JP2009212255A - Coil part and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coil part that achieves improved characteristics and reduced size by finely fabricating a spiral conductor, while exhibiting high electrical reliability, and to provide a method of manufacturing such a coil part. <P>SOLUTION: A common-mode choke coil 100 includes a laminate having a magnetic substrate 10A and a first insulating resin element 11a formed on the magnetic substrate 10A, a first terminal electrode 17a provided at the side face of the laminate, a first extraction electrode 14a that is provided in contact with the top face of the magnetic substrate 10A and one end 14a<SB>1</SB>of which is connected with the first terminal electrode, and a first spiral conductor 15a that is formed on the first insulating resin element 11a to be electrically connected with the first terminal electrode 17a. The first extraction electrode 14a is formed to be larger in width than the first spiral conductor 15a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a coil component and a manufacturing method thereof, and more particularly to a coil component such as a common mode choke coil including a spiral conductor and a manufacturing method thereof.

  In recent years, the USB 2.0 standard and the IEEE 1394 standard are widely used as high-speed signal transmission interfaces, and are used in many digital devices such as personal computers and digital cameras. Unlike the single-ended transmission method that has been common for a long time, interfaces such as the USB 2.0 standard and the IEEE 1394 standard adopt a differential signal method that transmits a differential signal using a pair of signal lines.

  The differential transmission system has an excellent feature that not only the radiation electromagnetic field generated from the signal line is small compared to the single-end transmission system, but also that the differential transmission system is less susceptible to external noise. For this reason, it is easy to reduce the amplitude of the signal, and by shortening the rise time and the fall time due to the small amplitude, it becomes possible to perform signal transmission at a higher speed than the single-ended transmission method.

  FIG. 6 is a circuit diagram of a general differential transmission circuit.

  The differential transmission circuit shown in FIG. 6 includes a pair of signal lines 61 and 62, an output buffer 63 that supplies a differential signal to the signal lines 61 and 62, and an input buffer that receives the differential signal from the signal lines 61 and 62. 64. With this configuration, the input signal IN given to the output buffer 63 is transmitted to the input buffer 64 via the pair of signal lines 61 and 62 and reproduced as the output signal OUT. Such a differential transmission circuit has a feature that the radiated electromagnetic field generated from the signal lines 61 and 62 is small as described above, but noise common to the signal lines 61 and 62 (common mode noise) is generated. When superposed, a relatively large radiated electromagnetic field is generated. In order to reduce the radiated electromagnetic field generated by the common mode noise, it is effective to insert a common mode choke coil 60 into the signal lines 61 and 62 as shown in FIG.

The common mode choke coil 60 has a characteristic that an impedance with respect to a differential component (signal) transmitted through the signal lines 61 and 62 is low and an impedance with respect to an in-phase component (common mode noise) is high. For this reason, by inserting the common mode choke coil 60 into the signal lines 61 and 62, it is possible to block the common mode noise transmitted through the pair of signal lines 61 and 62 without substantially attenuating the differential signal. . As the common mode choke coil 60, for example, an element described in Patent Document 1 is known.
JP-A-8-203737

  In recent years, common mode choke coils have been required to have improved characteristics and reduced shape. For this reason, high definition of the spiral conductor constituting the common mode choke coil is being promoted.

  In the conventional common mode choke coil as described in Patent Document 1, the spiral conductor and the extraction electrode are each formed in a planar manner on different insulator layers. Both the spiral conductor and the extraction electrode are formed of the same material and with substantially the same width using the same thin film method such as photolithography and sputtering. However, when the spiral conductor has been refined as described above, it has become difficult to electrically connect the extraction electrode formed with substantially the same width as the spiral conductor to the spiral conductor.

  That is, since the spiral conductor has a planar shape as described above, the inner peripheral end thereof needs to be electrically connected to the extraction electrode via the through-hole electrode. However, if both the spiral conductor and the extraction electrode are formed thin, there is a high possibility that the position in the horizontal direction between the inner peripheral end of the spiral conductor and one end of the extraction electrode will be shifted. Therefore, when both are connected by a through-hole electrode, there arises a problem that the electrical resistance is increased and the electrical reliability is lowered.

  The present invention has been made to solve such problems, and by improving the characteristics and miniaturizing the shape by increasing the definition of the spiral conductor, a coil component having high electrical reliability and It aims at providing the manufacturing method.

  The coil component according to the present invention includes a laminate having a magnetic substrate and a first insulating resin body formed on the magnetic substrate, a first terminal electrode provided on a side surface of the laminate, and a magnetic body. A first lead electrode provided in contact with the upper surface of the substrate and having one end connected to the first terminal electrode, and formed on the first insulating resin body and electrically connected to the first terminal electrode And a first spiral conductor, wherein the width of the first extraction electrode is larger than the width of the first spiral conductor.

  According to the present invention, the spiral conductor is formed with high definition, and even if the width of the spiral conductor is reduced, the width of the extraction electrode is made larger than the width of the spiral conductor. It becomes possible to connect electrically. Further, since the width of the extraction electrode is large, the DC resistance of the extraction electrode can be reduced.

  In the present invention, it is preferable that the inner peripheral end of the first spiral conductor and the other end of the first extraction electrode are connected to each other by a through-hole electrode.

  In the present invention, a second insulating resin body formed as a part of the laminated body on the first insulating resin body, a second terminal electrode provided on a side surface of the laminated body, and a magnetic substrate A second extraction electrode provided in contact with the upper surface and having one end connected to the second terminal electrode; and formed on the second insulating resin body and electrically connected to the second terminal electrode; and It is preferable that a first spiral conductor and a second spiral conductor magnetically coupled to each other are further provided, and the width of the first and second extraction electrodes is larger than the width of the first and second spiral conductors. According to this, this coil component can be functioned as a common mode choke coil by the first and second spiral conductors.

  In the present invention, the first and second extraction electrodes are provided adjacent to each other, and the distance between the first and second extraction electrodes along the surface of the magnetic substrate is between the first and second extraction electrodes. It is preferably longer than the planar distance. According to this, since the distance along the magnetic substrate surface between the first and second extraction electrodes is long, the first and second extraction electrodes can be obtained even if the planar distance between them is short. It is difficult to form a current path caused by ion movement (migration) between the layers. The configuration in which the distance along the magnetic substrate surface between the first and second extraction electrodes is increased is realized by, for example, providing a groove in a region between the first and second extraction electrodes of the magnetic substrate. it can. Alternatively, the magnetic substrate is provided with first and second grooves, the first and second extraction electrodes are embedded in the first and second grooves, respectively, and the upper surfaces of the first and second extraction electrodes are formed. You may comprise so that it may become lower than the upper part of a 1st and 2nd groove | channel.

  The coil component manufacturing method according to the present invention includes a first step of screen-printing an extraction electrode paste on the surface of a magnetic material, and a sintered body in which an extraction electrode is formed on the surface of the magnetic material by firing the magnetic material and the extraction electrode paste. A second step of forming the laminated body, a third step of sequentially laminating an insulating resin body and a spiral conductor electrically connected to the extraction electrode on the sintered body by a thin film construction method, and a laminated body. And a fourth step of forming a terminal electrode to be electrically connected to the extraction electrode on the side surface.

  According to the manufacturing method of the present invention, the formation of a spiral conductor requiring high definition uses a relatively expensive thin film method such as a photolithography method or a sputtering method, and the extraction electrode has little direct effect on characteristics. For the formation of the film, by using a screen printing method capable of keeping the cost relatively low, it is possible to provide a miniaturized coil component with improved characteristics while suppressing the material and the manufacturing cost. In addition, since the extraction electrode and the spiral conductor are formed by different methods, the width of the extraction electrode can be formed larger than the width of the spiral conductor. As a result, the spiral conductor and the extraction electrode can be reliably electrically connected, and the DC resistance of the extraction electrode can be reduced. Therefore, the electrical reliability of the coil component can be increased.

  In the manufacturing method of the present invention, the first and second extraction electrodes are formed on the surface of the magnetic body by the first and second steps, and the first insulating resin body and the first on the magnetic body in the third step. The spiral conductor, the second insulating resin body, and the second spiral conductor that is magnetically coupled to the first spiral conductor are sequentially laminated to form a laminate, and one end of the first extraction electrode is formed in the fourth step. A first terminal electrode connected to the second terminal electrode and a second terminal electrode connected to one end of the second extraction electrode are formed, and the third step includes the other end of the first extraction electrode and the first extraction electrode. Forming a first through-hole electrode that connects the inner peripheral end of the spiral conductor, and a second through-hole connecting the other end of the second lead electrode to the inner peripheral end of the second spiral conductor Forming a Hall electrode. There. Thereby, a common mode choke coil can be manufactured.

  In the manufacturing method of the present invention, the first and second extraction electrodes are formed adjacent to each other, and the distance between the first and second extraction electrodes along the surface of the magnetic material is the first and second extraction electrodes. It is preferably longer than the planar distance between them. As described above, a current path caused by migration of the first and second extraction electrodes can be suppressed.

  In the manufacturing method of this invention, it is preferable that the temperature of the baking or thermosetting performed at a subsequent process is lower than melting | fusing point or thermal decomposition temperature of the material used for the process performed previously. Thereby, it can prevent that the material used at the process performed previously receives damage in a subsequent process.

  Thus, according to the present invention, the spiral conductor and the extraction electrode are formed by forming the spiral conductor with high definition and making the width of the extraction electrode larger than the width of the spiral conductor even if the width is reduced. Can be reliably electrically connected to each other. Further, since the width of the extraction electrode is large, the DC resistance of the extraction electrode can be reduced. Therefore, it is possible to provide a coil component with improved characteristics and reduced electrical reliability.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic perspective view showing a configuration of a common mode choke coil 100 according to a preferred embodiment of the present invention. The common mode choke coil 100 includes magnetic substrates 10A and 10B, an insulating resin body layer 20 having a plurality of insulating resin bodies formed on the magnetic substrate 10A, a magnetic resin layer 12, and an adhesive layer 13. And a first to fourth terminal electrodes 17a to 17d provided on the side surface of the multilayer body.

  The first and second magnetic substrates 10A and 10B physically protect the insulating resin layer 20 and play a role as a magnetic path of the common mode choke coil. As materials for the first and second magnetic substrates 10A and 10B, it is preferable to use sintered ferrite, composite ferrite (resin containing powdered ferrite), or the like.

  FIG. 2 is a schematic exploded perspective view of the common mode choke coil 100.

As shown in FIG. 2, the insulating resin body layer 20 is formed by laminating a plurality of layers on the first magnetic substrate 10A, and the first to third insulating resin bodies 11a to 11c and The first and second spiral conductors 15a and 15b function as actual common mode choke coils. Further, a magnetic resin layer 12 and an adhesive layer 13 are provided on the third insulating resin body 11c, and a second magnetic substrate 10B is provided thereon. Further, on the first magnetic substrate 10A, one end 14a ₁ is connected to the first terminal electrode 17a, and one end 14b ₁ is connected to the second terminal electrode 17b. The second extraction electrode 14b is provided in contact with the upper surface of the first magnetic substrate 10A. Although it does not specifically limit as extraction electrode 14a, 14b, It is preferable to use metal materials, such as Ag.

  The 1st-3rd insulating resin bodies 11a-11c play the role which ensures the flatness of the plane in which a conductor pattern is formed while insulating between each conductor pattern or a conductor pattern and a magnetic body board | substrate. The insulating resin bodies 11a to 11c are not particularly limited, but it is preferable to use a resin material that has excellent electrical and magnetic insulating properties and good workability, such as a polyimide resin and an epoxy resin.

  An opening 16 penetrating the first to third insulating resin bodies 11a to 11c is provided in the central region inside the first and second spiral conductors 15a and 15b. The magnetic resin layer 12 includes a planar portion 12a and a convex portion 12b protruding downward from the central portion thereof, and a magnetic path between the first magnetic substrate 10A and the second magnetic substrate 10B. In order to form the protrusions 12 b of the magnetic resin layer 12, the protrusions 12 b are disposed inside the openings 16. As the magnetic resin layer 12, it is preferable to use a material obtained by mixing a magnetic powder such as ferrite in a resin.

The first spiral conductor 15a is provided on the first insulating resin body 11a. The first spiral conductor 15a is made of a metal material such as Cu and has a planar shape. The outer peripheral edge 15a ₂ of the first spiral conductor 15a is connected to the third terminal electrode 17c. On the other hand, the inner peripheral end 15a1 of the _first spiral conductor 15a is connected to the other end 14a of the first extraction electrode 14a via a through-hole electrode embedded in the through-hole 18a that penetrates the first insulating resin body 11a. ₂ , thereby being electrically connected to the first terminal electrode 17 a.

The second spiral conductor 15b is provided on the second insulating resin body 11b. The second spiral conductor 15b is also made of a metal material such as Cu, has a planar shape, and is very close to the first spiral conductor 15a, like the first spiral conductor 15a. Since the second spiral conductor 15b completely overlaps with the first spiral conductor 15a, strong magnetic coupling is generated between the first spiral conductor 15a and the second spiral conductor 15b. The outer peripheral end 15b2 of the _second spiral conductor 15b is connected to the fourth terminal electrode 17d. On the other hand, the inner peripheral edge 15b ₁ of the second spiral conductor 15b, the second lead electrode through the through-hole electrode embedded in the through hole 18b which penetrates the first and second insulating resin body 11a, and 11b 14b connected to the other end 14b _2, thereby being connected to the second terminal electrode 17b electrically.

  As shown in FIG. 2, the first and second lead electrodes 14a and 14b formed on the magnetic substrate 10A are formed on the first and second insulating resin bodies 11a and 11b. The conductor width is formed larger than that of the second spiral conductors 15a and 15b. By adopting such a configuration, even when the width of the spiral conductor is reduced by forming the spiral conductor with high definition, there is a margin in alignment between the spiral conductors 15a and 15b and the extraction electrodes 14a and 14b. The through-hole electrodes formed in the holes 18a and 18b can surely electrically connect the spiral conductors 15a and 15b and the extraction electrodes 14a and 14b, respectively. Further, since the widths of the extraction electrodes 14a and 14b are large, the DC resistance of the extraction electrodes 14a and 14b can be reduced. The extraction electrodes 14a and 14b preferably have a width of 50 to 200 μm and a thickness of 5 to 20 μm. The width of the spiral conductors 15a and 15b is preferably 7 to 20 μm, and more preferably about 15 μm. The thickness of the spiral conductors 15a and 15b is preferably 10 to 20 μm, particularly preferably about 18 μm.

  As shown in FIG. 2, the first and second extraction electrodes 14a and 14b are formed on the same magnetic substrate 10A. In order to make the shapes of the first and second spiral conductors as close to each other as possible, the planar distance between the first extraction electrode 14a and the second extraction electrode 14b is necessarily reduced. For this reason, a current path caused by ion movement (migration) or the like along the surface of the magnetic substrate 10A is easily formed between the first extraction electrode 14a and the second extraction electrode 14b. The extraction electrode 14a and the second extraction electrode 14b are easily short-circuited. In particular, in the region X close to the through holes 18a and 18b, the first extraction electrode 14a and the second extraction electrode 14b cannot be separated from each other, so that a short circuit is most likely to occur in this portion.

  3 and 4 are schematic cross-sectional views of the region X shown in FIG. 2, and show two examples of the cross-sectional structure. In FIGS. 3 and 4, the layers above the spiral conductors 15a and 15b are omitted. As shown in FIGS. 3 and 4, the distance between the first and second extraction electrodes 14a and 14b along the surface of the magnetic substrate 10A is planar between the first and second extraction electrodes 14a and 14b. It is configured longer than the distance.

  As shown in FIG. 3, in the magnetic substrate 10A on which the first and second extraction electrodes 14a and 14b are formed on the upper surface, a recess (or slit) 30 is provided between the extraction electrode 14a and the extraction electrode 14b. Is formed. An upper insulating resin body 11 a is embedded in the recess 30.

With this configuration, the lead electrode 14a along the surface of the magnetic substrate 10A, the distance _{s 1} between 14b is longer than the planar distance p between the lead electrode 14a, 14b, the surface of the magnetic substrate 10A Current paths caused by the movement of ions along the line are difficult to form. For this reason, although the planar distance is very close, it becomes possible to prevent a short circuit.

  Such a recess 30 may be formed over the entire area between the extraction electrodes 14a and 14b, but is preferably provided at least in a portion where the planar distance between the extraction electrodes 14a and 14b is closest. According to this, it becomes possible to suppress this in the portion where the short circuit is most likely to occur.

  FIG. 4 shows another example of suppressing a short circuit between the first and second extraction electrodes 14a and 14b.

  As shown in FIG. 4, first and second grooves 40a and 40b are formed in the magnetic substrate 10A. The first and second extraction electrodes 14a and 14b are embedded in the first and second grooves 40a and 40b, respectively, and the top surfaces of the first and second extraction electrodes 14a and 14b are the first and second. It is lower than the upper portions of the grooves 40a, 40b.

With such a configuration, the extraction electrode 14a along the surface of the magnetic substrate 10A, it is possible to longer than planar distances p between the distance s ₂ the lead electrodes 14a, 14b between 14b, FIG. 3 As in the case of the configuration shown in FIG. 4, it is difficult to form a current path caused by ion migration (migration) along the surface of the magnetic substrate 10A, and it is possible to prevent a short circuit.

  As described above, in the common mode choke coil 100 according to the present embodiment, even when the spiral conductor is formed with high definition, the width of the extraction electrodes 14a and 14b is larger than the width of the spiral conductors 15a and 15b. The spiral conductors 15a and 15b and the extraction electrodes 14a and 14b can be reliably electrically connected. Further, since the widths of the extraction electrodes 14a and 14b are large, the DC resistance of the extraction electrodes 14a and 14b can be reduced. Furthermore, by forming the extraction electrodes 14a and 14b directly on the magnetic substrate 10A, not on the insulating resin body, the number of layers of the insulating resin body can be reduced. Therefore, the cost can be reduced and the height can be reduced.

  Further, although the planar distance between the extraction electrodes 14a and 14b is very close, the short-circuit is prevented by increasing the distance between the extraction electrodes 14a and 14b along the surface of the magnetic substrate 10A. You can also.

  Therefore, according to the present embodiment, it is possible to provide a coil component with improved characteristics and reduced electrical reliability.

  Next, a method for manufacturing the common mode choke coil 100 according to the present embodiment will be described.

  FIG. 5 is a flowchart showing manufacturing steps of the common mode choke coil 100 according to the present embodiment.

  First, a magnetic material is prepared (step S1). As the magnetic material, it is preferable to use a wafer-like material that can form a large number of chips simultaneously because it is in the form of a sheet or a substrate. Here, the substrate-like magnetic body means one that has been fired in advance. Next, the recess 30 (or grooves 40a and 40b) (see FIGS. 3 and 4) is formed on the surface of the magnetic material (step S2). The recess 30 is formed, for example, by forming a corresponding recess in a mold for forming a magnetic body. Or you may make a cut using a dicer. Next, an extraction electrode paste is formed on the surface of the magnetic material by screen printing of Ag (step S3). Subsequently, the sintered body in which the first and second extraction electrodes 14a and 14b are formed on the surface of the first magnetic substrate 10A by firing the magnetic body and the extraction electrode paste at a temperature of 800 to 900 ° C. A body is formed (step S4).

  Subsequently, the first insulating resin body 11a, the first spiral conductor 15a, the second insulating resin body 11b, the second spiral conductor 15a, and the third insulating resin body 11c are sequentially formed by a thin film method. (Steps S5 to S7). That is, a photosensitive resin (for example, photosensitive polyimide resin) is spin-coated on the magnetic substrate 10A (step S5), and this is exposed, developed, and thermally cured (step S6), whereby the first having the opening 16 is formed. The insulating resin body 11a is formed. The thermosetting temperature of the polyimide resin is preferably 350 to 400 ° C. Subsequently, a first conductive conductor 15a is formed on the first insulating resin body 11a by forming a base conductive layer by a vapor deposition method or a sputtering method and performing plating using this as a power feeding body (step S7). . In this case, after forming a resist on the entire surface of the underlying conductive layer and exposing the underlying conductive layer in a predetermined region by a photolithography method, plating may be performed, or the underlying conductive layer is patterned by a photolithography method. After that, plating may be performed. After such steps S5 to S7 are repeatedly executed twice, steps S5 and S6 are further executed, whereby the insulating resin body layer 20 shown in FIG. 2 is formed.

  Here, in the formation of the first and second insulating resin bodies 11a and 11b, the opening 16 and the through holes 18a and 18b can be simultaneously formed by exposing and developing the photosensitive resin. In the formation of the third insulating resin body 11c, an opening 16 is formed. Further, when the first and second spiral conductors 15a and 15b are formed, a through hole electrode is formed by embedding a conductor in the through holes 18a and 18b.

  After the insulating resin body layer 20 is formed on the first magnetic substrate 10A in this way, the magnetic resin layer 12 that fills the opening 16 and covers the third insulating resin body 11c is formed by screen printing. (Step S8). Further, the adhesive layer 13 is formed on the magnetic resin layer 12 (step S9), and the second magnetic substrate 10B is adhered thereon (step S10). And after dividing | segmenting into an individual chip | tip by dicing, if the terminal electrodes 17a-17d are formed (step S11), the common mode choke coil 100 by this embodiment will be completed.

  As described above, in this embodiment, since the direct influence on the characteristics of the coil is small, the extraction electrode having a relatively low accuracy requirement is directly formed on the magnetic material by the screen printing method. Thereby, compared with the case where an extraction electrode is formed with a thin film construction method, a manufacturing cost can be made low. In addition, since the total number of insulating resin bodies can be reduced, the material cost can be reduced, and the height can be reduced.

  Further, the firing temperature of the extraction electrode paste (Ag) is 800 to 900 ° C. as described above, whereas the thermal decomposition temperature of the polyimide resin is 500 ° C. Therefore, the extraction electrode is formed after the insulating resin body layer 20 is formed. When the paste (Ag) is fired, the insulating resin body layer 20 is thermally decomposed. In this embodiment, after the extraction electrode paste is formed, the insulating resin body layer 20 is fired at a high temperature in advance. Therefore, thermal decomposition of the insulating resin body layer 20 does not occur.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. Needless to say, it is included in the range.

  For example, in the above embodiment, after the photosensitive resin is spin-coated, the insulating resin body having the opening and the through hole is formed by exposing and developing the photosensitive resin, but the opening and the through hole are formed in the insulating resin body. However, the method of forming is not limited to this. For example, after forming an insulating resin body by spin coating, a photosensitive resist may be formed, and etching may be performed using this as a mask to form openings and through holes in the insulating resin body. Alternatively, the insulating resin body may be formed by spin coating, and then an opening and a through hole portion may be formed in the insulating resin body by irradiating a laser beam. Further, the material of the insulating layer is not limited to the resin material, and other insulating materials may be used.

  Furthermore, in the said embodiment, although the opening 16 is provided in the insulating resin bodies 11a-11c and the convex part 12b of the magnetic resin layer 12 is inserted here, in this invention, such an opening and the magnetic resin layer 12 are provided. It is not essential to provide.

  Moreover, although the example which applied this invention to the common mode choke coil was shown in the said embodiment, it is not restricted to this, It can apply to the coil components containing at least 1 spiral conductor, such as an inductor.

  In the above embodiment, the insulating resin body layer 20 is formed after the extraction electrode paste (Ag) is baked so that the thermal decomposition of the insulating resin body layer 20 does not occur. Furthermore, it is preferable to lower the temperature of the firing or thermosetting performed in the subsequent step from the melting point or the thermal decomposition temperature of the material used in the step performed earlier. Thereby, it can prevent that the material used at the process performed previously receives damage in a subsequent process. To give a specific example, when the material used in the process performed earlier is Ag, when baking or thermosetting higher than the melting point of Ag 960 ° C. is performed in the subsequent process, the previously formed Ag is Although it will melt | dissolve, if it carries out as mentioned above, elution of Ag can be prevented.

1 is a schematic perspective view showing a configuration of a common mode choke coil 100 according to a preferred embodiment of the present invention. 2 is a schematic exploded perspective view of a common mode choke coil 100. FIG. FIG. 3 is a schematic cross-sectional view illustrating an example of a region X illustrated in FIG. 2. It is a schematic sectional drawing which shows the other example of the area | region X shown in FIG. 4 is a flowchart showing manufacturing steps of the common mode choke coil 100. It is a circuit diagram of a general differential transmission circuit.

Explanation of symbols

11a to 11c Insulating resin bodies 17a to 17d Terminal electrodes 10A and 10B Magnetic substrate 12 Magnetic resin layer 13 Adhesive layers 14a and 14b Lead electrodes 15a and 15b Spiral conductor 16 Openings 17a to 17d Terminal electrodes 18a and 18b Through holes (through holes) electrode)
20 Insulating resin layer 30 Recess 40a, 40b Groove 100 Common mode choke coil

Claims (10)

A laminate having a magnetic substrate and a first insulating resin body formed on the magnetic substrate;
A first terminal electrode provided on a side surface of the laminate;
A first extraction electrode provided in contact with the upper surface of the magnetic substrate and having one end connected to the first terminal electrode;
A first spiral conductor formed on the first insulating resin body and electrically connected to the first terminal electrode;
A coil component, wherein a width of the first extraction electrode is larger than a width of the first spiral conductor.   2. The coil component according to claim 1, wherein an inner peripheral end of the first spiral conductor and the other end of the first extraction electrode are connected to each other by a through-hole electrode. A second insulating resin body formed as a part of the laminate on the first insulating resin body;
A second terminal electrode provided on a side surface of the laminate;
A second lead electrode provided in contact with the top surface of the magnetic substrate and having one end connected to the second terminal electrode;
A second spiral conductor formed on the second insulating resin body, electrically connected to the second terminal electrode, and magnetically coupled to the first spiral conductor;
The coil component according to claim 1 or 2, wherein a width of the first and second extraction electrodes is larger than a width of the first and second spiral conductors.   The first and second extraction electrodes are provided adjacent to each other, and the distance between the first and second extraction electrodes along the surface of the magnetic substrate is between the first and second extraction electrodes. The coil component according to claim 3, wherein the coil component is longer than a planar distance.   5. The coil component according to claim 4, wherein a groove is provided in a region between the first and second extraction electrodes of the magnetic substrate. The magnetic substrate is provided with first and second grooves,
The first and second extraction electrodes are embedded in the first and second grooves, respectively, and the upper surfaces of the first and second extraction electrodes are from the upper portions of the first and second grooves, respectively. The coil component according to claim 4, wherein the coil component is also low. A first step of screen-printing an extraction electrode paste on the surface of the magnetic material;
A second step of firing the magnetic body and the extraction electrode paste to form a sintered body having an extraction electrode formed on the surface of the magnetic body;
A third step of forming a laminate by sequentially laminating an insulating resin body and a spiral conductor electrically connected to the extraction electrode on the sintered body by a thin film construction method;
And a fourth step of forming a terminal electrode electrically connected to the extraction electrode on a side surface of the laminated body. First and second extraction electrodes are formed on the magnetic surface by the first and second steps,
In the third step, a first insulating resin body, a first spiral conductor, a second insulating resin body, and a second spiral conductor that is magnetically coupled to the first spiral conductor are formed on the magnetic body. The laminated body is formed by sequentially laminating,
In the fourth step, a first terminal electrode connected to one end of the first extraction electrode and a second terminal electrode connected to one end of the second extraction electrode are formed,
The third step includes a step of forming a first through-hole electrode connecting the other end of the first extraction electrode and an inner peripheral end of the first spiral conductor, and a step of forming the second extraction electrode. The method of manufacturing a coil component according to claim 7, further comprising: forming a second through-hole electrode that connects the other end to the inner peripheral end of the second spiral conductor.   The first and second extraction electrodes are formed adjacent to each other, and the distance between the first and second extraction electrodes along the surface of the magnetic body is a plane between the first and second extraction electrodes. The method for manufacturing a coil component according to claim 8, wherein the coil component is longer than a typical distance.   The coil according to any one of claims 7 to 9, wherein a temperature of firing or thermosetting performed in a later step is lower than a melting point or a thermal decomposition temperature of a material used in a step performed earlier. A manufacturing method for parts.

Images