JP2009224685A - Substrate storing container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive substrate storing container capable of reducing generation of pollutant caused by water left after washing, capable of improving operability and positional accuracy when separated support bodies are attached to a container body and capable of smoothly entering/ejecting the substrate. <P>SOLUTION: The substrate storing container includes the container body 1 for storing a semiconductor wafer and a pair of support bodies 30 which are individually built in the container body 1 to support the semiconductor wafer. Each support 30 is composed of: an intermediate piece 31 opposed to a sidewall inner surface of the container body 1; a top piece 32 formed on the intermediate piece 31 and located on the front part 2 side of the sidewall inner surface of the container body 1; an end piece 39 formed on the intermediate piece 31; and teeth 45 formed so as to be protruded between the intermediate piece 31 and the end piece 39 to support the semiconductor wafer; wherein, drain holes 33 are pieced into the top piece 32. Each lock groove 3 is formed on the front part 2 side of the sidewall inner surface of the container body 1, a tip 34 of each top piece 32 is formed as a projected part, and by engaging the lock groove 3 with the tip 34, the top piece 32 is fixed on the sidewall inner surface of the container body 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate storage container that stores substrates represented by semiconductor wafers, compound semiconductor wafers, glass wafers, and the like.

  Although not shown, a conventional substrate storage container includes a front open box type container main body that stores a predetermined number of semiconductor wafers, and a detachable lid that opens and closes an open front portion of the container main body. It is used for conveyance between processes, storage, transportation between factories, and the like, and it is used repeatedly by washing it appropriately with a cleaning liquid before and after use (see Patent Document 1).

The container body is molded to a size that can accommodate 25 semiconductor wafers by a predetermined molding material, or from the viewpoint of improving the throughput of semiconductor production, and is molded to a size that can accommodate 2 semiconductor wafers. The A pair of teeth for horizontally supporting the semiconductor wafer is provided on both sides inside the container body, and a plurality of pairs of teeth are arranged at predetermined intervals in the vertical direction of the container body. The plurality of teeth are integrally formed on both sides of the container main body by an insert molding method or a two-color molding method, or formed separately from the container main body, and then attached to the interior of the molded container main body.
JP 2006-245206 A

  Since the conventional substrate storage container is configured as described above, when a plurality of teeth are integrally formed inside the container body, the container body and the teeth are integrated according to the compatibility and type of the molding material. In addition, when the container body is of a type that accommodates two semiconductor wafers, there is a problem that the structure of the mold is complicated and the cost is increased.

  To solve this problem, it is sufficient to form the teeth separately from the container body and attach it to the container body. Will occur. This problem is extremely important in view of the recent situation that the minimum width of the processing line of the semiconductor circuit is reduced to 90 nm or less and contamination of the semiconductor wafer must be eliminated as much as possible. In addition, when a plurality of teeth are retrofitted to the container body, the workability of the mounting work is deteriorated and the positional accuracy is liable to be lowered, and as a result, there is a possibility that the semiconductor wafer may be taken in and out.

  The present invention has been made in view of the above, and moisture at the time of cleaning is less likely to become a source of substrate contamination, improving workability and positional accuracy when attaching a separate support to the container body, An object of the present invention is to provide an inexpensive substrate storage container capable of smoothly taking out and putting in and out.

In the present invention, in order to solve the above-mentioned problem, the container main body that houses the substrate from the opening includes a separate support for supporting the substrate,
The support includes an intermediate piece facing the inner side wall of the container body, a tip piece formed on the intermediate piece and positioned on the opening side of the inner side wall of the container body, and an intermediate piece formed on the intermediate piece. Including a terminal piece positioned on the closing portion side and a shelf piece protruding from at least the intermediate piece to support the substrate, and draining holes in at least one of the intermediate piece, the tip piece, the terminal piece, and the shelf piece. Perforate and
A concave portion is formed on one of the opening side of the inner surface of the side wall of the container main body and the front end portion of the tip piece, and a convex portion is formed on the other side, and the side wall of the container main body is formed by fitting the concave portion and the convex portion. The tip piece is fixed to the inner surface.

In addition, the container main body is a short front open box type capable of storing three or less substrates, and the front portion thereof is an opening, and a transparent window can be provided on the opening side of the side wall of the container main body.
In addition, a plurality of positioning ribs can be formed on the inner surface of the side wall of the container main body with the intermediate piece or the end piece of the support interposed therebetween.

In addition, a locking groove is formed on the opening side of the inner wall of the container body to form a recess, and the tip of the tip piece is bent to fit into the locking groove, and the tip of the tip piece is substantially comb-shaped. Inclined protrusions can be formed on the comb teeth.
Further, a plurality of guide ribs sandwiching the support are formed on the inner surface of the side wall of the container main body, a positioning groove is formed at the end of the guide rib, and a positioning protrusion that fits in the positioning groove is formed at the tip of the support. It is possible to form.

Further, it is possible to form an alignment protrusion on the tip piece of the support so as to contact and align with the guide rib of the container body.
In addition, it is possible to form an engagement groove on the closed side of the inner surface of the side wall of the container body, and to form an engagement protrusion that fits into the engagement groove at the end of the end piece.
In addition, a plurality of holding ribs for supporting the end piece of the support may be formed on the closed portion side of the inner surface of the side wall of the container body.

Moreover, you may form the bending control stopper which controls the bending of a terminal piece in either the obstruction | occlusion part side of the side wall inner surface of a container main body, or the terminal piece of a support body.
Moreover, you may form in the terminal piece of a support body the position control part which controls the accommodation position of the board | substrate accommodated in a container main body.

Furthermore, a thick portion located on the opening side of the container body is formed on the support surface that supports the substrate of the shelf board piece, and the jump out of the substrate stored in the container body can be regulated by this thick portion. it can.
Furthermore, the shelf board piece of a support body can be divided | segmented, and this divided | segmented several shelf board piece can also be arranged at intervals in the longitudinal direction of a support body.

  Here, the substrate in the claims includes at least one semiconductor wafer (for example, 200 mm, 300 mm, 450 mm type, etc.), compound semiconductor wafer, glass wafer, photomask glass, hard disk and the like. The container body may be large enough to accommodate 25 or 26 substrates, or may be large enough to accommodate two or three substrates. The container body can be a front open box type or a top open box type.

According to the present invention, moisture at the time of cleaning hardly remains and becomes a source of contamination of the substrate, improves workability and positional accuracy when attaching a separate support to the container body, and allows the substrate to be taken in and out smoothly. There is an effect that the substrate storage container can be provided at low cost.
In addition, if a plurality of positioning ribs are formed on the inner surface of the side wall of the container body with the intermediate piece or the end piece of the support interposed therebetween, the parallelism of the support can be adjusted with a simple configuration.

  In addition, a locking groove is formed on the opening side of the inner wall of the container body to form a recess, and the tip of the tip piece is bent to fit into the locking groove, and the tip of the tip piece is substantially comb-shaped. If the inclined protrusions are formed on the comb teeth, the flexibility of the tip end portion of the tip piece can be improved and it can be smoothly fitted into the locking groove. Further, the insertion of the tip end of the tip piece into the locking groove can be smoothed by the inclined protrusion of the comb teeth.

  Also, a plurality of guide ribs sandwiching the support are formed on the inner wall of the side wall of the container body, a positioning groove is formed at the end of the guide rib, and a positioning protrusion that fits into the positioning groove is formed at the end piece of the support. If formed, at least the intermediate piece of the support can be set at an appropriate position. Moreover, it becomes possible to position a support body appropriately in an insertion direction by a positioning protrusion.

In addition, if the alignment protrusion is formed on the tip of the support to contact and align with the guide ribs of the container body, the support and shelf pieces can be positioned in the direction in which the stored substrates are arranged. Become.
Further, if an engagement groove is formed on the closed side of the inner surface of the side wall of the container body, and an engagement protrusion that fits into the engagement groove is formed at the end of the end piece, the engagement protrusion is fitted. Due to the action, dropping of the support into the container body is restricted.

Moreover, if the several holding rib which supports the terminal piece of a support body is formed in the obstruction | occlusion part side of the side wall inner surface of a container main body, drop | omission into the container main body of a support body will be controlled.
In addition, if a deflection regulating stopper that regulates the bending of the end piece is formed on either the closed side of the inner side wall of the container body or the end piece of the support, the deflection regulating stopper faces the inner side wall of the container body. To regulate the bending of the end piece.

In addition, if a thick part located on the opening side of the container body is formed on the support surface that supports the substrate of the shelf board piece, this thick part leads to the opening part direction of the substrate stored in the container body. You can expect pop-out regulation.
Furthermore, if the shelf pieces of the support are divided and the plurality of divided shelf pieces are arranged at intervals in the longitudinal direction of the support, the contact area between the shelf pieces and the substrate is reduced. It can be expected to suppress contamination, prevent deformation of shelf boards during manufacturing, and reduce material costs.

  Hereinafter, a preferred embodiment of a substrate storage container according to the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 9, the substrate storage container according to the present embodiment includes a semiconductor wafer that is a small number of substrates. A container body 1 having a substantially polygonal shape that can be stored, and a pair of left and right support bodies 30 that are housed separately in the container body 1 and support a semiconductor wafer horizontally are provided. The tip piece 32, the end piece 39, and the pair of teeth 45 are integrally formed.

  Although not shown, the semiconductor wafer is made of, for example, a thin and round silicon type of φ300 mm, and a notch for alignment and identification is selectively formed on the peripheral edge, and a circuit pattern is formed on the surface.

  As shown in FIG. 1 and FIG. 2, the container body 1 is a short front open box that stores two semiconductor wafers in an up-and-down arrangement by injecting a molding material containing a predetermined resin into a mold. A lid 20 of the same shape is detachably fitted to the horizontally long front portion 2 that is molded and opened through an endless gasket, and the front portion 2 of the container body 1 is fitted to the lid 20. A locking mechanism that locks the closed lid 20 is built in, and is slidably mounted on a load port device (not shown) so that the front surface portion 2 is brought into contact with the loading / unloading port.

  Examples of the resin of the molding material for molding the container body 1 include polybutylene terephthalate, polycarbonate, polyether imide, and cycloolefin resin, which are excellent in mechanical properties, heat resistance, dimensional stability, and the like. Two or more kinds of these resins are selectively combined and used for insert molding, two-color molding, and the like. In addition, carbon black, carbon filler, carbon nanotube, conductive polymer, etc. are added to these resins from the viewpoint of improving conductivity, or UV absorbers such as hindered amines are used from the viewpoint of controlling the transmission wavelength. Glass fibers are added or added to improve rigidity.

  As shown in FIG. 2, the container body 1 is formed by linearly forming the front surface 2 side of both side walls and bending the back wall side (closed portion side) of both side walls into a substantially cross-sectional shape. The interior front portion 2 side is wide and the interior back wall side is narrowly formed. As shown in FIGS. 2 and 8, the front end piece 32 of the support body 30 is fixed to the front portion 2 side of the inner surface of each side wall of the container main body 1, in other words, to the inner periphery of the front portion of the container main body 1. The stop groove 3 is cut out in the vertical direction.

  As shown in FIGS. 5, 6, and 8, at least the intermediate piece 31 of the support 30, specifically, the intermediate piece 31 and the tip piece 32 are guided and sandwiched between the inner surfaces of the side walls through a slight gap. A pair of upper and lower guide ribs 4 are formed. Each guide rib 4 is formed in a plate shape or a rod shape that is elongated in the front-rear direction of the container body 1, and the front end portion 2 side has an abbreviated cross-sectional shape, an approximate C-shape, an approximate J-shape. A positioning groove 5 such as a letter shape or a substantially U shape is formed in a recessed shape. The pair of guide ribs 4 are disposed to face each other with an interval corresponding to the height of the intermediate piece 31 and the tip piece 32, and are inclined so that the interval gradually decreases from the front part 2 of the container body 1 to the rear wall side.

  As shown in FIGS. 5, 6, and 9, a pair of upper and lower positioning ribs 6 that sandwich the end piece 39 of the support 30 are formed to protrude on the back wall side of the inner surface of each side wall of the container body 1. In addition, on the back wall side of the inner surface of each side wall, engagement grooves 7 having substantially L-shaped, U-shaped and V-shaped cross sections located behind the positioning rib 6 are formed via the ribs. In addition, a pair of upper and lower holding ribs 8 are formed on the back wall side of the inner surface of each side wall, and the pair of upper and lower holding ribs 8 are located near the upper and lower sides of the engagement groove 7. It functions to sandwich the end piece 39 of the support 30. Each holding rib 8 is formed in a plate shape elongated in the front-rear direction of the container body 1, and is positioned behind the positioning rib 6.

  A rib flange 9 is formed on the outer peripheral surface of the container body 1 to increase mechanical strength and rigidity. The rib flange 9 protrudes when the container body 1 is removed and faces the pin. The rib flange 9 is integrally formed on the back wall and both side walls of the container body 1 from the outside, and has a deformed planar substantially U shape. Both sides of the rib flange 9 on the back wall are screwed with a metal balance weight 10 so that the front part 2 of the container body 1 does not tilt downward, and a plurality of parts are removed when the container body 1 is removed from the mold. It functions to face the protruding pin from the outside.

  A central portion of the rib flange 9 on the back wall is bent into a substantially W shape to form a concave portion, and the opening of the concave portion faces downward and functions as a positioning portion 11 for the load port device of the container body 1. Further, the front portion of the rib flange 9 on each side wall is bent into a substantially inverted V shape to form a concave portion, and the opening of the concave portion functions downward as a positioning portion 11 for the load port device. In addition, a plurality of attached ribs 12 are erected at the center of the ceiling of the container body 1, and a planar substantially triangular suspension flange 13 held by a transport mechanism (not shown) is provided on the plurality of attached ribs 12. It is detachably screwed through a fastener.

  The front portion 2 of the container body 1 is formed to bulge outwardly to form a rim flange 14, and locking grooves 15 for locking the lid 20 are notched in the vertical direction on both sides inside the rim flange 14. It is. As shown in FIGS. 2, 5, and 6, a plurality of mounting holes 16 are drilled side by side in the vertical direction on both sides of the rim flange 14 projecting to the left and right, and information display pads are formed in the mounting holes 16. As the infopad is selectively inserted and detected by the detection sensor of the load port device, the presence or number of semiconductor wafers, the storage position of the semiconductor wafer, the type of the substrate storage container, etc. are identified to the load port device. Is done.

  As shown in FIG. 1, the lid 20 is detachably fitted to the front part 2 of the container body 1, and has a horizontally long case containing a locking mechanism, and an open front part (surface part) of the case. And a front cover 21 that is screwed onto the container body 1 and attached to and removed from the container body 1 by a lid opening / closing device of the load port device. As a material of the lid 20, for example, a molding material similar to that of the container body 1 is used.

  A horizontally long mounting hole is formed in the center of the rear surface of the housing, and a front retainer that elastically holds the front of the peripheral edge of the semiconductor wafer with an elastic piece is mounted in the mounting hole. In addition, a horizontally long frame-shaped mounting groove is cut out at the peripheral edge of the rear surface of the housing, and an elastic gasket interposed between the container main body 1 is fitted into the mounting groove.

  The front cover 21 is formed in a horizontally long and substantially rectangular shape, and operation ports 22 for a locking mechanism are formed in both sides so as to have a substantially convex shape, respectively. A front circular suction region that is vacuum-sucked by the lid opening / closing device is formed.

  As shown in FIGS. 2 to 4 and 7 to 9, each support 30 is provided with an intermediate piece 31 that faces the inner surface of the side wall of the container main body 1, and a side wall of the container main body 1 that is integrally formed with the intermediate piece 31. An elongated rectangular tip piece 32 positioned on the front surface 2 side of the inner surface, an elongated rectangular end piece 39 formed on the intermediate piece 31 and positioned on the back wall side of the inner wall of the container body 1, and the intermediate piece 31 and the distal end A pair of upper and lower teeth 45 that are formed on the piece 39 and horizontally support the peripheral edge of the semiconductor wafer are formed.

  Examples of the resin of the molding material that molds the support 30 include polyether ether ketone, polybutylene terephthalate, polycarbonate, polyether imide, and cycloolefin resin that are excellent in lubricity, heat resistance, dimensional stability, and the like. Two or more kinds of these resins are selectively combined and used for insert molding, two-color molding, and the like. In addition, carbon black, carbon filler, carbon nanotube, conductive polymer, etc. are added to these resins from the viewpoint of improving conductivity, or UV absorbers such as hindered amines are used from the viewpoint of controlling the transmission wavelength. Glass fibers are added or added to improve rigidity.

  As shown in FIGS. 3 and 4, the intermediate piece 31 of the support 30 is formed in an elongated rectangular shape that is interposed between a pair of guide ribs 4 and extends in the front-rear direction of the container body 1. The end piece 39 is formed to be bent in the inner inner direction of the container main body 1, in other words, toward the center portion of the semiconductor wafer.

  As shown in FIG. 3 and FIG. 4, the tip piece 32 has a plurality of drain holes 33 arranged in a lattice shape for facilitating draining of the cleaning liquid, and each drain hole 33 is formed in an elongated rectangular shape in the front-rear direction. And interposed between the pair of guide ribs 4 of the container body 1. The distal end portion 34 of the distal end piece 32 is bent and formed in an approximately L shape toward the inside and outside of the container main body 1, and is detachably fitted and locked in the locking groove 3 of the container main body 1 to remove the support 30. To prevent.

  The tip portion 34 of the tip piece 32 is formed in a comb shape from the viewpoint of ensuring flexibility and flexibility as shown in FIGS. 3, 4, and 6, and at least one of the front and back surfaces of each comb tooth 35. A plurality of inclined protrusions 36 that reduce friction with the locking groove 3 are selectively arranged in parallel with each other, and the plurality of arranged inclined protrusions 36 are fitted into the locking groove 3. To facilitate or improve drainage. In addition, positioning protrusions 37 that are fitted into the positioning grooves 5 of the guide rib 4 are respectively formed on the upper and lower surfaces of the tip piece 32 to project the pair of positioning protrusions 37 in the insertion direction.

  Each positioning projection 37 is formed to protrude in a pin shape, and is positioned rearward of the distal end portion 34 of the distal end piece 32. Further, as shown in FIGS. 3, 4, and 8, alignment protrusions 38 that are in contact with the opposing surfaces of the guide rib 4 of the container body 1 are formed on the upper and lower surfaces of the tip piece 32, respectively. The mating protrusion 38 functions to position the support 30 and the teeth 45 in the vertical direction. Each alignment protrusion 38 is lower than the positioning protrusion 37, is formed in a hemispherical shape from the viewpoint of reducing friction, and is adjacent to the rear of the positioning protrusion 37.

  As shown in FIGS. 3, 4, 6, and 8, the end piece 39 is integrally formed with a mounting piece 40 at its end, and the mounting piece 40 is formed on a semiconductor wafer housed in the container body 1. A position restricting portion 41 that contacts and restricts the storage position is formed so as to project, and the upper and lower surfaces of the attachment piece 40 are positioned by being sandwiched between the pair of positioning ribs 6 of the container body 1 to adjust the parallelism. The An end wall portion 42 extending in parallel with the intermediate piece 31 is integrally formed at the end portion of the attachment piece 40, and the upper and lower sides of the end wall portion 42 are on the back wall side of the inner surface of the side wall of the container body 1 and the pair of holding ribs 8 Is sandwiched between.

  A pin-shaped engagement protrusion 43 that fits into the engagement groove 7 of the container body 1 is integrally formed at the end portion of the end wall portion 42, and the engagement of the engagement protrusion 43 and the holding rib 8 are sandwiched. The action effectively prevents the support 30 from dropping or dropping into the container body 1. Further, the position restricting portion 41 is formed so as to have an obtuse angle of 90 ° or more with the accommodated semiconductor wafer, or is formed in a substantially semi-circular or substantially semi-elliptical cross section, in the vicinity of the positioning rib 6. It is located near the rear part of the teeth 45.

  On the back surface of the mounting piece 40, a plate-shaped bending restriction stopper 44 located on the back side of the position restriction portion 41 is installed, and this bending restriction stopper 44 comes into contact with the rear wall side of the inner wall of the container main body 1 to contact the end piece. It functions to regulate the bending of 39 and teeth 45. The deflection regulating stopper 44 functions to suppress and prevent the positional deviation of the semiconductor wafer when the lid 20 is removed from the front part 2 of the container body 1.

  As shown in FIGS. 2 to 4, each tooth 45 is formed in a plate shape elongated in the front-rear direction of the container body 1, and is formed so as to protrude substantially horizontally in a region extending from the intermediate piece 31 to the end piece 39 of the support 30. The On the surface of the tooth 45 that horizontally supports the peripheral edge of the semiconductor wafer, a thin, thin, substantially triangular thick portion 46 positioned on the front surface 2 side of the container body 1 is laminated and formed by the thickness of the semiconductor wafer. The front end of the peripheral portion of the semiconductor wafer contacts the end face of the thick portion 46, so that the semiconductor wafer accommodated in the container body 1 that slides in the front-rear direction on the load port device effectively jumps out in the front portion 2 direction. Be regulated.

  In the above, when the support body 30 is mounted inside the container body 1, first, the support body 30 is inserted into the container body 1 via the pair of guide ribs 4 and is inserted into the engagement groove 7 of the container body 1. The engaging protrusion 43 of the support body 30 is fitted, the end wall portion 42 of the support body 30 is sandwiched between the rear wall side of the inner wall of the container body 1 and the holding rib 8, and the pair of positioning ribs 6 support the support body. Thirty end pieces 39 are clamped. At this time, the pair of guide ribs 4 are inclined so as to be gradually narrowed to perform positioning action and rattling prevention action, so that the intermediate piece 31 and the end piece 39 of the support 30 can be appropriately inserted and slid.

  Thus, when the intermediate piece 31 and the end piece 39 of the support 30 are properly inserted into the container body 1 so as not to fall off, the distal end portion 34 of the distal end piece 32 is fitted and locked in the locking groove 3 of the container body 1. Then, the positioning protrusions 37 are fitted into the positioning grooves 5 of the guide ribs 4 to position the support 30 in the insertion direction, and the alignment protrusions 38 are pressed against the opposing surfaces of the guide ribs 4 so that the teeth 45 are moved vertically. If it positions, the support body 30 can be mounted | worn with the inside of the container main body 1, and can be integrated.

  According to the said structure, since the some teeth 45 are not integrally molded inside the container main body 1, the container main body 1 and the teeth 45 can be integrated irrespective of the compatibility and kind of molding material. Further, even when the container body 1 is of a type that accommodates two semiconductor wafers, the structure of the mold is not complicated, and molding is not difficult and the cost is not increased, so that inexpensive manufacturing can be expected. Further, since the plurality of drain holes 33 are drilled in the tip piece 32 of the support 30, it is possible to prevent the moisture of the cleaning liquid during cleaning from remaining as a contamination source of the semiconductor wafer.

  Further, the guide rib 4, the engagement groove 7, the engagement protrusion 43, the holding rib 8, the positioning rib 6, the locking groove 3, the tip end 34 of the tip piece 32, the positioning groove 5, the positioning protrusion 37, and the alignment protrusion By utilizing 38, workability and positional accuracy when the pair of support bodies 30 are retrofitted to the container body 1 can be remarkably improved, so that the semiconductor wafer can be smoothly put in and out by a dedicated robot. Further, by adjusting the thickness of the inclined protrusion 36 of the distal end portion 34, the thickness of the distal end portion 34 itself can be easily adjusted without cutting the entire distal end portion 34.

  Next, FIG. 10 shows a second embodiment of the present invention. In this case, each of the teeth 45 of the support 30 is divided into a pair of front and back, and the pair of front and rear teeth 45 thus divided is supported by the support 30. Are arranged at intervals in the longitudinal direction.

  Support protrusions 47 for selectively supporting the semiconductor wafer by point contact or point contact are selectively formed on the surfaces of the pair of teeth 45. Each support protrusion 47 is attached to or integrated with the tooth 45 by a molding material different from the tooth 45, for example, and is formed into a protrusion having a hemispherical shape, a semi-cylindrical shape, a triangular cross section, or the like. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In the present embodiment, the same effect as the above embodiment can be expected, and each tooth 45 is divided into a pair of front and rear, so that the contact area between the tooth 45 and the semiconductor wafer is reduced to prevent the contamination of the semiconductor wafer. Obviously, the deformation of the teeth 45 during molding can be prevented, and the material cost can be significantly reduced.

Next, FIG. 11 shows a third embodiment of the present invention. In this case, see-through windows 50 for optical sensors are respectively formed on the front surface 2 side of both side walls of the container body 1, and each see-through is shown. A locking groove 3 is formed in the inner surface of the window 50, and the tip portion 34 of the tip piece 32 shortened in the locking groove 3 is detachably fitted and locked.
The see-through window 50 is molded by an insert molding method or a two-color molding method using a molding material such as PC. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the semiconductor wafer can be directly detected by the transparent window 50 using a transmission type optical sensor instead of a weight sensor. It is clear that the presence / absence, the number of sheets, the storage position, etc. can be accurately detected. Also, the configuration of the container body 1 can be diversified.

  In the above-described embodiment, a pair of the same type of support 30 is built in the container main body 1, but one support 30 may be of a different type as long as it does not hinder the support of the semiconductor wafer. In addition, the lengths of the intermediate piece 31, the tip piece 32, and the end piece 39 in the above embodiment may be extended or shortened as necessary. In addition, a pair of upper and lower convex portions are formed at intervals on the front surface 2 side of the inner surface of the side wall of the container body 1, and concave portions that fit into the convex portions are formed above and below the distal end portion 34 of the distal end piece 32. The substantially crank-shaped fitting pieces that fit into the convex portions may be formed to extend, or the protruding pieces with concave portions may be formed.

  Moreover, while forming a convex part in the inner periphery of the front part 2 of the container main body 1, a recessed part is formed in the front-end | tip part 34 of the front-end | tip piece 32, and it supports on the side wall of the container main body 1 by fitting with these convex part and a recessed part. The body 30 may be fixed. In the above embodiment, a plurality of drain holes 33 are drilled in the tip piece 32, but a plurality of drain holes 33 may be drilled in the intermediate piece 31, the end piece 39, and / or the teeth 45. Further, the draining hole 33 can be formed in a circular shape, an elliptical shape, a polygonal shape or the like in addition to a rectangular shape.

  In addition, a plurality of positioning ribs 6 are formed on the inner surface of the side wall of the container body 1 with the end piece 39 of the support 30 interposed therebetween, but the plurality of positioning ribs 6 positioned with the intermediate piece 31 of the support 30 interposed therebetween. It is also possible to form. Further, although the bending restriction stopper 44 for restricting the bending is formed on the end piece 39 of the support 30, the bending restriction stopper 44 can be formed on the back wall side of the inner wall of the container body 1. The deflection regulating stopper 44 may be increased to a plurality.

  Further, the positioning protrusion 37 and / or the alignment protrusion 38 can be formed on the tooth 45 for positioning. Further, each tooth 45 is divided into a pair of front and rear, but each tooth 45 is divided into three pieces such as front, center, and rear, and the semiconductor wafer is supported by the front and rear teeth 45, and the front and rear teeth 45. Alternatively, the central tooth 45 may be disposed at a low position so as not to contact the semiconductor wafer.

It is a perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is a section top view showing typically an embodiment of a substrate storage container concerning the present invention. It is a perspective explanatory view showing typically the support in the embodiment of the substrate storage container concerning the present invention. FIG. 4 is a rear view of FIG. 3. It is front explanatory drawing which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically the container main body and support body in embodiment of the substrate storage container which concerns on this invention. It is a section side view showing typically a container main part and a support in an embodiment of a substrate storage container concerning the present invention. It is a partial cross-section explanatory drawing which shows typically the front part side of the side wall of the container main body in embodiment of the substrate storage container which concerns on this invention. It is a section explanatory view showing typically the back wall side of the side wall of the container main part in the embodiment of the substrate storage container concerning the present invention. It is a perspective explanatory view showing typically a 2nd embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing typically a 3rd embodiment of a substrate storage container concerning the present invention.

Explanation of symbols

1 Container body 2 Front (opening)
3 Locking groove (concave)
4 Guide rib 5 Positioning groove 6 Positioning rib 7 Engaging groove 8 Holding rib 20 Lid body 30 Support body 31 Intermediate piece 32 End piece 33 Drain hole 34 End part (convex part)
35 Comb tooth 36 Inclined protrusion 37 Positioning protrusion 38 Positioning protrusion 39 End piece 40 Mounting piece (a part of the end piece)
41 Position restriction part 42 End wall part (part of terminal piece)
43 Engaging protrusion 44 Deflection regulating stopper 45 Teeth (shelf plate piece)
46 Thick part 47 Support projection 50 Perspective window

Claims (12)

A substrate storage container containing a separate support for supporting a substrate in a container main body that stores the substrate from the opening,
The support includes an intermediate piece facing the inner side wall of the container body, a tip piece formed on the intermediate piece and positioned on the opening side of the inner side wall of the container body, and an intermediate piece formed on the intermediate piece. Including a terminal piece positioned on the closing portion side and a shelf piece protruding from at least the intermediate piece to support the substrate, and draining holes in at least one of the intermediate piece, the tip piece, the terminal piece, and the shelf piece. Perforate and
A concave portion is formed on one of the opening side of the inner surface of the side wall of the container main body and the front end portion of the tip piece, and a convex portion is formed on the other side, and the side wall of the container main body is formed by fitting the concave portion and the convex portion. A substrate storage container characterized in that a tip piece is fixed to an inner surface.   2. The substrate storage according to claim 1, wherein the container main body is a short front open box type capable of storing three or less substrates, the front portion of which is an opening, and a transparent window is provided on the opening side of the side wall of the container main body. container.   3. The substrate storage container according to claim 1 or 2, wherein a plurality of positioning ribs are formed on the inner surface of the side wall of the container body so as to position the support member with either the intermediate piece or the end piece interposed therebetween.   A locking groove is formed on the opening side of the inner surface of the side wall of the container body to form a recess, and the tip of the tip piece is bent to fit into the locking groove, and the tip of the tip piece is formed in a substantially comb shape. 4. A substrate storage container according to claim 1, wherein the comb teeth are formed with inclined protrusions.   A plurality of guide ribs sandwiching the support are formed on the inner surface of the side wall of the container body, a positioning groove is formed at the end of the guide rib, and a positioning protrusion that fits in the positioning groove is formed at the end piece of the support. The substrate storage container according to claim 1.   6. The substrate storage container according to claim 5, wherein an alignment protrusion is formed on the tip piece of the support so as to contact and align with the guide rib of the container body.   The substrate storage according to any one of claims 1 to 6, wherein an engagement groove is formed on the closed side of the inner surface of the side wall of the container main body, and an engagement protrusion that fits into the engagement groove is formed at the end of the end piece. container.   The substrate storage container according to any one of claims 1 to 7, wherein a plurality of holding ribs for supporting the end piece of the support are formed on the closed side of the inner wall of the container body.   The substrate storage container according to any one of claims 1 to 8, wherein a deflection regulating stopper for regulating the bending of the end piece is formed on either the closed portion side of the inner surface of the side wall of the container body or the end piece of the support.   The substrate storage container according to claim 1, wherein a position restricting portion for restricting a storage position of a substrate stored in the container main body is formed on the end piece of the support.   A thick part located on the opening side of the container body is formed on the support surface that supports the substrate of the shelf board piece, and the jump of the substrate stored in the container body is regulated by this thick part. Item 11. A substrate storage container according to any one of Items 1 to 10.   The substrate storage container according to any one of claims 1 to 11, wherein a shelf piece of the support is divided, and the plurality of divided shelf pieces are arranged at intervals in the longitudinal direction of the support.

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