second switching valves 34 are not controlled without controlling the first and second electropneumatic regulators 33 and 35. , 36 need only be switched.

  The switching of the first and second switching valves 34, 36 is quicker than the case where the compressed air supply pressure is controlled by adjusting the opening degree of the throttles of the first and second electropneumatic regulators 33, 35. Can be done.

  For this reason, the tact time required for receiving the semiconductor chip 21 from the wafer stage 22 and mounting it on the substrate 24 can be shortened to the time required for moving the mounting tool 17, so that productivity can be improved. Become.

  After mounting the semiconductor chip 21 on the substrate 24, the mounting tool 17 is driven in the upward direction by the Z drive source 11 together with the cylinder 12. The mounting tool 17 receives the semiconductor chip 21 from the wafer stage 22 again and repeatedly mounts it on the substrate 24.

  In the state where the semiconductor chip 21 has been mounted on the substrate 24, the pressure of the compressed air in the supply pipe 29 is the pressure P <b> 2 set by the second electropneumatic regulator 35. This pressure P2 is higher than the pressure P1 when the mounting tool 17 receives the semiconductor chip 21 from the wafer stage 22.

  Therefore, while the mounting tool 17 moves from above the substrate 24 to above the wafer stage 22, the exhaust port of the first electropneumatic regulator 33 is opened by the control device 38, and the pressure in the supply pipe 29 is atmospheric pressure. Then, the exhaust port is closed.

  Thereby, when the mounting tool 17 receives the semiconductor chip 21 from the wafer stage 22, the pressure applied to the semiconductor chip 21 by the mounting tool 17 can be set to P1, which is a pressure lower than P2, and is received by the semiconductor chip 21. Sometimes, it is possible to prevent an excessively high pressure from being applied. That is, when receiving and mounting the semiconductor chip 21 repeatedly, it is possible to prevent the semiconductor chip 21 from being received and damaged by the pressure during mounting.

  FIG. 7 shows a second embodiment of the present invention. Note that the same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The pressure of the compressed air supplied to the cylinder 12 that drives the mounting tool 17 can be set to the above-mentioned during operation by simply setting the pressure P1 or the mounting pressure P2 by the first and second electropneumatic regulators 33 and 35. It may fluctuate when an abnormality occurs in the first and second electropneumatic regulators 33 and 35, the first and second switching valves 34 and 36, or a leakage occurs in the supply pipe 29.

  Therefore, in the second embodiment, the pressure detection sensor 41 is provided at a portion where the first and second switching valves 34 and 36 of the supply pipe 29 are connected to the cylinder 12. The pressure detection sensor 41 detects the pressure of the compressed air supplied to the cylinder 12 and outputs a detection signal to the control device 38.

  The control device 38 controls the first electropneumatic regulator 33 or the second electropneumatic regulator 35 based on the detection signal from the pressure detection sensor 41 and receives the pressure of the compressed air supplied to the cylinder 12. The pressure P1 or the mounting pressure P2 is set.

  That is, when the mounting tool 17 receives the semiconductor chip 21, the pressure of the compressed air supplied to the cylinder 12 is controlled to be the receiving pressure P1, and when the semiconductor chip 21 is mounted, the pressure is controlled to be the mounting pressure P2.

  Accordingly, the semiconductor chip 21 can be reliably received at the optimum receiving pressure P1, and the mounting can be reliably performed at the optimum mounting pressure P2.

  On the other hand, when the receiving pressure P1 and the mounting pressure P2 by the mounting tool 17 are calibrated, the strain gauge 42 installed on the wafer stage 22 is pressurized by the mounting tool 17. The strain gauge 42 pressurized by the mounting tool 17 outputs a detection signal corresponding to the pressure applied by the mounting tool 17 to the control device 38.

  The control device 38 that has received the output of the strain gauge 42 controls the first electropneumatic regulator 33 and the second electropneumatic regulator 35 so that the pressure applied by the mounting tool 17 becomes the received pressure P1 or the mounting pressure P2. Set the supply pressure of compressed air. Although this setting may be performed by the control device 38, it may be performed manually.

  In this way, if the operation is started after the pressure of the compressed air supplied to the cylinder 12 is calibrated, the semiconductor chip 21 is received at the optimal receiving pressure P1 even at the start of the operation, and the optimal It can be mounted at the mounting pressure P2.

  During operation, the semiconductor chip 21 can be received at the optimum receiving pressure P1 based on the pressure detected by the pressure detection sensor 41, and can be mounted at the optimum mounting pressure P2.

  In each of the above embodiments, the case where the semiconductor chip is directly received from the wafer stage by the mounting tool as the semiconductor chip supply unit has been described. However, when the semiconductor chip is mounted on the substrate by the flip chip method, the semiconductor chip is removed from the wafer stage. Since it is taken out by the reversing tool and transferred to the mounting tool, the wafer stage and the reversing tool constitute a semiconductor chip supply unit.

  Further, the electronic component is not limited to a semiconductor chip, and may be another electronic component such as a resistor or a capacitor. In that case, the tray that accommodates the electronic component constitutes the supply unit of the present invention. .

  Moreover, although the electropneumatic regulator is used as the first and second pressure setting means, a manual pressure regulating valve may be used instead of the electropneumatic regulator.

The side view of the mounting head of the mounting apparatus which shows 1st Embodiment of this invention. Sectional drawing which follows the II-II line | wire of FIG. Explanatory drawing when a mounting tool moves between a wafer stage and a board | substrate, receives a semiconductor chip from a wafer stage, and mounts it on a board | substrate. The block diagram of the pressure provision means comprised by the 1st, 2nd electropneumatic regulator and the switching means. The figure which shows operation | movement of the 1st, 2nd switching valve when supplying the compressed air of the pressure P1 set with the 1st electropneumatic regulator to a cylinder. The figure which shows operation | movement of the 1st, 2nd switching valve when supplying the compressed air of the pressure P2 set with the 2nd electropneumatic regulator to a cylinder. The block diagram of the pressure provision means comprised by the 1st, 2nd electropneumatic regulator and switching means which show the 2nd Embodiment of this invention.

  DESCRIPTION OF SYMBOLS 1 ... Mounting head, 11 ... Z drive source, 12 ... Cylinder, 17 ... Mounting tool, 21 ... Semiconductor chip (electronic component), 22 ... Wafer stage (supply part), 23 ... Mounting part, 24 ... Substrate, 27 ... Pressure Application means 28 ... Supply source 33 ... First electropneumatic regulator (pressure setting means) 34 ... First switching valve (selection means) 35 ... Second electropneumatic regulator (pressure setting means) 36 ... Second switching valve (selecting means), 38... Control device.

Claims (7)

A mounting device that receives an electronic component from a supply unit by a mounting tool and mounts the electronic component on a substrate,
A pressure applying means that selectively applies a receiving pressure applied to the electronic component when the mounting tool receives the electronic component from the supply unit and a mounting pressure applied to the electronic component when mounted on the substrate;
The pressure applying means is
A cylinder having a drive shaft driven by fluid pressure, and the mounting tool mounted on the drive shaft;
First pressure setting means for supplying fluid to the cylinder by setting the fluid to a pressure corresponding to the received pressure;
Second pressure setting means for supplying the cylinder with a fluid set to a pressure corresponding to the mounting pressure;
An electronic component mounting apparatus comprising: selection means for selectively supplying a fluid whose pressure is controlled by the first pressure setting means and the second pressure setting means to the cylinder.   The selection means includes a first control valve that controls supply of the fluid whose pressure is set by the first pressure setting means to the cylinder, and the fluid whose pressure is set by the second pressure setting means. 2. The electronic component mounting apparatus according to claim 1, comprising a second control valve that controls supply to the cylinder.   The mounting pressure is set higher than the receiving pressure, and when the pressure applied to the mounting tool is changed from the mounting pressure to the receiving pressure, the fluid supplied to the cylinder is discharged from the first pressure setting means. 2. The electronic component mounting apparatus according to claim 1, wherein the fluid set to the receiving pressure is supplied to the cylinder.   4. The fluid having a pressure set by the second pressure setting means is supplied to the cylinder without discharging the fluid from the cylinder when changing from the receiving pressure to the mounting pressure. The electronic component mounting apparatus described.   A pressure detection sensor for detecting the pressure of the fluid supplied to the cylinder, and the first pressure setting means and the second pressure setting means are controlled based on the detection of the pressure detection sensor and supplied to the cylinder. The electronic component mounting apparatus according to claim 1, further comprising a control device configured to set a pressure of the fluid. A mounting method in which a mounting tool is driven by a cylinder operated by fluid pressure, and an electronic component is received from a supply unit by the mounting tool and mounted on a substrate,
Presetting the pressure of the fluid applied to the cylinder to a pressure corresponding to a receiving pressure when the electronic component is received from the supply unit and a mounting pressure when the electronic component is mounted on the substrate;
When the mounting tool receives the electronic component from the supply unit or when the electronic component is mounted on the substrate, either a fluid set to a pressure corresponding to the received pressure or a fluid set to a pressure corresponding to the mounting pressure is used. A method of selectively supplying the cylinder with the electronic component mounting method. Detecting the pressure of the fluid supplied to the cylinder;
The electronic component mounting method according to claim 6, further comprising a step of controlling a pressure of a fluid supplied to the cylinder based on the detection.

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