JP2009203414A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009203414A5 JP2009203414A5 JP2008049474A JP2008049474A JP2009203414A5 JP 2009203414 A5 JP2009203414 A5 JP 2009203414A5 JP 2008049474 A JP2008049474 A JP 2008049474A JP 2008049474 A JP2008049474 A JP 2008049474A JP 2009203414 A5 JP2009203414 A5 JP 2009203414A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- group
- resin composition
- thermosetting resin
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011342 resin composition Substances 0.000 claims 6
- 229920001187 thermosetting polymer Polymers 0.000 claims 6
- 239000004642 Polyimide Substances 0.000 claims 4
- 150000004985 diamines Chemical class 0.000 claims 4
- 229920001721 polyimide Polymers 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 239000003086 colorant Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008049474A JP2009203414A (ja) | 2008-02-29 | 2008-02-29 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008049474A JP2009203414A (ja) | 2008-02-29 | 2008-02-29 | 熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009203414A JP2009203414A (ja) | 2009-09-10 |
| JP2009203414A5 true JP2009203414A5 (https=) | 2011-04-07 |
Family
ID=41145994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008049474A Withdrawn JP2009203414A (ja) | 2008-02-29 | 2008-02-29 | 熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009203414A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5930549B2 (ja) * | 2011-06-09 | 2016-06-08 | 住友精化株式会社 | 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 |
| US20160194542A1 (en) * | 2013-10-23 | 2016-07-07 | Nippon Kayaku Kabushiki Kaisha | Polyimide resin composition, and heat-conductive adhesive film produced using same |
| CN103980491B (zh) * | 2014-05-23 | 2016-04-06 | 哈尔滨工业大学 | 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法 |
| JP6451500B2 (ja) | 2015-05-22 | 2019-01-16 | Jnc株式会社 | 熱硬化性樹脂組成物およびその硬化膜 |
| CN111344859A (zh) * | 2018-07-19 | 2020-06-26 | 东丽先端材料研究开发（中国）有限公司 | 一种半导体器件及太阳能电池 |
| JP6872081B2 (ja) * | 2019-03-15 | 2021-05-19 | 日本化薬株式会社 | ポリアミック酸樹脂、ポリイミド樹脂およびこれらを含む樹脂組成物 |
-
2008
- 2008-02-29 JP JP2008049474A patent/JP2009203414A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009203414A5 (https=) | ||
| KR102011258B1 (ko) | 벤족사진, 에폭시 및 무수물의 혼합물 | |
| JP2007016214A5 (https=) | ||
| RU2018106457A (ru) | Отверждаемые бензоксазиновые композиции | |
| JP2013504653A5 (https=) | ||
| JP2013504652A5 (https=) | ||
| JP2013163812A5 (https=) | ||
| JP2011514266A5 (https=) | ||
| WO2008133228A1 (ja) | ケイ素含有化合物、硬化性組成物及び硬化物 | |
| JP2017039909A5 (https=) | ||
| JP2013256125A5 (https=) | ||
| JP2019052315A5 (https=) | ||
| DE602008001878D1 (de) | Wärmehärtbare zusammensetzung | |
| CA2900633A1 (en) | Benzoxazine curable composition containing polysulfone-based tougheners | |
| JP2025158998A5 (https=) | ||
| WO2008133227A1 (ja) | ケイ素含有化合物、硬化性組成物及び硬化物 | |
| JP2011256242A5 (https=) | ||
| ATE410484T1 (de) | Härtbare silikonzusammensetzung und elektronische komponenten | |
| KR20190008547A (ko) | 염기발생제, 시제, 유기염, 조성물, 소자의 제조방법, 경화막 및 소자 | |
| JP2016536393A5 (ja) | 樹脂組成物、樹脂フィルム、電子素子製造用基板、電子装置を製造する方法および電子装置 | |
| JPWO2020095693A5 (https=) | ||
| JP2016074894A5 (https=) | ||
| JP2012113256A5 (https=) | ||
| JP4771414B2 (ja) | ポリイミドシリコーン樹脂及びそれを含む熱硬化性組成物 | |
| JP2008222908A5 (https=) |