JPS6441230A - Die-bonding device - Google Patents

Die-bonding device

Info

Publication number
JPS6441230A
JPS6441230A JP62198463A JP19846387A JPS6441230A JP S6441230 A JPS6441230 A JP S6441230A JP 62198463 A JP62198463 A JP 62198463A JP 19846387 A JP19846387 A JP 19846387A JP S6441230 A JPS6441230 A JP S6441230A
Authority
JP
Japan
Prior art keywords
pressure
die
pipings
chuck
feeder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62198463A
Other languages
Japanese (ja)
Inventor
Ryuichiro Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62198463A priority Critical patent/JPS6441230A/en
Publication of JPS6441230A publication Critical patent/JPS6441230A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To apply push force to a die held to a vacuum chuck by regulating the pressure of a pressure gas to specified pressure in mutually different magnitude by a pressure regulating valve and changing over one of feeder side pipings and a case side piping by a changeover valve. CONSTITUTION:The pressure of pressure air fed from a gas feeder 14 through two feeder side pipings 21 is regulated at specified pressure in mutually different magnitude by regulators 23. One of the pipings 21 and a case side piping 22 are connected by changing over a changeover valve 24. Consequently, the inside of a chuck case 12 is supplied with a pressure gas at fixed pressure fed from one piping 21. Accordingly, proper push force corresponding to each of the time of pickup and the time of die-bonding is applied to a die 30 held to a vacuum chuck 11 through the chuck 11.
JP62198463A 1987-08-06 1987-08-06 Die-bonding device Pending JPS6441230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62198463A JPS6441230A (en) 1987-08-06 1987-08-06 Die-bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62198463A JPS6441230A (en) 1987-08-06 1987-08-06 Die-bonding device

Publications (1)

Publication Number Publication Date
JPS6441230A true JPS6441230A (en) 1989-02-13

Family

ID=16391524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62198463A Pending JPS6441230A (en) 1987-08-06 1987-08-06 Die-bonding device

Country Status (1)

Country Link
JP (1) JPS6441230A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414042A (en) * 1992-12-29 1995-05-09 Unitika Ltd. Reinforced polyamide resin composition and process for producing the same
US6347655B1 (en) * 1999-11-02 2002-02-19 Mitsubishi Denki Kabushiki Kaisha Die bonding device and semiconductor device
EP1187181A2 (en) * 2000-09-12 2002-03-13 Esec Trading S.A. Method and apparatus for mounting semiconductor chips
JP2002118125A (en) * 2000-09-12 2002-04-19 Esec Trading Sa Method and device for mounting semiconductor chip
SG98455A1 (en) * 2000-09-12 2003-09-19 Esec Trading Sa Method and apparatus for the mounting of semiconductor chips
US7284318B2 (en) 2001-12-05 2007-10-23 Esec, Trading Sa Apparatus for mounting semiconductor chips
JP2009231817A (en) * 2008-02-25 2009-10-08 Shibaura Mechatronics Corp Device for mounting electronic parts and method of mounting electronic parts
JP2013191840A (en) * 2012-03-13 2013-09-26 Ableprint Technology Co Ltd Chip crimping device and its method
US9049810B2 (en) 2010-06-14 2015-06-02 Samsung Techwin Co., Ltd. Device mounter head and device mounting method using the same
JP2015191945A (en) * 2014-03-27 2015-11-02 リンテック株式会社 Lamination device and lamination method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414042A (en) * 1992-12-29 1995-05-09 Unitika Ltd. Reinforced polyamide resin composition and process for producing the same
US6347655B1 (en) * 1999-11-02 2002-02-19 Mitsubishi Denki Kabushiki Kaisha Die bonding device and semiconductor device
EP1187181A2 (en) * 2000-09-12 2002-03-13 Esec Trading S.A. Method and apparatus for mounting semiconductor chips
JP2002118125A (en) * 2000-09-12 2002-04-19 Esec Trading Sa Method and device for mounting semiconductor chip
SG98455A1 (en) * 2000-09-12 2003-09-19 Esec Trading Sa Method and apparatus for the mounting of semiconductor chips
US6648215B2 (en) 2000-09-12 2003-11-18 Esec Trading Sa Method and apparatus for mounting semiconductor chips
US7284318B2 (en) 2001-12-05 2007-10-23 Esec, Trading Sa Apparatus for mounting semiconductor chips
JP2009231817A (en) * 2008-02-25 2009-10-08 Shibaura Mechatronics Corp Device for mounting electronic parts and method of mounting electronic parts
US9049810B2 (en) 2010-06-14 2015-06-02 Samsung Techwin Co., Ltd. Device mounter head and device mounting method using the same
JP2013191840A (en) * 2012-03-13 2013-09-26 Ableprint Technology Co Ltd Chip crimping device and its method
JP2015191945A (en) * 2014-03-27 2015-11-02 リンテック株式会社 Lamination device and lamination method

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